DK2050150T3 - Fremgangsmåde til fremstilling af mindst én flerlagsgenstand samt flerlagsgenstand - Google Patents

Fremgangsmåde til fremstilling af mindst én flerlagsgenstand samt flerlagsgenstand

Info

Publication number
DK2050150T3
DK2050150T3 DK07801506.2T DK07801506T DK2050150T3 DK 2050150 T3 DK2050150 T3 DK 2050150T3 DK 07801506 T DK07801506 T DK 07801506T DK 2050150 T3 DK2050150 T3 DK 2050150T3
Authority
DK
Denmark
Prior art keywords
multilayer article
producing
multilayer
article
Prior art date
Application number
DK07801506.2T
Other languages
Danish (da)
English (en)
Inventor
Gernot Schneider
Rene Staub
Wayne Robert Tompkin
Achim Hansen
Original Assignee
Ovd Kinegram Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ovd Kinegram Ag filed Critical Ovd Kinegram Ag
Application granted granted Critical
Publication of DK2050150T3 publication Critical patent/DK2050150T3/da

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/464Lateral top-gate IGFETs comprising only a single gate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612Composite web or sheet
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electroluminescent Light Sources (AREA)
DK07801506.2T 2006-08-09 2007-08-03 Fremgangsmåde til fremstilling af mindst én flerlagsgenstand samt flerlagsgenstand DK2050150T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006037433A DE102006037433B4 (de) 2006-08-09 2006-08-09 Verfahren zur Herstellung eines Mehrschichtkörpers sowie Mehrschichtkörper
PCT/EP2007/006884 WO2008017426A1 (de) 2006-08-09 2007-08-03 Verfahren zur herstellung mindestens eines mehrschichtkörpers sowie mehrschichtkörper

Publications (1)

Publication Number Publication Date
DK2050150T3 true DK2050150T3 (da) 2013-07-22

Family

ID=38608712

Family Applications (1)

Application Number Title Priority Date Filing Date
DK07801506.2T DK2050150T3 (da) 2006-08-09 2007-08-03 Fremgangsmåde til fremstilling af mindst én flerlagsgenstand samt flerlagsgenstand

Country Status (6)

Country Link
US (2) US8129217B2 (enExample)
EP (1) EP2050150B1 (enExample)
JP (1) JP4944200B2 (enExample)
DE (1) DE102006037433B4 (enExample)
DK (1) DK2050150T3 (enExample)
WO (1) WO2008017426A1 (enExample)

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US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
JP5319533B2 (ja) 2006-09-20 2013-10-16 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 転写可能な半導体構造、デバイス、及びデバイスコンポーネントを作成するための剥離方法
MY149292A (en) 2007-01-17 2013-08-30 Univ Illinois Optical systems fabricated by printing-based assembly
EP2349440B1 (en) 2008-10-07 2019-08-21 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
DE202010018040U1 (de) * 2009-03-30 2013-11-25 Boegli-Gravures S.A. Festkörperoberfläche mit einer Hartstoff-Beschichtung mit mindestens einem strukturierten Bereich und Vorrichtung zur Strukturierung
CA2756840C (en) 2009-03-30 2018-10-23 Boegli-Gravures S.A. Method and device for structuring the surface of a hard material coated solid body by means of a laser
TWI592996B (zh) 2009-05-12 2017-07-21 美國伊利諾大學理事會 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
JP6046491B2 (ja) 2009-12-16 2016-12-21 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ コンフォーマル電子機器を使用した生体内での電気生理学
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
EP2974673B1 (en) 2010-03-17 2017-03-22 The Board of Trustees of the University of Illionis Implantable biomedical devices on bioresorbable substrates
WO2012097163A1 (en) 2011-01-14 2012-07-19 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
EP2681781A4 (en) * 2011-03-03 2014-09-03 Orthogonal Inc Method for structuring materials in thin film components
US9765934B2 (en) 2011-05-16 2017-09-19 The Board Of Trustees Of The University Of Illinois Thermally managed LED arrays assembled by printing
EP2712491B1 (en) 2011-05-27 2019-12-04 Mc10, Inc. Flexible electronic structure
US8934965B2 (en) 2011-06-03 2015-01-13 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
CN108389893A (zh) 2011-12-01 2018-08-10 伊利诺伊大学评议会 经设计以经历可编程转变的瞬态器件
KR20150004819A (ko) 2012-03-30 2015-01-13 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 표면에 상응하는 부속체 장착가능한 전자 장치
DE102012108170B4 (de) * 2012-09-03 2015-01-22 Bundesdruckerei Gmbh Sicherheitselement und Verfahren zur Herstellung eines Sicherheitselements
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
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US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
EP3985715A4 (en) * 2020-06-01 2022-11-09 Changxin Memory Technologies, Inc. Design method for wafer layout and lithography machine exposure system

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Also Published As

Publication number Publication date
EP2050150B1 (de) 2013-04-24
JP2010500606A (ja) 2010-01-07
DE102006037433A1 (de) 2008-02-28
JP4944200B2 (ja) 2012-05-30
US8502213B2 (en) 2013-08-06
WO2008017426A1 (de) 2008-02-14
DE102006037433B4 (de) 2010-08-19
EP2050150A1 (de) 2009-04-22
US20120164391A1 (en) 2012-06-28
US8129217B2 (en) 2012-03-06
US20090289246A1 (en) 2009-11-26

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