JP2009224461A5 - - Google Patents
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- Publication number
- JP2009224461A5 JP2009224461A5 JP2008065863A JP2008065863A JP2009224461A5 JP 2009224461 A5 JP2009224461 A5 JP 2009224461A5 JP 2008065863 A JP2008065863 A JP 2008065863A JP 2008065863 A JP2008065863 A JP 2008065863A JP 2009224461 A5 JP2009224461 A5 JP 2009224461A5
- Authority
- JP
- Japan
- Prior art keywords
- connection pad
- insulating layer
- pad portion
- concave
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008065863A JP2009224461A (ja) | 2008-03-14 | 2008-03-14 | 配線基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008065863A JP2009224461A (ja) | 2008-03-14 | 2008-03-14 | 配線基板及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009224461A JP2009224461A (ja) | 2009-10-01 |
| JP2009224461A5 true JP2009224461A5 (https=) | 2011-02-10 |
Family
ID=41240957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008065863A Pending JP2009224461A (ja) | 2008-03-14 | 2008-03-14 | 配線基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009224461A (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5444136B2 (ja) * | 2010-06-18 | 2014-03-19 | 新光電気工業株式会社 | 配線基板 |
| JP5578962B2 (ja) * | 2010-06-24 | 2014-08-27 | 新光電気工業株式会社 | 配線基板 |
| JP6465386B2 (ja) * | 2014-11-17 | 2019-02-06 | 新光電気工業株式会社 | 配線基板及び電子部品装置と配線基板の製造方法及び電子部品装置の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04322451A (ja) * | 1991-04-23 | 1992-11-12 | Hitachi Ltd | 半導体装置 |
| JP2000200849A (ja) * | 1999-01-06 | 2000-07-18 | Shinko Electric Ind Co Ltd | Ｐｇａ型電子部品用基板、その製造方法及び半導体装置 |
| JP3378550B2 (ja) * | 2000-02-03 | 2003-02-17 | 日本特殊陶業株式会社 | リードピン付き配線基板 |
| JP2003188311A (ja) * | 2001-12-20 | 2003-07-04 | Kyocera Corp | ピン付き配線基板およびこれを用いた電子装置 |
| JP2007027701A (ja) * | 2005-06-13 | 2007-02-01 | Ngk Spark Plug Co Ltd | 配線基板 |
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2008
- 2008-03-14 JP JP2008065863A patent/JP2009224461A/ja active Pending