CN101491166B - 在载体上生产导电表面的方法 - Google Patents

在载体上生产导电表面的方法 Download PDF

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Publication number
CN101491166B
CN101491166B CN2007800266427A CN200780026642A CN101491166B CN 101491166 B CN101491166 B CN 101491166B CN 2007800266427 A CN2007800266427 A CN 2007800266427A CN 200780026642 A CN200780026642 A CN 200780026642A CN 101491166 B CN101491166 B CN 101491166B
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CN
China
Prior art keywords
structured
full
carrier
conductive
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007800266427A
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English (en)
Chinese (zh)
Other versions
CN101491166A (zh
Inventor
R·洛赫特曼
J·卡祖恩
N·施奈德
J·普菲斯特
N·瓦格纳
D·亨切尔
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BASF SE
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BASF SE
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Publication of CN101491166A publication Critical patent/CN101491166A/zh
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Publication of CN101491166B publication Critical patent/CN101491166B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H05K2203/097—Corona discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
  • Liquid Crystal (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
CN2007800266427A 2006-06-14 2007-06-11 在载体上生产导电表面的方法 Expired - Fee Related CN101491166B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP06115487.8 2006-06-14
EP06115487 2006-06-14
PCT/EP2007/055701 WO2007144322A1 (de) 2006-06-14 2007-06-11 Verfahren zur herstellung von elektrisch leitfähigen oberflächen auf einem träger

Publications (2)

Publication Number Publication Date
CN101491166A CN101491166A (zh) 2009-07-22
CN101491166B true CN101491166B (zh) 2011-09-28

Family

ID=38461132

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800266427A Expired - Fee Related CN101491166B (zh) 2006-06-14 2007-06-11 在载体上生产导电表面的方法

Country Status (11)

Country Link
US (1) US20090285976A1 (https=)
EP (1) EP2033501A1 (https=)
JP (1) JP2009539593A (https=)
KR (1) KR20090025337A (https=)
CN (1) CN101491166B (https=)
BR (1) BRPI0712709A2 (https=)
CA (1) CA2654797A1 (https=)
IL (1) IL195620A0 (https=)
RU (1) RU2436266C2 (https=)
TW (1) TW200806127A (https=)
WO (1) WO2007144322A1 (https=)

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ATE474080T1 (de) 2007-02-20 2010-07-15 Basf Se Verfahren zur herstellung von metallisierten textilen oberflächen mit strom erzeugenden oder strom verbrauchenden artikeln
WO2009112573A2 (de) * 2008-03-13 2009-09-17 Basf Se Verfahren und dispersion zum aufbringen einer metallschicht auf einem substrat sowie metallisierbare thermoplastische formmasse
WO2009144186A2 (de) 2008-05-30 2009-12-03 Basf Se Verfahren zur herstellung von transparenten leitfähigen oxiden
CN102067323A (zh) * 2008-06-18 2011-05-18 巴斯夫欧洲公司 制备太阳能电池用电极的方法
WO2009153361A1 (es) * 2008-06-19 2009-12-23 Fundacion Cidetec Procedimiento para recubrir un sustrato aislante por vía electroquímica
US8486305B2 (en) 2009-11-30 2013-07-16 Lockheed Martin Corporation Nanoparticle composition and methods of making the same
DE102009009650B4 (de) * 2009-02-19 2013-10-10 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Herstellen einer Kunststoffschicht sowie deren Verwendung
US8585911B2 (en) * 2009-03-18 2013-11-19 Kuo-Ching Chiang Thin film antenna and the method of forming the same
US20170038658A1 (en) 2011-09-30 2017-02-09 View, Inc. Particle removal during fabrication of electrochromic devices
US9007674B2 (en) 2011-09-30 2015-04-14 View, Inc. Defect-mitigation layers in electrochromic devices
KR101009442B1 (ko) * 2009-04-15 2011-01-19 한국과학기술연구원 전도성 구조체를 이용한 전도성필름 제조방법 및 전도성필름
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CN102404934B (zh) * 2010-09-09 2015-01-14 富葵精密组件(深圳)有限公司 电路板基板及其制作方法
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US20050191511A1 (en) * 2003-12-26 2005-09-01 Hideo Aoki Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit
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US20060086619A1 (en) * 2004-10-26 2006-04-27 Seiko Epson Corporation Method of forming conductive pattern, wiring substrate, electronic device and electronic equipment

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DE2528000A1 (de) * 1975-06-24 1977-01-20 Licentia Gmbh Verfahren zur herstellung einer loetflaeche relativ grosser abmessungen
US4417296A (en) * 1979-07-23 1983-11-22 Rca Corp Method of connecting surface mounted packages to a circuit board and the resulting connector
US5109269A (en) * 1991-07-08 1992-04-28 Ofer Holzman Method and means for positioning surface mounted electronic components on a printed wiring board
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Also Published As

Publication number Publication date
RU2009100627A (ru) 2010-07-20
RU2436266C2 (ru) 2011-12-10
JP2009539593A (ja) 2009-11-19
IL195620A0 (en) 2009-09-01
TW200806127A (en) 2008-01-16
BRPI0712709A2 (pt) 2012-05-22
CN101491166A (zh) 2009-07-22
KR20090025337A (ko) 2009-03-10
EP2033501A1 (de) 2009-03-11
CA2654797A1 (en) 2007-12-21
US20090285976A1 (en) 2009-11-19
WO2007144322A1 (de) 2007-12-21

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Granted publication date: 20110928

Termination date: 20130611