JP5773679B2 - 炭素繊維強化プラスチック構造体及びその製造方法 - Google Patents
炭素繊維強化プラスチック構造体及びその製造方法 Download PDFInfo
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- JP5773679B2 JP5773679B2 JP2011030883A JP2011030883A JP5773679B2 JP 5773679 B2 JP5773679 B2 JP 5773679B2 JP 2011030883 A JP2011030883 A JP 2011030883A JP 2011030883 A JP2011030883 A JP 2011030883A JP 5773679 B2 JP5773679 B2 JP 5773679B2
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- Prior art keywords
- carbon fiber
- conductive layer
- spar
- fiber prepreg
- jumper
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
- B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64C—AEROPLANES; HELICOPTERS
- B64C3/00—Wings
- B64C3/18—Spars; Ribs; Stringers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64C—AEROPLANES; HELICOPTERS
- B64C3/00—Wings
- B64C3/20—Integral or sandwich constructions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64C—AEROPLANES; HELICOPTERS
- B64C3/00—Wings
- B64C3/26—Construction, shape, or attachment of separate skins, e.g. panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENTS OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D45/00—Aircraft indicators or protectors not otherwise provided for
- B64D45/02—Lightning protectors; Static dischargers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2307/00—Use of elements other than metals as reinforcement
- B29K2307/04—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T50/00—Aeronautics or air transport
- Y02T50/40—Weight reduction
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Description
また、導電層が炭素繊維プリプレグの表面に形成されているので、導電層に直接接触させて電子機器を設けることができる。これにより、電子機器と導電層とを電気的に接続する配線等が不要であるため、簡略な構成によって電子機器についてアースを取ることができる。
また、導電層に接触して電子機器を設けた場合、この電子機器が導電層及びジャンパーを介して、基準電位点としての炭素繊維プリプレグに対して電気的に接続される。これにより、炭素繊維強化プラスチック構造体の上に設けられた電子機器についてアースを取ることができる。
以下、図面を参照して本発明の実施の形態について説明する。まず、本発明の第1実施形態に係るCFRP構造体の構成について説明する。本実施形態では、CFRP構造体の一例として、航空機の主翼を構成する部材について説明する。
次に、本発明の第2実施形態に係るCFRP構造体の構成について説明する。第2実施形態でも、CFRP構造体として、航空機の主翼を構成するスパーを例に説明する。
次に、本発明の第3実施形態に係るCFRP構造体の構成について説明する。第3実施形態でも、CFRP構造体として、航空機の主翼を構成するスパーを例に説明する。
次に、本発明の第4実施形態に係るCFRP構造体の構成について説明する。第4実施形態でも、CFRP構造体として、航空機の主翼を構成するスパーを例に説明する。
10 スパー(第2実施形態)
11 ジャンパー
12 ボルト
2 スパー
21 フロントスパー
22 リアスパー
23 スパー本体
231 炭素繊維プリプレグ
231a 表面(炭素繊維プリプレグ)
231b シート(炭素繊維プリプレグ)
232 レジン層
232a 導電層露出穴
233 導電層
233a 表面(導電層)
24 ジャンパー
25 電子機器
26 ボルト
26a 軸部
26b 頭部
27 ナット
3 パネル
31 上面パネル
31a 上面スキン
31b ストリンガー
32 下面パネル
32a 下面スキン
32b ストリンガー
4 リブ
40 スパー(第3実施形態)
41 ジャンパー
42 電子機器
43 ボルト
43a 軸部
43b 頭部
44 ナット
45 突起(ジャンパー)
46 突起(電子機器)
5 マスキングテープ
50 スパー(第4実施形態)
51 導電層
Claims (4)
- 炭素繊維プリプレグの表面に積層して形成された導電層と、
この導電層及び前記炭素繊維プリプレグを貫通するとともに前記導電層に電気的に接続された導電体製のジャンパーと、
前記導電層に電気的に接続された電子機器と、
を有することを特徴とする炭素繊維強化プラスチック構造体。 - 前記ジャンパーの端部に、前記導電層の表面に接する頭部を設けたことを特徴とする請求項1に記載の炭素繊維強化プラスチック構造体。
- 炭素繊維プリプレグの表面に導電層を形成する工程と、
前記導電層の表面をマスキングする工程と、
前記炭素繊維プリプレグを硬化させる工程と、
前記マスキングを除去して前記導電層を露出させる工程と、
前記導電層に接する導電体製のジャンパーを前記炭素繊維プリプレグに貫通させる工程と、
を含むことを特徴とする炭素繊維強化プラスチック構造体の製造方法。 - 炭素繊維プリプレグの表面に導電層を形成する工程と、
前記炭素繊維プリプレグを硬化させる工程と、
下面に突起を有する導電体製のジャンパーを、前記炭素繊維プリプレグの硬化時にその表面に形成されたレジン層を前記突起で破りながら、前記炭素繊維プリプレグに貫通させる工程と、
を含むことを特徴とする炭素繊維強化プラスチック構造体の製造方法。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011030883A JP5773679B2 (ja) | 2011-02-16 | 2011-02-16 | 炭素繊維強化プラスチック構造体及びその製造方法 |
CN201280008083.8A CN103347690B (zh) | 2011-02-16 | 2012-02-15 | 碳纤维强化塑料结构体及其制造方法 |
US13/985,363 US10080286B2 (en) | 2011-02-16 | 2012-02-15 | Carbon-fiber-reinforced plastic structure and method for producing same |
BR112013020146A BR112013020146B1 (pt) | 2011-02-16 | 2012-02-15 | estrutura de plástico reforçada com fibra de carbono e métodos para produção da mesma |
CA2827396A CA2827396C (en) | 2011-02-16 | 2012-02-15 | Carbon-fiber-reinforced plastic structure and method for producing same |
EP12747044.1A EP2676792B1 (en) | 2011-02-16 | 2012-02-15 | Carbon-fiber-reinforced plastic structure and method for producing same |
PCT/JP2012/053522 WO2012111704A1 (ja) | 2011-02-16 | 2012-02-15 | 炭素繊維強化プラスチック構造体及びその製造方法 |
RU2013137704/05A RU2540649C1 (ru) | 2011-02-16 | 2012-02-15 | Конструкция из пластика, армированного углеволокном, и способ изготовления такой конструкции |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011030883A JP5773679B2 (ja) | 2011-02-16 | 2011-02-16 | 炭素繊維強化プラスチック構造体及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012166506A JP2012166506A (ja) | 2012-09-06 |
JP2012166506A5 JP2012166506A5 (ja) | 2013-10-24 |
JP5773679B2 true JP5773679B2 (ja) | 2015-09-02 |
Family
ID=46672617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011030883A Expired - Fee Related JP5773679B2 (ja) | 2011-02-16 | 2011-02-16 | 炭素繊維強化プラスチック構造体及びその製造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US10080286B2 (ja) |
EP (1) | EP2676792B1 (ja) |
JP (1) | JP5773679B2 (ja) |
CN (1) | CN103347690B (ja) |
BR (1) | BR112013020146B1 (ja) |
CA (1) | CA2827396C (ja) |
RU (1) | RU2540649C1 (ja) |
WO (1) | WO2012111704A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5751871B2 (ja) * | 2011-03-10 | 2015-07-22 | 三菱重工業株式会社 | 燃料タンク |
JP5972967B2 (ja) | 2012-03-26 | 2016-08-17 | 三菱重工業株式会社 | 燃料タンク、主翼、航空機胴体、航空機及び移動体 |
WO2014057960A1 (ja) * | 2012-10-09 | 2014-04-17 | 三菱重工業株式会社 | 構造体用構造材、燃料タンク、主翼及び航空機 |
JP6093192B2 (ja) * | 2013-01-25 | 2017-03-08 | 三菱航空機株式会社 | 航空機の機体用パネル、航空機の翼 |
JP6071686B2 (ja) | 2013-03-26 | 2017-02-01 | 三菱重工業株式会社 | 燃料タンク、主翼、航空機胴体、航空機及び移動体 |
DE102015213271A1 (de) * | 2015-07-15 | 2017-01-19 | Siemens Aktiengesellschaft | Flugzeug mit einer Tragstruktur zur Übertragung elektrischer Energie zwischen einer Energiequelle und einem Energieverbraucher |
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US3755713A (en) * | 1972-07-25 | 1973-08-28 | Boeing Co | Electrically conductive surface for aircraft |
US3989984A (en) * | 1975-07-11 | 1976-11-02 | Mcdonnell Douglas Corporation | Aircraft lightning protection means |
JPH0263725A (ja) * | 1988-05-27 | 1990-03-05 | Mitsubishi Heavy Ind Ltd | 炭素繊維強化プラスチツク部材の組立方法 |
RU2041508C1 (ru) | 1992-11-05 | 1995-08-09 | Московский авиационный технологический институт им.К.Э.Циолковского | Слоистый полимерный материал |
US5866272A (en) | 1996-01-11 | 1999-02-02 | The Boeing Company | Titanium-polymer hybrid laminates |
US6327132B1 (en) * | 1998-06-10 | 2001-12-04 | Aerospatiale Matra | Spark resistant structure, in particular for aircraft |
JP4119205B2 (ja) * | 2002-08-27 | 2008-07-16 | 富士通株式会社 | 多層配線基板 |
US7686905B2 (en) | 2005-09-06 | 2010-03-30 | The Boeing Company | Copper grid repair technique for lightning strike protection |
US8231751B2 (en) * | 2005-09-06 | 2012-07-31 | The Boeing Company | Repair technique for lightning strike protection |
JP4908884B2 (ja) * | 2006-03-15 | 2012-04-04 | 三菱重工業株式会社 | 成形体表面の導電化方法及び表面導電性成形体 |
DE102006031334A1 (de) | 2006-07-06 | 2008-01-10 | Airbus Deutschland Gmbh | Verfahren zur Herstellung eines Faserverbundbauteils für die Luft- und Raumfahrt |
US7599164B2 (en) * | 2006-12-07 | 2009-10-06 | The Boeing Company | Lightning protection system for aircraft composite structure |
US7829796B2 (en) * | 2007-11-06 | 2010-11-09 | The Boeing Company | Circuit joining assembly materials for multi-layer lightning protection systems on composite aircraft |
JP4719203B2 (ja) * | 2007-09-28 | 2011-07-06 | 三菱重工業株式会社 | 耐雷ファスナ |
JP5055178B2 (ja) * | 2008-03-24 | 2012-10-24 | 三菱重工業株式会社 | 航空機組立品 |
EP2331320B1 (en) * | 2008-10-03 | 2013-03-13 | Short Brothers Plc | Fibre reinforced composite structures and method of manufacture |
JP2010194749A (ja) * | 2009-02-23 | 2010-09-09 | Mitsubishi Heavy Ind Ltd | 樹脂基複合材の製造方法 |
JP5769412B2 (ja) | 2010-12-17 | 2015-08-26 | 三菱重工業株式会社 | 構造物製造方法 |
JP5730057B2 (ja) | 2011-02-16 | 2015-06-03 | 三菱重工業株式会社 | 炭素繊維強化プラスチック構造体 |
JP5669635B2 (ja) * | 2011-03-14 | 2015-02-12 | 三菱航空機株式会社 | 機体構成部材の連結構造 |
US9108363B2 (en) * | 2011-10-06 | 2015-08-18 | The Boeing Company | Thin wall bushing for robust electrical bonding to fiber-reinforced structures |
-
2011
- 2011-02-16 JP JP2011030883A patent/JP5773679B2/ja not_active Expired - Fee Related
-
2012
- 2012-02-15 US US13/985,363 patent/US10080286B2/en active Active
- 2012-02-15 WO PCT/JP2012/053522 patent/WO2012111704A1/ja active Application Filing
- 2012-02-15 CN CN201280008083.8A patent/CN103347690B/zh not_active Expired - Fee Related
- 2012-02-15 BR BR112013020146A patent/BR112013020146B1/pt not_active IP Right Cessation
- 2012-02-15 EP EP12747044.1A patent/EP2676792B1/en active Active
- 2012-02-15 CA CA2827396A patent/CA2827396C/en not_active Expired - Fee Related
- 2012-02-15 RU RU2013137704/05A patent/RU2540649C1/ru active
Also Published As
Publication number | Publication date |
---|---|
CA2827396A1 (en) | 2012-08-23 |
CA2827396C (en) | 2016-12-20 |
EP2676792A1 (en) | 2013-12-25 |
WO2012111704A1 (ja) | 2012-08-23 |
US10080286B2 (en) | 2018-09-18 |
RU2540649C1 (ru) | 2015-02-10 |
JP2012166506A (ja) | 2012-09-06 |
BR112013020146B1 (pt) | 2020-04-07 |
CN103347690B (zh) | 2015-07-29 |
EP2676792B1 (en) | 2019-05-01 |
US20130319750A1 (en) | 2013-12-05 |
BR112013020146A2 (pt) | 2016-11-08 |
CN103347690A (zh) | 2013-10-09 |
EP2676792A4 (en) | 2017-11-22 |
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