JP2009538539A - 短パルス固体uvレーザによるマイクロマシニング - Google Patents
短パルス固体uvレーザによるマイクロマシニング Download PDFInfo
- Publication number
- JP2009538539A JP2009538539A JP2009512248A JP2009512248A JP2009538539A JP 2009538539 A JP2009538539 A JP 2009538539A JP 2009512248 A JP2009512248 A JP 2009512248A JP 2009512248 A JP2009512248 A JP 2009512248A JP 2009538539 A JP2009538539 A JP 2009538539A
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- JP
- Japan
- Prior art keywords
- laser
- pulse
- cleaning
- pad
- solder mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
- B23K2101/35—Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/14—Titanium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
- B23K2103/26—Alloys of Nickel and Cobalt and Chromium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【選択図】 図2
Description
Claims (48)
- 望ましい動作特性を有するビアの穴あけに用いられるパルスの総数を最小化することによってレーザビア穴あけスループットを高める方法であって、前記パルスの総数Nは、レーザ除去−バルク材料インタラクションによってバルク材料を除去してビアを形成するために使用されるバルク除去パルスのバルク数N0と、レーザクリーニング−材料インタラクションによってビアの底面をクリーニングするために使用される底面クリーニングパルスの底面クリーニング数δNとを含み、
フルーエンスFを有し、及びビアの底面をクリーニングするためのパルス幅τの少なくとも1つのレーザパルスを有し、δNがF/τ1/2と所定の関係を有し、δN/N0が1以下であるレーザ出力を生成する工程と、
前記レーザ出力をターゲット位置に向け、ビアの底面をクリーニングする工程とを有する方法。 - 前記δNは、Lと所定の関係を有し、fを繰返し率とし、L=(1/fτ)1/2−(1/fτ−1)1/2である請求項1記載の方法。
- 前記レーザ出力は、400ナノメートルより短い波長を有する請求項1記載の方法。
- 前記レーザ出力は、約355ナノメートル又は約351ナノメートルの波長を有する請求項1記載の方法。
- 前記レーザパルスは、1,000ピコ秒より短いパルス幅を有する請求項1記載の方法。
- 前記レーザパルスは、500ピコ秒より短いパルス幅を有する請求項1記載の方法。
- イメージ整形光学素子を用いて、レーザ出力を整形する工程を更に有する請求項1記載の方法。
- 前記ビアは、プリント配線板に穴あけされる請求項1記載の方法。
- 前記バルク材料は、均質のフィルム、粒子充填樹脂、ポリイミド又は繊維強化ポリマを含む請求項1記載の方法。
- 前記バルク材料は、金属クラッディングを含む請求項10記載の方法。
- 前記金属クラッディングは、厚さが約18ミクロン未満である請求項11記載の方法。
- 前記底面の材料は、金属を含む請求項1記載の方法。
- 前記レーザ出力は、固体レーザ又はファイバレーザによって生成される請求項1記載の方法。
- 前記レーザ出力は、レーザパンチングプロセスで使用される請求項1記載の方法。
- 前記バルク材料は、繊維強化ポリマを含み、前記ビアは、ファイバの突出が最小の側壁を有する請求項1記載の方法。
- 前記レーザ出力は、10メガヘルツ以下の繰返し率を有する請求項1記載の方法。
- 前記レーザ出力は、1メガヘルツ以下の繰返し率を有する請求項1記載の方法。
- 前記バルク材料除去及び前記底面クリーニングは、ほぼ同じフルーエンスで、異なるパルス幅を用いて実行される請求項1記載の方法。
- 前記底面クリーニングは、2ミクロンより薄い厚さの材料を除去する請求項1記載の方法。
- 前記ビア穴あけはパンチングプロセスによって達成される請求項1記載の方法。
- 前記ビア穴あけは、トレパニングプロセス、スパイラルプロセス又はループプロセスによって達成される請求項1記載の方法。
- 前記ターゲット位置のワークピースは、上位の金属層と、前記上位の金属層の下に配設されたバルク材料と、前記バルク材料の下に配設された基底にある金属層又はパッドとを含み、前記最上位の金属層は、レーザパラメータの第1の組によって除去され、前記バルク材料は、レーザパラメータの第2の組によって除去され、前記基底にある金属層は、レーザパラメータの第3の組によってクリーニングされ、前記パラメータの第1の組、第2の組及び第3の組は、異なる請求項1記載の方法。
- レーザビア穴あけのための方法において、
固体レーザを用いて、400ナノメートルより短い波長を有し、500ピコ秒より短いパルス幅を有する少なくとも1つのレーザパルスを含むレーザ出力を生成する工程と、
イメージ整形光学素子を用いて、前記レーザ出力を整形する工程と、
レーザ出力をターゲット位置に向け、ターゲット材料内にビアを形成し、クリーニングする工程とを有する方法。 - 前記バルク材料は、均質のフィルム、粒子充填樹脂、ポリイミド又は繊維強化ポリマを含む請求項24記載の方法。
- 前記バルク材料は、金属クラッディングを含む請求項25記載の方法。
- 前記金属クラッディングは、厚さが約18ミクロン未満である請求項26記載の方法。
- 前記底面の材料は、金属を含む請求項24記載の方法。
- 前記バルク材料は、レジスト材料を含む請求項24記載の方法。
- 前記レーザ出力は、10メガヘルツ以下の繰返し率を有する請求項24記載の方法。
- マスク材料で覆われたソルダパッドの表面をクリーニングする方法において、
400ナノメートルより短い波長を有し、1000ピコ秒より短いパルス幅を有する少なくとも1つのレーザパルスを含むレーザ出力を生成する工程と、
前記レーザ出力を、前記ソルダパッドを覆うマスク材料に向け、前記ソルダパッドを、ソルダリングプロセスにとって、動作的にクリーンにする工程とを有する方法。 - 前記ソルダマスク材料は、エポキシを含む請求項31記載の方法。
- 前記ソルダマスク材料は、液状現像型ソルダマスクを含む請求項31記載の方法。
- 前記ソルダマスク材料は、Coates ImageCure XV501T及びXV501TSM、Coates ImageFlex(フレキシブルソルダマスク)SV 601T、Enthone DSR 3241及びDSR 3241 GM、Rogers Rflex 8080 LP1及びRflex 8080 LP3(フレキシブル)、Taiyo PSR 4000 BN及び4000 AUS5、Taiyo PSR 9000(フレキシブル)、又はVantico Probimer 77 LPI Solder Maskを含む請求項33記載の方法。
- 前記ソルダマスク材料は、ドライフィルムソルダマスクを含む請求項31記載の方法。
- 前記ソルダマスク材料は、Dupont VACREL 8100、Dupont Flexible Photoimageable Coverlay(PIC)1000及び2000、Shipley(Dynachem)DynaMASK 5000、又はShipley ConforMASK 2500を含む請求項35記載の方法。
- 前記レーザパルスは、500ピコ秒より短いパルス幅を有する請求項31記載の方法。
- イメージ整形光学素子を用いて、前記レーザ出力を整形する工程を更に有する請求項31記載の方法。
- 前記レーザ出力は、固体レーザ又はファイバレーザによって生成される請求項31記載の方法。
- 前記レーザ出力は、レーザパンチングプロセスで使用される請求項31記載の方法。
- 前記レーザ出力は、トレパニングプロセス、スパイラルプロセス又はループプロセスにおいて使用される請求項31記載の方法。
- 前記ソルダパッドは、ソルダパッドリフティング及び/又は層割れなしで、動作的にクリーンである請求項31記載の方法。
- 前記ソルダマスク材料を除去するために用いられるパルスの総数が最小化され、前記パルスの総数Nは、レーザ除去−バルク材料インタラクションによってソルダマスク材料を除去するために使用されるバルク除去パルスのバルク数N0と、レーザクリーニング−材料インタラクションによって前記ソルダパッドの表面をクリーニングするために使用される表面クリーニングパルスの底面クリーニング数δNとを含み、前記レーザ出力は、フルーエンスFを有し、及び前記ソルダパッドの表面をクリーニングするためのパルス幅τの少なくとも1つのレーザパルスを有し、δNがF/τ1/2と所定の関係を有し、δN/N0が1以下である請求項31記載の方法。
- 前記δNは、Lと所定の関係を有し、L=(1/fτ)1/2−(1/fτ−1)1/2である請求項43記載の方法。
- 前記レーザ出力は、10メガヘルツ以下の繰返し率を有する請求項31記載の方法。
- 前記レーザ出力は、約355ナノメートル又は約351ナノメートルの波長を有する請求項31記載の方法。
- 前記ソルダパッドは、隔離されたパッドを含む請求項31記載の方法。
- ソルダパッドの表面をクリーニングするレーザシステムにおいて、
1,000ピコ秒より短いパルス幅を有する少なくとも1つのオシレータ出力パルスを含むオシレータ出力を生成するオシレータモジュールと、
前記オシレータ出力を、400ナノメートルより短い波長を有し、1000ピコ秒より短いパルス幅を有する少なくとも1つのレーザパルスを含むレーザ出力に変換する増幅モジュールと、
前記ソルダパッドを覆うソルダマスク材料のターゲット部分に前記レーザ出力を向け、前記ソルダマスク材料のターゲット部分が除去されるようにするビームポジショニングシステムとを備えるレーザシステム。
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JP2012522374A (ja) * | 2009-03-27 | 2012-09-20 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 短レーザパルスのテイラードバーストによるレーザマイクロマシニング |
JP2021181121A (ja) * | 2015-09-09 | 2021-11-25 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成 |
JP7404316B2 (ja) | 2015-09-09 | 2023-12-25 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成 |
JP2017112222A (ja) * | 2015-12-16 | 2017-06-22 | 三菱瓦斯化学株式会社 | レーザー穴あけ方法 |
WO2024005097A1 (ja) * | 2022-06-30 | 2024-01-04 | 太陽ホールディングス株式会社 | 回路基板の製造方法 |
WO2024005103A1 (ja) * | 2022-06-30 | 2024-01-04 | 太陽ホールディングス株式会社 | 回路基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101448603A (zh) | 2009-06-03 |
WO2007140168A1 (en) | 2007-12-06 |
US20100032417A1 (en) | 2010-02-11 |
KR101372437B1 (ko) | 2014-03-11 |
TWI403379B (zh) | 2013-08-01 |
US20070272667A1 (en) | 2007-11-29 |
KR20090013798A (ko) | 2009-02-05 |
US8415586B2 (en) | 2013-04-09 |
DE112007001246T5 (de) | 2009-06-04 |
US7605343B2 (en) | 2009-10-20 |
JP5816409B2 (ja) | 2015-11-18 |
CN101448603B (zh) | 2013-12-18 |
GB2452198A (en) | 2009-02-25 |
GB0822494D0 (en) | 2009-01-14 |
TW200804023A (en) | 2008-01-16 |
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