JP2009267398A - スタンピング加工を用いて形成される形状を有する半導体素子パッケージ - Google Patents

スタンピング加工を用いて形成される形状を有する半導体素子パッケージ Download PDF

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JP2009267398A
JP2009267398A JP2009091309A JP2009091309A JP2009267398A JP 2009267398 A JP2009267398 A JP 2009267398A JP 2009091309 A JP2009091309 A JP 2009091309A JP 2009091309 A JP2009091309 A JP 2009091309A JP 2009267398 A JP2009267398 A JP 2009267398A
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die
die pad
pin
semiconductor device
pins
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JP2009267398A5 (https=
Inventor
Anthony C Tsui
シー．ツイ アンソニー
Mohammad Eslamy
エスラミー モハンマド
Anthony Chia
チア アンソニー
Hongbo Yang
ヤン ホンボ
Zhou Ming
チョウ ミン
Jian Xu
スー ジアン
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GEM Services Inc USA
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GEM Services Inc USA
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Publication of JP2009267398A publication Critical patent/JP2009267398A/ja
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JP2009091309A 2008-04-04 2009-04-03 スタンピング加工を用いて形成される形状を有する半導体素子パッケージ Pending JP2009267398A (ja)

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US20110024886A1 (en) 2011-02-03
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US7838339B2 (en) 2010-11-23
US20090250796A1 (en) 2009-10-08

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