JP2009164604A - イメージセンサー及びその製造方法 - Google Patents
イメージセンサー及びその製造方法 Download PDFInfo
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- JP2009164604A JP2009164604A JP2008325522A JP2008325522A JP2009164604A JP 2009164604 A JP2009164604 A JP 2009164604A JP 2008325522 A JP2008325522 A JP 2008325522A JP 2008325522 A JP2008325522 A JP 2008325522A JP 2009164604 A JP2009164604 A JP 2009164604A
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- 238000009792 diffusion process Methods 0.000 description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 4
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- 239000007789 gas Substances 0.000 description 3
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- 229910000077 silane Inorganic materials 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000123112 Cardium Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 229910017875 a-SiN Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- -1 hydrogen ions Chemical class 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000678 plasma activation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14692—Thin film technologies, e.g. amorphous, poly, micro- or nanocrystalline silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14649—Infrared imagers
- H01L27/1465—Infrared imagers of the hybrid type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
Abstract
【解決手段】実施例によるイメージセンサーは、配線を含む回路が形成された第1基板と、前記配線と接触しながら前記第1基板上に形成されたフォトダイオードを含み、前記第1基板の回路は、前記第1基板に形成された電気接合領域と、及び前記電気接合領域上部に前記配線と繋がって形成された高濃度の第1導電型領域を含むことを特徴とする。
【選択図】図5
Description
図1は、第1実施例によるイメージセンサーの断面図である。
図7は、第2実施例によるイメージセンサーの断面図である。
Claims (14)
- 配線を含む回路が形成された第1基板と、前記配線と接触しながら前記第1基板上に形成されたフォトダイオードを含み、前記第1基板の回路は、前記第1基板に形成された電気接合領域と、及び前記電気接合領域の上部に前記配線と繋がって形成された第1導電型領域を含むことを特徴とするイメージセンサー。
- 前記電気接合領域は、前記第1基板に形成された第1導電型イオン注入領域と、前記第1導電型イオン注入領域上に形成された第2導電型イオン注入領域を含むことを含むことを特徴とする請求項1に記載のイメージセンサー。
- 前記電気接合領域は、PNPジャンクションであることを特徴とする請求項2に記載のイメージセンサー。
- 前記第1導電型領域は、前記配線に対するコンタクトプラグの幅と同じ幅を持つことを特徴とする請求項1に記載のイメージセンサー。
- 前記第1導電型領域は、前記配線に対するコンタクトプラグの幅と同じ幅を持つことを特徴とする請求項2に記載のイメージセンサー。
- 前記フォトダイオードは、前記第1基板とボンディングされた結晶型半導体層内で、前記配線と電気的に繋がるように形成されたことを特徴とする請求項1に記載のイメージセンサー。
- 配線を含む回路が形成された第1基板と、前記配線と接触しながら前記第1基板上に形成されたフォトダイオードを含み、前記第1基板の上側は、第2導電型に導電されていて、前記回路は、前記第1基板に形成されたトランジスタと、前記トランジスタの一側に形成された電気接合領域と、及び前記配線と繋がりながら前記電気接合領域に接して形成された第1導電型領域を含むことを特徴とするイメージセンサー。
- 前記電気接合領域は、前記第1基板の第2導電型領域上に形成された第1導電型イオン注入領域と、前記第1導電型イオン注入領域上に形成された第2導電型イオン注入領域を含むことを特徴とする請求項7に記載のイメージセンサー。
- 前記第1基板の上側はP型に導電されていて、前記電気接合領域はPNジャンクションであることを特徴とする請求項8に記載のイメージセンサー。
- 前記トランジスタは、トランスファトランジスタであることを特徴とする請求項8に記載のイメージセンサー。
- 第1基板に配線を含む回路を形成する段階と、前記配線上にフォトダイオードを形成する段階を含み、前記第1基板の回路を形成する段階は、前記第1基板に電気接合領域を形成する段階と、前記電気接合領域の上部に前記配線と繋がる第1導電型領域を形成する段階を含むことを特徴とするイメージセンサーの製造方法。
- 前記電気接合領域を形成する段階は、前記第1基板に第1導電型イオン注入領域を形成する段階と、前記第1導電型イオン注入領域上に第2導電型イオン注入領域を形成する段階を含むことを特徴とする請求項11に記載のイメージセンサーの製造方法。
- 前記第1導電型領域を形成する段階は、前記配線に対するコンタクトエッチング後に行われることを特徴とする請求項11に記載のイメージセンサーの製造方法。
- 前記電気接合領域を形成する段階は、PNPジャンクションを形成する段階であることを特徴とする請求項12に記載のイメージセンサーの製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070139742A KR100882467B1 (ko) | 2007-12-28 | 2007-12-28 | 이미지센서 및 그 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009164604A true JP2009164604A (ja) | 2009-07-23 |
Family
ID=40681245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008325522A Pending JP2009164604A (ja) | 2007-12-28 | 2008-12-22 | イメージセンサー及びその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090179293A1 (ja) |
JP (1) | JP2009164604A (ja) |
KR (1) | KR100882467B1 (ja) |
CN (1) | CN101471370B (ja) |
DE (1) | DE102008061820A1 (ja) |
TW (1) | TW200929535A (ja) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012105106A1 (ja) * | 2011-02-04 | 2012-08-09 | 富士フイルム株式会社 | 固体撮像素子の製造方法、固体撮像素子、撮像装置 |
JP2014216469A (ja) * | 2013-04-25 | 2014-11-17 | パナソニック株式会社 | 固体撮像装置 |
US9324757B2 (en) | 2011-11-22 | 2016-04-26 | Panasonic Intellectual Property Management Co., Ltd. | Solid-state imaging device |
US9813651B2 (en) | 2012-06-27 | 2017-11-07 | Panasonic Intellectual Property Management Co., Ltd. | Solid-state imaging device |
US9876046B2 (en) | 2015-04-02 | 2018-01-23 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device comprising multilayer wiring structure and capacitance element capable of having relatively larger capacitance value |
US9881967B2 (en) | 2016-02-25 | 2018-01-30 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device |
US9917119B2 (en) | 2014-12-26 | 2018-03-13 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device including unit pixel cell which includes capacitor circuit and feedback circuit |
US10141354B2 (en) | 2014-10-23 | 2018-11-27 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device and image acquisition device |
US10304828B2 (en) | 2016-09-20 | 2019-05-28 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device and manufacturing method thereof |
JP2020170953A (ja) * | 2019-04-04 | 2020-10-15 | 日本放送協会 | 撮像装置および画像フレーム読出し制御回路 |
US10868051B2 (en) | 2017-04-26 | 2020-12-15 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device and camera system |
US11024665B2 (en) | 2018-10-15 | 2021-06-01 | Panasonic Corporation | Imaging device and manufacturing method thereof |
US11064139B2 (en) | 2018-12-26 | 2021-07-13 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device |
US11165979B2 (en) | 2017-06-05 | 2021-11-02 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device including semiconductor substrate and pixels |
WO2022153628A1 (ja) | 2021-01-15 | 2022-07-21 | パナソニックIpマネジメント株式会社 | 撮像装置及びカメラシステム |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101046060B1 (ko) * | 2008-07-29 | 2011-07-01 | 주식회사 동부하이텍 | 이미지센서 제조방법 |
EP3525232A1 (en) * | 2018-02-09 | 2019-08-14 | Nexperia B.V. | Semiconductor device and method of manufacturing the same |
DE102021114314A1 (de) * | 2021-06-02 | 2022-12-08 | Universität Siegen, Körperschaft des öffentlichen Rechts | Photonendetektion |
Citations (2)
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JPH05153501A (ja) * | 1991-11-25 | 1993-06-18 | Fuji Film Micro Device Kk | 固体撮像装置とその駆動方法 |
JP2007273945A (ja) * | 2006-03-06 | 2007-10-18 | Fujifilm Corp | 光電変換素子及び固体撮像素子 |
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JP3371708B2 (ja) * | 1996-08-22 | 2003-01-27 | ソニー株式会社 | 縦型電界効果トランジスタの製造方法 |
US7786543B2 (en) * | 2002-08-27 | 2010-08-31 | E-Phocus | CDS capable sensor with photon sensing layer on active pixel circuit |
US7279729B2 (en) * | 2003-05-26 | 2007-10-09 | Stmicroelectronics S.A. | Photodetector array |
KR100889365B1 (ko) * | 2004-06-11 | 2009-03-19 | 이상윤 | 3차원 구조의 영상센서와 그 제작방법 |
US6927432B2 (en) * | 2003-08-13 | 2005-08-09 | Motorola, Inc. | Vertically integrated photosensor for CMOS imagers |
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KR100682829B1 (ko) * | 2005-05-18 | 2007-02-15 | 삼성전자주식회사 | 씨모스 이미지 센서의 단위 픽셀, 픽셀 어레이 및 이를포함한 씨모스 이미지 센서 |
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2007
- 2007-12-28 KR KR1020070139742A patent/KR100882467B1/ko not_active IP Right Cessation
-
2008
- 2008-12-11 DE DE102008061820A patent/DE102008061820A1/de not_active Ceased
- 2008-12-12 TW TW097148669A patent/TW200929535A/zh unknown
- 2008-12-22 JP JP2008325522A patent/JP2009164604A/ja active Pending
- 2008-12-26 CN CN2008101888128A patent/CN101471370B/zh not_active Expired - Fee Related
- 2008-12-28 US US12/344,536 patent/US20090179293A1/en not_active Abandoned
Patent Citations (2)
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JPH05153501A (ja) * | 1991-11-25 | 1993-06-18 | Fuji Film Micro Device Kk | 固体撮像装置とその駆動方法 |
JP2007273945A (ja) * | 2006-03-06 | 2007-10-18 | Fujifilm Corp | 光電変換素子及び固体撮像素子 |
Cited By (29)
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JP2012164780A (ja) * | 2011-02-04 | 2012-08-30 | Fujifilm Corp | 固体撮像素子の製造方法、固体撮像素子、撮像装置 |
KR20140015308A (ko) | 2011-02-04 | 2014-02-06 | 후지필름 가부시키가이샤 | 고체 촬상 소자의 제조 방법, 고체 촬상 소자, 촬상 장치 |
WO2012105106A1 (ja) * | 2011-02-04 | 2012-08-09 | 富士フイルム株式会社 | 固体撮像素子の製造方法、固体撮像素子、撮像装置 |
US9324757B2 (en) | 2011-11-22 | 2016-04-26 | Panasonic Intellectual Property Management Co., Ltd. | Solid-state imaging device |
US9942506B2 (en) | 2012-06-27 | 2018-04-10 | Panasonic Intellectual Property Management Co., Ltd. | Solid-state imaging device |
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JP2014216469A (ja) * | 2013-04-25 | 2014-11-17 | パナソニック株式会社 | 固体撮像装置 |
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US10868051B2 (en) | 2017-04-26 | 2020-12-15 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device and camera system |
US11165979B2 (en) | 2017-06-05 | 2021-11-02 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device including semiconductor substrate and pixels |
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US11064139B2 (en) | 2018-12-26 | 2021-07-13 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device |
JP2020170953A (ja) * | 2019-04-04 | 2020-10-15 | 日本放送協会 | 撮像装置および画像フレーム読出し制御回路 |
JP7249194B2 (ja) | 2019-04-04 | 2023-03-30 | 日本放送協会 | 撮像装置および画像フレーム読出し制御回路 |
WO2022153628A1 (ja) | 2021-01-15 | 2022-07-21 | パナソニックIpマネジメント株式会社 | 撮像装置及びカメラシステム |
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TW200929535A (en) | 2009-07-01 |
CN101471370B (zh) | 2011-08-24 |
US20090179293A1 (en) | 2009-07-16 |
KR100882467B1 (ko) | 2009-02-09 |
CN101471370A (zh) | 2009-07-01 |
DE102008061820A1 (de) | 2009-08-06 |
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