JP4944200B2 - 少なくとも一つの多層体の製造プロセスと多層体 - Google Patents

少なくとも一つの多層体の製造プロセスと多層体 Download PDF

Info

Publication number
JP4944200B2
JP4944200B2 JP2009523184A JP2009523184A JP4944200B2 JP 4944200 B2 JP4944200 B2 JP 4944200B2 JP 2009523184 A JP2009523184 A JP 2009523184A JP 2009523184 A JP2009523184 A JP 2009523184A JP 4944200 B2 JP4944200 B2 JP 4944200B2
Authority
JP
Japan
Prior art keywords
region
layer
carrier substrate
functional layer
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009523184A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010500606A5 (enExample
JP2010500606A (ja
Inventor
ゲールノート シュナイデル
ルネ シュタウプ
ウェイン ロバート トンプキン
アヒム ハンセン
Original Assignee
オーファウデー キネグラム アーゲー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オーファウデー キネグラム アーゲー filed Critical オーファウデー キネグラム アーゲー
Publication of JP2010500606A publication Critical patent/JP2010500606A/ja
Publication of JP2010500606A5 publication Critical patent/JP2010500606A5/ja
Application granted granted Critical
Publication of JP4944200B2 publication Critical patent/JP4944200B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/464—Lateral top-gate IGFETs comprising only a single gate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electroluminescent Light Sources (AREA)
JP2009523184A 2006-08-09 2007-08-03 少なくとも一つの多層体の製造プロセスと多層体 Expired - Fee Related JP4944200B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006037433.9 2006-08-09
DE102006037433A DE102006037433B4 (de) 2006-08-09 2006-08-09 Verfahren zur Herstellung eines Mehrschichtkörpers sowie Mehrschichtkörper
PCT/EP2007/006884 WO2008017426A1 (de) 2006-08-09 2007-08-03 Verfahren zur herstellung mindestens eines mehrschichtkörpers sowie mehrschichtkörper

Publications (3)

Publication Number Publication Date
JP2010500606A JP2010500606A (ja) 2010-01-07
JP2010500606A5 JP2010500606A5 (enExample) 2010-09-09
JP4944200B2 true JP4944200B2 (ja) 2012-05-30

Family

ID=38608712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009523184A Expired - Fee Related JP4944200B2 (ja) 2006-08-09 2007-08-03 少なくとも一つの多層体の製造プロセスと多層体

Country Status (6)

Country Link
US (2) US8129217B2 (enExample)
EP (1) EP2050150B1 (enExample)
JP (1) JP4944200B2 (enExample)
DE (1) DE102006037433B4 (enExample)
DK (1) DK2050150T3 (enExample)
WO (1) WO2008017426A1 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
EP2650907B1 (en) 2004-06-04 2024-10-23 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating and assembling printable semiconductor elements
WO2008036837A2 (en) * 2006-09-20 2008-03-27 The Board Of Trustees Of The University Of Illinois Release strategies for making transferable semiconductor structures, devices and device components
EP2104954B1 (en) 2007-01-17 2022-03-16 The Board of Trustees of the University of Illinois Optical systems fabricated by printing-based assembly
EP2349440B1 (en) 2008-10-07 2019-08-21 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
WO2010111799A1 (en) * 2009-03-30 2010-10-07 Boegli-Gravures S.A. Method and device for structuring a solid body surface with a hard coating with a laser using mask and diaphragm
ES2534982T5 (es) 2009-03-30 2019-12-12 Boegli Gravures Sa Procedimiento y dispositivo para estructurar una superficie de cuerpo sólido con un revestimiento duro con un primer láser con pulsos en el campo de nanosegundos y un segundo láser con pulsos en el campo de pico- o femtosegundos; lámina de embalaje
EP2430652B1 (en) 2009-05-12 2019-11-20 The Board of Trustees of the University of Illionis Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
WO2011084450A1 (en) 2009-12-16 2011-07-14 The Board Of Trustees Of The University Of Illinois Electrophysiology in-vivo using conformal electronics
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
EP2974673B1 (en) 2010-03-17 2017-03-22 The Board of Trustees of the University of Illionis Implantable biomedical devices on bioresorbable substrates
US9442285B2 (en) 2011-01-14 2016-09-13 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
CN103348503A (zh) * 2011-03-03 2013-10-09 正交公司 薄膜器件的材料图案化工艺
WO2012158709A1 (en) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Thermally managed led arrays assembled by printing
WO2012166686A2 (en) 2011-05-27 2012-12-06 Mc10, Inc. Electronic, optical and/or mechanical apparatus and systems and methods for fabricating same
WO2012167096A2 (en) 2011-06-03 2012-12-06 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
US9691873B2 (en) 2011-12-01 2017-06-27 The Board Of Trustees Of The University Of Illinois Transient devices designed to undergo programmable transformations
US9554484B2 (en) 2012-03-30 2017-01-24 The Board Of Trustees Of The University Of Illinois Appendage mountable electronic devices conformable to surfaces
DE102012108170B4 (de) * 2012-09-03 2015-01-22 Bundesdruckerei Gmbh Sicherheitselement und Verfahren zur Herstellung eines Sicherheitselements
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
AU2016270807A1 (en) 2015-06-01 2017-12-14 The Board Of Trustees Of The University Of Illinois Miniaturized electronic systems with wireless power and near-field communication capabilities
US11029198B2 (en) 2015-06-01 2021-06-08 The Board Of Trustees Of The University Of Illinois Alternative approach for UV sensing
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
EP3985715A4 (en) * 2020-06-01 2022-11-09 Changxin Memory Technologies, Inc. Design method for wafer layout and lithography machine exposure system

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3829213A (en) * 1972-06-02 1974-08-13 Mos Technology Inc Artproof method for semiconductor devices
US4374911A (en) * 1978-04-28 1983-02-22 International Business Machines Corporation Photo method of making tri-level density photomask
GB9404675D0 (en) * 1994-03-11 1994-04-27 Dow Corning Sa Foils
US5932397A (en) * 1996-05-28 1999-08-03 Rvm Scientific, Inc. Multicolor lithography for control of three dimensional refractive index gradient processing
US6133933A (en) * 1997-01-13 2000-10-17 Xerox Corporation Color Xerographic printing system with multicolor printbar
US6255130B1 (en) * 1998-11-19 2001-07-03 Samsung Electronics Co., Ltd. Thin film transistor array panel and a method for manufacturing the same
WO2001040836A1 (en) * 1999-12-02 2001-06-07 Gemfire Corporation Photodefinition of optical devices
US6569580B2 (en) * 2001-03-13 2003-05-27 Diverging Technologies, Inc. Binary and phase-shift photomasks
US20020195928A1 (en) * 2001-06-25 2002-12-26 Grace Anthony J. Electroluminescent display device and method of making
US7160649B2 (en) * 2002-07-11 2007-01-09 Hitachi Via Mechanics, Ltd. Gray level imaging masks, optical imaging apparatus for gray level imaging masks and methods for encoding mask and use of the masks
KR20050109963A (ko) * 2003-03-07 2005-11-22 코닌클리케 필립스 일렉트로닉스 엔.브이. 전자 장치 제조 방법
JP3746497B2 (ja) * 2003-06-24 2006-02-15 松下電器産業株式会社 フォトマスク
DE10349963A1 (de) * 2003-10-24 2005-06-02 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Herstellung einer Folie
DE102004059467A1 (de) * 2004-12-10 2006-07-20 Polyic Gmbh & Co. Kg Gatter aus organischen Feldeffekttransistoren
DE102004059798A1 (de) * 2004-12-10 2006-06-29 Ovd Kinegram Ag Optisch variables Element mit elektrisch aktiver Schicht
JP4769544B2 (ja) * 2005-10-28 2011-09-07 Ｈｏｙａ株式会社 二次鋳型の製造方法
US8906490B2 (en) * 2006-05-19 2014-12-09 Eastman Kodak Company Multicolor mask

Also Published As

Publication number Publication date
US8502213B2 (en) 2013-08-06
DK2050150T3 (da) 2013-07-22
EP2050150A1 (de) 2009-04-22
DE102006037433B4 (de) 2010-08-19
WO2008017426A1 (de) 2008-02-14
US20120164391A1 (en) 2012-06-28
EP2050150B1 (de) 2013-04-24
US20090289246A1 (en) 2009-11-26
DE102006037433A1 (de) 2008-02-28
US8129217B2 (en) 2012-03-06
JP2010500606A (ja) 2010-01-07

Similar Documents

Publication Publication Date Title
JP4944200B2 (ja) 少なくとも一つの多層体の製造プロセスと多層体
RU2374082C2 (ru) Способ изготовления многослойной подложки и многослойная подложка
KR101389914B1 (ko) 광학 소자, 광학 소자 제작용 원반의 제조 방법, 및 광전변환 장치
RU2390808C2 (ru) Многослойное тело и способ изготовления многослойного тела
AU2010214906B2 (en) Surface relief microstructures, related devices and method of making them
KR100888303B1 (ko) 와이어 그리드 편광판 및 그 제조 방법
CN105980935B (zh) 形成导电网格图案的方法及由其制造的网格电极和层叠体
US4576439A (en) Reflective diffractive authenticating device
KR20100131472A (ko) 필름 소자를 제조하는 방법
KR20120082356A (ko) 연성 스탬프를 이용한 강성 기판상의 텍스처 임프린트 방법
US20100165316A1 (en) Inclined exposure lithography system
TW575786B (en) Exposure controlling photomask and production method thereof
TWI361229B (enExample)
JPWO2001069316A1 (ja) 露光量制御用フォトマスクおよびその製造方法
JPH01252902A (ja) 低反射回折格子およびその作製方法
US20060274415A1 (en) Inexpensive polarizer having high polarization characteristic
TW200419270A (en) Method for manufacturing transflective thin film transistor (TFT) liquid crystal display (LCD)
KR20110048061A (ko) 광기전력 장치에서 사용되기 위한 투명서브스트레이트 상에 광포획층을 제조하는 방법, 광기전력 장치 및 광기전력 장치를 제조하기 위한 방법
JP4178583B2 (ja) 反射防止膜
US20130264729A1 (en) Method for Manufacturing Mold Assembly of Multi-Functional Light Guide Plate and its Application
CN216622745U (zh) 一种消反结构
GB2126949A (en) Diffractive authenticating device
US7183126B2 (en) Method for forming an optical interfering pattern on a surface of a metal substrate, and article having an optical interfering effect
KR20210059356A (ko) 필름 마스크, 필름 마스크의 제조 방법 및 필름 마스크를 이용한 패턴의 제조 방법
KR20210059355A (ko) 필름 마스크, 필름 마스크의 제조 방법 및 필름 마스크를 이용한 패턴의 제조 방법

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100726

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100726

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120221

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120301

R150 Certificate of patent or registration of utility model

Ref document number: 4944200

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150309

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees