JP2009539250A - 多重屈折率レンズを備えるパッケージ化された発光デバイスおよびその作製方法 - Google Patents
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Abstract
Description
Claims (37)
- 基板と、
前記基板上の固体発光デバイスと、
前記基板上の第1のレンズであって、前記固体発光デバイスに対して空洞を画定し、第1の屈折率を有する第1のレンズと、
前記第1のレンズによって形成された前記空洞内に少なくとも部分的に配置された第2のレンズであって、前記第1の屈折率とは異なる第2の屈折率を有する第2のレンズと
を備えることを特徴とするパッケージ化された発光デバイス。 - 前記第2の屈折率は、前記第1の屈折率より大きいことを特徴とする請求項1に記載のパッケージ化された発光デバイス。
- 前記固体発光デバイスと前記第2のレンズとの間に封入材料をさらに備えることを特徴とする請求項1に記載のパッケージ化された発光デバイス。
- 前記基板は、リードフレームまたは印刷回路基板を備え、
前記パッケージ化された発光デバイスは、前記基板の上に成形体をさらに備え、
前記成形体の上に前記第1のレンズがあることを特徴とする請求項1に記載のパッケージ化された発光デバイス。 - 前記成形体は、前記基板の表面に沿って延在する少なくとも1つの表面と、前記表面から延在して前記第1のレンズのための取付け位置を画定する少なくとも1つの垂直方向の側壁とを備えることを特徴とする請求項4に記載のパッケージ化された発光デバイス。
- 前記成形体は、少なくとも部分的に前記リードフレームを貫通して延在することを特徴とする請求項4に記載のパッケージ化された発光デバイス。
- 前記第1のレンズは第1の整合表面を含み、
前記第2のレンズは、前記第1のレンズの前記第1の整合表面と接触する第2の整合表面を備えることを特徴とする請求項1に記載のパッケージ化された発光デバイス。 - 前記第2のレンズは、接着性封入剤を使用して前記第1のレンズに取り付けられることを特徴とする請求項1に記載のパッケージ化された発光デバイス。
- 前記接着性封入剤は、前記第1の屈折率または前記第2の屈折率と実質的に同じ屈折率を有することを特徴とする請求項8に記載のパッケージ化された発光デバイス。
- 前記第2のレンズの上に配置された、第3の屈折率を有する第3のレンズをさらに備えることを特徴とする請求項1に記載のパッケージ化された発光デバイス。
- 前記第3の屈折率は、前記第1の屈折率より大きいことを特徴とする請求項10に記載のパッケージ化された発光デバイス。
- 前記第3の屈折率は、前記第2の屈折率より大きいことを特徴とする請求項11に記載のパッケージ化された発光デバイス。
- 前記第3の屈折率は、前記第1の屈折率より大きく、前記第2の屈折率と同じ屈折率であることを特徴とする請求項11に記載のパッケージ化された発光デバイス。
- 請求項1に記載のパッケージ化された発光デバイスを備えることを特徴とする固体照明器具。
- 請求項1に記載のパッケージ化された発光デバイスを備えることを特徴とする、ディスプレイのためのバックライトパネル。
- パッケージ化された発光デバイスのためのレンズにおいて、
空洞を画定する概ね環状のサイドレンズであって、第1の屈折率を有する概ね環状のサイドレンズと、
前記サイドレンズによって形成された前記空洞内に少なくとも部分的に配置されたコアレンズであって、前記第1の屈折率とは異なる第2の屈折率を有するコアレンズと
を備えることを特徴とするレンズ。 - 前記第2の屈折率は、前記第1の屈折率より大きいことを特徴とする請求項16に記載のレンズ。
- 第2のレンズの上に配置された、第3の屈折率を有する第3のレンズをさらに備えることを特徴とする請求項16に記載のレンズ。
- 前記第3の屈折率は、前記第1の屈折率より大きいことを特徴とする請求項18に記載のレンズ。
- 前記第3の屈折率は、前記第2の屈折率より大きいことを特徴とする請求項19に記載のレンズ。
- 前記第3の屈折率は、前記第1の屈折率より大きく、前記第2の屈折率と同じ屈折率であることを特徴とする請求項19に記載のレンズ。
- 上部表面を有する基板と、
前記基板の前記上部表面上のダイ取付けパッドであって、固体発光デバイスを支えるように構成されたダイ取付けパッドと、
前記基板上の第1のメニスカス制御形体であって、前記ダイ取付けパッドを取り囲み、液体封入材料の流れを制限するように構成された第1のメニスカス制御形体と、
前記基板上の第2のメニスカス制御形体であって、前記第1のメニスカス制御形体を取り囲み、液体封入材料の流れを制限するように構成された第2のメニスカス制御形体と、
前記ダイ取付けパッド上の固体発光デバイスと、
前記第1のメニスカス制御形体および前記第2のメニスカス制御形体によって画定された封入剤領域内の前記基板上の第1の封入剤であって、第1の屈折率を有し、前記固体発光デバイスの上方に空洞を画定する第1の封入剤と、
前記空洞内の第2の封入剤であって、前記第1の屈折率とは異なる第2の屈折率を有する第2の封入剤と
を備え、
前記第1のメニスカス制御形体および前記第2のメニスカス制御形体は、第1の封入剤領域を取り囲む前記基板の前記上部表面の前記封入剤領域を画定することを特徴とするパッケージ化された発光デバイス。 - 前記第2の屈折率は、前記第1の屈折率より大きいことを特徴とする請求項22に記載のパッケージ化された発光デバイス。
- 前記第2のメニスカス制御形体を取り囲む第3のメニスカス制御形体と、
前記基板上の、前記第3のメニスカス制御形体によって画定される領域内の第3の封入剤であって、前記第1の封入剤および前記第2の封入剤を覆い、前記第1の屈折率または前記第2の屈折率とは異なる第3の屈折率を有する第3の封入剤と
をさらに備えることを特徴とする請求項22に記載のパッケージ化された発光デバイス。 - 前記第3の屈折率は、前記第1の屈折率より大きいことを特徴とする請求項24に記載のパッケージ化された発光デバイス。
- 前記第3の屈折率は、前記第2の屈折率より大きいことを特徴とする請求項24に記載のパッケージ化された発光デバイス。
- 前記第3の屈折率は、前記第1の屈折率より大きく、前記第2の屈折率と同じ屈折率であることを特徴とする請求項24に記載のパッケージ化された発光デバイス。
- 前記第1の封入剤および/または前記第2の封入剤は、シリコーンゲルおよび/またはエポキシ樹脂を含むことを特徴とする請求項22に記載のパッケージ化された発光デバイス。
- 前記第1の封入剤および/または前記第2の封入剤は、波長変換材料を含むことを特徴とする請求項22に記載のパッケージ化された発光デバイス。
- 前記第3の封入剤は、シリコーンゲルおよび/またはエポキシ樹脂を含むことを特徴とする請求項24に記載のパッケージ化された発光デバイス。
- 前記第3の封入剤は、波長変換材料を含むことを特徴とする請求項24に記載のパッケージ化された発光デバイス。
- パッケージ化された発光デバイスを形成する方法であって、
パターン化された金属膜を基板の上に形成するステップであって、前記パターン化された金属膜はダイ取付けパッドを含むステップと、
前記ダイ取付けパッドを取り囲み、封入材料の流れを制限するように構成された第1のメニスカス制御形体を前記基板の上に形成するステップと、
第1の封入剤領域を取り囲み、封入材料の流れを制限するように構成された第2のメニスカス制御形体を前記基板の上に形成するステップであって、前記第1のメニスカス制御形体および前記第2のメニスカス制御形体は前記基板の上部表面の封入剤領域を画定するステップと、
前記ダイ取付けパッドの上に固体発光デバイスを取り付けるステップと、
前記第1のメニスカス制御形体および前記第2のメニスカス制御形体によって画定される前記封入剤領域内に第1の封入材料をディスペンスするステップであって、前記第1の封入材料は第1の屈折率を有し、前記固体発光デバイスの上方に空洞を画定するステップと、
前記第1の封入材料を少なくとも部分的に硬化させるステップと、
前記第1の封入材料によって画定された前記空洞内に第2の封入材料をディスペンスするステップであって、前記第2の封入材料は、前記第1の屈折率とは異なる第2の屈折率を有するステップと
を含むことを特徴とする方法。 - 前記第2の屈折率は、前記第1の屈折率より大きいことを特徴とする請求項32に記載の方法。
- 前記第2のメニスカス制御形体を取り囲む第3のメニスカス制御形体を前記基板の上に形成するステップと、
前記第3のメニスカス制御形体によって画定される領域内に第3の封入材料をディスペンスするステップであって、前記第3の封入材料は、前記第1の屈折率または前記第2の屈折率とは異なる第3の屈折率を有するステップと、
前記第3の封入材料を硬化させるステップと
をさらに含むことを特徴とする請求項32に記載の方法。 - 前記第3の屈折率は、前記第1の屈折率より大きいことを特徴とする請求項34に記載の方法。
- 前記第3の屈折率は、前記第2の屈折率より大きいことを特徴とする請求項34に記載の方法。
- 前記第3の屈折率は、前記第1の屈折率より大きく、前記第2の屈折率と同じ屈折率であることを特徴とする請求項34に記載の方法。
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PCT/US2007/011325 WO2007142778A2 (en) | 2006-05-31 | 2007-05-10 | Packaged light emitting devices including multiple index lenses and methods of fabricating the same |
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- 2007-05-10 JP JP2009513163A patent/JP4886033B2/ja active Active
- 2007-05-10 WO PCT/US2007/011325 patent/WO2007142778A2/en active Application Filing
- 2007-05-30 TW TW096119345A patent/TW200807765A/zh unknown
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2009
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Cited By (8)
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KR20120060990A (ko) * | 2010-10-08 | 2012-06-12 | 엘지이노텍 주식회사 | 발광소자 모듈 |
KR101722627B1 (ko) * | 2010-10-08 | 2017-04-03 | 엘지이노텍 주식회사 | 발광소자 모듈 |
JP2013239390A (ja) * | 2012-05-16 | 2013-11-28 | Toshiba Lighting & Technology Corp | 照明装置 |
KR20160005587A (ko) * | 2014-07-07 | 2016-01-15 | 엘지전자 주식회사 | 광원 모듈 어셈블리 조립 장치 및 조립 방법 |
KR102268172B1 (ko) | 2014-07-07 | 2021-06-23 | 엘지전자 주식회사 | 광원 모듈 어셈블리 조립 장치 및 조립 방법 |
WO2021010350A1 (ja) * | 2019-07-12 | 2021-01-21 | Dowaエレクトロニクス株式会社 | 発光素子ランプ及びその製造方法 |
JP2021015910A (ja) * | 2019-07-12 | 2021-02-12 | Dowaエレクトロニクス株式会社 | 発光素子ランプ及びその製造方法 |
JP7165629B2 (ja) | 2019-07-12 | 2022-11-04 | Dowaエレクトロニクス株式会社 | 発光素子ランプ及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2025009A2 (en) | 2009-02-18 |
US7646035B2 (en) | 2010-01-12 |
WO2007142778A2 (en) | 2007-12-13 |
US20100073917A1 (en) | 2010-03-25 |
EP2025009B1 (en) | 2020-07-08 |
WO2007142778A3 (en) | 2008-02-07 |
TW200807765A (en) | 2008-02-01 |
JP4886033B2 (ja) | 2012-02-29 |
US7952115B2 (en) | 2011-05-31 |
US20070278512A1 (en) | 2007-12-06 |
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