JP2009224461A - Wiring board and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board on which pins are fitted to connection pads with high reliability even if areas of the connection pads become smaller. <P>SOLUTION: The wiring board has such a structure that the pins 40 are fitted standing at the connection pads P of a wiring layer 16 formed on an insulating layer 22, and recesses C are formed at regions of the insulating layer 22 which correspond to the connection pads P which have upper surfaces formed in concave surfaces Ca conforming to the recesses C of the insulating layer 22. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a wiring board and a manufacturing method thereof, and more particularly to a wiring board of PGA (Pin Grid Array) type using pins as connection terminals and a manufacturing method thereof.

  Conventionally, there is a PGA type wiring board that uses pins as connection terminals. FIG. 1 partially shows a peripheral portion of a pin in a conventional PGA type wiring board. As shown in FIG. 1, in the conventional PGA type wiring board, wiring layers 200 and 220 formed above and below the interlayer insulating layer 100 are interconnected via via holes VH.

  A solder resist 400 in which an opening 420 is provided in the connection pad portion P of the lowermost wiring layer 220 is formed. Further, a pin 600 is attached to the connection pad portion P of the lowermost wiring layer 220 with solder 500. And the pin 600 of a wiring board is inserted in the socket of a motherboard, and is electrically connected.

  Patent Document 1 discloses that in a PGA type electronic component substrate, the surface of the pad wiring formed thereon is made uneven by providing unevenness in the insulating layer in the region where the pad portion is formed, thereby providing pin mounting strength. It is described to increase.

  In Patent Document 2, in a PGA type wiring board, a spherical contact portion made of a eutectic silver brazing material having a melting point higher than that of Sn-Ag solder is provided at a large diameter portion of the pin, and a pin is provided on a pin pad of the wiring board. It is described that the spherical contact portion is soldered.

Patent Document 3 describes that the adhesion of bumps formed on electrode pads is improved by processing the surface of the electrode pads of the wiring board into a shape that is recessed toward the center. Yes.
Japanese Patent Laid-Open No. 2000-200849 JP 2000-49252 A JP-A-9-162240

  In recent years, with higher performance of semiconductor chips, higher density of wiring boards is required. In the PGA type wiring board, the area of the connection pad portion to which the pin is attached is becoming smaller, and there are cases where the connection strength between the connection pad portion and the pin cannot be sufficiently obtained.

  For this reason, when inserting and connecting the pins of the wiring board to the socket of the motherboard, the pins may be removed, and the pins may not be inserted with high reliability.

  Furthermore, when the area of the connection pad portion of the wiring board is reduced, there is a problem that sufficient adhesion between the connection pad portion and the interlayer insulating layer cannot be obtained. For this reason, when performing a tensile test of the pins of the wiring board, the connection pad portion may be peeled off from the interlayer insulating layer, which causes a decrease in yield.

  The present invention has been created in view of the above problems, and an object of the present invention is to provide a wiring board in which pins can be reliably attached to a connection pad portion even when the area of the connection pad portion is reduced, and a method for manufacturing the same. And

  In order to solve the above problems, the present invention relates to a wiring board, and is a wiring board having a structure in which pins are erected and attached to connection pad portions of a wiring layer formed on an insulating layer, The insulating layer corresponding to the pad portion is provided with a concave portion collectively, and the surface of the connection pad portion is a concave surface corresponding to the concave portion of the insulating layer.

  In the present invention, the concave portions collectively provided in the region of the insulating layer under the connection pad portion are provided, and the surface of the connection pad portion is a concave surface corresponding to the concave portion of the insulating layer. And the pin is attached to the concave surface of the connection pad part with solder.

  By providing recesses collectively in the insulating layer under the connection pad portion, the contact area between the connection pad portion and the insulating layer can be set larger than when the connection pad portion is disposed on a flat insulating layer. it can. Thereby, even if it is a case where the area of a connection pad part becomes small, the adhesive strength of a connection pad part and an insulating layer can be made high.

  Further, in the present invention, since the surface of the connection pad portion is concave and recessed, more solder can be filled around the head portion of the pin. Thereby, the connection intensity | strength of a pin and a connection pad part can be raised, and the reliability of a connection can be improved.

  In one preferable aspect of the present invention, the concave surface of the connection pad portion has a bowl-like shape whose depth increases from the outer peripheral side toward the central portion. Further, the pin has a conical head portion, and the conical head portion is fixed to the connection pad portion by solder.

  In this aspect, since the surface of the connection pad portion corresponds to the conical head portion of the pin by recessing the surface of the connection pad portion with a bowl-shaped concave surface, it is sufficient when attaching the pin. Mounting stability is obtained. Thereby, the reliability of pin attachment can be improved.

  Further, in order to solve the above problems, the present invention relates to a wiring board, and is a wiring board having a structure in which pins are erected and attached to connection pad portions of a wiring layer formed on an insulating layer, A plurality of recesses are provided in the region of the insulating layer corresponding to the connection pad portion, the connection pad portion is formed by embedding the recess, and the surface of the connection pad portion is flat or batched. It is characterized by a concave surface.

  Also in the present invention, by providing a plurality of recesses in the insulating layer under the connection pad portion, the contact area between the connection pad portion and the insulating layer can be made larger than when the connection pad portion is disposed on a flat insulating layer. Can be set large. Thereby, even if it is a case where the area of a connection pad part becomes small, the adhesive strength of a connection pad part and an insulating layer can be made high.

  In addition, when attaching a pin having a conical head portion, sufficient mounting stability can be obtained when attaching the pin, as in the above-described invention, by making the surface of the connection pad portion into a concave surface. .

  As described above, in the wiring board of the present invention, even if the area of the connection pad portion is reduced, the pin can be attached to the connection pad portion with high reliability.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

(First embodiment)
FIG. 2 is a sectional view showing the wiring board according to the first embodiment of the present invention. As shown in FIG. 2, in the wiring substrate 1 of the first embodiment, the first wiring layers 12 are respectively formed on both sides of the core substrate 10. The core substrate 10 is provided with a through hole TH penetrating in the thickness direction, and the through hole 11 is filled in the through hole TH. The first wiring layers 12 on both sides of the core substrate 10 are interconnected via the through electrodes 11.

  Alternatively, a through-hole plating layer is provided on the inner surface of the so-hole TH of the core substrate 10, the resin inside the hole is filled, and the first wiring layers 12 on both sides of the core substrate 10 are mutually connected via the through-hole plating layer. It may be connected.

  A first interlayer insulating layer 20 that covers the first wiring layer 12 is formed on both sides of the core substrate 10, and a first via hole VH 1 having a depth reaching the first wiring layer 12 is formed in each of them. Is provided. A second wiring layer 14 connected to the first wiring layer 12 through the first via hole VH1 is formed on each of the first interlayer insulating layers 20 on both sides of the core substrate 10.

  Further, second interlayer insulating layers 22 are respectively formed on the second wiring layers 14 on both sides of the core substrate 10, and second via holes VH 2 having a depth reaching the second wiring layer 14 are respectively formed thereon. Is provided. Further, third wiring layers 16 connected to the second wiring layer 14 through the second via holes VH2 are respectively formed on the second interlayer insulating layers 22 on both sides of the core substrate 10.

  In the region of the second interlayer insulating layer 22 corresponding to the lower side of the third wiring layer 16 on the lower surface side of the core substrate 10 (upper side in FIG. 2), the depth increases from the outer peripheral side to the central portion. A deepened bowl-shaped recess C is provided. The connection pad portion P of the third wiring layer 16 is formed on the concave portion C of the second interlayer insulating layer 22 with substantially the same film thickness. Thus, the surface of the connection pad portion P of the third wiring layer 16 is a concave surface Ca corresponding to the concave portion C of the second interlayer insulating layer 22, and the depth increases from the outer peripheral side to the central portion as in the concave portion C. It is like a mikoshi.

  A case where the connection pad portion P is arranged on the flat second interlayer insulating layer 22 by providing the concave portions C collectively in the region of the second interlayer insulating layer 22 below the connection pad portion P of the third wiring layer 16. The contact area between the connection pad portion P and the second interlayer insulating layer 22 can be set larger. Thereby, even when the area of the connection pad portion P is reduced, the adhesion strength between the connection pad portion P and the second interlayer insulating layer 22 can be increased.

  Further, on both surface sides of the core substrate 10, solder resists 18 having openings 18 a provided on the connection pad portions P of the third wiring layer 16 are respectively formed.

  A pin 40 is attached to the connection pad portion P of the third wiring layer 16 on the lower surface side of the core substrate 10. The pin 40 includes a head portion 40a having a conical large diameter portion. The head portion 40 a of the pin 40 is disposed on the connection pad portion P in the opening 18 a of the solder resist 18 and is fixed to the connection pad portion P with the solder 42. The pin 40 is configured, for example, by applying nickel plating and gold plating to the surface of a metal pin made of Kovar or the like. The pins 40 are provided in a grid pattern in the entire lower surface side of the wiring board or in a partial region such as a peripheral edge.

  In the present embodiment, since the surface of the connection pad portion P is recessed as a concave surface Ca, more solder 42 can be filled around the head portion 40a of the pin 40. Thereby, the connection intensity | strength of the pin 40 and the connection pad part P can be raised, and the reliability of pin connection can be improved.

  Moreover, since the surface of the connection pad part P corresponds to the conical head part 40a of the pin 40 by making the surface of the connection pad part P into a concave-shaped concave surface Ca, the pin 40 is attached. In this case, sufficient mounting stability can be obtained, and the yield of pin mounting can be improved.

  Bumps 32 of the semiconductor chip 30 are flip-chip connected to the connection pad portions P of the third wiring layer 16 on the upper surface side of the core substrate 10. An underfill resin 34 is filled in the gap below the semiconductor chip 30. Then, the pins 40 of the wiring board 1 on which the semiconductor chip 30 is mounted are inserted into the socket of the motherboard and are electrically connected.

  In the wiring board 1 of the present embodiment, as described above, the head portion 40a of the pin 40 can be fixed to the connection pad portion P with a large amount of solder 42 by making the surface of the connection pad portion P concave surface Ca. The connection strength can be increased. Therefore, the problem that the pin 40 is removed when the pin 40 of the wiring board 1 is inserted into a socket such as a mother board is solved, and the wiring board 1 can be connected to the mother board or the like with high reliability.

  Further, in the wiring substrate 1 of the present embodiment, as described above, the connection pad portion P is disposed on the concave portion C of the second interlayer insulating layer 22 and the surface thereof is the concave surface Ca, so that the flat second interlayer These contact areas are made larger than when the connection pad portion P is disposed on the insulating layer 22.

  As a result, the adhesion between the connection pad portion P and the second interlayer insulating layer 22 can be improved. Therefore, even if the pin 40 is pulled with the pin tensile strength of the design specifications, the connection pad portion P is removed from the second interlayer insulating layer 22. It becomes difficult to peel off and can withstand tensile stress.

  Next, a method for forming the connection pad portion P of the third wiring layer 16 in which the above-described surface becomes a concave surface Ca and is recessed will be described. As shown in FIG. 3A, first, a structure in which the second interlayer insulating layer 22 is formed on the second wiring layer 14 (lower wiring layer) on the lower surface side of the core substrate 10 in FIG. Prepare your body. The first and second interlayer insulating layers 20 and 22 are formed, for example, by sticking a semi-cured resin film such as a polyimide resin or an epoxy resin and then curing the resin film by heat treatment.

  Next, as shown in FIG. 3B, a region having the connection pad portion P of the second interlayer insulating layer 22 is processed by a laser to form a bowl-shaped recess C. The depth d of the recess C is set to 5 to 10 μm when the thickness of the second interlayer insulating layer 22 is 30 μm. In addition to the laser processing method, a mask (resist or the like) having an opening is formed in a region where the connection pad portion P is disposed, and the second interlayer insulating layer 22 is etched through the opening to form a recess. It is also possible to form C.

  Subsequently, as shown in FIG. 3C, the portion of the second interlayer insulating layer 22 in which the via hole is disposed in the recess C is processed with a laser or the like, so that the depth reaching the second wiring layer 14 is reached. A second via hole VH2 is formed. In addition, after forming the second via hole VH2 in the second interlayer insulating layer 22, the recess C may be formed around the second via hole VH2.

  Next, as shown in FIG. 4A, a seed layer 16a made of copper or the like is formed on the upper surface including the inner surface of the recess C of the second interlayer insulating layer 22 from the second via hole VH2 by electroless plating or sputtering. To do. Subsequently, as shown in FIG. 4B, a plating resist 17 in which an opening 17a is provided in a portion where the third wiring layer is disposed is formed. Further, a metal plating layer 16b made of copper or the like is formed in the opening 17a of the plating resist 17 from the second via hole VH2 by electrolytic plating using the seed layer 16a as a plating power feeding path.

  At this time, the metal plating layer 16b is formed so as to fill the second via hole VH2, and is formed on the inner surface of the concave portion C of the second interlayer insulating layer 22 with substantially the same film thickness. Thereby, the metal plating layer 16b is formed on the inner surface of the concave portion C of the second interlayer insulating layer 22 so that the surface thereof becomes a concave-shaped concave surface Ca corresponding to the concave portion C.

  Next, as shown in FIG. 4C, after the plating resist 17 is removed, the seed layer 16a is wet-etched using the metal plating layer 16b as a mask, thereby forming the seed layer 16a and the metal plating layer 16b. A third wiring layer 16 (upper wiring layer) is obtained. In this way, the connection pad portion P whose surface is the concave surface Ca is disposed on the concave portion C of the second interlayer insulating layer 22. Although the semi-additive method is exemplified as a method for forming the third wiring layer 16, various wiring forming methods such as a subtractive method can be employed.

  Next, as shown in FIG. 5A, a solder resist 18 having an opening 18 a provided on the connection pad portion P of the third wiring layer 16 is formed on the second interlayer insulating layer 22.

  Thereafter, as shown in FIG. 5 (b), a pin 40 having a conical head portion 40a is prepared, and the head portion 40a of the pin 40 is disposed on the connection pad portion P via a solder paste, and reflow heating is performed. As a result, the pin 40 is fixed to the connection pad portion P by the solder 42. At this time, as described above, since the concave surface Ca of the connection pad portion P corresponds to the head portion 40a of the pin 40, the pin 40 is stably attached to the connection pad portion P. Thus, the wiring board 1 shown in FIG. 2 is obtained.

  With such a manufacturing method, the connection pad portion P having a concave surface Ca can be easily formed, and the pin 40 can be reliably attached to the concave surface Ca of the connection pad portion P.

  FIG. 6 shows a wiring board 1a according to a first modification of the first embodiment of the present invention. In the wiring substrate 1 (FIG. 5B) described above, the second via hole VH2 is disposed under the connection pad portion P of the third wiring layer 16. Like the wiring substrate 1a of the first modification shown in FIG. 6, the third wiring layer 16 is drawn from the second via hole VH2 to the upper surface of the second interlayer insulating layer 22, and the surface is controlled at a position away from the second via hole VH2. You may make it arrange | position the connection pad part P used as the bowl-shaped concave surface Ca.

  FIG. 7 shows a wiring board 1b according to a second modification of the first embodiment of the present invention. In the above-described wiring board 1 (FIG. 5B), the surface of the connection pad portion P of the third wiring layer 16 is a bowl-shaped concave surface Ca. Like the wiring substrate 1b of the second modification shown in FIG. 7, the region of the second interlayer insulating layer 22 corresponding to the connection pad portion P has a plurality of steps and the depth becomes deeper toward the center portion. Such a stepped recess C may be formed, and the surface of the connection pad portion P may be a corresponding stepped recess.

  As described above, in the first embodiment, various shapes can be adopted as the recesses formed in the third interlayer insulating layer 22 as long as they are collective recesses (concave surfaces) (internal communication). What is necessary is just to make it the contact area of the part P and the 3rd interlayer insulation layer 22 large. Also in the first and second modified examples, the same effects as those of the wiring board 1 of FIG.

(Second Embodiment)
8 and 9 are cross-sectional views showing a method of manufacturing a wiring board according to the second embodiment of the present invention. The feature of the second embodiment is that the adhesiveness of the connection pad portion is improved by forming a plurality of recesses in the interlayer insulating layer below the connection pad portion. Detailed descriptions of the same steps as those in the first embodiment are omitted.

  As shown in FIG. 8A, the method for manufacturing a wiring board according to the second embodiment of the present invention is first performed in the above-described wiring board shown in FIG. 2, as in FIG. 3A. A structure in which the second interlayer insulating layer 22 is formed on the second wiring layer 14 (lower wiring layer) on the lower surface side of the substrate 10 is prepared. Next, as shown in FIG. 8B, a plurality of hole-shaped recesses Cx are formed by laser in the region of the second interlayer insulating layer 22 where the connection pad portions are disposed.

For example, when the thickness of the second interlayer insulating layer 22 is 30 μm, the depth d of each recess Cx is set to 5 to 10 μm. When the area where the connection pad portion is arranged is 800 × 800 μm ^2, a plurality of (for example, 5 to 10) concave portions Cx having a diameter of about 60 μm are arranged in the region. Since the recess Cx is provided in order to increase the contact area between the connection pad portion and the third interlayer insulating layer 22, it may be formed from a groove or the like in addition to the hole shape, and the shape and number are arbitrarily set. be able to.

  In addition to the method using a laser, a mask (resist or the like) having an opening is formed in a portion where the recess Cx is disposed, and the second interlayer insulating layer 22 is etched through the opening to form the recess Cx. It is also possible to do. When the recess Cx such as a groove other than the hole shape is formed, it can be easily formed by employing etching.

  Subsequently, as shown in FIG. 8C, the central portion of the region where the recess Cx of the second interlayer insulating layer 22 is formed is processed by a laser or the like, so that the depth reaching the second wiring layer 14 is reached. A second via hole VH2 is formed.

  Next, as shown in FIG. 8D, the third wiring layer 16 (upper wiring layer) is formed on the second interlayer insulating layer 22 by the semi-additive method described in the first embodiment. As a result, the connection pad portion P of the third wiring layer 16 is disposed on the region of the second interlayer insulating layer 22 where the plurality of recesses Cx are formed. The connection pad portion P of the third wiring layer 16 is formed by embedding a plurality of recesses Cx in the second interlayer insulating layer 22, and the surface of the connection pad portion P is flat without being affected by the recesses Cx below it. Formed.

  By adopting the semi-additive method, the metal plating layer is formed on the second interlayer insulating layer 22 while burying the recess Cx of the second interlayer insulating layer 22. The third wiring layer 16 can be easily formed.

  Further, as shown in FIG. 9A, a solder resist 18 having an opening 18 a provided on the connection pad portion P of the third wiring layer 16 is formed on the second interlayer insulating layer 22.

  Thereafter, as shown in FIG. 9B, a pin 40 having a conical head portion 40 a is prepared, and the head portion 40 a of the pin 40 is fixed to the connection pad portion P with solder 42.

  As described above, the wiring board 2 of the second embodiment is manufactured.

  In the wiring substrate 2 of the second embodiment, since the plurality of recesses Cx are formed in the second interlayer insulating layer 22 below the connection pad portion P of the third wiring layer 16, the connection pad portion P and the second interlayer insulating layer 22 are formed. And the contact area of the connection pad portion P can be improved. As a result, as in the first embodiment, even if the pin 40 is pulled with the design specification pin tensile strength, the connection pad portion P is not easily peeled off from the second interlayer insulating layer 22 below, and can withstand tensile stress.

  FIG. 10 shows a wiring board 2a according to a first modification of the second embodiment. As shown in FIG. 10, in the first modification, the third wiring layer 16 is drawn out from the second via hole VH2 to the upper surface of the second interlayer insulating layer 22, and a similar connection pad portion P is formed at a position away from the second via hole VH2. May be provided. Also in the first modified example, the same effects as those of the wiring board 2 in FIG.

  In addition, FIG. 11 shows a wiring board 2b of a second modification of the second embodiment. In the wiring board 2 (FIG. 9B) of the second embodiment, the plurality of recesses Cx are completely embedded by the connection pad portion P, so that the surface of the connection pad portion P is formed as a flat surface S.

  When it is necessary to ensure sufficient mounting stability of the pin 40 having the conical head portion 40a, the surface of the connection pad portion P is processed like the wiring board 2b of the second modification shown in FIG. And it is good also as the bowl-shaped concave surface Ca. After the third wiring layer 16 is formed (before the solder resist 18 is formed), the surface of the third wiring layer 16 is processed into a concave surface Ca. For example, after forming a mask (resist or the like) having an opening on the connection pad portion P, the concave surface Ca can be obtained by wet etching the surface layer portion of the connection pad portion P through the opening of the mask. .

  The concave surface Ca of the connection pad portion P may be provided partially on the center side of the connection pad portion P (portion corresponding to the head portion 40a of the pin 40) as shown in FIG. May be provided.

  When the concave surface Ca is provided all over the connection pad portion P, the concave surface Ca may be formed by wet etching the surface of the connection pad portion P through the opening 18a of the solder resist 18. In this case, the solder resist 18 is left as it is.

  As a result, similarly to the first embodiment, even when the pin 40 having the conical head portion 40a is attached, the surface shape of the connection pad portion P corresponds to the head portion 40a of the pin 40. Therefore, sufficient mounting stability of the pin 40 can be ensured.

FIG. 1 is a partial cross-sectional view showing a peripheral portion of a pin of a conventional PGA type wiring board. FIG. 2 is a sectional view showing the wiring board according to the first embodiment of the present invention. 3A to 3C are partial cross-sectional views (part 1) showing the method for manufacturing the wiring board according to the first embodiment of the present invention. 4A to 4C are partial cross-sectional views (part 2) illustrating the method for manufacturing the wiring board according to the first embodiment of the present invention. 5A and 5B are partial cross-sectional views (part 3) illustrating the method for manufacturing the wiring board according to the first embodiment of the present invention. FIG. 6 is a partial cross-sectional view showing a wiring board of a first modification of the first embodiment of the present invention. FIG. 7 is a partial sectional view showing a wiring board of a second modification of the first embodiment of the present invention. 8A to 8D are partial cross-sectional views (part 1) showing the method for manufacturing a wiring board according to the second embodiment of the present invention. 9A and 9B are partial cross-sectional views (part 2) showing the method for manufacturing the wiring board according to the second embodiment of the present invention. FIG. 10 is a partial cross-sectional view showing a wiring board of a first modification of the second embodiment of the present invention. FIG. 11 is a partial cross-sectional view showing a wiring board of a second modification of the second embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,1a, 1b, 2,2a, 2b ... wiring board, 10 ... core board, 11 ... penetration electrode, 12 ... 1st wiring layer, 14 ... 2nd wiring layer, 16 ... 3rd wiring layer, 16a ... seed layer 16b ... metal plating layer, 17 ... plating resist, 17a, 18a ... opening, 18 ... solder resist, 20 ... first interlayer insulating layer, 22 ... second interlayer insulating layer, 30 ... semiconductor chip, 32 ... bump, 34 ... Underfill resin, 40 ... pin, 40a ... head portion, 42 ... solder, C, Cx ... concave, Ca ... concave surface, P ... connection pad portion, S ... flat surface, TH ... through hole, VH ... via hole.

Claims (10)

A wiring board having a structure in which pins are erected and attached to connection pad portions of a wiring layer formed on an insulating layer,
A wiring board, wherein a concave portion is provided in the insulating layer region corresponding to the connection pad portion, and a surface of the connection pad portion is a concave surface corresponding to the concave portion of the insulating layer.   2. The wiring board according to claim 1, wherein the concave surface of the connection pad portion is shaped like a bowl having a depth that increases from the outer peripheral side toward the central portion.   The wiring board according to claim 1, wherein the pin includes a conical head portion, and the head portion is fixed to a concave surface of the connection pad portion by solder.   The wiring board according to claim 1, wherein a via hole is provided in the insulating layer, and the connection pad portion is connected to a lower wiring layer through the via hole. A wiring board having a structure in which pins are erected and attached to connection pad portions of a wiring layer formed on an insulating layer,
A plurality of recesses are provided in the region of the insulating layer corresponding to the connection pad portion, the connection pad portion is formed by embedding the recess, and the surface of the connection pad portion is flat or batched. A wiring board having a concave surface.   The wiring substrate according to claim 5, wherein the recess has a hole shape. A method for manufacturing a wiring board having a structure in which pins are erected and attached to connection pad portions of an upper wiring layer formed on an insulating layer,
Forming the insulating layer on the lower wiring layer;
Forming a recess collectively in the region of the insulating layer corresponding to the connection pad portion, and forming a via hole reaching the lower wiring layer in the insulating layer;
Forming the upper wiring layer in which the connection pad portion connected to the upper surface including the concave portion of the insulating layer from the inside of the via hole and having a concave surface corresponding to the concave portion is disposed on the concave portion of the insulating layer; ,
And a step of attaching the pin to the concave surface of the connection pad portion.   The method for manufacturing a wiring board according to claim 7, wherein the concave surface of the connection pad portion is shaped like a bowl whose depth increases from the outer peripheral side toward the center portion. A method for manufacturing a wiring board having a structure in which pins are erected and attached to connection pad portions of an upper wiring layer formed on an insulating layer,
Forming the insulating layer on the lower wiring layer;
Forming a plurality of recesses in the region of the insulating layer corresponding to the connection pad portion, and forming a via hole reaching the lower wiring layer in the insulating layer;
The connection pad portion that is connected to the upper surface including the plurality of recesses of the insulating layer from within the via hole, is embedded in the region where the plurality of recesses of the insulating layer are formed, and has a flat surface. Forming an upper wiring layer;
And a step of attaching the pin to the connection pad portion.   The method for manufacturing a wiring board according to claim 9, further comprising a step of making the surface of the connection pad portion concave after the step of forming the upper wiring layer.

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