JP2009505386A5 - - Google Patents
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- Publication number
- JP2009505386A5 JP2009505386A5 JP2008525534A JP2008525534A JP2009505386A5 JP 2009505386 A5 JP2009505386 A5 JP 2009505386A5 JP 2008525534 A JP2008525534 A JP 2008525534A JP 2008525534 A JP2008525534 A JP 2008525534A JP 2009505386 A5 JP2009505386 A5 JP 2009505386A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- formation
- partial
- substrate
- protective layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 50
- 239000011241 protective layer Substances 0.000 claims description 18
- 230000015572 biosynthetic process Effects 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 8
- 229910010272 inorganic material Inorganic materials 0.000 claims description 8
- 239000011147 inorganic material Substances 0.000 claims description 8
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 16
- 238000004519 manufacturing process Methods 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 12
- 229910052751 metal Inorganic materials 0.000 claims 10
- 239000002184 metal Substances 0.000 claims 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 4
- 239000011368 organic material Substances 0.000 claims 4
- 239000004033 plastic Substances 0.000 claims 4
- 229920003023 plastic Polymers 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 239000004696 Poly ether ether ketone Substances 0.000 claims 2
- 239000004952 Polyamide Substances 0.000 claims 2
- 239000004698 Polyethylene Substances 0.000 claims 2
- 239000004642 Polyimide Substances 0.000 claims 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 150000002118 epoxides Chemical class 0.000 claims 2
- 239000012778 molding material Substances 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 239000012044 organic layer Substances 0.000 claims 2
- 229920000052 poly(p-xylylene) Polymers 0.000 claims 2
- 229920002647 polyamide Polymers 0.000 claims 2
- 229920002530 polyetherether ketone Polymers 0.000 claims 2
- -1 polyethylene Polymers 0.000 claims 2
- 229920000573 polyethylene Polymers 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 150000008442 polyphenolic compounds Chemical class 0.000 claims 2
- 235000013824 polyphenols Nutrition 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- 238000005234 chemical deposition Methods 0.000 claims 1
- 238000009388 chemical precipitation Methods 0.000 claims 1
- 238000005229 chemical vapour deposition Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000000608 laser ablation Methods 0.000 claims 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 claims 1
- 238000010297 mechanical methods and process Methods 0.000 claims 1
- 238000000206 photolithography Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005037869A DE102005037869B4 (de) | 2005-08-10 | 2005-08-10 | Anordnung zur hermetischen Abdichtung von Bauelementen und Verfahren zu deren Herstellung |
| DE102005037869.2 | 2005-08-10 | ||
| PCT/EP2006/064787 WO2007017404A2 (de) | 2005-08-10 | 2006-07-28 | Anordnung zur hermetischen abdichtung von bauelementen und verfahren zu deren herstellung |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009505386A JP2009505386A (ja) | 2009-02-05 |
| JP2009505386A5 true JP2009505386A5 (enExample) | 2012-11-15 |
| JP5174664B2 JP5174664B2 (ja) | 2013-04-03 |
Family
ID=37681045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008525534A Expired - Fee Related JP5174664B2 (ja) | 2005-08-10 | 2006-07-28 | 密閉用のパッケージ及びパッケージの製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7897881B2 (enExample) |
| JP (1) | JP5174664B2 (enExample) |
| DE (1) | DE102005037869B4 (enExample) |
| WO (1) | WO2007017404A2 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007036045A1 (de) * | 2007-08-01 | 2009-02-05 | Siemens Ag | Elektronischer Baustein mit zumindest einem Bauelement, insbesondere einem Halbleiterbauelement, und Verfahren zu dessen Herstellung |
| US20090091005A1 (en) * | 2007-10-09 | 2009-04-09 | Huang Chung-Er | Shielding structure for semiconductors and manufacturing method therefor |
| DE102008031231B4 (de) | 2008-07-02 | 2012-12-27 | Siemens Aktiengesellschaft | Herstellungsverfahren für planare elektronsche Leistungselektronik-Module für Hochtemperatur-Anwendungen und entsprechendes Leistungselektronik-Modul |
| EP2161974A1 (de) * | 2008-09-09 | 2010-03-10 | Hegutechnik v. Gutwald KG | Bifunktionale EMV Beschichtung |
| US20110270028A1 (en) * | 2010-04-30 | 2011-11-03 | Allergan, Inc. | Biocompatible and biostable implantable medical device |
| US20120188727A1 (en) * | 2011-01-24 | 2012-07-26 | ADL Engineering Inc. | EMI Shielding in a Package Module |
| US9064883B2 (en) * | 2011-08-25 | 2015-06-23 | Intel Mobile Communications GmbH | Chip with encapsulated sides and exposed surface |
| DE102011112476A1 (de) * | 2011-09-05 | 2013-03-07 | Epcos Ag | Bauelement und Verfahren zum Herstellen eines Bauelements |
| CN102548239A (zh) * | 2012-01-09 | 2012-07-04 | 华为终端有限公司 | 一种电路板的制作方法、电路板和电子设备 |
| US9146207B2 (en) | 2012-01-10 | 2015-09-29 | Hzo, Inc. | Methods, apparatuses and systems for sensing exposure of electronic devices to moisture |
| AU2013208273B2 (en) | 2012-01-10 | 2015-11-26 | Hzo, Inc. | Methods, apparatuses and systems for monitoring for exposure of electronic devices to moisture and reacting to exposure of electronic devices to moisture |
| US10449568B2 (en) | 2013-01-08 | 2019-10-22 | Hzo, Inc. | Masking substrates for application of protective coatings |
| US9894776B2 (en) | 2013-01-08 | 2018-02-13 | Hzo, Inc. | System for refurbishing or remanufacturing an electronic device |
| BR112014005790A2 (pt) | 2013-01-08 | 2017-03-28 | Hzo Inc | remoção de partes selecionadas de revestimentos de proteção de substratos |
| CN103594434B (zh) * | 2013-10-23 | 2017-12-29 | 广东明路电力电子有限公司 | 带复合散热层的功率部件 |
| ES2909452T3 (es) * | 2014-10-14 | 2022-05-06 | Carel Ind Spa | Dispositivo de control para sistemas de refrigeración y acondicionamiento |
| DE102014115565B3 (de) | 2014-10-27 | 2015-10-22 | Semikron Elektronik Gmbh & Co. Kg | Verfahren zur Herstellung einer Schalteinrichtung mit einer feuchtigkeitsdichten und elektrisch isolierenden Abdeckung und zur Herstellung einer Anordnung hiermit |
| JP2019012722A (ja) * | 2017-06-29 | 2019-01-24 | 株式会社ケーヒン | 制御回路装置 |
| US11034068B2 (en) * | 2018-04-30 | 2021-06-15 | Raytheon Company | Encapsulating electronics in high-performance thermoplastics |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6218739A (ja) | 1985-07-18 | 1987-01-27 | Sumitomo Electric Ind Ltd | 混成集積回路 |
| US5051275A (en) * | 1989-11-09 | 1991-09-24 | At&T Bell Laboratories | Silicone resin electronic device encapsulant |
| US5439849A (en) | 1994-02-02 | 1995-08-08 | At&T Corp. | Encapsulation techniques which include forming a thin glass layer onto a polymer layer |
| US5639989A (en) * | 1994-04-19 | 1997-06-17 | Motorola Inc. | Shielded electronic component assembly and method for making the same |
| US5811050A (en) * | 1994-06-06 | 1998-09-22 | Gabower; John F. | Electromagnetic interference shield for electronic devices |
| JPH1050763A (ja) * | 1996-07-30 | 1998-02-20 | Matsushita Electric Ind Co Ltd | 電子部品実装方法と電子部品実装基板 |
| FR2799883B1 (fr) * | 1999-10-15 | 2003-05-30 | Thomson Csf | Procede d'encapsulation de composants electroniques |
| TW517368B (en) * | 2002-01-22 | 2003-01-11 | Via Tech Inc | Manufacturing method of the passivation metal on the surface of integrated circuit |
| JP2003243704A (ja) * | 2002-02-07 | 2003-08-29 | Lumileds Lighting Us Llc | 発光半導体デバイス及び方法 |
| US6781231B2 (en) * | 2002-09-10 | 2004-08-24 | Knowles Electronics Llc | Microelectromechanical system package with environmental and interference shield |
| JP2004193517A (ja) * | 2002-12-13 | 2004-07-08 | Seiko Epson Corp | 半導体チップ、半導体チップの製造方法、半導体実装基板、電子デバイスおよび電子機器 |
| US7451539B2 (en) * | 2005-08-08 | 2008-11-18 | Rf Micro Devices, Inc. | Method of making a conformal electromagnetic interference shield |
| US8004860B2 (en) * | 2006-08-29 | 2011-08-23 | Texas Instruments Incorporated | Radiofrequency and electromagnetic interference shielding |
-
2005
- 2005-08-10 DE DE102005037869A patent/DE102005037869B4/de not_active Expired - Fee Related
-
2006
- 2006-07-28 WO PCT/EP2006/064787 patent/WO2007017404A2/de not_active Ceased
- 2006-07-28 JP JP2008525534A patent/JP5174664B2/ja not_active Expired - Fee Related
- 2006-07-28 US US11/990,263 patent/US7897881B2/en not_active Expired - Fee Related
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