JP2010500606A5 - - Google Patents
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- JP2010500606A5 JP2010500606A5 JP2009523184A JP2009523184A JP2010500606A5 JP 2010500606 A5 JP2010500606 A5 JP 2010500606A5 JP 2009523184 A JP2009523184 A JP 2009523184A JP 2009523184 A JP2009523184 A JP 2009523184A JP 2010500606 A5 JP2010500606 A5 JP 2010500606A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- carrier substrate
- layer
- positional relationship
- multilayer body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102006037433.9 | 2006-08-09 | ||
| DE102006037433A DE102006037433B4 (de) | 2006-08-09 | 2006-08-09 | Verfahren zur Herstellung eines Mehrschichtkörpers sowie Mehrschichtkörper |
| PCT/EP2007/006884 WO2008017426A1 (de) | 2006-08-09 | 2007-08-03 | Verfahren zur herstellung mindestens eines mehrschichtkörpers sowie mehrschichtkörper |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010500606A JP2010500606A (ja) | 2010-01-07 |
| JP2010500606A5 true JP2010500606A5 (enExample) | 2010-09-09 |
| JP4944200B2 JP4944200B2 (ja) | 2012-05-30 |
Family
ID=38608712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009523184A Expired - Fee Related JP4944200B2 (ja) | 2006-08-09 | 2007-08-03 | 少なくとも一つの多層体の製造プロセスと多層体 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8129217B2 (enExample) |
| EP (1) | EP2050150B1 (enExample) |
| JP (1) | JP4944200B2 (enExample) |
| DE (1) | DE102006037433B4 (enExample) |
| DK (1) | DK2050150T3 (enExample) |
| WO (1) | WO2008017426A1 (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101260981B1 (ko) | 2004-06-04 | 2013-05-10 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 인쇄가능한 반도체소자들의 제조 및 조립방법과 장치 |
| US7799699B2 (en) | 2004-06-04 | 2010-09-21 | The Board Of Trustees Of The University Of Illinois | Printable semiconductor structures and related methods of making and assembling |
| JP5319533B2 (ja) | 2006-09-20 | 2013-10-16 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | 転写可能な半導体構造、デバイス、及びデバイスコンポーネントを作成するための剥離方法 |
| CN105826345B (zh) | 2007-01-17 | 2018-07-31 | 伊利诺伊大学评议会 | 通过基于印刷的组装制造的光学系统 |
| US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| EP2349440B1 (en) | 2008-10-07 | 2019-08-21 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| US8372726B2 (en) | 2008-10-07 | 2013-02-12 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
| CA2756840C (en) | 2009-03-30 | 2018-10-23 | Boegli-Gravures S.A. | Method and device for structuring the surface of a hard material coated solid body by means of a laser |
| PL2414131T3 (pl) * | 2009-03-30 | 2015-10-30 | Boegli Gravures Sa | Sposób i urządzenie do tworzenia struktury na powierzchni ciała stałego o twardej powłoce laserem z wykorzystaniem maski i przysłony |
| EP2430652B1 (en) | 2009-05-12 | 2019-11-20 | The Board of Trustees of the University of Illionis | Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays |
| WO2011041727A1 (en) | 2009-10-01 | 2011-04-07 | Mc10, Inc. | Protective cases with integrated electronics |
| US9936574B2 (en) | 2009-12-16 | 2018-04-03 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
| WO2011084450A1 (en) | 2009-12-16 | 2011-07-14 | The Board Of Trustees Of The University Of Illinois | Electrophysiology in-vivo using conformal electronics |
| US10441185B2 (en) | 2009-12-16 | 2019-10-15 | The Board Of Trustees Of The University Of Illinois | Flexible and stretchable electronic systems for epidermal electronics |
| CN102892356B (zh) | 2010-03-17 | 2016-01-13 | 伊利诺伊大学评议会 | 基于生物可吸收基质的可植入生物医学装置 |
| US9442285B2 (en) | 2011-01-14 | 2016-09-13 | The Board Of Trustees Of The University Of Illinois | Optical component array having adjustable curvature |
| KR20140019341A (ko) * | 2011-03-03 | 2014-02-14 | 올싸거널 인코포레이티드 | 박막 장치에서 재료를 패터닝하는 공정 |
| WO2012158709A1 (en) | 2011-05-16 | 2012-11-22 | The Board Of Trustees Of The University Of Illinois | Thermally managed led arrays assembled by printing |
| KR102000302B1 (ko) | 2011-05-27 | 2019-07-15 | 엠씨10, 인크 | 전자, 광학, 및/또는 기계 장치 및 시스템, 그리고 이를 제조하기 위한 방법 |
| US8934965B2 (en) | 2011-06-03 | 2015-01-13 | The Board Of Trustees Of The University Of Illinois | Conformable actively multiplexed high-density surface electrode array for brain interfacing |
| HK1204205A1 (en) | 2011-12-01 | 2015-11-06 | The Board Of Trustees Of The University Of Illinois | Transient devices designed to undergo programmable transformations |
| JP2015521303A (ja) | 2012-03-30 | 2015-07-27 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシ | 表面への形状適合可能な付属物装着可能電子デバイス |
| DE102012108170B4 (de) * | 2012-09-03 | 2015-01-22 | Bundesdruckerei Gmbh | Sicherheitselement und Verfahren zur Herstellung eines Sicherheitselements |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| MX2017015587A (es) | 2015-06-01 | 2018-08-23 | Univ Illinois | Metodo alternativo para sensor uv. |
| WO2016196675A1 (en) | 2015-06-01 | 2016-12-08 | The Board Of Trustees Of The University Of Illinois | Miniaturized electronic systems with wireless power and near-field communication capabilities |
| US10925543B2 (en) | 2015-11-11 | 2021-02-23 | The Board Of Trustees Of The University Of Illinois | Bioresorbable silicon electronics for transient implants |
| EP3985715A4 (en) * | 2020-06-01 | 2022-11-09 | Changxin Memory Technologies, Inc. | Design method for wafer layout and lithography machine exposure system |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3829213A (en) * | 1972-06-02 | 1974-08-13 | Mos Technology Inc | Artproof method for semiconductor devices |
| US4374911A (en) * | 1978-04-28 | 1983-02-22 | International Business Machines Corporation | Photo method of making tri-level density photomask |
| GB9404675D0 (en) * | 1994-03-11 | 1994-04-27 | Dow Corning Sa | Foils |
| US5932397A (en) * | 1996-05-28 | 1999-08-03 | Rvm Scientific, Inc. | Multicolor lithography for control of three dimensional refractive index gradient processing |
| US6133933A (en) * | 1997-01-13 | 2000-10-17 | Xerox Corporation | Color Xerographic printing system with multicolor printbar |
| US6255130B1 (en) * | 1998-11-19 | 2001-07-03 | Samsung Electronics Co., Ltd. | Thin film transistor array panel and a method for manufacturing the same |
| JP2003515782A (ja) * | 1999-12-02 | 2003-05-07 | ジェムファイア コーポレイション | 光デバイスの光画定 |
| US6569580B2 (en) * | 2001-03-13 | 2003-05-27 | Diverging Technologies, Inc. | Binary and phase-shift photomasks |
| US20020195928A1 (en) * | 2001-06-25 | 2002-12-26 | Grace Anthony J. | Electroluminescent display device and method of making |
| US7160649B2 (en) * | 2002-07-11 | 2007-01-09 | Hitachi Via Mechanics, Ltd. | Gray level imaging masks, optical imaging apparatus for gray level imaging masks and methods for encoding mask and use of the masks |
| KR20050109963A (ko) * | 2003-03-07 | 2005-11-22 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 전자 장치 제조 방법 |
| JP3746497B2 (ja) * | 2003-06-24 | 2006-02-15 | 松下電器産業株式会社 | フォトマスク |
| DE10349963A1 (de) * | 2003-10-24 | 2005-06-02 | Leonhard Kurz Gmbh & Co. Kg | Verfahren zur Herstellung einer Folie |
| DE102004059467A1 (de) * | 2004-12-10 | 2006-07-20 | Polyic Gmbh & Co. Kg | Gatter aus organischen Feldeffekttransistoren |
| DE102004059798A1 (de) * | 2004-12-10 | 2006-06-29 | Ovd Kinegram Ag | Optisch variables Element mit elektrisch aktiver Schicht |
| JP4769544B2 (ja) * | 2005-10-28 | 2011-09-07 | Ｈｏｙａ株式会社 | 二次鋳型の製造方法 |
| US8906490B2 (en) * | 2006-05-19 | 2014-12-09 | Eastman Kodak Company | Multicolor mask |
-
2006
- 2006-08-09 DE DE102006037433A patent/DE102006037433B4/de not_active Expired - Fee Related
-
2007
- 2007-08-03 JP JP2009523184A patent/JP4944200B2/ja not_active Expired - Fee Related
- 2007-08-03 US US12/309,908 patent/US8129217B2/en not_active Expired - Fee Related
- 2007-08-03 DK DK07801506.2T patent/DK2050150T3/da active
- 2007-08-03 WO PCT/EP2007/006884 patent/WO2008017426A1/de not_active Ceased
- 2007-08-03 EP EP07801506.2A patent/EP2050150B1/de not_active Not-in-force
-
2012
- 2012-01-25 US US13/358,007 patent/US8502213B2/en not_active Expired - Fee Related
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