JP2009160725A - Chamfering tool for flat panel display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve productivity by reducing tact time compared with a conventional one, when chamfering is performed to substrates. <P>SOLUTION: A chamfering tool includes a substrate loading unit 110 for loading substrates; a chamfering unit 120 for advancing chamfering process applied to the substrates; a substrate unloading unit 130 for unloading the substrates, with the chamfering unit 120 including: a plurality of stages 300a and 300b, on which the substrates are placed and supported, mutually separately disposed in a crossing direction with a virtual working line that connects the substrate loading unit 110 and the substrate unloading unit 130; and a grinder 123 including at least one aligning camera for aligning work of the substrates placed on the plurality of stages 300a and 300b and at least one wheel 126 for chamfering process to advance chamfering work applied to the substrates placed on the plurality of stages. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a chamfering machine for a flat display, and more specifically, when a chamfering process is performed on a substrate, a tact time can be reduced as compared to the conventional case, and a plurality of stages and a plurality of chamfering machines are improved. A chamfering machine for flat display that can improve the productivity by improving the problems of the conventional chamfering machine in which the entire equipment cannot be operated if a failure occurs in any one of the chamfering wheels. About.

  Recently, flat display (FPD) has begun to appear while the electronic display industry in the semiconductor industry has been rapidly developing.

  A flat display (FPD) is an image display device that is thinner and lighter than a cathode ray tube (CRT) that has been mainly used as a display for a TV or a computer monitor. , Liquid Crystal Display), plasma display substrate (PDP), and organic EL (OLED, Organic Light Emitting Diodes).

  Hereinafter, a flat display (FPD) including an LCD, a PDP, and an OLED will be described as a substrate.

  The substrate is usually rectangular and is made of a glass material. Therefore, edge processing on the four corners and the long and short sides of the substrate, that is, the sharpness of the glass itself is removed only after chamfering, facilitating transfer and operation between processes, and preventing a safety accident. Although it can be prevented, a chamfering machine is used for such chamfering.

  Among conventional chamfering machines, there is an example in which all four corners, long sides, and short sides of a substrate are machined through a single chamfering wheel. However, when all four corners, long sides, and short sides of the substrate are machined through one chamfering wheel as described above, there is a problem that a lot of tact time is required because continuous work is impossible.

  Accordingly, in consideration of such problems, a chamfering machine of a type in which chamfering processing for the long side and the short side individually proceeds has been disclosed.

  FIG. 1 is a schematic configuration diagram of a conventional chamfering machine that individually proceeds with chamfering processing for a long side and a short side.

  As shown in FIG. 1, the conventional chamfering machine includes a substrate loading unit 10 disposed on both sides of a chamfering unit 20 in which chamfering processing of a substrate proceeds, and a substrate unloading unit 30.

  The chamfering processing unit 20 includes a first stage 21 and a second stage 22 that are arranged in series along a virtual work line that connects the substrate loading unit 10 and the substrate unloading unit 30. First alignment camera 25a and second alignment camera 25b for aligning the substrates placed on the first stage 21 and the second stage 22, a first chamfering wheel 26a, and a second chamfering wheel 26b.

  The first align camera 25a and the first chamfering wheel 26a are in charge of chamfering on the edges on both sides of the front surface of the substrate, the short sides on both sides, and the edges on both sides of the rear surface along the direction in which the substrate travels. The align camera 25b and the second chamfering wheel 26b are in charge of chamfering on both long sides of the substrate.

  With such a configuration, when a substrate to be chamfered is placed on the first stage 21 from the substrate loading unit 10, the substrate is first moved by the first stage 21 based on the video information photographed by the first alignment camera 25a. Aligned to a fixed position. Thereafter, the first stage 21 moves toward the first chamfering wheel 26a, or the first chamfering wheel 26a moves relative to the first stage 21 to advance the substrate. The edges on both sides of the front surface, the short sides on both sides, and the edges on both sides of the rear surface are sequentially chamfered.

  Thereafter, a separate pickup robot (not shown) picks up the substrate on the first stage 21 and rotates it by substantially 90 °, and then moves it onto the second stage 22. Thereafter, after the fixed position alignment operation of the substrate proceeds again on the second stage 22, the long sides of the substrate are chamfered by the second chamfering wheel 26b. Thereafter, the substrate after the chamfering process is taken out to the substrate unloading unit 30.

  In such a conventional chamfering machine, when the long side of the substrate is chamfered on the second stage 22, the first stage 21 processes the edges on both sides of the front surface, the short sides on both sides, and the edges on both sides of the rear surface. Therefore, the tact time can be reduced as compared with a chamfering machine (not shown) having one chamfering wheel (not shown). In other words, by implementing the first stage 21 and the second stage 22 in series on the chamfering unit 20, the chamfering work can be inlined and the tact time can be reduced.

  However, in the conventional chamfering machine in which the chamfering processing for the long side and the short side individually proceeds as described above, when the substrate is transferred from the first stage 21 to the second stage 22, a pickup robot must be used. Therefore, the alignment operation for the substrate must be performed again on the second stage 22, and the tact time may be slightly reduced depending on the transfer time by the pickup robot and the time required for the alignment operation for the substrate on the second stage 22. There is a problem of inefficiency.

  In such a conventional chamfering machine, the first stage 21 and the second stage 22, and the first chamfering wheel 26a and the second chamfering wheel 26b have a serial arrangement structure between each other. Therefore, if a failure occurs in any one of them, there is a problem that the entire equipment cannot be operated, which causes a decrease in productivity.

  The object of the present invention is to improve productivity by reducing the tact time compared to the prior art when chamfering a substrate, and failure occurs in any one of a plurality of stages and a plurality of chamfering wheels. In this case, it is to provide a chamfering machine for a flat display that can improve the productivity by improving the problems of the conventional chamfering machine in which the entire equipment cannot be operated.

  The object is to provide a substrate loading unit for loading a substrate according to the present invention, a chamfering unit for chamfering the substrate, a substrate unloading unit for unloading the substrate, The chamfering unit includes a plurality of stages on which the substrate is placed and supported, and spaced apart from each other in a crossing direction of a virtual work line that connects the substrate loading unit and the substrate unloading unit. At least one alignment camera for aligning the substrates placed on the plurality of stages, and at least one chamfering wheel for performing a chamfering operation on the substrates placed on the plurality of stages. A grinder with It is achieved by chamfering machine for a flat display according to claim.

  According to the present invention, when chamfering a substrate, the tact time can be reduced compared to the prior art to improve productivity, and a failure occurs in any one of a plurality of stages and a plurality of chamfering wheels. In this case, it is possible to improve the productivity by improving the problems of the conventional chamfering machine in which the entire equipment cannot be operated.

  For a full understanding of the invention, its operational advantages, and the objectives achieved by the practice of the invention, reference should be made to the accompanying drawings that illustrate preferred embodiments of the invention and the contents described in the accompanying drawings. There must be.

  Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals in the drawings denote like members.

  FIG. 2 is a schematic diagram illustrating a chamfering machine for a flat display according to an embodiment of the present invention.

  Prior to the description of the drawings, the substrate described below means a TFT-LCD (Thin Film Transistor-Liquid Crystal Display) substrate, but the scope of rights of the present invention is not limited to this. The present invention is also applicable to flat display (Flat Panel Display, FPD) such as plasma display substrate (PDP, Plasma Display Panel) and organic EL (OLED, Organic Light Emitting Diodes). However, in the following, for convenience of explanation, a TFT-LCD substrate will be described as an example.

  As shown in FIG. 2, the chamfering machine for a flat display according to an embodiment of the present invention includes a substrate loading unit 110 on which a substrate to be chamfered is loaded, and a chamfering unit 120 on which the chamfering process on the substrate proceeds. And a substrate unloading unit 130 for unloading the substrate that has been chamfered.

  Since the substrate loading unit 110 and the substrate loading unit 110 all serve to transfer the substrate, the substrate loading unit 110 and the substrate loading unit 110 can be applied to a general conveyor type. However, since the scope of rights of the present invention is not limited to this, the substrate loading unit 110 and the substrate loading unit 110 may be replaced with a roller type or a stage type. . In addition to these, an air injection module that floats the substrate to a predetermined height by air floating and transfers the substrate may be applied.

  For reference, when the substrate on the substrate loading unit 110 is transferred to the chamfering processing unit 120 side or the substrate is transferred from the chamfering processing unit 120 to the substrate unloading unit 130, a sensor for detecting the transfer is applied. Although it is desirable that this is not described.

  The substrate unloading unit 130 of this embodiment is further provided with a chamfering amount measurement unit 630. The chamfering amount measuring unit 630 plays a role of measuring the chamfering amount with respect to the substrate that has been chamfered. If the substrate measured by the chamfer amount measurement unit 630 is chamfered by mistake, or if the chamfer amount is insufficient, the substrate is discarded or the substrate loading unit 110. The chamfering process can proceed again by feeding back to the side. In the present embodiment, the chamfering amount measurement unit 630 is provided in the substrate unloading unit 130, but may be provided in the chamfering processing unit 120. The chamfering amount measurement unit 630 will be described in detail later.

  On the other hand, the chamfering unit 120 is a part that proceeds with chamfering on the four corners, the long side, and the short side of the substrate provided from the substrate loading unit 110.

  In the case of the prior art, a chamfering unit 120 for chamfering may be provided. However, as described with reference to FIG. When the substrate is transferred to the stage 122, the pick-up robot must be used. Therefore, the alignment operation for the substrate must proceed again on the second stage 122. There is a problem that the time required for aligning the substrate on 122 is somewhat inefficient in reducing the tact time.

  In addition, in the conventional chamfering machine described in FIG. 1, the first stage 121 and the second stage 122, and the first chamfering wheel 126 a and the second chamfering wheel 126 b are connected in series. Due to the arrangement structure, there is a problem that the entire equipment cannot be operated if any one of them fails.

  However, in the case of the present embodiment, as will be described later, a virtual work in which the first and second stages 300a and 300b provided in the chamfering processing unit 120 connect the substrate loading unit 110 and the substrate unloading unit 130 together. The conventional problems are solved by having a structure that is separated from each other in the direction intersecting with the line, that is, a parallel arrangement structure different from the conventional structure, and the grinder 123 is provided corresponding to this structure.

  The chamfering processing unit 120 of the present embodiment is spaced apart from each other in a direction intersecting with a virtual work line that connects the substrate loading unit 110 and the substrate unloading unit 130, and the first and second substrates on which the substrate is placed and supported. Stages 300a and 300b and a grinder 123 are provided.

  Unlike the prior art, the first and second stages 300 a and 300 b are provided in a virtual work line that connects the substrate loading unit 110 and the substrate unloading unit 130 and spaced apart from each other along the horizontal direction. In the present embodiment, the two first and second stages 300a and 300b are provided in the chamfering processing unit 120, but the number of stages may be three or more. However, even if three or more stages are provided, these are provided in a virtual work line connecting the substrate loading unit 110 and the substrate unloading unit 130 along the horizontal direction, that is, in parallel arrangement. If it has a structure, it is sufficient.

  Although not shown in detail, each of the first and second stages 300a and 300b is provided so as to be operable on the X axis, the Y axis, and the θ axis at the corresponding positions on the chamfering processing unit 120 for alignment with the substrate. .

  For reference, the operations of the first and second stages 300a and 300b to the X axis and the Y axis are performed by a linear motor or the like, and the operations of the first and second stages 300a and 300b to the θ axis are performed. However, the present invention is not limited to this, and other structures may be applied to connect the first and second stages 300a and 300b to X. You may operate on the axis, the Y axis, and the θ axis.

  On the other hand, the grinder 123 includes a shared gantry unit 124 and a shared gantry unit 124 provided over the first and second stages 300a and 300b along a virtual line connecting the first and second stages 300a and 300b. An alignment camera 125 that moves along the shared gantry unit 124 and moves along the first and second stages 300a and 300b, and the other side of the shared gantry unit 124. And a shared chamfering wheel 126 that advances a substantial chamfering process for each substrate mounted on the first and second stages 300a and 300b while moving along the shared gantry unit 124. Prepare.

  As illustrated, the shared gantry unit 124 is provided in a direction parallel to a virtual line that connects the first and second stages 300a and 300b. An alignment camera 125 and a common chamfering wheel 126 are coupled to the shared gantry unit 124, respectively. For reference, the alignment camera 125 and the common chamfering wheel 126 are schematically shown for convenience in the drawing.

  The alignment camera 125 advances the alignment with respect to the respective substrates placed on the first and second stages 300a and 300b, that is, the first and second stages 300a and 300b are set to the X axis, the Y axis, and the θ axis. In order to advance alignment with respect to the substrate by operating, it plays a role of photographing two alignment marks on any one side formed on the substrate.

  In the drawing, the alignment mark is shown in a cross (+) shape. Therefore, two alignment cameras 125 are provided for each stage in the present embodiment because two alignment marks on either side must be photographed. However, the scope of rights of the present invention is not limited to this, and the alignment camera 125 is a shared alignment camera that is provided so as to be movable along the shared gantry unit 124 and is shared by the first and second stages 300a and 300b. In this case, two shared alignment cameras may be provided. When the shared alignment camera is applied in this way, when the alignment mark of the substrate placed on the first stage 300a is photographed, the shared alignment camera is arranged on the first stage 300a and the second stage 300b. When the alignment mark of the substrate placed on the camera is photographed, the shared alignment camera is moved to a position on the second stage 300b.

  The shared chamfering wheel 126 is provided on the opposite side of the shared gantry unit 124 where the alignment camera 125 is located. This is because the common chamfering wheel 126 has to move on the shared gantry 124, so that interference with the alignment camera 125 is avoided.

  Since such chamfering wheels 126 for chamfering must proceed on the four corners, the long side and the short side of the substrate, in principle, two wheels can be provided for each stage. it can. However, in this embodiment, since the chamfering wheel is applied as the shared chamfering wheel 126 that can move along the shared gantry portion 124, two shared chamfering wheels 126 are provided. It is done. Therefore, at the time of chamfering the substrate placed on the first stage 1300a, the common chamfering wheel 126 is disposed at the position shown by the solid line in FIG. 2, and the substrate placed on the second stage 1300b. At the time of chamfering, the common chamfering wheel 126 is moved to a position indicated by a dotted line in FIG.

  As described above, the common chamfering wheel 126 in the present embodiment is chamfering the four corners, the long side, and the short side of the substrate. Applicable.

  On the other hand, in the following, before the description of the operation on the chamfering machine, the configuration that cannot be described above or briefly described, that is, the first and second stages 300a and 300b, the first and second transfers 400a and 400b, The stage cleaning unit 530 and the chamfering amount measuring unit 630 will be described in detail with reference to FIGS.

  3 is an enlarged perspective view of the stage, FIG. 4 is a perspective view illustrating the operation of the stage of FIG. 3, and FIG. 5A is a first vacuum hole formed on the surface of the turntable. FIG. 5B is a configuration diagram for the second vacuum hole formed on the surface of the variable table, FIG. 6 is a schematic side view of the stage, and FIG. FIG. 8 is an enlarged perspective view of the transfer, FIG. 8 is a perspective view partially illustrating an operation for the transfer of FIG. 7, and FIG. 9 is a perspective view illustrating a mounting state of a stage cleaning unit provided on the upper part of the stage. 10 is a perspective view of the unit cleaning unit illustrated in FIG. 9, FIG. 11 is a cross-sectional view taken along line AA of FIG. 10, and FIG. 12 is a rear view of the substrate unloading unit. Measurement of chamfering amount 13 is a perspective view illustrating the configuration of the unit, FIG. 13 is an enlarged perspective view of the “B” portion illustrated in FIG. 12, and FIG. 14 illustrates the foreign substance removing unit illustrated in FIG. 13. FIG. 15 is an exploded perspective view of FIG. 14, and FIG. 16 is a cross-sectional view taken along the line CC of FIG.

  First, the stages 300a and 300b will be described. In the present embodiment, the stages 300a and 300b are provided on the two first and second stages 300a and 300b along the Y axis as shown in FIG. It is done. Since the first and second stages 300a and 300b proceed with the chamfering work in parallel with the remaining configuration of the grinder 221, the tact time is reduced so that the productivity is improved.

  However, since the scope of rights of the present invention is not limited to this, only one stage may be provided, or three or more stages may be provided. This is the reason as described above. However, when three or more stages are provided, it is sufficient if they have a parallel arrangement structure along the Y axis.

  The first and second stages 300a and 300b are all the same in structure and operation except that their positions are different. Accordingly, the same reference numerals are assigned to the detailed configurations of the first and second stages 300a and 300b for convenience of illustration and description.

  The first and second stages 300a and 300b will be described. The first and second stages 300a and 300b of the present embodiment have a structure that can be applied to a variety of substrates.

  That is, the stage (not shown) disclosed in the conventional chamfering machine has a simple block-like structure that sucks the substrate placed on the upper surface in a vacuum, and the upper surface area is a fixed size. For this reason, there is no choice but to adsorb and support only one type of substrate. Therefore, the chamfering machine to which such a conventional stage is applied cannot be applied to various sizes of substrates, and chamfers a substrate that has been chamfered first and a substrate having a different size. For this purpose, the stage (not shown) has to be replaced, and such a replacement time has a disadvantage that the tact time is increased and the productivity is lowered. However, the first and second stages 300a and 300b of the present embodiment can be mixed and applied to substrates of various sizes because the entire area of the upper surface thereof can be adjusted as necessary. Have.

  For this purpose, each of the first and second stages 300a and 300b applied to the chamfering machine of the present embodiment is provided with a turntable 310 that sucks and rotates the substrate, and an outer shell of the turntable 310. A plurality of variable tables 320 capable of adsorbing and supporting the substrate together with the substrate 310 and being capable of approaching and separating from the turntable 310 so as to support all of various sizes of substrates are provided.

  As shown in FIGS. 3 and 4, one turntable 310 is provided in the central region of the first and second stages 300 a and 300 b, and the variable table 320 is 4 symmetrically around the turntable 310. Are provided. The four variable tables 320 are moved closer to and away from the turntable 310 in pairs.

  A table driving unit 330 is further provided so that the four variable tables 320 are moved closer to and away from the turntable 310 in pairs.

  Referring to FIG. 4, the table driving unit 330 is rotatably coupled to a pair of connection blocks 331 a and 331 b and a pair of connection blocks 331 a and 331 b respectively connecting two variable tables 320. In the forward / reverse direction, a ball screw shaft 332 for moving the pair of connecting blocks 331a and 331b toward and away from each other and a drive motor 333 for moving the ball screw shaft 332 forward and backward are included.

  Each of the pair of connection blocks 331a and 331b has a square block structure, and a block support portion 334 that supports each variable table 320 is further provided on the upper surface thereof. Two block support portions 334 are provided for each of the pair of connection blocks 331a and 331b to support the two variable tables 320. In the present embodiment, the same reference numerals are assigned to the block support portions 334 for the convenience of illustration and description.

  The ball screw shaft 332 has a thread formed on the outer surface and connects the pair of connecting blocks 331a and 331b. The ball screw shaft 332 is connected to the pair of connecting blocks 331a and 331b. The area threads are machined in opposite directions.

  In this way, the threads formed on the outer surface of the ball screw shaft 332 are processed in opposite directions, and the pair of connecting blocks 331a and 331b are respectively screwed into the threads processed in the opposite directions. For example, if the ball screw shaft 332 is rotated forward, the pair of connecting blocks 331a and 331b can open the variable table 320 and can suck a large substrate while being separated from each other as shown in FIG. On the other hand, if the ball screw shaft 332 is reversed, the pair of connecting blocks 331a and 331b can narrow the variable table 320 so that a small substrate can be sucked while being close to each other as shown in FIG.

  The drive motor 333 is a part that generates power for rotating the ball screw shaft 332 forward and backward. In this embodiment, the ball screw shaft 332 is rotated forward and backward as a single, that is, one drive motor 333. Thus, since the variable table 320 can be driven only by the single drive motor 333, the configuration is simplified so that the installation and maintenance can be simplified, and the cost can be reduced. .

  The turntable 310 has a substantially circular upper surface, and the four variable tables 320 have a substantially rectangular shape with a part cut. However, since the scope of rights of the present invention is not limited to this, the shapes of the turntable 310 and the variable table 320 may be appropriately changed.

  For example, at least the upper surface of the turntable 310 may have a polygonal shape including an elliptical shape. In addition, since four variable tables 320 are not necessarily provided, two variable tables 320 may be provided symmetrically with respect to the outer surface of the turntable 310. Even in such a case, the configuration of the table driving unit 330 and the operation thereof can be implemented in the same manner.

  As described above, when the size of the substrate to be chamfered is large, four variable with respect to the turntable 310 as shown in FIG. 3 so that the entire suction area of the turntable 310 and the variable table 320 is widened. If the table 320 must be separated and the substrate size to be chamfered is small, the four variable tables 320 must be brought close to the turntable 310 as shown in FIG. At this time, when the four variable tables 320 are approached to the turntable 310 as shown in FIG. 4, the side surfaces of the four variable tables 320 must collide with the turntable 310. An incision portion 321 is formed on the side surface. In the present embodiment, the incision portion 321 may have an arc shape corresponding to the outer surface of the turntable 310, but this is not necessarily the case.

  As shown in FIG. 5, a number of first and second vacuum holes 315 and 325 are formed on the surfaces of the turntable 310 and the variable table 320 to attract and support the substrate. The first and second vacuum holes 315 and 325 are provided so as to penetrate through the thicknesses of the turntable 310 and the variable table 320, respectively.

  Such first and second vacuum holes 315 and 325 alone are practically sufficient to attract and support the substrate. However, in the case of the present embodiment, a line having a certain shape is formed on the surfaces of the turntable 310 and the variable table 320 while being bent by a certain depth downward from the surfaces of the turntable 310 and the variable table 320. Thus, first and second vacuum suction line grooves 315a and 325a that double the vacuum suction area with respect to the substrate are further formed. That is, if a vacuum suction force is generated in the first and second vacuum holes 315 and 325, the vacuum suction force acts in a wider area through the first and second vacuum suction line grooves 315a and 325a, and Since it can be adsorbed, the vacuum adsorption area for the substrate can be increased. In the present embodiment, one first and second vacuum suction line grooves 315a and 325a are provided for each of the first and second vacuum holes 315 and 325, but this is not necessarily the case.

  In the present embodiment, the first vacuum suction line groove 315a formed on the turntable 310 has a pizza-like shape formed on the variable table 320 as shown in FIG. 5A. As shown in FIG. 5B, the vacuum suction line groove 325a can be formed in a Hangul '¬' shape, but the scope of rights of the present invention is not limited thereto. This means that a portion not hatched on the surface of the turntable 310 and the variable table 320 illustrated in FIGS. 5A and 5B is crushed compared to a hatched portion.

  As described above, since four variable tables 320 are provided, if the vacuum pressures formed on the four variable tables 320 are significantly different from each other, the substrate can be stably supported. Can not be, or can be distorted to one side. Accordingly, the vacuum pressures provided to the four variable tables 320 and at least two variable tables 320 in pairs must be substantially uniform. It is also efficient to turn the vacuum on / off symmetrically so that the substrates are aligned in the center, i.e., symmetrically arranged with respect to the center.

  Referring to FIG. 5B, the second vacuum hole 325 formed on the surface of the variable table 320 has a number of vacuum pipes 326a, 326b, so that the on / off state of the vacuum is controlled individually. 326c is connected, and many vacuum pipes 326a, 326b, 326c are connected to many intermediate pipes 327a, 327b, 327c.

  At this time, the vacuum pipes 326a, 326b, 326c are bifurcated into a pair of variable tables 320 adjacent to each other from one line of the intermediate pipes 327a, 327b, 327c. In other words, for example, the intermediate pipe denoted by reference numeral 327a forms one line, but the vacuum pipe 326a, which is two lines branched from the intermediate pipe denoted by reference numeral 327a, has a pair of variable tables 320 adjacent to each other. It faces the second vacuum hole 325. By constructing the piping in this manner, the vacuum pressure provided to the variable table 320 paired at least two can be made symmetrically uniform with respect to the center. Can be increased.

  On the other hand, even if a uniform vacuum pressure is formed through the first and second vacuum holes 315 and 325, particularly through the second vacuum hole 325, if the flatness of the variable table 320 does not match correctly, there is a gap between the substrate and the substrate. In order to generate | occur | produce, the adsorption | suction efficiency of a board | substrate falls, and the loss of a vacuum is induced.

  Thereby, in this embodiment, the flatness adjustment part 340 is further provided so that the flatness of the variable table 320 with respect to connection block 331a, 331b can be adjusted with a simple method.

  As shown in FIG. 6, the flatness adjusting unit 340 is screwed into the variable table 320 and the connecting blocks 331a and 331b in a state where the screw threads at both ends are processed in opposite directions. Adjustment bolts 341, and a plurality of contact support bolts 342 coupled to the connection blocks 331 a and 331 b and having one end in contact with the variable table 320.

  With this configuration, if the flatness of the variable table 320 needs to be adjusted, first, a large number of contact support bolts 342 are loosened and one end of the contact support bolt 342 is adjusted from the variable table 320 to the flatness. After being separated to the position required for the adjustment bolt 341 in that position is tightened or loosened. Both ends of the adjustment bolt 341 are threaded in opposite directions, and the opposite threads are connected to the variable table 320 and the connection blocks 331a and 331b, respectively. When loosened, the variable table 320 is lowered or raised with respect to the connecting blocks 331a and 331b. Therefore, the flatness of the variable table 320 may be adjusted through such an operation. When the flatness of the variable table 320 is adjusted, the contact support bolt 342 is tightened again, and one end of the contact support bolt 342 is connected to the variable table 320. It is only necessary to prevent the variable table 320 from being arbitrarily tilted by being supported by the contact.

  On the other hand, referring to FIG. 2, the region between the substrate loading unit 110 and the chamfering processing unit 120 and the region between the chamfering processing unit 120 and the substrate unloading unit 130 are on the substrate loading unit 110. Transfers 400 a and 400 b are provided for transferring the unprocessed substrates to the first and second stages 300 a and 300 b and transferring the processed substrates on the first and second stages 300 a and 300 b to the substrate unloading unit 130.

  In this embodiment, the structure and operation of the transfer 400a, 400b provided in the region between the substrate loading unit 110 and the chamfering processing unit 120 and in the region between the chamfering processing unit 120 and the substrate unloading unit 130. Are all the same. Accordingly, the same reference numerals are assigned to the detailed configurations of the transfer 400a and 400b for convenience of illustration and description.

  Referring mainly to FIGS. 7 and 8, the transfer 400a, 400b is provided with a large number of basic gripping units 410 for gripping the substrate on both sides of the substrate, and a plurality of basic gripping units 410 provided at different positions. And a safety gripping unit 430 for preventing the substrate from being detached from the basic gripping unit 410 and falling during the transfer or stoppage.

  The basic gripping unit 410 and the safety gripping unit 430 are coupled to the head unit 440. Therefore, if the head unit 440 is moved to a desired position by an X-axis drive unit 461, a Y-axis drive unit 462, and a Z-axis drive unit 463, which will be described later, the basic gripping unit 410 and the safety gripping unit 430 are also moved to that position. Let

  In the present embodiment, a large number of basic gripping units 410 are provided in two on each side surface (short side) region of the head portion 440, and the safety gripping unit 430 is connected to the chamfering processing unit 120 or the substrate unloading unit 130. One is provided in the front (long side) region of the head portion 440 directed.

  However, since the scope of the right of the present invention is not necessarily limited to this, one basic gripping unit 410 is provided in each of the side surface regions of the head portion 440, or 3 in both side surface regions of the head portion 440. One or more basic gripping units 410 may be provided. In the case of the safety gripping unit 430, two or more can be provided in the front surface (long side) region of the head unit 440, and the front surface (long side) region and the rear surface (long side) region of the head unit 440 can be provided. All can be provided. If the number of the safety gripping units 430 is increased, there is an effect that a large substrate can be prevented from sagging, so that an efficient structure can be appropriately selected.

  Explaining the four basic gripping units 410, two of the four basic gripping units 410 are provided in the short side region of the head portion 440 in this embodiment. At this time, the two basic gripping units 410 are connected by the pair of connecting portions 411a and 411b, respectively.

  The pair of connecting portions 411a and 411b are accommodated and coupled to a pair of guide portions 412a and 412b which are formed on the side surface of the head portion 440 and guide the movement of the pair of connecting portions 411a and 411b. In the case of the present embodiment, the guide portions 412a and 412b are paired, but the guide portions 412a and 412b may have a structure of being integrally penetrated without being separated as shown in the drawing.

  The transfer units 400a and 400b drive the pair of connection parts 412a and 412b so that the pair of connection parts 411a and 411b are guided by the pair of guide parts 412a and 412b by a predetermined control signal so as to approach and separate from each other. A driving unit 413 is further provided. Although not shown in detail with respect to the drive unit 413, the drive unit 413 is connected to a motor and a pair of connecting portions 411a and 411b having screw threads in different directions. It can be embodied as a ball screw shaft.

  As a result, when power is applied to the motor of the drive unit 413 and the ball screw shaft rotates forward, for example, as shown by the dotted line in FIG. 8, the two basic gripping units 410 are moved by the pair of connecting portions 411a and 411b. If the ball screw shafts can be reversed, the two basic gripping units 410 can be separated from each other by the pair of connecting portions 411a and 411b. Thus, there is an advantage that the four basic gripping units 410 can be applied to substrates of various sizes by being approached and separated from each other.

  If the structure of one safety gripping unit 430 is described, a fixed rod 431 and a rotation support portion 433 are provided for mounting the safety gripping unit 430.

  The fixed rod 431 is configured to be a so-called bracket provided to be fixed to the head portion 440, and the fixed rod 431 is disposed laterally to the vertical rod 431a at the end of the vertical rod 431a and the vertical rod 431a. And a horizontal rod 431b to be formed.

  The rotation support part 433 supports the safety gripping unit 430 at the end of the horizontal rod 431b. The rotation support part 433 supports the safety gripping unit 430 so as to be rotatable with respect to the horizontal rod 431b. The rotation operation of the rotation support unit 433 operates in conjunction with the operation of the basic gripping unit 410 according to the control signal described above. That is, as shown by the dotted line in FIG. 8, when the basic gripping unit 410 operates to substantially support both side surfaces and part of the lower surface of the substrate, the safety gripping unit 430 is based on the rotating operation of the rotating support portion 433. Thus, a part of the front surface and the lower surface of the substrate is supported to prevent the substrate from dropping during the transfer or stop of the substrate.

  As described above, the basic gripping unit 410 and the safety gripping unit 430 that are provided to simply grip the substrate substantially or to stably grip the substrate are all in contact with the side surface of the substrate at this position. It is manufactured in an “L” shape so that the lower surface of the substrate can be partially supported and supported. However, the scope of rights of the present invention is not limited to this shape.

  In addition, since the basic gripping unit 410 and the safety gripping unit 430 are all in contact with the substrate and grip the substrate, there is a risk of generating a scratch on the substrate in the process of contacting the substrate.

  Thereby, in this embodiment, all of the basic gripping unit 410 and the safety gripping unit 430 are made of MD-PA material so as to prevent the generation of scratches on the substrate. However, the basic gripping unit 410 and the safety gripping unit 430 may be made of different materials as long as they have a certain rigidity even though they are not MD-PA materials and do not damage the substrate.

  On the other hand, as described above, in particular, the basic gripping unit 410 is provided so as to be able to approach and separate from each other so that substrates of various sizes can be gripped. As such, the substrate loading unit 110 is transferred to the first and second stages 300a and 300b, and the substrate on the first and second stages 300a and 300b is transferred to the substrate unloading unit 130. It is movably provided on the axis and the Z axis.

  For this reason, the transfer 400a, 400b of the present embodiment includes a head portion in which the basic gripping unit 410 and the safety gripping unit 430 are coupled along a virtual X axis that connects the substrate loading unit 110 and the substrate unloading unit 130. An X-axis drive unit 461 that drives 440, a Y-axis drive unit 462 that drives the head unit 440 along a Y-axis that intersects the X-axis, and a head unit 440 that drives the Z-axis that is the vertical direction. And a Z-axis drive unit 463.

  The X-axis drive unit 461, the Y-axis drive unit 462, and the Z-axis drive unit 463 can be implemented by a linear motor that can be easily controlled by linear movement. Sometimes it is done.

  On the other hand, after the chamfered substrate is transferred to the substrate unloading unit 130, the stages 300a and 300b move toward the substrate loading unit 110 in order to repeat the above-described operation again. By the way, after the tops of the stages 300a and 300b on which the substrates are placed are cleaned, the foreign matters generated during the chamfering process can remain on the tops of the stages 300a and 300b. The next substrate must be loaded. This is because when a new substrate is loaded on the stages 300a and 300b without cleaning, the substrate can be contaminated by foreign matters remaining on the stages 300a and 300b.

  Therefore, the chamfering machine of this embodiment includes a stage cleaning unit 530 (see FIG. 2) that is provided between the chamfering processing unit 120 and the substrate unloading unit 130 and cleans the surfaces of the stages 300a and 300b, the stage 300a, And a controller (not shown) for controlling the operation of the stage cleaning unit 530 for injecting the cleaning fluid onto the surface of the substrate 300b, thereby causing contamination by foreign matters remaining on the stages 300a and 300b of the substrate to be chamfered in the future. Can be prevented.

  Here, the control unit transfers the substrate after the chamfering process to the substrate unloading unit 130, and the stages 300a and 300b not supporting the substrate also load the substrate loading unit 110 to load a new substrate. When moving, the stage cleaning unit 530 is operated to remove foreign matters remaining on the surfaces of the stages 300a and 300b, and if the stages 300a and 300b pass through the injection region of the stage cleaning unit 530, the stage cleaning unit 530 is moved. The operation of the stage cleaning unit 530 is controlled so as to stop the operation.

  As shown in FIGS. 2 and 9, the stage cleaning unit 530 according to the present embodiment includes two pairs of unit cleaning units 531a and 531b that are arranged on the moving lines of the first and second stages 300a and 300b, respectively. A unit frame 545 which is arranged in a lateral direction of the moving direction of the stages 300a and 300b and to which two pairs of unit cleaning units 531a and 531b are coupled.

  However, since the two pairs of unit cleaning units 531a and 531b have substantially the same configuration, only the pair of unit cleaning units 531a disposed on the first stage 300a will be described below.

  As shown in detail in FIGS. 9 to 11, the pair of unit cleaning parts 531a is disposed on the upper portion of the first stage 300a that is movably disposed along the movement line, and in the upper surface direction of the first stage 300a. Spray cleaning fluid for cleaning. At this time, the pair of unit cleaning parts 531a are inclined with respect to each other so that foreign matters remaining on the upper surface of the flatly provided first stage 300a can be released to the outside.

  In other words, the foreign matter remaining on the upper surface of the first stage 300a is released to the outside by the pressing force of the cleaning fluid by causing the cleaning fluid ejection direction to be inclined with respect to the surface direction of the upper surface of the first stage 300a. To be able to. The upper surface of the first stage 300a indicates the upper surfaces of the turntable 310 and the multiple variable tables 320 described above.

  Therefore, the unit cleaning unit 531a rotates in multiple directions with respect to the unit frame 545 so that the unit cleaning unit 531a can remove the foreign matters remaining on the stage 570a by adjusting the jet direction of the cleaning fluid. Provided possible.

  The specific configuration of the unit cleaning unit 531a will be described. The unit cleaning unit 531a of the present embodiment includes an injection body 532 provided with an injection port for injecting a cleaning fluid to the first stage 300a. The injection body portion 532 includes a rotation coupling portion 540 that couples the injection body portion 532 to the unit frame 545 so as to be rotatable in multiple directions with respect to the unit frame 545.

  The injection body 532 is coupled to the pivot member 533 that is pivotally coupled to the pivot coupling portion 540 and the pivot member 533 substantially alongside the pivot member 533, and is directed inward from the upper end. The injection member 534 is formed with a moving space 534s in which the cleaning fluid moves, and the shielding member 535 is coupled to the upper surface of the injection member 534 and shields the inside of the injection member 534 from the outside.

  Here, if the injection member 534 and the shielding member 535 are combined, a slit-like injection port 534h that communicates with the moving space 534s is provided at the tip, and the cleaning fluid flows through the injection port 534h. The foreign matter on the first stage 300a can be neatly ejected on the upper surface of the first stage 300a to cleanly remove foreign matters.

First, as shown in FIGS. 10 and 11, the rotation member 533 is coupled to the rotation coupling portion 540 so as to be rotatable in the “θ ₁ ” direction. Therefore, it is possible to adjust the ejection direction of the cleaning fluid ejected through the ejection port 534h of the ejection member 534. That is, the inclination angle of the ejection member 534 with respect to the first stage 300a can be easily adjusted so that the cleaning fluid pushes out the foreign matter remaining on the first stage 300a.

  The shielding member 535 is coupled to the upper surface of the injection member 534 in order to protect the inner portion of the injection member 534, that is, to prevent external foreign matter from penetrating the inside of the injection member 534 through which the cleaning fluid moves. The Further, the shielding member 535 has an advantage that it can be easily coupled and separated and can easily maintain and repair the inner structure of the injection member 534 while protecting the structure provided inside the injection member 534.

  On the other hand, the rotation coupling portion 540 to which the injection body portion 532 is coupled includes a frame fastening member 541 fastened to the unit frame 545 and a rotation member 533 so that the rotation member 533 can rotate about the axis. A rotation coupling member 542 to be coupled, and a coupling member 543 coupled between the frame fastening member 541 and the rotation coupling member 542 and configured to rotate the rotation coupling member 542 relative to the frame fastening member 541 are provided.

Due to the structure of the rotation coupling part 540, as described above, the injection body part 532 can not only rotate in the “θ ₁ ” direction, but also the rotation coupling member 542 can be rotated with respect to the frame fastening member 541. _By rotating relative to each other in the ₂ ′ direction, the entire injection body 532 can rotate relative to the rotational coupling portion 540 in the “θ ₂ ” direction. Therefore, the foreign matters remaining on the first stage 300a can be more effectively removed by appropriately adjusting the inclination angle of the unit cleaning unit 531a with respect to the first stage 300a.

  On the other hand, the cleaning operation of the first stage 300a described above does not proceed while temporarily interrupting the process, but proceeds during the process. That is, the chamfered substrate is transferred to the substrate unloading unit 540 and the first stage 300a on which the substrate is not loaded moves again in the direction of the substrate loading unit 110 along the movement line for future work. At this time, however, the stage cleaning unit 530 operates to remove foreign matters remaining on the first stage 300a. Therefore, the tact time of the chamfering process for the substrate can be shortened, thereby improving the overall productivity.

  On the other hand, in the present embodiment, the unit cleaning units 531a and 531b corresponding to the number of stages 300a and 300b are coupled to the unit frame 545 as described above, but a pair of unit cleaning units can be moved to the unit frame. By being coupled, it is possible to proceed with the cleaning operation for a plurality of stages that move alternately.

  On the other hand, as described above, referring to FIGS. 2 and 12 to 16, the chamfering amount of the chamfered substrate is measured in the substrate unloading unit 130 in the chamfering machine of this embodiment. A chamfering amount measurement unit 630 is provided. This is because when chamfering a substrate, the chamfering must be performed within a predetermined chamfering amount standard. For example, the substrate can be chamfered so as not to exceed the predetermined standard. Then, the chamfering amount measuring unit 630 accurately measures the chamfering amount of the substrate and feeds it back to the chamfering wheel 126 side to correct the chamfering amount. This is for accuracy.

  However, as described above, in the case of the conventional chamfering machine, a chamfering amount measurement unit (not shown) is provided in the chamfering processing unit 20 (see FIG. 1) to measure the chamfering amount together with the chamfering processing. Therefore, there is a problem of increasing the overall tact time. That is, conventionally, since the chamfering amount is measured by the chamfering amount measuring unit provided in the chamfering processing unit 20, not only the tact time for the chamfering work is increased but also the substrate for measuring the chamfering amount. There was a problem that a separate time to be stopped must be allocated.

  Therefore, the chamfering machine according to the present embodiment transfers the substrate along the roller of the substrate unloading unit 130 where the chamfered substrate is unloaded to solve the problem of increasing the tact time. In order to measure the chamfering amount of the substrate, the chamfering amount measuring unit 630 is provided above and below the substrate unloading unit 130. Hereinafter, the configuration of the chamfering amount measurement unit 630 will be described in detail.

  2 and FIGS. 12 to 16, the chamfer amount measurement unit 630 according to the present embodiment is disposed at the upper and lower portions of the substrate unloading unit 130, respectively, so that the chamfer amount of the short edge portion of the substrate is obtained. A measurement unit 631 for measuring the measurement unit, a measurement support frame 633 provided in the lateral direction of the longitudinal direction of the substrate unloading unit 130 and movably coupled to the measurement unit 631, and a measurement support frame 633 on which the measurement unit 631 is mounted. Is moved along the longitudinal direction of the moving frame 635 to adjust the position of the measuring unit 631 relative to the substrate, and the measuring unit 631 is moved up and down on the moving frame 635 so that the measuring unit 631 moves relative to the substrate unloading unit 130. And an elevating drive unit 637 that enables approach and separation.

  In the present embodiment, a pair of measuring units 631 are provided at the upper and lower portions of the substrate unloading unit 130 to measure the chamfering amount of the edge portion of one short side of the substrate, and the measurement unit 631 as a whole is arranged on both short sides of the substrate. Two pairs are provided for measuring the chamfered amount of the edge portion.

  The measuring unit 631 can be moved up and down on the moving frame 635 by the lift driving unit 637 and approaches the edge portions on both short sides of the substrate transferred along the roller (not shown) of the substrate unloading unit 640. Or separated. The moving frame 635 combined with the measuring unit 631 is slidable along the longitudinal direction of the measuring support frame 633 and can be adjusted in the horizontal direction depending on the size of the substrate. The measurement of the chamfer amount for a large number of substrates having different sizes is made flexible.

  Here, the lifting / lowering driving unit 637 may be provided with a linear motor so that the measuring unit 631 can move in a linear motion along the height direction of the moving frame 635. In addition, a separate movement driving unit 638 for driving the movement frame 635 may be mounted on the measurement support frame 633 so that the movement frame 635 can also move in a linear motion with respect to the measurement support frame 633.

  The measurement unit 631 of the present embodiment is applied with a line scan camera 631 (line scan camera) that continuously captures edge portions on both short sides of the substrate that has been chamfered in order to accurately measure the chamfering amount of the substrate. The Therefore, there is an advantage that the chamfering amount and chamfering state of the substrate can be accurately measured.

  However, in the present embodiment, the line scan camera 631 is applied as the measurement unit 631, but other than that, an area camera or the like can be applied to measure the chamfering amount and chamfering state of the substrate. . Unlike the line scan camera, the area camera is a camera that measures the chamfering amount of the substrate by photographing a part of the short side edges of the both sides of the substrate that has been chamfered. Can accurately measure chamfering conditions.

  On the other hand, the chamfering machine for a flat display according to the present embodiment measures the chamfering amount of the substrate chamfered by the measurement unit 631 of the chamfering amount measurement unit, and then chamfers the processing wheel based on the measured value. A control unit (not shown) for controlling the chamfering wheel 126 is further provided so that the chamfering amount of the substrate to be processed in the future can be readjusted by correcting the chamfering amount of 126.

  In other words, the measurement unit 631 measures the chamfering amount of the substrate chamfered by photographing. For example, when the chamfered portion of the substrate is further processed or insufficiently processed from a predetermined reference, the control is performed. The unit readjusts the position of the chamfering wheel 126 to correct the chamfering amount based on the measured chamfering amount information. More specifically, for example, when the chamfered portion of the substrate is further processed from a predetermined standard, the control unit narrows the interval of the chamfering wheel 126 and the substrate to be chamfered in the future is insufficient. For example, when the chamfered portion of the substrate is processed less than a predetermined reference, the control unit increases the interval of the chamfering wheel 126 to correct the chamfering amount in the future. The substrate to be chamfered is further chamfered as compared with the substrate whose chamfering amount is measured by the measuring unit 631.

  On the other hand, the chamfering amount measurement unit 630 according to the present embodiment further includes a foreign matter removing unit 640 for removing foreign matter remaining on the chamfered portion of the substrate prior to measuring the chamfering amount of the substrate. Such foreign matter removing unit 640 can remove foreign matter remaining at the edge portions on both short sides of the substrate, and the measuring unit 631 can measure a more accurate chamfering amount.

  As shown in FIGS. 13 to 16, the foreign substance removing unit 640 of the present embodiment is coupled to the moving frame 635 and is open on one side so that edge portions on both short sides of the substrate whose chamfering amount is measured can pass. A moving space 642s (see FIG. 16) is formed in the tunnel portion 641s formed in the tunnel portion 641s. The moving space 642s (see FIG. 16) in which the working fluid for removing the foreign matter moves from one surface facing the substrate loading unit 110 to the inside. A foreign matter removing body 641, an ejecting member 642 provided on the foreign matter removing body 641, and ejecting the working fluid for removing foreign matter that has passed through the moving space 642 s toward the long side or the short side of the substrate, and the ejecting member 642 are provided. A shielding member 643 that is detachably coupled to one surface of the foreign matter removing body 641 and shields the inside of the foreign matter removing body 641 from the outside.

  Here, the foreign substance removing working fluid that has moved through the moving space 642s is formed at a joint portion between the ejection member 642 and the shielding member 643, that is, the ejection member 642 and the shielding member 643 are separated and coupled. It injects through the provided injection outlet 642h. The ejection outlet 642h is inclined to a virtual line connecting the upper end and the lower end of the foreign substance removal body 641 so that the foreign substance removal working fluid is ejected obliquely and the foreign substance on the substrate can be effectively removed.

  The foreign substance removing body 641 is fixedly coupled to the moving frame 635 and can move as the moving frame 635 slides with respect to the measurement support frame 633. Accordingly, the position of the foreign substance removing body 641 placed on both sides of the substrate can be adjusted according to the size of the board, and thereby the substrate can pass between the measuring unit 631 past the tunnel portion 641s of the foreign substance removing body 641. sell.

  The pair of injection members 642 are provided so as to face each other on one surface of the foreign substance removal body 641 provided with the tunnel portion 641s, and one surface adjacent to the shielding member 643 is inclined. Therefore, it is possible to remove foreign substances from the edge portions on both short sides of the substrate by injecting a gas for removing foreign matters toward the edge portions on both short sides of the substrate, that is, chamfered portions, The measuring unit 631 can measure an accurate chamfering amount from the substrate.

  The shielding member 643 is detachably coupled to one surface of the foreign matter removing body 641 in order to protect a fluid moving tube (not shown) disposed inside the foreign matter removing body 641. Such a shielding member 643 is advantageous in that it can be easily coupled and separated and can easily maintain and repair the inner structure of the foreign matter removing body 641 while protecting the structure provided inside the foreign matter removing body 641.

  The operation of the chamfering machine having such a configuration will be described as follows.

  If the substrate to be chamfered is placed on the first stage 300a from the substrate loading unit 110 through the first transfer 400a, the alignment camera 125 on the first stage 300a first images the alignment mark on the substrate. The captured video information is transmitted to a control unit (not shown), and the control unit moves the first stage 300a to the X axis, the Y axis, and the θ axis, thereby aligning the substrate on the first stage 300a. Progresses.

  When the alignment operation for the substrate on the first stage 300a is completed, the substantial chamfering process is started. For chamfering, the common chamfering wheel 126 moves along the shared gantry 124 to the solid line position in FIG. At the time of chamfering, the first stage 1300a moves toward the common chamfering wheel 126, or conversely, the shared chamfering wheel 126 moves relative to the first stage 300a and both sides of the front surface in the substrate traveling direction. The chamfering process proceeds sequentially with respect to the edge, the short sides on both sides, and the edges on both sides of the rear surface.

  When the chamfering process is completed with respect to the edges on both sides of the front surface in the substrate traveling direction, the short sides on both sides, and the edges on both sides of the rear surface, the first stage 300a is rotated about the θ axis. Accordingly, the first stage 300a is arranged in the horizontal direction. In this case, since the first stage 300a itself is rotated around the θ axis without using a separate pickup robot as in the prior art, it is not necessary to proceed with the alignment operation for the substrate again as in the prior art. Tact time is shortened.

  If the first stage 300a rotates about the θ axis, the chamfering process for the long sides on both sides of the substrate continues. Also at this time, the first stage 300a moves toward the shared chamfering wheel 126, or conversely, the shared chamfering wheel 126 moves relative to the first stage 300a and moves toward the long sides on both sides of the substrate. Chamfering progresses.

  The substrate on which the chamfering process is completed is taken out to the substrate unloading unit 130 by the second transfer 400b, and the chamfering amount is measured on the substrate unloading unit 130. If the chamfering is wrong or the chamfering amount is insufficient, the substrate is discarded or fed back to the substrate loading unit 110 and the chamfering process can proceed again.

  On the other hand, in parallel with the process of chamfering the four corners, the long side, and the short side of the substrate on the first stage 300a, a new substrate to be chamfered is transferred onto the second stage 300b. The same chamfering process proceeds. In other words, in the present embodiment, the first and second stages 300a and 300b are arranged in a mutually parallel structure, so that the operation is interrupted or the first and second stages 300a are continuously performed without waiting. , 300b and the grinder 123 are organically chamfered. For example, after the chamfering process sequentially proceeds on the first stage 300a with respect to the edges on both sides of the front surface, the short sides on both sides, and the edges on both sides of the rear surface, the first stage 300a rotates about the θ axis. A new chamfering target substrate is placed on the second stage 300b, and the chamfering operation is performed on the first and second chamfering operations such as performing a chamfering operation on the aligned substrate using the alignment camera 125 on the second stage 300b. It can proceed organically in parallel with each other by the grinder 123 on the stages 300a and 300b. In parallel with this, the stage 300a, 300b moving to the substrate loading unit 110 side for loading a new substrate is loaded with the substrate to be worked after the surface is cleaned by the stage cleaning unit 530. By doing so, it is possible to prevent the occurrence of defects due to foreign matter. In order to apply a substrate having a size larger or smaller than the substrate applied in the above description to the above-described chamfering machine, the entire upper surface area of the first and second stages 300a and 300b supporting the substrate is set. Since it may be used after adjusting according to the method of FIG. 3 and FIG. 4, the applicable range is further widened.

  As described above, according to the present embodiment, when chamfering a substrate, the tact time can be reduced compared to the conventional case, and the productivity can be improved. Further, even if a failure occurs in any one of the first and second stages 300a and 300b, the equipment operation can continue without interruption of the equipment.

  FIG. 3 is a schematic diagram illustrating a chamfering machine for a flat display according to another embodiment of the present invention.

  In the case of this embodiment, a grinder 123a having a structure different from that of the above-described embodiment is applied. That is, as shown in FIG. 3, the grinder 123a of this embodiment includes a plurality of alignment cameras 125a, a plurality of chamfering wheels 126b, a camera support bar 127 that supports the plurality of alignment cameras 125a, A wheel support gantry unit 128 for supporting a plurality of chamfering wheels 126b.

  In the above-described embodiment, the chamfering wheel is applied as the common chamfering wheel 126 shared by all of the first and second stages 300a and 300b. However, in the present embodiment, the chamfering wheel is aligned. A structure in which two cameras 125a and two chamfering wheels 126b are provided independently for each of the first and second stages 300a and 300b is applied.

  In such a case, each of the alignment camera 125a and the chamfering wheel 126b is provided with four pieces, but the shared gantry unit 124 does not need to be used as in the above-described embodiment. It is sufficient if the four alignment cameras 125a are coupled to the camera support bar 127 and the four chamfering wheels 126b are coupled to the wheel support gantry 128.

  For reference, as shown in FIG. 3, two chamfering wheels 126b are provided on both sides of the wheel supporting gantry portion 128, respectively, and these are provided on one side of the wheel supporting gantry portion 128. May be arranged in a row.

  Even when configured as in the present embodiment, it is sufficient to provide an effect that the tact time can be reduced and the productivity can be improved when chamfering a substrate.

  In particular, in the case of this embodiment, one of the first and second stages 300a and 300b, or one of the two alignment cameras 125a and one of the chamfering wheels 126b are broken. Even if this occurs, it is possible to improve productivity over conventional chamfering machines in order to continue the equipment operation without interruption of equipment.

  As described above, it is obvious to those skilled in the art that the present invention is not limited to the above-described embodiment, and can be variously modified and changed without departing from the spirit and scope of the present invention. Therefore, it should be said that such modifications or variations belong to the scope of the claims of the present invention.

  The present invention is applicable to a technical field related to a chamfering machine for a flat display.

It is a schematic block diagram with respect to the conventional chamfering machine which advances the chamfering process for the long side and the short side individually. 1 is a schematic diagram illustrating a chamfering machine for a flat display according to an embodiment of the present invention. It is an expansion perspective view of a stage. FIG. 4 is a perspective view illustrating an operation with respect to the stage of FIG. 3. (A) is a block diagram with respect to the 1st vacuum hole formed in the surface of a turntable, (b) is a block diagram with respect to the 2nd vacuum hole formed in the surface of a variable table. It is a schematic side view of a stage. It is an expansion perspective view of a transfer. FIG. 8 is a perspective view partially illustrating an operation for the transfer of FIG. 7. It is the perspective view which illustrated the mounting state of the stage washing | cleaning unit provided in the upper part of the stage. FIG. 10 is a perspective view of the unit cleaning unit illustrated in FIG. 9. It is sectional drawing by the AA line of FIG. It is the perspective view which illustrated the structure of the measurement unit of the chamfering amount arrange | positioned at the tail of a board | substrate unloading unit. FIG. 13 is an enlarged perspective view in which a “B” portion illustrated in FIG. 12 is enlarged. FIG. 14 is a perspective view for explaining a foreign substance removing unit illustrated in FIG. 13. FIG. 15 is an exploded perspective view of FIG. 14. It is sectional drawing by CC line of FIG. FIG. 5 is a schematic diagram illustrating a chamfering machine for a flat display according to another embodiment of the present invention.

Claims (51)

A substrate loading unit on which the substrate is loaded;
A chamfering unit in which chamfering of the substrate proceeds,
A substrate unloading unit from which the substrate is unloaded,
The chamfering unit is
A plurality of stages on which the substrate is placed and supported and spaced apart from each other in a crossing direction of a virtual work line connecting the substrate loading unit and the substrate unloading unit;
At least one alignment camera for aligning the substrates placed on the plurality of stages, and at least one chamfering wheel for performing a chamfering operation on the substrates placed on the plurality of stages. A chamfering machine for a flat display, comprising: a grinder provided. The plurality of stages are:
The flat display according to claim 1, wherein the first stage and the second stage are provided along a horizontal direction on a virtual work line connecting the substrate loading unit and the substrate unloading unit. Chamfering machine. Each of the plurality of stages is
3. The chamfering machine for a flat display according to claim 2, wherein the chamfering machine is provided so as to be operable on the X axis, the Y axis, and the θ axis at the position on the chamfering unit for aligning the substrates. The grinder
A camera support bar that is provided over the first and second stages along a virtual work line connecting the first and second stages and supports the at least one alignment camera;
The at least one alignment camera is
3. The camera support bar according to claim 2, wherein two are separately provided for each of the first and second stages for photographing both side edges of one substrate. Chamfering machine for flat display. The at least one chamfering wheel is:
Two are provided independently for each of the first and second stages;
The grinder
A wheel support gantry section provided over the first and second stages along a virtual work line connecting the first and second stages, to which the chamfering wheel is coupled; The chamfering machine for a flat display according to claim 4, comprising: The at least one chamfering wheel is:
A wheel for shared chamfering that is shared by both the first and second stages,
The at least one alignment camera is
The chamfering machine for a flat display according to claim 2, wherein the chamfering machine is a shared alignment camera shared by both the first and second stages. The grinder
A shared gantry unit provided over the first and second stages along a virtual work line connecting the first and second stages;
The shared chamfering wheel is
Provided on one side of the shared gantry section,
The shared alignment camera is
The chamfering machine for a flat display according to claim 6, wherein the chamfering machine is provided on the other side of the shared gantry unit. The at least one chamfering wheel is:
A wheel for shared chamfering that is shared by both the first and second stages,
The at least one alignment camera is
3. The chamfering machine for a flat display according to claim 2, wherein two pieces are provided independently for each of the first and second stages for photographing both side edges of one substrate. 4. The grinder
A shared gantry unit provided over the first and second stages along a virtual work line connecting the first and second stages;
The alignment camera is
Provided on one side of the shared gantry section,
The shared chamfering wheel is
9. The chamfering machine for a flat display according to claim 8, wherein the chamfering machine is provided on the other side of the shared gantry unit. The chamfering wheel is
2. The chamfering machine for a flat display according to claim 1, wherein the chamfering machine is a multi-wheel capable of processing all four corners, long sides and short sides of the substrate. Each of the plurality of stages is
At least one turntable for sucking and rotating the substrate;
A plurality of variable tables that are arranged outside the turntable so as to be able to approach and separate from the turntable, and support the substrate together with the turntable at a position relative to the predetermined turntable according to the size of the substrate. The chamfering machine for a flat display according to claim 1, comprising: The at least one turntable is
One in the central area,
The multiple variable tables are:
The chamfering machine for a flat display according to claim 11, wherein four chamfers are provided symmetrically on the outer periphery of the turntable. On the side of the variable table,
13. The chamfering machine for a flat display according to claim 12, wherein an incision portion is formed to prevent a collision with the turntable when the variable table approaches the turntable. On the surface of the turntable,
A number of first vacuum holes for vacuum-adsorbing the substrate are formed,
On the surface of the variable table,
12. The flat display device according to claim 11, wherein the substrate is vacuum-sucked, and a plurality of second vacuum holes whose vacuum on / off is individually controlled by a plurality of vacuum pipes are formed. Chamfering machine. An intermediate pipe connected to the multiple vacuum pipes;
The multiple vacuum pipes are
15. The chamfering machine for a flat display according to claim 14, wherein the chamfering machine for a flat display is branched to a pair of variable tables adjacent to each other from one line of the intermediate pipe.   A vacuum suction area with respect to the substrate is formed around the first and second vacuum holes and forms a line with a certain shape in a state where the surface is tilted downward by a certain depth from the surfaces of the turntable and the variable table. The chamfering machine for a flat display as claimed in claim 14, further comprising first and second vacuum suction line grooves for doubling the pressure. The first and second vacuum suction line grooves are
17. The chamfering machine for a flat display according to claim 16, wherein one chamfer is provided for each of the first and second vacuum holes.   The chamfering machine for a flat display as claimed in claim 12, further comprising a table driving unit for moving the four variable tables toward and away from the turntable. The table driving unit is
A pair of connecting blocks each connecting two variable tables in pairs;
A ball screw shaft that is rotatably coupled to the pair of connection blocks and moves the pair of connection blocks toward and away from each other during forward and reverse rotation;
The chamfering machine for a flat display according to claim 18, further comprising a single drive motor that forwards and reverses the ball screw shaft.   The chamfering machine for a flat display according to claim 19, further comprising a flatness adjusting unit provided on the variable table and the connection block to adjust the flatness of the variable table with respect to the connection block. . The flatness adjuster is
A plurality of adjusting bolts whose both ends are screwed to the variable table and the connecting block in a state where the threads of both ends are processed in opposite directions;
The contact support bolt according to claim 20, further comprising: a plurality of contact support bolts coupled to any one of the variable table and the connection block and having one end in contact with and supported by the other. Chamfering machine for flat display. The plurality of stages are:
The chamfering machine for a flat display according to claim 11, wherein a plurality of chamfering machines are provided along a virtual X-axis lateral direction connecting the substrate loading unit and the substrate unloading unit. Provided in the region between the substrate loading unit and the chamfering unit and in the region between the chamfering unit and the substrate unloading unit, while moving in the X axis, Y axis and Z axis, And further comprising a transfer for transferring the substrate,
The transfer is
A plurality of basic gripping units provided to be spaced apart from each other and accessible to grip the substrate on both side surfaces of the substrate;
During the transfer or stop of the substrate, at least grips the substrate in a direction intersecting the mutual separation and approach directions of the basic gripping unit so as to prevent the substrate from falling off the basic gripping unit. The chamfering machine for a flat display according to claim 1, comprising one safety gripping unit. The transfer is
A head unit to which the plurality of basic gripping units and the at least one safety gripping unit are coupled;
The multiple basic gripping units are:
Provided on both sides of the head,
The at least one safety gripping unit is
24. The chamfering machine for a flat display according to claim 23, wherein the chamfering machine is provided in a front area of the head portion facing the chamfering unit. The multiple basic gripping units are:
4 each of which is provided on each side surface region of the head part,
25. The chamfering machine for a flat display according to claim 24, wherein one at least one safety gripping unit is provided. The transfer is
A pair of connecting portions respectively connecting the two basic gripping units;
A pair of guide portions provided on the head portion for guiding the movement of the pair of connecting portions;
26. The drive unit according to claim 25, further comprising: a drive unit that drives the pair of connection parts so that the pair of connection parts are moved toward and away from each other while being guided by the pair of guide parts. Chamfering machine for flat display. The transfer is
A fixed rod connected to the head part;
26. The chamfering machine for a flat display according to claim 25, further comprising a rotation support portion that rotatably supports the safety gripping unit with respect to the fixed rod. The multiple basic gripping units and the at least one safety gripping unit are:
24. The chamfering machine for a flat display according to claim 23, wherein the chamfering machine has a shape of 'L' so that the lower surface of the substrate can be partially supported and supported while being in contact with the side surface of the substrate. The multiple basic gripping units and the at least one safety gripping unit are:
24. The chamfering machine for a flat display according to claim 23, wherein the chamfering machine is made of an MD-PA material so as to prevent generation of scratches on the substrate. The transfer is
An X-axis drive unit that drives the multiple basic gripping units and the at least one safety gripping unit along a virtual X-axis connecting the substrate loading unit and the substrate unloading unit;
A Y-axis drive unit that drives the multiple basic gripping units and the at least one safety gripping unit along a Y-axis that intersects the X-axis;
24. The flat display device according to claim 23, further comprising: a Z-axis drive unit that drives the plurality of basic gripping units and the at least one safety gripping unit along a Z-axis that is a vertical direction. Chamfering machine.   A stage cleaning unit that is provided in an adjacent area of the chamfering processing unit and that injects a cleaning fluid for cleaning the stage onto the surface of the stage that moves in the direction of the substrate loading unit in order to load a new substrate. The chamfering machine for a flat display according to claim 1, further comprising: The stage cleaning unit is
A unit frame provided along a lateral direction of the moving direction of the stage;
32. The flat surface according to claim 31, further comprising at least one unit cleaning unit that is detachably coupled to the unit frame in an upper region of the stage and injects the cleaning fluid onto the surface of the stage. Chamfering machine for display.   The unit cleaning unit is tilted and coupled to a unit frame so that the cleaning fluid sprayed from the unit cleaning unit to the surface of the stage is sprayed from the inside to the outside of the stage. A chamfering machine for a flat display according to claim 32. The unit cleaning section is
Coupled to the unit frame to be provided in pairs per stage;
34. The chamfering machine for a flat display according to claim 33, wherein the pair of unit cleaning units provided on the stage is coupled to the unit frame so as to have a mutually symmetrical inclination. The unit cleaning section is
An injection body portion provided with an injection port for injecting the cleaning fluid on the surface of the stage;
33. The flat display device according to claim 32, wherein the injection body includes a rotation coupling unit that couples the injection body to the unit frame so as to be rotatable with respect to the unit frame. Chamfering machine. The injection body part is
A rotating member that is rotatably coupled to the rotational coupling portion;
An injection member that is coupled to the rotation member so as to have a direction substantially parallel to the rotation member, and in which a moving space in which the cleaning fluid moves inward from an upper end portion is formed. 36. A chamfering machine for a flat display according to claim 35. The injection body part is
A shielding member that is coupled to the upper end of the ejection member and shields the interior of the ejection member from the outside;
The injection port is
37. The chamfering machine for a flat display according to claim 36, wherein the tip end portion of the spray member and the tip end portion of the shielding member are coupled to be separated from each other and are provided in a slit shape. The rotation coupling part is
A frame fastening member coupled to the unit frame;
A pivot coupling member coupled to the pivot member so that the pivot member can pivot about an axis;
A connecting member provided laterally in the longitudinal direction of the rotating member, and connecting the frame coupling member and the rotation coupling member so that the rotation coupling member is rotatable relative to the frame fastening member; 38. A chamfering machine for a flat display according to claim 36. The stage cleaning unit is
32. The chamfering machine for a flat display according to claim 31, wherein the chamfering machine is provided between the chamfering unit and the substrate unloading unit.   The stage cleaning unit is configured such that when the chamfered substrate is transferred to the substrate unloading unit and the stage moves in the direction of the substrate loading unit, the cleaning fluid is ejected from the stage cleaning unit. 32. The chamfering machine for a flat display according to claim 31, further comprising a control unit for controlling the operation.   2. The chamfering machine for a flat display according to claim 1, further comprising a chamfering amount measuring unit that is provided in the substrate unloading unit and measures a chamfering amount with respect to a substrate that has been chamfered. The chamfering amount measuring unit is:
2. The apparatus according to claim 1, further comprising at least a pair of measurement units that are respectively provided at an upper part and a lower part of the substrate unloading unit and measure a chamfering amount of a long side or a short side of the substrate transferred by the substrate unloading unit. Item 42. A chamfering machine for a flat display according to Item 41. The at least one pair of measuring units includes
43. The flat display according to claim 42, wherein the flat display is a pair of photographing cameras for continuously photographing a pair of parallel long sides or a pair of short sides of the substrate transferred by the substrate unloading unit. Chamfering machine. The photographing camera is
44. The chamfering machine for a flat display according to claim 43, wherein the chamfering machine is one of a line scan camera and an area camera. The chamfering amount measuring unit is:
A pair of foreign matter removal provided to be separated from each other along the lateral direction of the substrate transfer direction and disposed upstream of the measurement unit with respect to the substrate transfer direction to remove the foreign matter remaining on the substrate. The chamfering machine for a flat display according to claim 42, further comprising a section. The foreign matter removing unit is
Foreign matter removal work for removing foreign matter from one side to the inside, provided in a tunnel structure with one side open so that the long side or short side of the substrate loaded and transferred to the substrate unloading unit can pass therethrough A foreign body removing body in which a moving space in which the fluid moves is formed as a trap;
46. An injection member provided on the foreign substance removing body and jetting the foreign substance removing working fluid that has passed through the moving space toward a long side or a short side of the substrate. Chamfering machine for flat display as described. The foreign matter removing unit is
In order to protect the fluid moving tube disposed inside the foreign substance removal body, the apparatus further includes a shielding member removably coupled to one surface of the foreign substance removal body,
47. The chamfering machine for a flat display according to claim 46, wherein the spray member and the shielding member are coupled to be separated from each other to form a spray outlet that communicates the moving space with the outside. The jet outlet is
48. The chamfering machine for a flat display according to claim 47, wherein the chamfering machine is provided with an inclination with respect to a virtual line connecting the upper end and the lower end of the foreign substance removing body. The chamfering amount measuring unit is:
A measurement support frame provided along a Y-axis that intersects a virtual X-axis connecting the substrate loading unit and the substrate unloading unit;
46. The chamfering machine for a flat display according to claim 45, further comprising: a moving frame that is coupled to the measurement support frame so as to be movable along the Y axis and on which the measurement unit is mounted. The chamfering amount measuring unit is:
50. The chamfering apparatus for a flat display according to claim 49, further comprising an elevating driving unit that moves the measuring unit toward and away from the substrate unloading unit on the moving frame. The foreign matter removing unit is
Coupled to the moving frame;
The working fluid is
50. The chamfering machine for a flat display according to claim 49, wherein the chamfering machine is a gas for removing foreign matter.

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