JP2009522806A - 集積回路の縦型dmosデバイス - Google Patents
集積回路の縦型dmosデバイス Download PDFInfo
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- JP2009522806A JP2009522806A JP2008549511A JP2008549511A JP2009522806A JP 2009522806 A JP2009522806 A JP 2009522806A JP 2008549511 A JP2008549511 A JP 2008549511A JP 2008549511 A JP2008549511 A JP 2008549511A JP 2009522806 A JP2009522806 A JP 2009522806A
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- wafer
- semiconductor
- integrated circuit
- dmos
- semiconductor devices
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- 239000004065 semiconductor Substances 0.000 claims abstract description 39
- 235000012431 wafers Nutrition 0.000 claims description 40
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 239000012212 insulator Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 238000002955 isolation Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000000746 body region Anatomy 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7812—Vertical DMOS transistors, i.e. VDMOS transistors with a substrate comprising an insulating layer, e.g. SOI-VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41741—Source or drain electrodes for field effect devices for vertical or pseudo-vertical devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Abstract
【解決手段】複数の半導体デバイスの少なくとも1つは、ゲート16と、その一方サイドに位置するソース電極26と、その対向サイドに位置するドレイン電極18を含む縦型伝導DMOS32である集積回路。
【選択図】図5
Description
10 IC
11 ソース領域
12 チャンネル領域
16 ゲート構造
18 ドリフト領域(ドレイン領域)
20 絶縁層
26 ソース電極
28 埋め込み酸化物層
30 絶縁壁
32 縦型伝導DMOS
33 フォトレジスト層
34 CMOS
35 開口
39 ドレイン接続(金属接点層)
Claims (16)
- それぞれが絶縁タブ内に位置する、複数の電気的に分離された半導体デバイスを含む半導体ウエファを備え、かつそれらの半導体デバイスの少なくとも1つが、ゲートと、その一方サイドに位置するソース電極と、その対向サイドに位置するドレイン電極を含む縦型伝導MOSFETであり、前記半導体ウエファは、第1のウエファと該第1のウエファに接続された第2のウエファを備え、両ウエファが珪素製であることを特徴とする集積回路。
- 複数の半導体デバイスの少なくとも1つは、CMOSである請求項1に記載の集積回路。
- 複数の半導体デバイスの全ての下に位置する埋め込み絶縁層を更に備える請求項1に記載の集積回路。
- 埋め込み絶縁層が二酸化珪素である請求項3に記載の集積回路。
- 第1のウエファ及び第2のウエファは珪素製である請求項1に記載の集積回路。
- それぞれが、ゲート、その一方サイドに位置する第1のパワー電極と、その対向サイドに位置する第2のパワー電極を含む複数のDMOSデバイスを更に備える請求項1に記載の集積回路。
- 複数の半導体デバイスの少なくとも1つは、MEMSである請求項1に記載の集積回路。
- 複数の半導体デバイスの少なくとも1つは、センサである請求項1に記載の集積回路。
- 複数の半導体デバイスの少なくとも1つは、アクチュエータである請求項1に記載の集積回路。
- 第1の半導体ウエファを第2の半導体ウエファに絶縁体を使用して接続して埋め込み絶縁体を有する単一のウエファを形成し、
前記第1の半導体ウエファ内に複数の溝を、各溝が少なくとも前記埋め込み絶縁体に達するように形成し、かつ
各溝を絶縁体で充填して絶縁壁を形成し、これにより、該絶縁壁をもって、各半導体の周囲に絶縁タブを形成する
ことを特徴とする集積回路の製造方法。 - 埋め込み絶縁体は、二酸化珪素製である請求項10に記載の方法。
- 絶縁壁は、二酸化珪素製である請求項10に記載の方法。
- 第1ウエファ及び第2ウエファは、珪素製である請求項10に記載の方法。
- 各半導体内に半導体デバイスを更に備える請求項10に記載の方法。
- 絶縁体でそれ自身を充填する前に、半導体デバイスを互いに分離するために使用する溝を形成する前に、複数の半導体デバイスを第1ウエファ内に形成することを更に含む請求項10に記載の方法。
- 縦型伝導DMOSが半導体ボディの少なくとも1つの中に形成され、該DMOSは、ゲート構造及び第1のパワー電極を含み、前記方法は、更に第2のウエファ及び埋め込み絶縁層の一部をDMOSの下から除去し、かつ第2のパワー電極を形成して、単一ウエファ内に縦型伝導DMOSを形成することを含む請求項10に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/326,009 US7525151B2 (en) | 2006-01-05 | 2006-01-05 | Vertical DMOS device in integrated circuit |
PCT/US2006/049514 WO2007081573A2 (en) | 2006-01-05 | 2006-12-29 | Vertical dmos device in integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009522806A true JP2009522806A (ja) | 2009-06-11 |
Family
ID=38223482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008549511A Pending JP2009522806A (ja) | 2006-01-05 | 2006-12-29 | 集積回路の縦型dmosデバイス |
Country Status (5)
Country | Link |
---|---|
US (1) | US7525151B2 (ja) |
EP (1) | EP1969634A4 (ja) |
JP (1) | JP2009522806A (ja) |
TW (1) | TW200735362A (ja) |
WO (1) | WO2007081573A2 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5353036B2 (ja) * | 2007-11-01 | 2013-11-27 | 富士電機株式会社 | 半導体装置の製造方法 |
KR100937599B1 (ko) * | 2007-12-17 | 2010-01-20 | 한국전자통신연구원 | 반도체 장치 및 그 형성 방법 |
KR101332228B1 (ko) * | 2008-12-26 | 2013-11-25 | 메키트 에퀴지션 코포레이션 | 전력 관리 집적 회로들을 갖는 칩 패키지들 및 관련 기술들 |
WO2012051133A2 (en) * | 2010-10-12 | 2012-04-19 | Io Semiconductor, Inc. | Vertical semiconductor device with thinned substrate |
US9159825B2 (en) | 2010-10-12 | 2015-10-13 | Silanna Semiconductor U.S.A., Inc. | Double-sided vertical semiconductor device with thinned substrate |
US9478507B2 (en) | 2013-03-27 | 2016-10-25 | Qualcomm Incorporated | Integrated circuit assembly with faraday cage |
US8748245B1 (en) | 2013-03-27 | 2014-06-10 | Io Semiconductor, Inc. | Semiconductor-on-insulator integrated circuit with interconnect below the insulator |
US9466536B2 (en) | 2013-03-27 | 2016-10-11 | Qualcomm Incorporated | Semiconductor-on-insulator integrated circuit with back side gate |
US9666703B2 (en) * | 2014-12-17 | 2017-05-30 | Great Wall Semiconductor Corporation | Semiconductor devices with cavities |
US9899527B2 (en) * | 2015-12-31 | 2018-02-20 | Globalfoundries Singapore Pte. Ltd. | Integrated circuits with gaps |
CN108946656A (zh) * | 2017-05-25 | 2018-12-07 | 联华电子股份有限公司 | 半导体制作工艺 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01128562A (ja) * | 1987-11-13 | 1989-05-22 | Nissan Motor Co Ltd | 半導体装置 |
JPH05109882A (ja) * | 1991-10-14 | 1993-04-30 | Nippondenso Co Ltd | 半導体装置の製造方法 |
US5356822A (en) * | 1994-01-21 | 1994-10-18 | Alliedsignal Inc. | Method for making all complementary BiCDMOS devices |
JP2001060634A (ja) * | 1999-08-20 | 2001-03-06 | Denso Corp | 半導体装置およびその製造方法 |
JP2001345377A (ja) * | 2000-06-01 | 2001-12-14 | Unisia Jecs Corp | 半導体装置 |
JP2002100672A (ja) * | 2000-09-21 | 2002-04-05 | Nec Corp | 素子分離用トレンチの形成方法 |
JP2004134762A (ja) * | 2002-09-19 | 2004-04-30 | Denso Corp | 半導体装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2788269B2 (ja) * | 1988-02-08 | 1998-08-20 | 株式会社東芝 | 半導体装置およびその製造方法 |
US5171699A (en) * | 1990-10-03 | 1992-12-15 | Texas Instruments Incorporated | Vertical DMOS transistor structure built in an N-well CMOS-based BiCMOS process and method of fabrication |
DE19816245A1 (de) * | 1998-04-11 | 1999-10-21 | Fraunhofer Ges Forschung | Verfahren zur Kontaktierung eines elektrischen Bauelements und elektrisches Bauelement |
DE19823768A1 (de) * | 1998-05-28 | 1999-12-02 | Bosch Gmbh Robert | Smartpower-Bauelement |
EP1319252B1 (en) * | 2000-09-21 | 2012-02-15 | Cambridge Semiconductor Limited | Semiconductor device and method of forming a semiconductor device |
EP1717195B1 (en) * | 2001-11-09 | 2011-09-14 | WiSpry, Inc. | Trilayered beam MEMS switch and related method |
US6861341B2 (en) * | 2002-02-22 | 2005-03-01 | Xerox Corporation | Systems and methods for integration of heterogeneous circuit devices |
US6902872B2 (en) * | 2002-07-29 | 2005-06-07 | Hewlett-Packard Development Company, L.P. | Method of forming a through-substrate interconnect |
-
2006
- 2006-01-05 US US11/326,009 patent/US7525151B2/en active Active
- 2006-12-29 EP EP06848295A patent/EP1969634A4/en not_active Withdrawn
- 2006-12-29 WO PCT/US2006/049514 patent/WO2007081573A2/en active Application Filing
- 2006-12-29 JP JP2008549511A patent/JP2009522806A/ja active Pending
-
2007
- 2007-01-04 TW TW096100300A patent/TW200735362A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01128562A (ja) * | 1987-11-13 | 1989-05-22 | Nissan Motor Co Ltd | 半導体装置 |
JPH05109882A (ja) * | 1991-10-14 | 1993-04-30 | Nippondenso Co Ltd | 半導体装置の製造方法 |
US5356822A (en) * | 1994-01-21 | 1994-10-18 | Alliedsignal Inc. | Method for making all complementary BiCDMOS devices |
JP2001060634A (ja) * | 1999-08-20 | 2001-03-06 | Denso Corp | 半導体装置およびその製造方法 |
JP2001345377A (ja) * | 2000-06-01 | 2001-12-14 | Unisia Jecs Corp | 半導体装置 |
JP2002100672A (ja) * | 2000-09-21 | 2002-04-05 | Nec Corp | 素子分離用トレンチの形成方法 |
JP2004134762A (ja) * | 2002-09-19 | 2004-04-30 | Denso Corp | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2007081573A2 (en) | 2007-07-19 |
TW200735362A (en) | 2007-09-16 |
US7525151B2 (en) | 2009-04-28 |
WO2007081573B1 (en) | 2008-08-14 |
EP1969634A4 (en) | 2011-04-20 |
WO2007081573A3 (en) | 2008-06-19 |
US20070152269A1 (en) | 2007-07-05 |
EP1969634A2 (en) | 2008-09-17 |
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