JP5730057B2 - 炭素繊維強化プラスチック構造体 - Google Patents
炭素繊維強化プラスチック構造体 Download PDFInfo
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- JP5730057B2 JP5730057B2 JP2011030886A JP2011030886A JP5730057B2 JP 5730057 B2 JP5730057 B2 JP 5730057B2 JP 2011030886 A JP2011030886 A JP 2011030886A JP 2011030886 A JP2011030886 A JP 2011030886A JP 5730057 B2 JP5730057 B2 JP 5730057B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/12—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by the relative arrangement of fibres or filaments of different layers, e.g. the fibres or filaments being parallel or perpendicular to each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/06—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions for securing layers together; for attaching the product to another member, e.g. to a support, or to another product, e.g. groove/tongue, interlocking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64C—AEROPLANES; HELICOPTERS
- B64C3/00—Wings
- B64C3/18—Spars; Ribs; Stringers
- B64C3/185—Spars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64C—AEROPLANES; HELICOPTERS
- B64C3/00—Wings
- B64C3/20—Integral or sandwich constructions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENTS OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D43/00—Arrangements or adaptations of instruments
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
- B29L2031/3076—Aircrafts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/106—Carbon fibres, e.g. graphite fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2605/00—Vehicles
- B32B2605/18—Aircraft
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24132—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in different layers or components parallel
Description
また、隣接する信号線同士が入力される信号の周波数に応じた間隔だけ離間してそれぞれ配置されるので、信号線がこれに隣接する信号線から発せられる電磁波の影響を受けることによってその信号にノイズが発生するという電磁干渉の問題を防止することができる。
以下、図面を参照して本発明の実施の形態について説明する。まず、本発明の第1実施形態に係るCFRP構造体の構成について説明する。本実施形態では、CFRP構造体の一例として、航空機の主翼を構成する部材について説明する。
次に、本発明の第2実施形態に係るCFRP構造体の構成について説明する。本実施形態でも、CFRP構造体の一例として、航空機の主翼を構成する部材について説明する。
2 スパー(第1実施形態)
3 パネル
4 リブ
5 スパー本体
6 ポート
10 スパー(第2実施形態)
11 スパー本体
12 ポート
13 炭素繊維プリプレグ
14 信号線層
21 フロントスパー
22 リアスパー
31 上面パネル
32 下面パネル
51 炭素繊維プリプレグ
52 信号線層
61 保持体
62 ポート本体
63 信号取り出し線
121 ポート本体
122 信号取り出し線
141 レジン層
521 レジン層
522 信号線
523 補強用繊維
31a 上面スキン
31b ストリンガー
32a 下面スキン
32b ストリンガー
51a シート
51b ポート挿通穴
521a ポート装着穴
522a 銅線
522b 絶縁体
61a 軸部
61b 頭部
61c 挿通穴
C 相互間隔
Claims (3)
- 複数の炭素繊維プリプレグを積層してなる炭素繊維強化プラスチック構造体であって、
前記炭素繊維強化プラスチック構造体の表面には、複数の信号線が埋め込まれたレジン層からなる信号線層が積層されていることを特徴とする炭素繊維強化プラスチック構造体。 - 前記信号線の途中に、前記信号線層を貫通して前記信号線に接するポートを設けたことを特徴とする請求項1に記載の炭素繊維強化プラスチック構造体。
- 前記信号線は、入力される信号の周波数に応じた相互間隔でそれぞれ配置されたことを特徴とする請求項1又は2に記載の炭素繊維強化プラスチック構造体。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011030886A JP5730057B2 (ja) | 2011-02-16 | 2011-02-16 | 炭素繊維強化プラスチック構造体 |
EP12746610.0A EP2677844A4 (en) | 2011-02-16 | 2012-02-08 | CARBON FIBER REINFORCED PLASTIC STRUCTURE |
PCT/JP2012/052845 WO2012111503A1 (ja) | 2011-02-16 | 2012-02-08 | 炭素繊維強化プラスチック構造体 |
US13/982,295 US10357938B2 (en) | 2011-02-16 | 2012-02-08 | Carbon-fiber-reinforced plastic structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011030886A JP5730057B2 (ja) | 2011-02-16 | 2011-02-16 | 炭素繊維強化プラスチック構造体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012169533A JP2012169533A (ja) | 2012-09-06 |
JP5730057B2 true JP5730057B2 (ja) | 2015-06-03 |
Family
ID=46672428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011030886A Expired - Fee Related JP5730057B2 (ja) | 2011-02-16 | 2011-02-16 | 炭素繊維強化プラスチック構造体 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10357938B2 (ja) |
EP (1) | EP2677844A4 (ja) |
JP (1) | JP5730057B2 (ja) |
WO (1) | WO2012111503A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5773679B2 (ja) | 2011-02-16 | 2015-09-02 | 三菱重工業株式会社 | 炭素繊維強化プラスチック構造体及びその製造方法 |
DE102014206861A1 (de) * | 2014-04-09 | 2015-10-15 | MAHLE Behr GmbH & Co. KG | Temperiervorrichtung für eine elektrische Energieversorgungseinheit |
RU2017123760A (ru) | 2015-01-22 | 2019-02-22 | Нептун Рисёрч, Ллс | Композиционные армирующие системы и способы их получения |
FR3065441B1 (fr) * | 2017-04-19 | 2019-07-05 | Airbus Operations | Ensemble pour aeronef comprenant une structure primaire de mat d'accrochage fixee a un caisson de voilure a l'aide d'une liaison boulonnee |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0741636A1 (en) * | 1994-01-26 | 1996-11-13 | AMP-Akzo LinLam VOF | A method of making a composite laminate and a pwb substrate so made |
US5866272A (en) | 1996-01-11 | 1999-02-02 | The Boeing Company | Titanium-polymer hybrid laminates |
JP4119205B2 (ja) * | 2002-08-27 | 2008-07-16 | 富士通株式会社 | 多層配線基板 |
US20040190274A1 (en) * | 2003-03-27 | 2004-09-30 | Yoshio Saito | Compact low cost plastic MCM to PCB |
JP2006024640A (ja) * | 2004-07-06 | 2006-01-26 | Fujitsu Ltd | 多層配線回路基板 |
JP4907216B2 (ja) * | 2006-04-19 | 2012-03-28 | 三菱電機株式会社 | プリント配線板及びプリント配線板の製造方法 |
US8148647B2 (en) | 2006-08-23 | 2012-04-03 | Mitsubishi Electric Corporation | Printed circuit board and method of manufacturing the same |
JP4656156B2 (ja) | 2008-01-22 | 2011-03-23 | ソニー株式会社 | 光通信装置 |
JP5200683B2 (ja) * | 2008-06-17 | 2013-06-05 | 富士通株式会社 | 配線基板及びその製造方法 |
JP5251395B2 (ja) * | 2008-09-24 | 2013-07-31 | 富士通株式会社 | 多層配線基板、プローブカード、及び、多層配線基板の製造方法 |
JP5170253B2 (ja) * | 2008-11-20 | 2013-03-27 | 富士通株式会社 | 配線基板及び配線基板の製造方法 |
-
2011
- 2011-02-16 JP JP2011030886A patent/JP5730057B2/ja not_active Expired - Fee Related
-
2012
- 2012-02-08 EP EP12746610.0A patent/EP2677844A4/en not_active Withdrawn
- 2012-02-08 US US13/982,295 patent/US10357938B2/en active Active
- 2012-02-08 WO PCT/JP2012/052845 patent/WO2012111503A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2012169533A (ja) | 2012-09-06 |
EP2677844A4 (en) | 2016-12-07 |
WO2012111503A1 (ja) | 2012-08-23 |
US20130316128A1 (en) | 2013-11-28 |
US10357938B2 (en) | 2019-07-23 |
EP2677844A1 (en) | 2013-12-25 |
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