JP2009517541A5 - - Google Patents
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- Publication number
- JP2009517541A5 JP2009517541A5 JP2008541731A JP2008541731A JP2009517541A5 JP 2009517541 A5 JP2009517541 A5 JP 2009517541A5 JP 2008541731 A JP2008541731 A JP 2008541731A JP 2008541731 A JP2008541731 A JP 2008541731A JP 2009517541 A5 JP2009517541 A5 JP 2009517541A5
- Authority
- JP
- Japan
- Prior art keywords
- gas
- floor
- process chamber
- inlet part
- gas inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 14
- 238000005452 bending Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 230000000284 resting effect Effects 0.000 claims 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005056320.1 | 2005-11-25 | ||
| DE102005056320A DE102005056320A1 (de) | 2005-11-25 | 2005-11-25 | CVD-Reaktor mit einem Gaseinlassorgan |
| PCT/EP2006/068716 WO2007060161A1 (de) | 2005-11-25 | 2006-11-21 | Cvd-reaktor mit einem gaseinlassorgan |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009517541A JP2009517541A (ja) | 2009-04-30 |
| JP2009517541A5 true JP2009517541A5 (https=) | 2012-09-20 |
| JP5148501B2 JP5148501B2 (ja) | 2013-02-20 |
Family
ID=37681372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008541731A Active JP5148501B2 (ja) | 2005-11-25 | 2006-11-21 | ガス入口部品を有するcvd反応装置 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8152924B2 (https=) |
| EP (1) | EP1954853B1 (https=) |
| JP (1) | JP5148501B2 (https=) |
| KR (1) | KR101354106B1 (https=) |
| AT (1) | ATE531833T1 (https=) |
| DE (1) | DE102005056320A1 (https=) |
| TW (1) | TWI414624B (https=) |
| WO (1) | WO2007060161A1 (https=) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101802254B (zh) | 2007-10-11 | 2013-11-27 | 瓦伦斯处理设备公司 | 化学气相沉积反应器 |
| DE102008055582A1 (de) | 2008-12-23 | 2010-06-24 | Aixtron Ag | MOCVD-Reaktor mit zylindrischem Gaseinlassorgan |
| JP5324347B2 (ja) * | 2009-07-15 | 2013-10-23 | 大陽日酸イー・エム・シー株式会社 | 気相成長装置 |
| DE102009043960A1 (de) | 2009-09-08 | 2011-03-10 | Aixtron Ag | CVD-Reaktor |
| JP5409413B2 (ja) * | 2010-01-26 | 2014-02-05 | 日本パイオニクス株式会社 | Iii族窒化物半導体の気相成長装置 |
| DE202011103798U1 (de) * | 2011-07-28 | 2012-10-29 | Michael Harro Liese | Schnellverschluss für Reaktoren und Konvertoren |
| DE102011053498A1 (de) | 2011-09-12 | 2013-03-14 | Aixtron Se | Verfahren und Vorrichtung zur Ermittlung der Verformung eines Substrates |
| DE102011055061A1 (de) * | 2011-11-04 | 2013-05-08 | Aixtron Se | CVD-Reaktor bzw. Substrathalter für einen CVD-Reaktor |
| DE102011056538A1 (de) | 2011-12-16 | 2013-06-20 | Aixtron Se | Verfahren zum Entfernen unerwünschter Rückstände aus einem MOCVD-Reaktor sowie zugehörige Vorrichtung |
| TWI565825B (zh) * | 2012-06-07 | 2017-01-11 | 索泰克公司 | 沉積系統之氣體注入組件及相關使用方法 |
| US9388494B2 (en) | 2012-06-25 | 2016-07-12 | Novellus Systems, Inc. | Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate region |
| US20150345046A1 (en) * | 2012-12-27 | 2015-12-03 | Showa Denko K.K. | Film-forming device |
| US20160194753A1 (en) * | 2012-12-27 | 2016-07-07 | Showa Denko K.K. | SiC-FILM FORMATION DEVICE AND METHOD FOR PRODUCING SiC FILM |
| US9399228B2 (en) * | 2013-02-06 | 2016-07-26 | Novellus Systems, Inc. | Method and apparatus for purging and plasma suppression in a process chamber |
| TWI654333B (zh) | 2013-12-18 | 2019-03-21 | 美商蘭姆研究公司 | 具有均勻性折流板之半導體基板處理設備 |
| KR102372893B1 (ko) * | 2014-12-04 | 2022-03-10 | 삼성전자주식회사 | 발광 소자 제조용 화학 기상 증착 장치 |
| DE102015101343A1 (de) | 2015-01-29 | 2016-08-18 | Aixtron Se | CVD-Reaktor mit dreidimensional strukturierter Prozesskammerdecke |
| DE102015101462A1 (de) * | 2015-02-02 | 2016-08-04 | Aixtron Se | Verfahren und Vorrichtung zum Abscheiden einer III-V-Halbleiterschicht |
| US9758868B1 (en) | 2016-03-10 | 2017-09-12 | Lam Research Corporation | Plasma suppression behind a showerhead through the use of increased pressure |
| TWI624561B (zh) * | 2016-08-12 | 2018-05-21 | 漢民科技股份有限公司 | 用於半導體製程之氣體噴射器及成膜裝置 |
| TWI649446B (zh) * | 2017-03-15 | 2019-02-01 | 漢民科技股份有限公司 | 應用於半導體設備之可拆卸式噴氣裝置 |
| TWI633585B (zh) * | 2017-03-31 | 2018-08-21 | 漢民科技股份有限公司 | 用於半導體製程之氣體噴射器與頂板之組合及成膜裝置 |
| KR102369676B1 (ko) | 2017-04-10 | 2022-03-04 | 삼성디스플레이 주식회사 | 표시 장치의 제조장치 및 표시 장치의 제조방법 |
| KR102935543B1 (ko) | 2019-07-17 | 2026-03-05 | 램 리써치 코포레이션 | 기판 프로세싱을 위한 산화 프로파일의 변조 |
| DE102019131794A1 (de) * | 2019-11-25 | 2021-05-27 | Aixtron Se | Wandgekühltes Gaseinlassorgan für einen CVD-Reaktor |
| DE102021103245A1 (de) * | 2021-02-11 | 2022-08-11 | Aixtron Se | CVD-Reaktor mit einem in einer Vorlaufzone ansteigenden Prozesskammerboden |
| TR2022000837A2 (tr) * | 2022-01-24 | 2023-08-21 | Tobb Ekonomi Ve Teknoloji Ueniversitesi | Bi̇r reaktör |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1913676A1 (de) * | 1969-03-18 | 1970-09-24 | Siemens Ag | Verfahren zum Abscheiden von Schichten aus halbleitendem bzw. isolierendem Material aus einem stroemenden Reaktionsgas auf erhitzte Halbleiterkristalle bzw. zum Dotieren solcher Kristalle aus einem stroemenden dotierenden Gas |
| US3783822A (en) * | 1972-05-10 | 1974-01-08 | J Wollam | Apparatus for use in deposition of films from a vapor phase |
| JPS5046273A (https=) * | 1973-08-30 | 1975-04-24 | ||
| JPS51140889A (en) * | 1975-05-30 | 1976-12-04 | Hitachi Ltd | A vapor phase growth apparatus |
| US4421786A (en) * | 1981-01-23 | 1983-12-20 | Western Electric Co. | Chemical vapor deposition reactor for silicon epitaxial processes |
| JPS6119119A (ja) * | 1984-07-06 | 1986-01-28 | Nec Corp | 気相成長装置 |
| JPS62131523A (ja) * | 1985-12-03 | 1987-06-13 | Hitachi Electronics Eng Co Ltd | Cvd薄膜形成装置 |
| US4976996A (en) * | 1987-02-17 | 1990-12-11 | Lam Research Corporation | Chemical vapor deposition reactor and method of use thereof |
| US5244694A (en) * | 1987-06-24 | 1993-09-14 | Advanced Semiconductor Materials America, Inc. | Apparatus for improving the reactant gas flow in a reaction chamber |
| US5221556A (en) * | 1987-06-24 | 1993-06-22 | Epsilon Technology, Inc. | Gas injectors for reaction chambers in CVD systems |
| JPH06310438A (ja) * | 1993-04-22 | 1994-11-04 | Mitsubishi Electric Corp | 化合物半導体気相成長用基板ホルダおよび化合物半導体気相成長装置 |
| JP3414475B2 (ja) * | 1994-02-25 | 2003-06-09 | スタンレー電気株式会社 | 結晶成長装置 |
| JP3042335B2 (ja) * | 1994-10-25 | 2000-05-15 | 信越半導体株式会社 | 気相成長方法及びその装置 |
| US6093252A (en) * | 1995-08-03 | 2000-07-25 | Asm America, Inc. | Process chamber with inner support |
| JPH09246192A (ja) * | 1996-03-05 | 1997-09-19 | Nissin Electric Co Ltd | 薄膜気相成長装置 |
| WO1999045167A1 (en) * | 1998-03-06 | 1999-09-10 | Asm America, Inc. | Method of depositing silicon with high step coverage |
| EP1125321B1 (en) * | 1999-06-19 | 2007-08-15 | ASM Genitech Korea Ltd. | Chemical deposition reactor and method of forming a thin film using the same |
| DE60003850T2 (de) * | 1999-12-22 | 2004-03-11 | Aixtron Ag | Cvd reaktor und prozesskammer dafür |
| DE10064944A1 (de) * | 2000-09-22 | 2002-04-11 | Aixtron Ag | Verfahren zum Abscheiden von insbesondere kristallinen Schichten, Gaseinlassorgan sowie Vorrichtung zur Durchführung des Verfahrens |
| DE10064941A1 (de) * | 2000-09-22 | 2002-04-11 | Aixtron Ag | Gaseinlassorgan |
| AU2001283944A1 (en) * | 2000-09-22 | 2002-04-02 | Aixtron Ag | Gas inlet mechanism for cvd-method and device |
| DE10057134A1 (de) * | 2000-11-17 | 2002-05-23 | Aixtron Ag | Verfahren zum Abscheiden von insbesondere kristallinen Schichten sowie Vorrichtung zur Durchführung des Verfahrens |
| DE10064942A1 (de) * | 2000-12-23 | 2002-07-04 | Aixtron Ag | Verfahren zum Abscheiden insbesondere kristalliner Schichten |
| US6915964B2 (en) * | 2001-04-24 | 2005-07-12 | Innovative Technology, Inc. | System and process for solid-state deposition and consolidation of high velocity powder particles using thermal plastic deformation |
| DE10133914A1 (de) * | 2001-07-12 | 2003-01-23 | Aixtron Ag | Prozesskammer mit abschnittsweise unterschiedlich drehangetriebenem Boden und Schichtabscheideverfahren in einer derartigen Prozesskammer |
| US6849306B2 (en) * | 2001-08-23 | 2005-02-01 | Konica Corporation | Plasma treatment method at atmospheric pressure |
| DE10153463A1 (de) | 2001-10-30 | 2003-05-15 | Aixtron Ag | Verfahren und Vorrichtung zum Abscheiden insbesondere kristalliner Schichten auf insbesondere kristallinen Substraten |
| DE10247921A1 (de) * | 2002-10-10 | 2004-04-22 | Aixtron Ag | Hydrid VPE Reaktor |
| JP2004200225A (ja) * | 2002-12-16 | 2004-07-15 | Sharp Corp | 気相成長装置 |
| JP2005072314A (ja) * | 2003-08-26 | 2005-03-17 | Sharp Corp | 気相成長装置および気相成長方法 |
| JP4542860B2 (ja) * | 2004-10-04 | 2010-09-15 | 大陽日酸株式会社 | 気相成長装置 |
| JP4542859B2 (ja) * | 2004-10-04 | 2010-09-15 | 大陽日酸株式会社 | 気相成長装置 |
| JP4598568B2 (ja) * | 2005-03-09 | 2010-12-15 | 大陽日酸株式会社 | 気相成長装置 |
-
2005
- 2005-11-25 DE DE102005056320A patent/DE102005056320A1/de not_active Withdrawn
-
2006
- 2006-11-11 US US12/094,972 patent/US8152924B2/en active Active
- 2006-11-21 WO PCT/EP2006/068716 patent/WO2007060161A1/de not_active Ceased
- 2006-11-21 AT AT06830064T patent/ATE531833T1/de active
- 2006-11-21 JP JP2008541731A patent/JP5148501B2/ja active Active
- 2006-11-21 EP EP06830064A patent/EP1954853B1/de active Active
- 2006-11-21 KR KR1020087015426A patent/KR101354106B1/ko active Active
- 2006-11-24 TW TW095143509A patent/TWI414624B/zh active
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