JP2009158930A - イメージセンサ及びその製造方法 - Google Patents
イメージセンサ及びその製造方法 Download PDFInfo
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- JP2009158930A JP2009158930A JP2008294273A JP2008294273A JP2009158930A JP 2009158930 A JP2009158930 A JP 2009158930A JP 2008294273 A JP2008294273 A JP 2008294273A JP 2008294273 A JP2008294273 A JP 2008294273A JP 2009158930 A JP2009158930 A JP 2009158930A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims description 11
- 239000007943 implant Substances 0.000 claims description 6
- 230000010354 integration Effects 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 53
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 229910021417 amorphous silicon Inorganic materials 0.000 description 10
- 238000005468 ion implantation Methods 0.000 description 9
- 230000007423 decrease Effects 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 6
- 238000002513 implantation Methods 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 229910017875 a-SiN Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14632—Wafer-level processed structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14689—MOS based technologies
Abstract
【解決手段】実施の形態によるイメージセンサは、基板にトランジスタを含んで形成された回路(circuitry)と、前記トランジスタの一側に形成された電気接合領域と、前記電気接合領域上に形成された高濃度第1導電型領域と、前記回路上側に形成されたフォトダイオードと、を含むことを特徴とする。これにより、回路(circuitry)とフォトダイオードの垂直型集積を実現することができる。
【選択図】図1
Description
Claims (10)
- 基板にトランジスタを含んで形成される回路(circuitry)と、
前記トランジスタの一側に形成される電気接合領域と、
前記電気接合領域上に形成される高濃度第1導電型領域と、
前記回路上側に形成されるフォトダイオードと、
を含むことを特徴とするイメージセンサ。 - 前記電気接合領域は、PNジャンクション(junction)であることを特徴とする請求項1に記載のイメージセンサ。
- 前記高濃度第1導電型領域は、前記電気接合領域の上部の一部にインプラントによって形成されることを特徴とする請求項1に記載のイメージセンサ。
- 前記回路上側のフォトダイオードは、
前記回路と電気的に連結される真性層(intrinsic layer)と、
前記真性層上に形成される第2導電型伝導層と、
を含むことを特徴とする請求項1に記載のイメージセンサ。 - 前記回路上側のフォトダイオードは、
前記回路と電気的に連結される真性層(intrinsic layer)と、
前記真性層上に形成される第2導電型伝導層と、
を含むことを特徴とする請求項2に記載のイメージセンサ。 - 基板にトランジスタを含む回路(circuitry)を形成するステップと、
前記トランジスタの一側に電気接合領域を形成するステップと、
前記電気接合領域上に高濃度第1導電型領域を形成するステップと、
前記回路上側にフォトダイオードを形成するステップと、
を含むことを特徴とするイメージセンサの製造方法。 - 前記電気接合領域を形成するステップは、PNジャンクション(junction)を形成するステップであることを特徴とする請求項6に記載のイメージセンサの製造方法。
- 前記高濃度第1導電型領域は、前記電気接合領域の上部の一部にコンタクトホールを利用するプラグインプラントによって形成されることを特徴とする請求項6に記載のイメージセンサの製造方法。
- 前記高濃度第1導電型領域は、コンタクトホールを形成する前にマスクパターンを利用して前記電気接合領域の上部の一部にインプラントによって形成されることを特徴とする請求項6に記載のイメージセンサの製造方法。
- 前記回路上側にフォトダイオードを形成するステップは、
前記回路と電気的に連結される真性層(intrinsic layer)を形成するステップと、
前記真性層上に形成された第2導電型伝導層を形成するステップはと、
を含むことを特徴とする請求項6に記載のイメージセンサの製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070139452A KR101002121B1 (ko) | 2007-12-27 | 2007-12-27 | 이미지센서 및 그 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009158930A true JP2009158930A (ja) | 2009-07-16 |
Family
ID=40758629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008294273A Pending JP2009158930A (ja) | 2007-12-27 | 2008-11-18 | イメージセンサ及びその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7989860B2 (ja) |
JP (1) | JP2009158930A (ja) |
KR (1) | KR101002121B1 (ja) |
CN (1) | CN101471371A (ja) |
DE (1) | DE102008063637A1 (ja) |
TW (1) | TW200929534A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013076924A1 (ja) * | 2011-11-22 | 2013-05-30 | パナソニック株式会社 | 固体撮像装置 |
JP2016178302A (ja) * | 2015-03-19 | 2016-10-06 | オムニヴィジョン テクノロジーズ インコーポレイテッド | イメージセンサのための感光性キャパシタ画素 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101046060B1 (ko) * | 2008-07-29 | 2011-07-01 | 주식회사 동부하이텍 | 이미지센서 제조방법 |
JP5458869B2 (ja) * | 2009-12-21 | 2014-04-02 | ソニー株式会社 | 固体撮像装置およびその駆動方法、カメラ |
JP2014199898A (ja) * | 2013-03-11 | 2014-10-23 | ソニー株式会社 | 固体撮像素子および製造方法、並びに、電子機器 |
KR102441585B1 (ko) * | 2015-02-12 | 2022-09-07 | 삼성전자주식회사 | 광검출 소자 및 그 제조방법과, 이미지 센서 및 그 제조방법 |
US11272132B2 (en) | 2019-06-07 | 2022-03-08 | Pacific Biosciences Of California, Inc. | Temporal differential active pixel sensor |
KR20210100409A (ko) | 2020-02-06 | 2021-08-17 | 삼성전자주식회사 | 접합형 전계 효과 트랜지스터의 구조를 갖는 광전 소자 및 그 제조 방법 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS59178769A (ja) * | 1983-03-30 | 1984-10-11 | Toshiba Corp | 固体撮像装置 |
JPH03270177A (ja) * | 1990-03-20 | 1991-12-02 | Fujitsu Ltd | 半導体受光装置及びその製造方法 |
JPH04240771A (ja) * | 1991-01-24 | 1992-08-28 | Fujitsu Ltd | 積層型固体撮像素子 |
JP2000340780A (ja) * | 1999-04-13 | 2000-12-08 | Agilent Technol Inc | アモルファスシリコンダイオードによるイメージセンサアレイ装置 |
JP2006253321A (ja) * | 2005-03-09 | 2006-09-21 | Fuji Photo Film Co Ltd | 固体撮像素子 |
Family Cites Families (6)
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US6476374B1 (en) * | 2000-04-25 | 2002-11-05 | Innovative Technology Licensing, Llc | Room temperature, low-light-level visible imager |
US20040041930A1 (en) * | 2002-08-27 | 2004-03-04 | Calvin Chao | Photoconductor-on-active-pixel (POAP) sensor utilizing a multi-layered radiation absorbing structure |
US6730914B2 (en) * | 2002-02-05 | 2004-05-04 | E-Phocus, Inc. | Photoconductor-on-active-pixel (POAP) sensor utilizing equal-potential pixel electrodes |
US7115855B2 (en) * | 2003-09-05 | 2006-10-03 | Micron Technology, Inc. | Image sensor having pinned floating diffusion diode |
KR100718878B1 (ko) | 2005-06-28 | 2007-05-17 | (주)실리콘화일 | 3차원 구조를 갖는 이미지 센서의 분리형 단위화소 및 그제조방법 |
US20090039397A1 (en) * | 2007-08-09 | 2009-02-12 | Micromedia Technology Corp. | Image sensor structure |
-
2007
- 2007-12-27 KR KR1020070139452A patent/KR101002121B1/ko not_active IP Right Cessation
-
2008
- 2008-11-18 JP JP2008294273A patent/JP2009158930A/ja active Pending
- 2008-12-12 TW TW097148668A patent/TW200929534A/zh unknown
- 2008-12-18 DE DE102008063637A patent/DE102008063637A1/de not_active Ceased
- 2008-12-26 US US12/344,442 patent/US7989860B2/en active Active
- 2008-12-26 CN CNA2008101888132A patent/CN101471371A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59178769A (ja) * | 1983-03-30 | 1984-10-11 | Toshiba Corp | 固体撮像装置 |
JPH03270177A (ja) * | 1990-03-20 | 1991-12-02 | Fujitsu Ltd | 半導体受光装置及びその製造方法 |
JPH04240771A (ja) * | 1991-01-24 | 1992-08-28 | Fujitsu Ltd | 積層型固体撮像素子 |
JP2000340780A (ja) * | 1999-04-13 | 2000-12-08 | Agilent Technol Inc | アモルファスシリコンダイオードによるイメージセンサアレイ装置 |
JP2006253321A (ja) * | 2005-03-09 | 2006-09-21 | Fuji Photo Film Co Ltd | 固体撮像素子 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013076924A1 (ja) * | 2011-11-22 | 2013-05-30 | パナソニック株式会社 | 固体撮像装置 |
JPWO2013076924A1 (ja) * | 2011-11-22 | 2015-04-27 | パナソニックIpマネジメント株式会社 | 固体撮像装置 |
US9324757B2 (en) | 2011-11-22 | 2016-04-26 | Panasonic Intellectual Property Management Co., Ltd. | Solid-state imaging device |
JP2016178302A (ja) * | 2015-03-19 | 2016-10-06 | オムニヴィジョン テクノロジーズ インコーポレイテッド | イメージセンサのための感光性キャパシタ画素 |
US9735196B2 (en) | 2015-03-19 | 2017-08-15 | Omnivision Technologies, Inc. | Photosensitive capacitor pixel for image sensor |
Also Published As
Publication number | Publication date |
---|---|
DE102008063637A1 (de) | 2009-07-16 |
CN101471371A (zh) | 2009-07-01 |
US7989860B2 (en) | 2011-08-02 |
TW200929534A (en) | 2009-07-01 |
KR20090071220A (ko) | 2009-07-01 |
US20090166787A1 (en) | 2009-07-02 |
KR101002121B1 (ko) | 2010-12-16 |
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