JP2009286071A - 銅張積層板、その銅張積層板製造に用いる表面処理銅箔及びその銅張積層板を用いて得られるプリント配線板 - Google Patents
銅張積層板、その銅張積層板製造に用いる表面処理銅箔及びその銅張積層板を用いて得られるプリント配線板 Download PDFInfo
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- JP2009286071A JP2009286071A JP2008143599A JP2008143599A JP2009286071A JP 2009286071 A JP2009286071 A JP 2009286071A JP 2008143599 A JP2008143599 A JP 2008143599A JP 2008143599 A JP2008143599 A JP 2008143599A JP 2009286071 A JP2009286071 A JP 2009286071A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- layer
- clad laminate
- insulating resin
- zinc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 142
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 92
- 239000010949 copper Substances 0.000 title claims abstract description 92
- 239000011889 copper foil Substances 0.000 title claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 150000001879 copper Chemical class 0.000 title description 2
- 239000011347 resin Substances 0.000 claims abstract description 69
- 229920005989 resin Polymers 0.000 claims abstract description 69
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 44
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 42
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 39
- 239000011701 zinc Substances 0.000 claims abstract description 39
- 238000005530 etching Methods 0.000 claims abstract description 36
- 229910052723 transition metal Inorganic materials 0.000 claims abstract description 22
- 150000003624 transition metals Chemical class 0.000 claims abstract description 22
- 230000003746 surface roughness Effects 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims description 112
- 239000000463 material Substances 0.000 claims description 28
- 239000002335 surface treatment layer Substances 0.000 claims description 27
- 238000007788 roughening Methods 0.000 claims description 19
- 239000000243 solution Substances 0.000 claims description 19
- 238000004381 surface treatment Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 7
- 239000007864 aqueous solution Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 239000002245 particle Substances 0.000 description 14
- 150000002500 ions Chemical class 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 6
- 239000000470 constituent Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000010365 information processing Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000002427 irreversible effect Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- QZYDAIMOJUSSFT-UHFFFAOYSA-N [Co].[Ni].[Mo] Chemical compound [Co].[Ni].[Mo] QZYDAIMOJUSSFT-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical group O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 1
- NJWNEWQMQCGRDO-UHFFFAOYSA-N indium zinc Chemical compound [Zn].[In] NJWNEWQMQCGRDO-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- UVZICZIVKIMRNE-UHFFFAOYSA-N thiodiacetic acid Chemical compound OC(=O)CSCC(O)=O UVZICZIVKIMRNE-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- ing And Chemical Polishing (AREA)
- Laminated Bodies (AREA)
Abstract
【解決手段】この目的を達成するため、銅層と絶縁樹脂層とを張り合わせたプリント配線板製造用の銅張積層板の当該銅層と当該絶縁樹脂層との界面に、亜鉛成分と3種類以下のイオン価数を採り得る亜鉛以外の遷移金属成分とを含む表面処理層を備え、且つ、当該銅層と当該絶縁樹脂層との界面の表面粗さ(Rzjis)が2.5μm以下という特徴を備える銅張積層板を採用する。また、この銅張積層板の製造に、銅箔2の表面に亜鉛成分と3種類以下のイオン価数を採り得る亜鉛以外の遷移金属成分とを含み、且つ、表面粗さ(Rzjis)が2.5μm以下の表面処理層3を備える表面処理銅箔1を採用する。
【選択図】図5
Description
2 銅箔(バルク銅層)
3 表面処理層
4 粗化処理層(粗化処理粒子、微細銅粒子)
5 絶縁樹脂層
6 アンダーカット部
Claims (8)
- 硫酸と過酸化水素とを含むエッチング液で配線回路を調製する工程を含むプリント配線板製造に用いる銅張積層板であって、
当該銅張積層板は、銅層と絶縁樹脂層とが張り合わせられたものであり、
当該銅層と当該絶縁樹脂層との界面に、亜鉛成分と3種類以下のイオン価数を採り得る亜鉛以外の遷移金属成分とを含む表面処理層を備え、
且つ、当該銅層と当該絶縁樹脂層との界面の表面粗さ(Rzjis)が2.5μm以下であることを特徴とする銅張積層板。 - 前記表面処理層は、亜鉛と前記遷移金属成分との合計の質量厚さが40mg/m2以上の厚さである請求項1に記載の銅張積層板。
- 前記銅層は、絶縁樹脂基材との張り合わせ面に粗化処理を設けたものである請求項1又は請求項2に記載の銅張積層板。
- 前記絶縁樹脂層に可撓性を備える樹脂フィルムを用いて得られるフレキシブル銅張積層板である請求項1〜請求項3のいずれかに記載の銅張積層板。
- 請求項1〜請求項4のいずれかに記載の銅張積層板の製造に用いる表面処理銅箔であって、
絶縁樹脂基材との張り合わせ面に、亜鉛成分と3種類以下のイオン価数を採り得る亜鉛以外の遷移金属成分とを含む表面処理層を備え、且つ、当該絶縁樹脂基材との張り合わせ面の表面粗さ(Rzjis)が2.5μm以下であることを特徴とする表面処理銅箔。 - 前記表面処理銅箔の絶縁樹脂基材との張り合わせ面に粗化処理を施したものである請求項5に記載の表面処理銅箔。
- 請求項4に記載の銅張積層板を用いて配線回路を形成したことを特徴とするプリント配線板。
- 前記配線回路を、硫酸濃度10%〜30%、過酸化水素濃度10%〜20%の液温30℃の水溶液に30秒間浸漬した後に、当該配線と前記絶縁樹脂基材との界面に形成されるアンダーカットの深さが、当該配線の端面から3.0μm以下である請求項7に記載のプリント配線板。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008143599A JP5474316B2 (ja) | 2008-05-30 | 2008-05-30 | 銅張積層板、その銅張積層板製造に用いる表面処理銅箔及びその銅張積層板を用いて得られるプリント配線板 |
TW098116835A TWI420991B (zh) | 2008-05-30 | 2009-05-21 | A copper-clad laminate, a surface-treated copper foil for manufacturing the copper-clad laminate, and a printed circuit board manufactured using the copper-clad laminate |
CN2009101420305A CN101594736B (zh) | 2008-05-30 | 2009-05-27 | 覆铜箔层压板、表面处理铜箔以及印刷电路板 |
KR1020090047492A KR101194320B1 (ko) | 2008-05-30 | 2009-05-29 | 동박 적층판, 그 동박 적층판의 제조에 이용하는 표면 처리 동박 및 그 동박 적층판을 이용하여 얻어지는 프린트 배선판 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008143599A JP5474316B2 (ja) | 2008-05-30 | 2008-05-30 | 銅張積層板、その銅張積層板製造に用いる表面処理銅箔及びその銅張積層板を用いて得られるプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009286071A true JP2009286071A (ja) | 2009-12-10 |
JP5474316B2 JP5474316B2 (ja) | 2014-04-16 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008143599A Active JP5474316B2 (ja) | 2008-05-30 | 2008-05-30 | 銅張積層板、その銅張積層板製造に用いる表面処理銅箔及びその銅張積層板を用いて得られるプリント配線板 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5474316B2 (ja) |
KR (1) | KR101194320B1 (ja) |
CN (1) | CN101594736B (ja) |
TW (1) | TWI420991B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103002663B (zh) * | 2011-09-09 | 2015-07-15 | 深南电路有限公司 | 一种印制电路板加工方法 |
JP5559288B2 (ja) * | 2012-11-13 | 2014-07-23 | メック株式会社 | プリント配線板の製造方法及び表面処理装置 |
JP2015134953A (ja) * | 2014-01-17 | 2015-07-27 | Jx日鉱日石金属株式会社 | 表面処理銅箔、キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法 |
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JPH04318997A (ja) * | 1991-03-11 | 1992-11-10 | Duk San Metal Co Ltd | 印刷回路用銅箔及びその製造方法 |
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IL145202A0 (en) * | 1999-03-03 | 2002-06-30 | Daiwa Kk | Method of manufacturing multilayer wiring boards |
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2008
- 2008-05-30 JP JP2008143599A patent/JP5474316B2/ja active Active
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2009
- 2009-05-21 TW TW098116835A patent/TWI420991B/zh active
- 2009-05-27 CN CN2009101420305A patent/CN101594736B/zh active Active
- 2009-05-29 KR KR1020090047492A patent/KR101194320B1/ko active IP Right Grant
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JPH07231161A (ja) * | 1994-02-15 | 1995-08-29 | Mitsui Mining & Smelting Co Ltd | プリント配線板用銅箔およびその製造方法 |
JPH10138394A (ja) * | 1996-11-12 | 1998-05-26 | Nippon Denkai Kk | プリント配線板用銅箔及びその製造方法 |
JP2003051673A (ja) * | 2001-08-06 | 2003-02-21 | Mitsui Mining & Smelting Co Ltd | プリント配線板用銅箔及びそのプリント配線板用銅箔を用いた銅張積層板 |
JP2005048269A (ja) * | 2003-07-31 | 2005-02-24 | Nikko Materials Co Ltd | 表面処理銅箔およびそれを使用した基板 |
JP2005262506A (ja) * | 2004-03-16 | 2005-09-29 | Mitsui Mining & Smelting Co Ltd | 絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法 |
JP2007081214A (ja) * | 2005-09-15 | 2007-03-29 | Mitsui Mining & Smelting Co Ltd | プリント配線基板の製造方法 |
JP2007294873A (ja) * | 2006-03-30 | 2007-11-08 | Nippon Steel Chem Co Ltd | フレキシブルプリント配線板の製造方法 |
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JP5474316B2 (ja) | 2014-04-16 |
CN101594736B (zh) | 2013-04-17 |
TWI420991B (zh) | 2013-12-21 |
CN101594736A (zh) | 2009-12-02 |
KR20090125000A (ko) | 2009-12-03 |
TW201010539A (en) | 2010-03-01 |
KR101194320B1 (ko) | 2012-10-24 |
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