DK2050150T3 - Fremgangsmåde til fremstilling af mindst én flerlagsgenstand samt flerlagsgenstand - Google Patents

Fremgangsmåde til fremstilling af mindst én flerlagsgenstand samt flerlagsgenstand

Info

Publication number
DK2050150T3
DK2050150T3 DK07801506.2T DK07801506T DK2050150T3 DK 2050150 T3 DK2050150 T3 DK 2050150T3 DK 07801506 T DK07801506 T DK 07801506T DK 2050150 T3 DK2050150 T3 DK 2050150T3
Authority
DK
Denmark
Prior art keywords
multilayer article
producing
multilayer
article
Prior art date
Application number
DK07801506.2T
Other languages
Danish (da)
English (en)
Inventor
Gernot Schneider
Rene Staub
Wayne Robert Tompkin
Achim Hansen
Original Assignee
Ovd Kinegram Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ovd Kinegram Ag filed Critical Ovd Kinegram Ag
Application granted granted Critical
Publication of DK2050150T3 publication Critical patent/DK2050150T3/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/464—Lateral top-gate IGFETs comprising only a single gate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electroluminescent Light Sources (AREA)
DK07801506.2T 2006-08-09 2007-08-03 Fremgangsmåde til fremstilling af mindst én flerlagsgenstand samt flerlagsgenstand DK2050150T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006037433A DE102006037433B4 (de) 2006-08-09 2006-08-09 Verfahren zur Herstellung eines Mehrschichtkörpers sowie Mehrschichtkörper
PCT/EP2007/006884 WO2008017426A1 (de) 2006-08-09 2007-08-03 Verfahren zur herstellung mindestens eines mehrschichtkörpers sowie mehrschichtkörper

Publications (1)

Publication Number Publication Date
DK2050150T3 true DK2050150T3 (da) 2013-07-22

Family

ID=38608712

Family Applications (1)

Application Number Title Priority Date Filing Date
DK07801506.2T DK2050150T3 (da) 2006-08-09 2007-08-03 Fremgangsmåde til fremstilling af mindst én flerlagsgenstand samt flerlagsgenstand

Country Status (6)

Country Link
US (2) US8129217B2 (enExample)
EP (1) EP2050150B1 (enExample)
JP (1) JP4944200B2 (enExample)
DE (1) DE102006037433B4 (enExample)
DK (1) DK2050150T3 (enExample)
WO (1) WO2008017426A1 (enExample)

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KR101588019B1 (ko) * 2006-09-20 2016-02-12 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들
CN105826345B (zh) 2007-01-17 2018-07-31 伊利诺伊大学评议会 通过基于印刷的组装制造的光学系统
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
EP2349440B1 (en) 2008-10-07 2019-08-21 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
JP5523549B2 (ja) * 2009-03-30 2014-06-18 ボエグリ − グラビュル ソシエテ アノニム 硬質材料をコーティングされた固体表面をレーザにより構造化する方法と装置
CA2756840C (en) 2009-03-30 2018-10-23 Boegli-Gravures S.A. Method and device for structuring the surface of a hard material coated solid body by means of a laser
KR101706915B1 (ko) 2009-05-12 2017-02-15 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 변형가능 및 반투과 디스플레이를 위한 초박형, 미세구조 무기발광다이오드의 인쇄 어셈블리
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
WO2011084450A1 (en) 2009-12-16 2011-07-14 The Board Of Trustees Of The University Of Illinois Electrophysiology in-vivo using conformal electronics
EP2974673B1 (en) 2010-03-17 2017-03-22 The Board of Trustees of the University of Illionis Implantable biomedical devices on bioresorbable substrates
WO2012097163A1 (en) 2011-01-14 2012-07-19 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
KR20140019341A (ko) * 2011-03-03 2014-02-14 올싸거널 인코포레이티드 박막 장치에서 재료를 패터닝하는 공정
WO2012158709A1 (en) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Thermally managed led arrays assembled by printing
US9159635B2 (en) 2011-05-27 2015-10-13 Mc10, Inc. Flexible electronic structure
EP2713863B1 (en) 2011-06-03 2020-01-15 The Board of Trustees of the University of Illionis Conformable actively multiplexed high-density surface electrode array for brain interfacing
HK1204205A1 (en) 2011-12-01 2015-11-06 The Board Of Trustees Of The University Of Illinois Transient devices designed to undergo programmable transformations
EP2830492B1 (en) 2012-03-30 2021-05-19 The Board of Trustees of the University of Illinois Appendage mountable electronic devices conformable to surfaces and method of making the same
DE102012108170B4 (de) * 2012-09-03 2015-01-22 Bundesdruckerei Gmbh Sicherheitselement und Verfahren zur Herstellung eines Sicherheitselements
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
JP2018524677A (ja) 2015-06-01 2018-08-30 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 無線電力及び近距離無線通信機能を備えた小型電子システム
US11029198B2 (en) 2015-06-01 2021-06-08 The Board Of Trustees Of The University Of Illinois Alternative approach for UV sensing
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
CN113759665A (zh) * 2020-06-01 2021-12-07 长鑫存储技术有限公司 晶圆布局的设计方法及光刻机曝光系统

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DE102004059798A1 (de) * 2004-12-10 2006-06-29 Ovd Kinegram Ag Optisch variables Element mit elektrisch aktiver Schicht
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US8906490B2 (en) * 2006-05-19 2014-12-09 Eastman Kodak Company Multicolor mask

Also Published As

Publication number Publication date
US8502213B2 (en) 2013-08-06
EP2050150B1 (de) 2013-04-24
DE102006037433A1 (de) 2008-02-28
WO2008017426A1 (de) 2008-02-14
US8129217B2 (en) 2012-03-06
JP4944200B2 (ja) 2012-05-30
US20120164391A1 (en) 2012-06-28
EP2050150A1 (de) 2009-04-22
JP2010500606A (ja) 2010-01-07
DE102006037433B4 (de) 2010-08-19
US20090289246A1 (en) 2009-11-26

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