JP2009246111A - ボンディング装置及びボンディング方法 - Google Patents
ボンディング装置及びボンディング方法 Download PDFInfo
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- JP2009246111A JP2009246111A JP2008090383A JP2008090383A JP2009246111A JP 2009246111 A JP2009246111 A JP 2009246111A JP 2008090383 A JP2008090383 A JP 2008090383A JP 2008090383 A JP2008090383 A JP 2008090383A JP 2009246111 A JP2009246111 A JP 2009246111A
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Abstract
【解決手段】カメラによって取得したパッドの画像とオフセット量とに基づいてボンディングツール中心軸のXY方向位置を制御する制御部は、カメラによって取得した画像を処理してパッドの各辺と、圧着ボールの輪郭とを取得する輪郭取得手段と、パッド各辺と圧着ボールの輪郭との各隙間長さGx、Gyを取得する隙間長さ取得手段と、隙間長さ取得手段によって取得した各隙間長さGx、Gyに基づいてオフセット量の修正を行うオフセット量修正手段と、を備える。
【選択図】図6
Description
Claims (13)
- XYテーブルによってXY方向に移動するボンディングヘッドと、
ボンディングヘッドに取り付けられ、先端に取り付けられたボンディングツールを半導体チップのパッドに対して接離方向に動作させるボンディングアームと、
ボンディングの際のボンディングツールの中心線に対してXY方向に所定量だけ光軸がオフセットされてボンディングヘッドに取り付けられ、パッドおよびパッドにボンディングされた圧着ボールの画像を取得するカメラと、
カメラによって取得したパッドの画像とオフセット量とに基づいてボンディングツール中心軸のXY方向位置を制御する制御部と、を含むボンディング装置であって、
制御部は、
カメラによって取得した画像を処理してパッドの各辺と、圧着ボールの輪郭と、を取得する輪郭取得手段と、
パッド各辺と圧着ボールの輪郭との各隙間長さを取得する隙間長さ取得手段と、
隙間長さ取得手段によって取得した各隙間長さに基づいてオフセット量の修正を行うオフセット量修正手段と、
を有することを特徴とするボンディング装置。 - 請求項1に記載のボンディング装置であって、
輪郭取得手段は、少なくとも1つのパッドの各辺と、各パッドにボンディングされた各圧着ボールの各輪郭とを取得し、
隙間長さ取得手段は、各パッドのX方向に延びる各辺と各圧着ボールの各輪郭とのY方向の距離を各Y方向隙間長さとし、各パッドのY方向に延びる各辺と各圧着ボールの各輪郭とのX方向の距離を各X方向隙間長さとして取得し、
オフセット量修正手段は、
各X方向隙間長さ及び各Y方向隙間長さが予め設定した許容範囲にあるか否かを比較し、各X方向隙間長さのうちの少なくとも1つが許容範囲外の場合には、各X方向隙間長さと許容範囲の中央値との差に応じてX方向のオフセット量を変化させ、各Y方向隙間長さのうちの少なくとも1つが許容範囲外の場合には、各Y方向隙間長さと許容範囲の中央値との差に応じてY方向のオフセット量を変化させること、
を特徴とするボンディング装置。 - 請求項2に記載のボンディング装置であって、
輪郭取得手段は、設計隙間長さが同一の複数のパッドの各辺と、各パッドにボンディングされた各圧着ボールの各輪郭とを取得し、
オフセット量修正手段は、
各X方向隙間長さの平均値と許容範囲の中央値との差に応じてX方向のオフセット量を変化させ、各Y方向隙間長さの平均値と許容範囲の中央値との差に応じてY方向のオフセット量を変化させること、
を特徴とするボンディング装置。 - 請求項2または3に記載のボンディング装置であって、
隙間長さ取得手段は、同一のパッドでX方向隙間長さ及びY方向隙間長さを1つずつ取得すること、
を特徴とするボンディング装置。 - 請求項4に記載のボンディング装置であって、
X方向隙間長さ及びY方向隙間長さは、隣接する2辺と圧着ボールの輪郭とのY方向の距離とX方向の距離であること、
を特徴とするボンディング装置。 - 請求項3に記載のボンディング装置であって、
隙間長さ取得手段は、X方向の設計隙間長さが同一の第1のグループに含まれる複数のパッドの各辺と、各パッドにボンディングされた各圧着ボールの各輪郭とから各X方向隙間長さを取得し、Y方向の設計隙間長さが同一の第2のグループに含まれる複数のパッドの各辺と、各パッドにボンディングされた各圧着ボールの各輪郭とから各Y方向隙間長さを取得すること、
を特徴とするボンディング装置。 - 請求項1に記載のボンディング装置であって。
隙間長さ取得手段によって取得した各隙間長さとパッドの幅とに基づいて圧着ボールの径を算出する圧着ボール径算出手段と、
算出した圧着ボール径を表示する表示手段と、
を有することを特徴とするボンディング装置。 - 請求項7に記載のボンディング装置であって、
輪郭取得手段は、パッド幅と設計隙間長さが同一の複数のパッドの各辺と、各パッドにボンディングされた各圧着ボールの各輪郭とを取得し、
隙間長さ取得手段は、各パッドのX方向に延びる各辺と各圧着ボールの各輪郭とのY方向の距離を各Y方向隙間長さとし、各パッドのY方向に延びる各辺と各圧着ボールの各輪郭とのX方向の距離を各X方向隙間長さとして取得し、
圧着ボール径算出手段は、パッド幅からXYいずれか一方向または両方向の隙間長さの平均値の2倍を引いて圧着ボール径を算出すること、
を特徴とするボンディング装置。 - 請求項7に記載のボンディング装置であって、
輪郭取得手段は、パッド幅と設計隙間長さが同一の複数のパッドの各辺と、各パッドにボンディングされた各圧着ボールの各輪郭とを取得し、
隙間長さ取得手段は、パッド幅方向プラス側にあってパッド幅方向と直角方向に延びる各辺と各圧着ボールの各輪郭とのパッド幅方向の距離を各パッド幅方向プラス側隙間長さとして取得し、各パッド幅方向マイナス側にあってパッド幅方向と直角方向に延びる各辺と各圧着ボールの各輪郭とのパッド幅方向の距離を各パッド幅方向マイナス側隙間長さとして取得し、
パッド幅から各パッド幅方向プラス側隙間長さの平均値と各パッド幅方向マイナス側隙間長さの平均値とを引いて圧着ボール径を計算する圧着ボール径算出手段と、
を有することを特徴とするボンディング装置。 - XYテーブルによってXY方向に移動するボンディングヘッドと、
ボンディングヘッドに取り付けられ、先端に取り付けられたボンディングツールを半導体チップのパッドに対して接離方向に動作させるボンディングアームと、
ボンディングの際のボンディングツールの中心線に対してXY方向に所定量だけ光軸がオフセットされてボンディングヘッドに取り付けられ、パッドおよびパッドにボンディングされた圧着ボールの画像を取得するカメラと、を含み、
カメラによって取得したパッドの画像とオフセット量とに基づいてボンディングツール中心軸のXY方向位置を制御するボンディング装置のボンディング方法であって、
カメラによって取得した画像を処理してパッドの各辺と、圧着ボールの輪郭とを取得する輪郭取得工程と、
パッド各辺と圧着ボールの輪郭との各隙間長さを取得する隙間長さ取得工程と、
隙間長さ取得工程によって取得した各隙間長さに基づいてオフセット量の修正を行うオフセット量修正工程と、
を有することを特徴とするボンディング方法。 - 請求項10に記載のボンディング方法であって、
輪郭取得工程は、少なくとも1つのパッドの各辺と、各パッドにボンディングされた各圧着ボールの各輪郭とを取得し、
隙間長さ取得工程は、各パッドのX方向に延びる各辺と各圧着ボールの各輪郭とのY方向の距離を各Y方向隙間長さとし、各パッドのY方向に延びる各辺と各圧着ボールの各輪郭とのX方向の距離を各X方向隙間長さとして取得し、
オフセット量修正工程は、
各X方向隙間長さ及び各Y方向隙間長さが予め設定した許容範囲にあるか否かを比較し、各X方向隙間長さのうちの少なくとも1つが許容範囲外の場合には、各X方向隙間長さと許容範囲の中央値との差に応じてX方向のオフセット量を変化させ、各Y方向隙間長さのうちの少なくとも1つが許容範囲外の場合には、各Y方向隙間長さと許容範囲の中央値との差に応じてY方向のオフセット量を変化させること、
を特徴とするボンディング方法。 - 請求項11に記載のボンディング方法であって、
輪郭取得工程は、設計隙間長さが同一の複数のパッドの各辺と、各パッドにボンディングされた各圧着ボールの各輪郭とを取得し、
オフセット量修正工程は、
各X方向隙間長さの平均値と許容範囲の中央値との差に応じてX方向のオフセット量を変化させ、各Y方向隙間長さの平均値と許容範囲の中央値との差に応じてY方向のオフセット量を変化させること、
を特徴とするボンディング方法。 - 請求項12に記載のボンディング方法であって、
隙間長さ取得工程は、X方向の設計隙間長さが同一の第1のグループに含まれる複数のパッドの各辺と、各パッドにボンディングされた各圧着ボールの各輪郭とから各X方向隙間長さを取得し、Y方向の設計隙間長さが同一の第2のグループに含まれる複数のパッドの各辺と、各パッドにボンディングされた各圧着ボールの各輪郭とから各Y方向隙間長さを取得すること、
を特徴とするボンディング方法。
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TW97129610A TW200941603A (en) | 2008-03-31 | 2008-08-05 | Bonding apparatus and bonding method |
CN200880128541.5A CN101981679B (zh) | 2008-03-31 | 2008-10-07 | 焊接装置及焊接方法 |
KR20107020243A KR101037080B1 (ko) | 2008-03-31 | 2008-10-07 | 본딩 장치 및 본딩 방법 |
PCT/JP2008/068247 WO2009122605A1 (ja) | 2008-03-31 | 2008-10-07 | ボンディング装置及びボンディング方法 |
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-
2008
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- 2008-08-05 TW TW97129610A patent/TW200941603A/zh unknown
- 2008-10-07 CN CN200880128541.5A patent/CN101981679B/zh active Active
- 2008-10-07 WO PCT/JP2008/068247 patent/WO2009122605A1/ja active Application Filing
- 2008-10-07 KR KR20107020243A patent/KR101037080B1/ko active IP Right Grant
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Publication number | Priority date | Publication date | Assignee | Title |
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JPWO2012165030A1 (ja) * | 2011-05-31 | 2015-02-23 | 株式会社村田製作所 | バンプ位置の導出方法およびバンプ形成位置の補正方法、バンプボンダー並びにバンプの外観検査装置 |
CN112074371A (zh) * | 2018-10-25 | 2020-12-11 | 克龙贝格和舒伯特汽车有限公司 | 用于接合过程监控的方法 |
CN112074371B (zh) * | 2018-10-25 | 2021-07-06 | 克龙贝格和舒伯特汽车有限公司 | 用于接合过程监控的方法 |
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KR101037080B1 (ko) | 2011-05-26 |
CN101981679B (zh) | 2012-07-25 |
US8091761B2 (en) | 2012-01-10 |
JP4247299B1 (ja) | 2009-04-02 |
KR20100105803A (ko) | 2010-09-29 |
TWI373812B (ja) | 2012-10-01 |
WO2009122605A1 (ja) | 2009-10-08 |
TW200941603A (en) | 2009-10-01 |
CN101981679A (zh) | 2011-02-23 |
US20110114704A1 (en) | 2011-05-19 |
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