JP2009177337A - 光通信装置及びその製造方法 - Google Patents
光通信装置及びその製造方法 Download PDFInfo
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- JP2009177337A JP2009177337A JP2008011812A JP2008011812A JP2009177337A JP 2009177337 A JP2009177337 A JP 2009177337A JP 2008011812 A JP2008011812 A JP 2008011812A JP 2008011812 A JP2008011812 A JP 2008011812A JP 2009177337 A JP2009177337 A JP 2009177337A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
- Optical Communication System (AREA)
- Transceivers (AREA)
Abstract
【解決手段】アンテナ12,13に接続された無線通信用の送信部及び受信部を有して無線通信をする半導体チップ10と、アンテナ22,27に接続された無線通信用の送信部,受信部を有し、かつ、当該送信部及び受信部に接続された光通信用の光学素子を有して半導体チップ10を実装した無線光学チップ基板20とを備え、半導体チップ10のアンテナ12,13とRF−OPTチップ21のアンテナ22,27とが対峙するように、当該半導体チップ10が無線光学チップ基板20上に実装されて成るものである。
【選択図】 図1
Description
Claims (8)
- アンテナ素子に接続された無線通信用の回路素子を有して無線通信をする半導体チップと、
アンテナ素子に接続された無線通信用の回路素子を有し、かつ、当該回路素子に接続された光通信用の光学素子を有して前記半導体チップを実装した無線光学チップ基板とを備え、
前記半導体チップのアンテナ素子と前記無線光学チップのアンテナ素子とが対峙するように、当該半導体チップが前記無線光学チップ基板上に実装されて成ることを特徴とする光通信装置。 - 前記無線光学チップ基板は、
前記半導体チップのアンテナ素子と対峙する位置に設けられたアンテナ素子と、
前記アンテナ素子に接続された無線通信用の回路素子と、
前記回路素子に接続されて電気信号を光に変換する電気信号−光変換素子と、
前記回路素子に接続されて光を電気信号に変換する光−電気信号変換素子と、
前記電気信号−光変換素子及び光−電気信号変換素子に接続された光ファイバとを備えた基板を備えることを特徴とする請求項1に記載の光通信装置。 - 前記無線光学チップ基板に2つの半導体チップが実装され、前記2つの半導体チップ間が当該無線光学チップ基板内の光ファイバで接続されることを特徴とする請求項2に記載の光通信装置。
- 前記無線光学チップ基板に2つの半導体チップが実装され、前記2つの半導体チップ間が前記無線光学チップ基板内の所定の形状に屈曲された光ファイバで接続されることを特徴とする請求項2に記載の光通信装置。
- 前記無線光学チップ基板で電気信号を受信可能な位置に穴部が設けられ、及び、当該穴部に至る溝部が設けられ、
無線光学チップ及び光ファイバを当該穴部及び溝部に配設するトレンチ構造を有することを特徴とする請求項2に記載の光通信装置。 - 少なくとも、前記半導体チップを冷却するための冷却機能を有していることを特徴とする請求項1に記載の光通信装置。
- アンテナ素子に接続された無線通信用の回路素子を有する半導体チップを光ファイバに接続して光通信するための光通信装置を製造する方法であって、
前記半導体チップと無線通信するためのアンテナ素子及び無線通信用の回路素子と、
前記回路素子と光ファイバとの間で光通信するための光通信用の光学素子とを同一基板上に配置し、当該アンテナ素子、回路素子、光学素子及び光ファイバを接続して無線光学チップ基板を形成する工程と、
前記半導体チップのアンテナ素子と前記無線光学チップのアンテナとが対峙するように位置合わせして前記無線光学チップ基板上に当該半導体チップを実装する工程とを有することを特徴とする光通信装置の製造方法。 - 前記無線光学チップ基板を形成する際に、
基板用のアンテナ素子、無線通信用の回路素子、電気信号−光変換素子、光−電気信号変換素子及び光ファイバを同一の基板に配置する工程と、
前記基板に配置されたアンテナ素子と無線通信用の回路素子とを接続し、当該回路素子と電気信号−光変換素子及び光−電気信号変換素子を接続し、かつ、当該電気信号−光変換素子及び光−電気信号変換素子に光ファイバを接続する工程とを有することを特徴とする請求項7に記載の光通信装置の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008011812A JP4656156B2 (ja) | 2008-01-22 | 2008-01-22 | 光通信装置 |
US12/337,486 US20090185808A1 (en) | 2008-01-22 | 2008-12-17 | Optical communication device and method of manufacturing the same |
EP09000801A EP2083609A3 (en) | 2008-01-22 | 2009-01-21 | Optical communication device and method of manufacturing the same |
CN200910005258XA CN101493556B (zh) | 2008-01-22 | 2009-01-21 | 光通信装置及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008011812A JP4656156B2 (ja) | 2008-01-22 | 2008-01-22 | 光通信装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009177337A true JP2009177337A (ja) | 2009-08-06 |
JP4656156B2 JP4656156B2 (ja) | 2011-03-23 |
Family
ID=40404922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008011812A Expired - Fee Related JP4656156B2 (ja) | 2008-01-22 | 2008-01-22 | 光通信装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090185808A1 (ja) |
EP (1) | EP2083609A3 (ja) |
JP (1) | JP4656156B2 (ja) |
CN (1) | CN101493556B (ja) |
Cited By (1)
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JP2016162771A (ja) * | 2015-02-26 | 2016-09-05 | ファナック株式会社 | 放熱フィンを有する熱伝導部材を備えた空冷式レーザ装置 |
Families Citing this family (5)
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JP5730057B2 (ja) * | 2011-02-16 | 2015-06-03 | 三菱重工業株式会社 | 炭素繊維強化プラスチック構造体 |
KR20150005113A (ko) * | 2013-07-04 | 2015-01-14 | 에스케이하이닉스 주식회사 | 광학 신호 경로를 포함하는 반도체 패키지 |
US9325420B2 (en) * | 2014-05-16 | 2016-04-26 | Qualcomm Incorporated | Electro-optical transceiver device to enable chip-to-chip interconnection |
US10665560B2 (en) * | 2017-10-27 | 2020-05-26 | Taiwan Semiconductor Manufacturing Company Ltd. | Optical semiconductor package and method for manufacturing the same |
CN114077016B (zh) * | 2020-08-11 | 2023-09-01 | 美国莫列斯有限公司 | 具有光子集成电路的封装结构 |
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2009
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Also Published As
Publication number | Publication date |
---|---|
EP2083609A3 (en) | 2009-08-26 |
EP2083609A2 (en) | 2009-07-29 |
JP4656156B2 (ja) | 2011-03-23 |
CN101493556A (zh) | 2009-07-29 |
US20090185808A1 (en) | 2009-07-23 |
CN101493556B (zh) | 2012-02-01 |
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