JP2009224461A - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
JP2009224461A
JP2009224461A JP2008065863A JP2008065863A JP2009224461A JP 2009224461 A JP2009224461 A JP 2009224461A JP 2008065863 A JP2008065863 A JP 2008065863A JP 2008065863 A JP2008065863 A JP 2008065863A JP 2009224461 A JP2009224461 A JP 2009224461A
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JP
Japan
Prior art keywords
connection pad
insulating layer
pad portion
wiring board
wiring
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Pending
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JP2008065863A
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English (en)
Japanese (ja)
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JP2009224461A5 (https=
Inventor
Toshiaki Aoki
利晃 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2008065863A priority Critical patent/JP2009224461A/ja
Publication of JP2009224461A publication Critical patent/JP2009224461A/ja
Publication of JP2009224461A5 publication Critical patent/JP2009224461A5/ja
Pending legal-status Critical Current

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JP2008065863A 2008-03-14 2008-03-14 配線基板及びその製造方法 Pending JP2009224461A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008065863A JP2009224461A (ja) 2008-03-14 2008-03-14 配線基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008065863A JP2009224461A (ja) 2008-03-14 2008-03-14 配線基板及びその製造方法

Publications (2)

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JP2009224461A true JP2009224461A (ja) 2009-10-01
JP2009224461A5 JP2009224461A5 (https=) 2011-02-10

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JP2008065863A Pending JP2009224461A (ja) 2008-03-14 2008-03-14 配線基板及びその製造方法

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JP (1) JP2009224461A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012004440A (ja) * 2010-06-18 2012-01-05 Shinko Electric Ind Co Ltd 配線基板
JP2012009606A (ja) * 2010-06-24 2012-01-12 Shinko Electric Ind Co Ltd 配線基板
JP2016096292A (ja) * 2014-11-17 2016-05-26 新光電気工業株式会社 配線基板及び電子部品装置と配線基板の製造方法及び電子部品装置の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04322451A (ja) * 1991-04-23 1992-11-12 Hitachi Ltd 半導体装置
JP2000200849A (ja) * 1999-01-06 2000-07-18 Shinko Electric Ind Co Ltd Ｐｇａ型電子部品用基板、その製造方法及び半導体装置
JP2001217341A (ja) * 2000-02-03 2001-08-10 Ngk Spark Plug Co Ltd リードピン付き配線基板
JP2003188311A (ja) * 2001-12-20 2003-07-04 Kyocera Corp ピン付き配線基板およびこれを用いた電子装置
JP2007027701A (ja) * 2005-06-13 2007-02-01 Ngk Spark Plug Co Ltd 配線基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04322451A (ja) * 1991-04-23 1992-11-12 Hitachi Ltd 半導体装置
JP2000200849A (ja) * 1999-01-06 2000-07-18 Shinko Electric Ind Co Ltd Ｐｇａ型電子部品用基板、その製造方法及び半導体装置
JP2001217341A (ja) * 2000-02-03 2001-08-10 Ngk Spark Plug Co Ltd リードピン付き配線基板
JP2003188311A (ja) * 2001-12-20 2003-07-04 Kyocera Corp ピン付き配線基板およびこれを用いた電子装置
JP2007027701A (ja) * 2005-06-13 2007-02-01 Ngk Spark Plug Co Ltd 配線基板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012004440A (ja) * 2010-06-18 2012-01-05 Shinko Electric Ind Co Ltd 配線基板
JP2012009606A (ja) * 2010-06-24 2012-01-12 Shinko Electric Ind Co Ltd 配線基板
JP2016096292A (ja) * 2014-11-17 2016-05-26 新光電気工業株式会社 配線基板及び電子部品装置と配線基板の製造方法及び電子部品装置の製造方法
US10049972B2 (en) 2014-11-17 2018-08-14 Shinko Electric Industries Co., Ltd. Wiring board, electronic component device, method for manufacturing wiring board, and method for manufacturing electronic component device

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