JP2009283699A5 - - Google Patents

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Publication number
JP2009283699A5
JP2009283699A5 JP2008134500A JP2008134500A JP2009283699A5 JP 2009283699 A5 JP2009283699 A5 JP 2009283699A5 JP 2008134500 A JP2008134500 A JP 2008134500A JP 2008134500 A JP2008134500 A JP 2008134500A JP 2009283699 A5 JP2009283699 A5 JP 2009283699A5
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JP
Japan
Prior art keywords
sample
sample stage
dummy
vacuum processing
stage
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Application number
JP2008134500A
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English (en)
Japanese (ja)
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JP4940184B2 (ja
JP2009283699A (ja
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Priority claimed from JP2008134500A external-priority patent/JP4940184B2/ja
Priority to JP2008134500A priority Critical patent/JP4940184B2/ja
Application filed filed Critical
Priority to TW097129662A priority patent/TW200949928A/zh
Priority to KR1020080081011A priority patent/KR101007898B1/ko
Priority to US12/199,820 priority patent/US7913646B2/en
Publication of JP2009283699A publication Critical patent/JP2009283699A/ja
Priority to US12/854,435 priority patent/US8262801B2/en
Publication of JP2009283699A5 publication Critical patent/JP2009283699A5/ja
Publication of JP4940184B2 publication Critical patent/JP4940184B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008134500A 2008-05-22 2008-05-22 真空処理装置および真空処理方法 Expired - Fee Related JP4940184B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008134500A JP4940184B2 (ja) 2008-05-22 2008-05-22 真空処理装置および真空処理方法
TW097129662A TW200949928A (en) 2008-05-22 2008-08-05 Vacuum processing apparatus and vacuum processing method
KR1020080081011A KR101007898B1 (ko) 2008-05-22 2008-08-19 진공처리장치 및 진공처리방법
US12/199,820 US7913646B2 (en) 2008-05-22 2008-08-28 Vacuum processing apparatus and vacuum processing method
US12/854,435 US8262801B2 (en) 2008-05-22 2010-08-11 Vacuum processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008134500A JP4940184B2 (ja) 2008-05-22 2008-05-22 真空処理装置および真空処理方法

Publications (3)

Publication Number Publication Date
JP2009283699A JP2009283699A (ja) 2009-12-03
JP2009283699A5 true JP2009283699A5 (OSRAM) 2011-04-07
JP4940184B2 JP4940184B2 (ja) 2012-05-30

Family

ID=41341170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008134500A Expired - Fee Related JP4940184B2 (ja) 2008-05-22 2008-05-22 真空処理装置および真空処理方法

Country Status (4)

Country Link
US (2) US7913646B2 (OSRAM)
JP (1) JP4940184B2 (OSRAM)
KR (1) KR101007898B1 (OSRAM)
TW (1) TW200949928A (OSRAM)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8052794B2 (en) * 2005-09-12 2011-11-08 The United States Of America As Represented By The Secretary Of The Navy Directed reagents to improve material uniformity
DE102006039507A1 (de) * 2006-08-23 2008-03-13 Dürr Ecoclean GmbH Reinigungsvorrichtung und Verfahren zum Reinigen eines Werkstücks
EP2740143A2 (en) * 2011-08-02 2014-06-11 Tokyo Electron Limited Method and device for controlling pattern and structure formation by an electric field
JP5957248B2 (ja) * 2012-03-07 2016-07-27 株式会社アルバック 基板保持装置の再生方法
US10153141B2 (en) * 2014-02-14 2018-12-11 Electronics And Telecommunications Research Institute Apparatus for monitoring gas and plasma process equipment including the same
JP6422074B2 (ja) * 2014-09-01 2018-11-14 株式会社アルバック 真空処理装置
JP6458677B2 (ja) 2015-08-05 2019-01-30 三菱電機株式会社 炭化珪素エピタキシャルウエハの製造方法及び製造装置
KR102204229B1 (ko) * 2016-08-26 2021-01-15 어플라이드 머티어리얼스, 인코포레이티드 저압 리프트 핀 캐비티 하드웨어
US10559451B2 (en) * 2017-02-15 2020-02-11 Applied Materials, Inc. Apparatus with concentric pumping for multiple pressure regimes
US10413913B2 (en) 2017-02-15 2019-09-17 Tokyo Electron Limited Methods and systems for dielectrophoresis (DEP) separation
US11056371B2 (en) * 2018-08-14 2021-07-06 Taiwan Semiconductor Manufacturing Co., Ltd. Tool and method for cleaning electrostatic chuck
US11376640B2 (en) 2018-10-01 2022-07-05 Tokyo Electron Limited Apparatus and method to electrostatically remove foreign matter from substrate surfaces
US11145532B2 (en) * 2018-12-21 2021-10-12 Toto Ltd. Electrostatic chuck
CN110459493B (zh) * 2019-08-21 2022-03-22 北京北方华创微电子装备有限公司 抽真空腔室及抽真空方法
CN112144036B (zh) * 2020-08-24 2021-04-20 宁波中骏森驰汽车零部件股份有限公司 一种pvd真空镀膜机
CN112331588B (zh) * 2020-10-26 2024-05-17 北京北方华创微电子装备有限公司 半导体设备中的卡盘组件及半导体工艺设备
CN114582694B (zh) * 2020-12-01 2025-04-08 中微半导体设备(上海)股份有限公司 一种集尘器、等离子体处理设备及调压方法
KR20240156370A (ko) * 2022-02-02 2024-10-29 도쿄엘렉트론가부시키가이샤 플라스마 처리 장치의 클리닝 방법
CN116334597B (zh) * 2023-03-28 2024-06-25 成都沃特塞恩电子技术有限公司 一种反应腔组件、mpcvd系统及mpcvd系统控制方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06173041A (ja) * 1992-12-02 1994-06-21 Nissin Electric Co Ltd エッチング装置のクリ−ニング方法
US5746928A (en) * 1996-06-03 1998-05-05 Taiwan Semiconductor Manufacturing Company Ltd Process for cleaning an electrostatic chuck of a plasma etching apparatus
JPH10321488A (ja) * 1997-05-21 1998-12-04 Hitachi Ltd 粘着剤付き基板
JP2003197615A (ja) * 2001-12-26 2003-07-11 Tokyo Electron Ltd プラズマ処理装置およびそのクリーニング方法
JP2004211168A (ja) * 2003-01-06 2004-07-29 Canon Inc 処理装置クリーニング方法
JP4450371B2 (ja) 2004-04-28 2010-04-14 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法
US7628864B2 (en) 2004-04-28 2009-12-08 Tokyo Electron Limited Substrate cleaning apparatus and method
JP4804968B2 (ja) * 2006-03-16 2011-11-02 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP2009212293A (ja) * 2008-03-04 2009-09-17 Tokyo Electron Ltd 基板処理装置用の部品及び基板処理装置
JP2009245988A (ja) * 2008-03-28 2009-10-22 Tokyo Electron Ltd プラズマ処理装置、チャンバ内部品及びチャンバ内部品の寿命検出方法

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