JP2009253076A - 基板用ステージ - Google Patents
基板用ステージ Download PDFInfo
- Publication number
- JP2009253076A JP2009253076A JP2008100250A JP2008100250A JP2009253076A JP 2009253076 A JP2009253076 A JP 2009253076A JP 2008100250 A JP2008100250 A JP 2008100250A JP 2008100250 A JP2008100250 A JP 2008100250A JP 2009253076 A JP2009253076 A JP 2009253076A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- stage
- flange portion
- back surface
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 56
- 230000002093 peripheral effect Effects 0.000 claims abstract description 16
- 239000002826 coolant Substances 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Abstract
【解決手段】 ステージ1には水などの冷媒が流れる通路3が形成され、上面には円環状のフランジ部4が形成され、このフランジ部4の内側を凹部5としている。前記フランジ部4の上面は基板W裏面の周縁部を載置するため、平滑に仕上げられ、またフランジ部4には周方向に等間隔で3個の位置決めピン6とリフトピン7が挿通する孔が設けられている。
【選択図】 図1
Description
Claims (4)
- 裏面に凹凸部が形成されている基板を載置するステージであって、このステージは周縁部に回路が形成されていない基板の周縁部を載置するフランジ部が設けられ、このフランジ部の内側には基板の裏面との間に空間を形成する凹部が設けられ、また前記フランジ部上面には基板の位置決めピンが形成され、且つ前記フランジ部に基板移載用のリフトピンが貫通していることを特徴とする基板用ステージ。
- 請求項1に記載のステージにおいて、前記凹凸部は電気回路であることを特徴とする基板用ステージ。
- 請求項1に記載のステージにおいて、前記凹部の底面形状は中央部が最も深く外周部が最も浅くなる曲面形状をなしていることを特徴とする基板用ステージ。
- 請求項1に記載のステージにおいて、前記位置決めピンとリフトピンの数は何れも3本以上とし、それぞれが周方向に等間隔で配置されていることを特徴とする基板用ステージ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008100250A JP5036614B2 (ja) | 2008-04-08 | 2008-04-08 | 基板用ステージ |
US12/384,719 US8336866B2 (en) | 2008-04-08 | 2009-04-08 | Stage for substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008100250A JP5036614B2 (ja) | 2008-04-08 | 2008-04-08 | 基板用ステージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009253076A true JP2009253076A (ja) | 2009-10-29 |
JP5036614B2 JP5036614B2 (ja) | 2012-09-26 |
Family
ID=41132524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008100250A Expired - Fee Related JP5036614B2 (ja) | 2008-04-08 | 2008-04-08 | 基板用ステージ |
Country Status (2)
Country | Link |
---|---|
US (1) | US8336866B2 (ja) |
JP (1) | JP5036614B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013158841A (ja) * | 2012-02-01 | 2013-08-19 | Disco Corp | 加工装置 |
JP2018113344A (ja) * | 2017-01-12 | 2018-07-19 | 株式会社アルバック | 基板搬送方法及び基板搬送装置 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI478272B (zh) * | 2007-08-15 | 2015-03-21 | 尼康股份有限公司 | A positioning device, a bonding device, a laminated substrate manufacturing device, an exposure device, and a positioning method |
US8820728B2 (en) * | 2009-02-02 | 2014-09-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor wafer carrier |
US8672311B2 (en) * | 2010-06-01 | 2014-03-18 | Varian Semiconductor Equipment Associates, Inc. | Method of cooling textured workpieces with an electrostatic chuck |
US8757603B2 (en) * | 2010-10-22 | 2014-06-24 | Applied Materials, Inc. | Low force substrate lift |
DE102012022067A1 (de) | 2012-11-09 | 2014-05-15 | Centrotherm Photovoltaics Ag | Substrathalter sowie eine vorrichtung und ein verfahren zum behandeln von substraten |
CN103943450B (zh) * | 2013-12-24 | 2016-05-18 | 成都天马微电子有限公司 | 一种干刻设备的电极和干刻设备 |
CN105965390A (zh) * | 2016-06-30 | 2016-09-28 | 新蕾车业无锡有限公司 | 一种金属板打磨固定装置 |
US20240038575A1 (en) * | 2022-07-27 | 2024-02-01 | Applied Materials, Inc. | Thickness uniformity improvement kit for thermally sensitive epitaxial processing |
CN115284240B (zh) * | 2022-09-28 | 2022-12-27 | 山西天宝集团有限公司 | 一种基于风电法兰摆放用的固定装置及其方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08206570A (ja) * | 1995-02-02 | 1996-08-13 | Dainippon Screen Mfg Co Ltd | 回転式基板処理装置 |
JP2001102434A (ja) * | 1999-07-21 | 2001-04-13 | Moore Epitaxial Inc | 基板支持治具 |
JP2004119859A (ja) * | 2002-09-27 | 2004-04-15 | Shin Etsu Handotai Co Ltd | サセプタ、半導体ウェーハの製造装置及び製造方法 |
JP2006245252A (ja) * | 2005-03-03 | 2006-09-14 | Dainippon Printing Co Ltd | シリコンウエハ載置用冶具および微細構造体の表面形状検出方法 |
Family Cites Families (28)
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US4189230A (en) * | 1977-10-26 | 1980-02-19 | Fujitsu Limited | Wafer holder with spring-loaded wafer-holding means |
JP2855046B2 (ja) * | 1993-03-31 | 1999-02-10 | 大日本スクリーン製造株式会社 | 回転式基板処理装置用の基板回転保持装置 |
US4799659A (en) * | 1987-07-22 | 1989-01-24 | Northern Telecom Limited | Pin insertion support member for circuit boards |
TW277139B (ja) * | 1993-09-16 | 1996-06-01 | Hitachi Seisakusyo Kk | |
US6544379B2 (en) * | 1993-09-16 | 2003-04-08 | Hitachi, Ltd. | Method of holding substrate and substrate holding system |
JPH09213772A (ja) * | 1996-01-30 | 1997-08-15 | Dainippon Screen Mfg Co Ltd | 基板保持装置 |
US6120609A (en) * | 1996-10-25 | 2000-09-19 | Applied Materials, Inc. | Self-aligning lift mechanism |
US5848670A (en) * | 1996-12-04 | 1998-12-15 | Applied Materials, Inc. | Lift pin guidance apparatus |
US6073681A (en) * | 1997-12-31 | 2000-06-13 | Temptronic Corporation | Workpiece chuck |
US6111706A (en) * | 1998-07-09 | 2000-08-29 | Gerber Coburn Optical Inc. | Adjustable lens support assembly |
US6152031A (en) * | 1999-02-10 | 2000-11-28 | Decruz; Rudolf R. | STS dayloader system |
JP3395696B2 (ja) * | 1999-03-15 | 2003-04-14 | 日本電気株式会社 | ウェハ処理装置およびウェハ処理方法 |
US6630053B2 (en) * | 2000-08-22 | 2003-10-07 | Asm Japan K.K. | Semiconductor processing module and apparatus |
JP3264441B2 (ja) | 2000-09-11 | 2002-03-11 | 株式会社日立製作所 | 真空処理装置用基板保持装置 |
KR100422199B1 (ko) * | 2001-05-04 | 2004-03-12 | 주성엔지니어링(주) | 반도체 소자 제조장치 |
JP3720007B2 (ja) | 2001-09-10 | 2005-11-24 | 松下電器産業株式会社 | 膜の評価方法,温度測定方法及び半導体装置の製造方法 |
US6711810B2 (en) * | 2001-09-19 | 2004-03-30 | International Business Machines Corporation | Method of assembling a land grid array module |
EP1323465A1 (en) * | 2001-12-31 | 2003-07-02 | Corning Incorporated | Flexible high density array print head with systems and methods for aligning pin plate, reservoir and substrate with respect to each other |
KR100459788B1 (ko) * | 2002-01-14 | 2004-12-04 | 주성엔지니어링(주) | 2단 웨이퍼 리프트 핀 |
JP3727273B2 (ja) * | 2002-01-18 | 2005-12-14 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
US6677167B2 (en) * | 2002-03-04 | 2004-01-13 | Hitachi High-Technologies Corporation | Wafer processing apparatus and a wafer stage and a wafer processing method |
WO2004023644A1 (ja) * | 2002-09-04 | 2004-03-18 | Mitsubishi Denki Kabushiki Kaisha | シリコン基板装置とその製造方法 |
US6887317B2 (en) * | 2002-09-10 | 2005-05-03 | Applied Materials, Inc. | Reduced friction lift pin |
WO2004086145A1 (ja) * | 2003-03-24 | 2004-10-07 | Dai Nippon Printing Co. Ltd. | 硬化性樹脂組成物、感光性パターン形成用硬化性樹脂組成物、カラーフィルター、液晶パネル用基板、及び、液晶パネル |
JP4836512B2 (ja) * | 2005-07-29 | 2011-12-14 | 東京エレクトロン株式会社 | 基板昇降装置および基板処理装置 |
JP2007183193A (ja) * | 2006-01-10 | 2007-07-19 | Micronics Japan Co Ltd | プロービング装置 |
US7654010B2 (en) * | 2006-02-23 | 2010-02-02 | Tokyo Electron Limited | Substrate processing system, substrate processing method, and storage medium |
US20090314211A1 (en) * | 2008-06-24 | 2009-12-24 | Applied Materials, Inc. | Big foot lift pin |
-
2008
- 2008-04-08 JP JP2008100250A patent/JP5036614B2/ja not_active Expired - Fee Related
-
2009
- 2009-04-08 US US12/384,719 patent/US8336866B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08206570A (ja) * | 1995-02-02 | 1996-08-13 | Dainippon Screen Mfg Co Ltd | 回転式基板処理装置 |
JP2001102434A (ja) * | 1999-07-21 | 2001-04-13 | Moore Epitaxial Inc | 基板支持治具 |
JP2004119859A (ja) * | 2002-09-27 | 2004-04-15 | Shin Etsu Handotai Co Ltd | サセプタ、半導体ウェーハの製造装置及び製造方法 |
JP2006245252A (ja) * | 2005-03-03 | 2006-09-14 | Dainippon Printing Co Ltd | シリコンウエハ載置用冶具および微細構造体の表面形状検出方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013158841A (ja) * | 2012-02-01 | 2013-08-19 | Disco Corp | 加工装置 |
JP2018113344A (ja) * | 2017-01-12 | 2018-07-19 | 株式会社アルバック | 基板搬送方法及び基板搬送装置 |
Also Published As
Publication number | Publication date |
---|---|
JP5036614B2 (ja) | 2012-09-26 |
US8336866B2 (en) | 2012-12-25 |
US20090250855A1 (en) | 2009-10-08 |
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