KR20100130696A - Grinding apparatus - Google Patents

Abstract

PURPOSE: A chamfering apparatus is provided to prevent the breakage of an edge due to a fine crack or defective particle due to burrs since the fine crack or the burr of the chamfered end is efficiently removed. CONSTITUTION: A chamfering apparatus comprises a substrate loading unit(100), a substrate unloading unit(200), and a chamfering unit(300). The loading unit loads the substrate. The unloading unit unloads the substrate, of which the end area has been chamfered. The chamfering unit is installed between the loading unit and the unloading unit. The chamfering unit comprises a chamfering part(320) and a polishing part(330). The chamfering part chamfers the end area of the substrate in a diagonal direction. The polishing part polishes the leading end of the substrate and removes burrs.

Description

Chamfering Machine {GRINDING APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chamfering machine, and more particularly, to effectively and efficiently remove fine cracks or burrs that may be present at an end of a chamfering process, so that cracks or burrs caused by fine cracks may occur. It is possible to prevent the occurrence of particle defects caused by the chamfering machine, which can reduce the time required for chamfering compared to the rounding process, and can provide excellent effects such as a conventional rounding process. It is about.

The substrate for a flat panel display including a liquid crystal display (LCD), a plasma display panel (PDP), organic light emitting diodes (OLED), and the like is made of glass.

In addition, substrates for thin-film solar cells are also made of glass among solar cells that convert light energy into electrical energy using properties of semiconductors.

Since the flat display or solar cell substrate is made of glass, the corner cut is performed on four corners (edges) of the substrate, and the edge cut is applied to the short and long edges of the substrate. And edge cutting (edge cutting), that is, the chamfering of the corners and sides of the substrate to remove the sharpness of the glass itself to facilitate the inter-process transfer and manipulation and to prevent safety accidents. Chamfering machine is used for this chamfering process.

Looking at the form of the chamfering process for the substrate with reference to Figure 1 as follows. Conventionally, the chamfering form of the substrate by the chamfering machine is, as shown in Fig. 1 (a), the chamfering process to squeeze the end (four corners, long sides and short sides) region of the substrate in the diagonal direction of 45 degrees, for example, It can be divided into a rounding process for rounding the end region of the substrate as shown in (b).

Among the chamfering processing forms of FIGS. 1A and 1B, the rounding processing as shown in (b) is more effective in preventing phenomena such as edge cracking and improving the strength than the chamfering processing as shown in (a). Although it is known to be preferable, the rounding process has a problem that the chamfering process is relatively difficult because not only increases the time required for chamfering processing because the amount of chamfering compared to the chamfering process.

However, when the chamfering process is carried out, since the chamfering amount can be reduced compared to the rounding process, the time required for the chamfering process can be reduced and the processing becomes easier.

Therefore, it is common to perform only a chamfering process for a flat panel display or a solar cell substrate.

However, if only the chamfering process is carried out, fine cracks may be present at the end portion which is struck in an oblique direction and thus the edges (edges or corners) are broken due to the brittleness of the glass substrate and the presence of such cracks. There is a high possibility that the phenomenon occurs.

In addition, after the chamfering process, burrs (sharp parts) are particularly likely to occur at the distal ends. If the burrs are not properly removed, burrs not removed in the post process become particles. Since there is a high possibility of causing defects caused by particles, a countermeasure is required.

It is an object of the present invention to properly and efficiently remove fine cracks or burrs that may be present at the chamfered ends, thereby preventing edge cracking caused by fine cracks and particle defects caused by burrs. In particular, it is possible to reduce the time required for chamfering compared to the rounding process while providing excellent effects such as a conventional rounding process, and to provide a chamfering machine that can easily perform chamfering processing.

The object is, in accordance with the present invention, a substrate loading unit is loaded (loading) substrate; A substrate unloading unit in which an end region of the substrate chamfered is unloaded; And a chamfering portion provided between the substrate loading unit and the substrate unloading unit to chamfer an end region of the substrate, and to chamfer the end region of the substrate in an oblique direction, and to be adjacent to the chamfer processing portion. It is achieved by a chamfering device comprising a chamfering processing unit having a polishing processing unit for polishing the leading end of the chamfered substrate to remove burrs.

Here, the chamfering processing unit may further include a gantry portion provided along a direction crossing the virtual line connecting the substrate loading unit and the substrate unloading unit, wherein the chamfer processing unit and the polishing processing unit are respectively Each pair may be provided to be spaced apart from each other on the gantry.

The chamfering processing unit, coupled to one side of the gantry portion, the vertical drive unit for the chamfer processing unit for driving the pair of chamfer processing unit in the vertical direction; Left and right drive unit for the chamfer processing unit for driving the pair of chamfer processing unit in the left and right direction on one side of the gantry unit coupled to the vertical drive unit for the chamfer processing unit; An up and down drive unit for a polishing processing unit coupled to the other side of the gantry and driving the pair of polishing processing units in a vertical direction; And a left and right driving unit for a polishing processing unit for driving the pair of polishing processing units in the left and right direction at the other side of the gantry unit to which the upper and lower driving units for the polishing processing unit are coupled.

The chamfer processing unit may include a plurality of chamfering wheels for chamfering the substrate; A first wheel rotation driving unit which rotationally drives the chamfering wheel; A first driving part casing coupled to an outer side of the first wheel rotation driving part and connected to a vertical driving part for the chamfer processing part and a left and right driving part for the chamfer processing part; And a first wheel casing coupled to an outer side of the chamfering wheel to form an exterior of the chamfering wheel, and having a first substrate entrance and exit opening and closing on one side thereof.

The polishing processing unit may include a plurality of polishing wheels for performing polishing processing on the substrate; A second wheel rotation driving unit which rotationally drives the polishing wheel; A second driving part casing coupled to an outer side of the second wheel rotation driving part and connected to a vertical driving part for the polishing processing part and a left and right driving part for the polishing processing part; And a second wheel casing coupled to an outer side of the polishing wheel to form an exterior of the polishing wheel, and having a second substrate entrance and exit through which the substrate enters and exits on one side.

The second wheel casing may be provided in a pair separated from each other, and the second wheel casing may be provided with a locking part for preventing disassembly when the divided pair is assembled.

The chamfering wheel may be made of diamond, and the polishing wheel may be made of a soft material having a lower hardness than the chamfering wheel.

The chamfering processing unit may further include an alignment camera for photographing the substrate entering the chamfering processing unit.

At least one stage on which the substrate is seated and supported but movable or rotatable on an imaginary line connecting the substrate loading unit and the substrate unloading unit; A first transfer provided between the substrate loading unit and the chamfering processing unit; And a second transfer provided between the chamfering processing unit and the substrate unloading unit.

The substrate may be a substrate for a flat panel display or a substrate for thin-film solar cells.

On the other hand, the above object, according to the present invention, a substrate loading unit is loaded (loading) substrate; A substrate unloading unit in which an end region of the substrate chamfered is unloaded; And a chamfering unit provided between the substrate loading unit and the substrate unloading unit, the chamfering unit having a plurality of chamfering wheels for chamfering an end region of the substrate, wherein the chamfering wheels are formed at an end of the substrate. It is also achieved by a chamfer, characterized in that it is a multi wheel which chamfers an area in an oblique direction and polishes a burr by polishing the leading end of the chamfered substrate.

Here, the multi-wheel may include a plurality of unit wheels having a disc shape and spaced apart from each other, at least one of the plurality of unit wheels may be the chamfering wheel, and the rest may be the polishing wheel.

The chamfering wheel may be made of diamond, and the polishing wheel may be made of a soft material having a lower hardness than the chamfering wheel.

On the other hand, the above object, according to the present invention, a substrate loading unit is loaded (loading) substrate; A substrate unloading unit in which an end region of the substrate chamfered is unloaded; And a plurality of chamfering wheels provided between the substrate loading unit and the substrate unloading unit to chamfer an end region of the substrate, and to chamfer the end region of the substrate in an oblique direction, and a tip portion of the chamfered substrate. And a chamfering processing unit having a plurality of polishing wheels for polishing and removing burrs, wherein the plurality of chamfering wheels are provided in an X-shape to cross each other. Many polishing wheels are also achieved by chamfering, which is provided in a cup type.

According to the present invention, fine cracks or burrs that may be present at the chamfered ends can be removed appropriately and efficiently to prevent edge cracking caused by fine cracks or particle defects caused by burrs. In particular, it can reduce the time required for the chamfering process compared to the rounding process and can easily perform the chamfering process while providing an excellent effect such as a conventional rounding process.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

Prior to the description with reference to the drawings, the substrate to be described below includes a flat panel including a liquid crystal display (LCD), a plasma display panel (PDP), organic light emitting diodes (OLED), and the like. It may include a substrate for display and a substrate for thin-film solar cells. However, in the following description, an LCD unit substrate made of a glass plate (CF, color filter) and a bottom plate (TFT, Thin Film Transistor), which are partially contacted and bonded to each other in a state where liquid crystal is injected therein, will be described as an example. do.

2 is a side view of a chamfering machine according to a first embodiment of the present invention, FIG. 3 is a plan view of FIG. 2, FIG. 4 is a front view of FIG. 2, FIG. 5 is a perspective view of a chamfering part and a polishing processing part, and FIG. 6 is an exploded perspective view of Figure 5, Figures 7 to 11 are views showing the operation of the chamfer according to the first embodiment of the present invention step by step, Figure 12 is a schematic perspective view of the stage.

As shown in these figures, the chamfering machine according to this embodiment includes a substrate loading unit 100 on which a substrate is loaded, a substrate unloading unit 200 on which an substrate is unloaded, and a substrate loading. A chamfering processing unit 300 is provided between the unit 100 and the substrate unloading unit 200 to chamfer the end region of the substrate.

In addition, the chamfering machine according to the present embodiment, the substrate 500 is mounted on the upper surface of the stage 500 and the substrate loading unit that can move or rotate on a virtual line connecting the substrate loading unit 100 and the substrate unloading unit 200, And a first transfer 410 provided between the 100 and the chamfering processing unit 300, and a second transfer 420 provided between the chamfering processing unit 300 and the substrate unloading unit 200. .

Since both the substrate loading unit 100 and the substrate unloading unit 200 serve to transfer the substrate, the substrate loading unit 100 and the substrate unloading unit 200 may be applied in a roller type as shown in FIG. 3. That is, the substrate loading unit 100 and the substrate unloading unit 200 may have a structure in which a plurality of rollers 112 and 212 rotatably supporting the substrate are respectively coupled to the plurality of rotation shafts 111 and 211.

However, since the scope of the present invention is not limited thereto, the substrate loading unit 100 and the substrate unloading unit 200 may be applied as a conventional conveyor type or stage type. When the substrate loading unit 100 and the substrate unloading unit 200 are applied in a conveyor type or a stage type, it may be advantageous to apply an air levitation module (not shown) for up the substrate.

The plurality of rollers 112 and 212 are preferably made of a flexible material so that scratches do not occur on the substrate. In addition, the plurality of rotation shafts 111 and 211 may be rotated together by a single motor to facilitate the control of the rotation speed thereof, but the rotation shafts 111 and 211 may be individually rotated by individual motors. You can also

The substrate loading unit 100 is provided with an alignment unit 115 for performing an alignment operation on the substrate to be entered. The alignment unit 115 serves to properly align the substrates by pressing both sides of the substrate by an operation of approaching and separating each other.

Unlike the substrate unloading unit 200, the substrate loading unit 100 is further provided with a plurality of entrance detection sensors 114 along the direction in which the substrate enters. The plurality of entrance detection sensors 114 generate a detection signal for reducing or stopping the speed of the rotating shaft 111 based on the entry position of the substrate.

In contrast, the substrate unloading unit 200 is further provided with a chamfering measurement unit 250. Chamfering measurement unit 250 serves to measure the chamfering for the substrate chamfering is completed through the chamfering processing unit 300.

With respect to the substrate whose chamfering amount is measured by the chamfering measuring unit 250, if the chamfering is wrong or if the chamfering amount is less than the reference value, the substrate is destroyed or Feed back toward the chamfering processing unit 300, the chamfering amount is corrected can be processed. In the present exemplary embodiment, the chamfering measurement unit 250 is provided in the substrate unloading unit 200, but may be provided in the chamfering processing unit 300 in some cases.

In the substrate loading unit 100 and the substrate unloading unit 200, a plurality of lift pins 113 and 213 for raising a predetermined height of the substrate with respect to the plurality of rollers 112 and 212 are disposed between the plurality of rollers 112 and 212. More is provided.

The lift pins 113 and 213 are provided in an area between the substrate loading unit 100 and the chamfering processing unit 300, and an area between the chamfering processing unit 300 and the substrate unloading unit 200 to transfer the substrate at a corresponding position. It is operated in conjunction with the operation of the transfer (410,420). That is, the lift pins 113 and 213 are up when the transfers 410 and 420 transfer the substrate from the substrate loading unit 100 to the chamfering processing unit 300 or from the chamfering processing unit 300 to the substrate unloading unit 200. (up) shows up.

Prior to the description of the chamfering processing unit 300, the transfer (410, 420) and the stage 500 will be described first.

First, the transfers 410 and 420 are provided in the region between the substrate loading unit 100 and the chamfering processing unit 300, and the region between the chamfering processing unit 300 and the substrate unloading unit 200, as described above. It serves to transfer the substrate on the loading unit 100 to the stage 500, the substrate on the stage 500 to the unloading unit 200.

In the present embodiment, the structure and operation of the transfers 410 and 420 provided in the region between the substrate loading unit 100 and the chamfering processing unit 300 and the region between the chamfering processing unit 300 and the substrate unloading unit 200 are All may be the same. That is, the substrate may have a structure and an operation of transferring the substrate to a corresponding position after absorbing the substrate by a vacuum adsorption method.

Next, the stage 500 is a part where the board | substrate of a chamfering process is mounted. In the present embodiment, one is provided on a virtual line connecting the substrate loading unit 100 and the substrate unloading unit 200, but the virtual connecting the substrate loading unit 100 and the substrate unloading unit 200 is provided. Two or more stages 500 may be provided in a direction crossing the line.

Briefly referring to the stage 500, the stage 500 of the present exemplary embodiment may have a structure that can be mixedly applied to substrates of various sizes.

That is, as shown in FIG. 12, the stage 500 of the present exemplary embodiment includes one turntable 561 for adsorbing and rotating the substrate, and the substrate 500 is disposed outside the turntable 561 to adsorb the substrate together with the turntable 561. Four variable tables 563 may be provided to support and space the turntable 561 so as to support all of the substrates of various sizes.

With respect to the turntable 561 having an upper surface having a substantially circular shape and having one in the center, four variable tables 563 may be provided symmetrically with respect to the outer side of the turntable 561. However, since the scope of the present invention is not limited thereto, the top surface shape of the turntable 561 may be an elliptic shape or a polygonal shape in addition to the circular shape, and the variable table 563 may be mutually at the outside of the turntable 561. Two may be provided symmetrically.

If the substrate size to be chamfered is large, four variable tables 563 should be spaced apart from the turntable 561 so that the entire adsorption area of the turntable 561 and the variable table 563 can be widened. If the substrate size to be processed is small, four variable tables 563 should be approached to the turntable 561. At this time, when the four variable tables 563 are approached to the turntable 561, the sides of the four variable tables 563 are not to collide with the turntables 561, so that the sides of the variable tables 563 are incised. The part 564 is formed. The cutout 564 may have an arc shape, but is not necessarily so.

In addition, a plurality of vacuum holes (not shown) are formed on the surfaces of the turntable 561 and the variable table 563 for vacuum suction of the substrate. The vacuum hole is formed in a vacuum suction line groove (not shown) that doubles the vacuum suction area to the substrate by forming a line of a predetermined shape in a state of being recessed downward from the surfaces of the turntable 561 and the variable table 563. It is formed one by one. In this embodiment, the vacuum suction line groove (not shown) formed in the turntable 561 is, for example, a pizza (pizza) shape, and the vacuum suction line groove (not shown) formed in the variable table 563 has a Korean letter 'A' shape. It may be formed, but the scope of the present invention is not limited thereto.

On the other hand, the chamfering processing unit 300 is a portion that proceeds substantially chamfering processing for the substrate. By the chamfering processing unit 300, the end region of the substrate is first chamfered in an oblique direction, and then the chamfered tip is polished to remove burrs.

In this case, if the polishing process is further roughened after the chamfering process, the shape is the same as that of FIG. 1 (c) in which the burr of the sharp tip is removed from FIG. Can be

In this case, fine cracks or burrs that can occur when only the chamfering process as shown in FIG. 1 (a) can be removed can be removed appropriately and efficiently. Particle defects can be prevented from occurring, and in particular, it can reduce the time required for chamfering compared to the rounding process and provide chamfering processing while providing excellent effects equivalent to or equivalent to those of the conventional rounding process as shown in FIG. It can be easily performed.

The chamfering processing unit 300, as shown in Figure 3, the gantry 310 is provided long along the direction crossing the virtual line connecting the substrate loading unit 100 and the substrate unloading unit 200 And a chamfering part 320 provided at one side of the gantry 310 and chamfering an end region of the substrate in an oblique direction, and a tip of the chamfered substrate polished at the other side of the gantry 310. and a polishing processing unit 330 for removing burrs by polishing.

In this embodiment, since the substrate is chamfered at both the front corners (corners) and rear rear corners (edges), and both short side edges and both long side edges, the chamfering part 320 and the polishing part ( 330 are provided in pairs to be spaced apart from each other on the gantry 310.

The chamfering part 320 and the polishing processing part 330 may be provided in different forms or structures, but in this embodiment, the chamfer processing part 320 and the polishing processing part 330 for convenience of installation and maintenance. Is applied in substantially the same structure.

Referring to FIGS. 5 and 6, the chamfering unit 320 and the polishing processing unit 330 will be described at one time. Each of the chamfer processing unit 320 and the polishing processing unit 330 may be a chamfering and polishing process for a substrate. A plurality of chamfer and polishing wheels 321 and 331 for processing, first and second wheel rotation drives 322 and 332 for rotationally driving the chamfer and polishing wheels 321 and 331, and first and second wheel rotation drives ( The first and second drive unit casings 323 and 333 coupled to the outside of the 322 and 332, and the outer side of the chamfer and polishing wheels 321 and 331 are combined to form an exterior of the chamfer and polishing wheels 321 and 331, and the substrate is moved in and out. First and second wheel casings 324 and 334 in which first and second substrate entrances 325 and 335 are formed.

At this time, the chamfering wheel 321 and the polishing processing wheel 331 is the same shape, but the material is different. That is, the chamfering wheel 321, which requires a relatively large amount of chamfering at a fast time, is made of diamond while the polishing wheel 331 may be made of a soft material having a lower hardness than diamond.

Since the polishing wheel 331 smoothly polishes only the sharp part of the tip portion after the chamfering, the hardness of the polishing wheel 331 does not need to be very high. In other words, if the polishing wheel 331 is made of a material that is unnecessarily high in hardness or high in roughness, a sharp burr may be formed on the substrate during polishing, so that the polishing wheel 331 is as soft as possible and has surface roughness. It would be desirable to select a lower material.

The first wheel rotation driving unit 322 and the second wheel rotation driving unit 332 serve to rotationally drive the chamfering wheel 321 and the polishing wheel 331, respectively. Since the chamfering wheel 321 and the polishing wheel 331 are provided in pairs, the first wheel rotation driving unit 322 and the second wheel rotation driving unit 332 may also be provided in pairs.

The first wheel rotation driving unit 322 and the second wheel rotation driving unit 332 may be applied as a rotary motor or a rotating cylinder, and the chamfering wheel (the first wheel rotation driving unit 322 and the second wheel rotation driving unit 332) When the 321 and the polishing wheel 331 are combined, as shown in FIG. 6, a cap C and a bolt B may be used.

The first driving part casing 323 and the second driving part casing 333 are portions that partially surround and support the first wheel rotation driving part 322 and the second wheel rotation driving part 332.

The first driving unit casing 323 is connected to the upper and lower driving units 341 (see FIG. 2) for the chamfer processing unit and the left and right driving units 342 (see FIG. 4) for the chamfer processing unit, and the upper and lower parts for the polishing processing unit are connected to the second driving unit casing 333. The driving unit 343 (see FIG. 2) and the left and right driving unit 344 (see FIG. 4) for the polishing processing unit may be connected.

The first wheel casing 324 and the second wheel casing 334 are portions surrounding the chamfering wheel 321 and the polishing wheel 331 from the outside. The first wheel casing 324 and the second wheel casing 334 may be excluded in configuration, but if they are not equipped, the first wheel casing 324 may have a high risk of glass fragments scattering when chamfered. And a second wheel casing 334 may be provided.

However, since the first wheel casing 324 and the second wheel casing 334 do not completely surround the chamfering wheel 321 and the polishing wheel 331, the first wheel casing 324 and the second wheel casing ( The first and second substrate entrances 325 and 335 are formed at 334 to access the substrate. The first and second substrate entrances 325 and 335 may have a size enough to allow the substrate to enter and exit without hitting the substrate.

Each of the first wheel casing 324 and the second wheel casing 334 may be provided in a pair separated from each other, and each of the first wheel casing 324 and the second wheel casing 334 may be divided into a pair. Locking parts L1 and L2 for assembly and disassembly may be provided.

On the other hand, since the width of the long side and the short side of the substrate is different from each other for the chamfering processing for them, as shown in Figure 5 and Figure 6 (assembly) provided in the assembly (assembly) form, the chamfer processing unit 320 and the polishing processing unit 330 Each of the chamfering part 320 and the polishing processing part 330 should be able to move up and down to have an operation of approaching or spaced apart from each other and chamfering the end region of the substrate by position. Only then, smooth chamfering can be performed.

To this end, the chamfering processing unit 300 of the present embodiment, for the chamfer processing unit for driving the chamfer processing unit 320 in the vertical direction and the left and right directions, respectively, on one side of the gantry 310 to which the chamfer processing unit 320 is coupled. Polishing for driving the polishing processing unit 330 in the vertical and horizontal directions on the other side of the upper and lower driving units 341 and the left and right driving units 342 for the chamfer processing unit and the gantry unit 310 to which the polishing processing unit 330 is coupled. The upper and lower eastern part 343 for a process part and the left-right drive part 344 for a polishing process part are provided.

The chamfering processing unit 300 is chamfered to control the operation of the upper and lower driving units 341 for the chamfer processing unit, the left and right driving units 342 for the chamfer processing unit, and the upper and lower driving units 343 for the polishing processing unit and the left and right driving units 344 for the polishing processing unit. The apparatus may further include an alignment camera 350 (see FIG. 2) for photographing the substrate entering the processing unit 300.

Although not shown in detail, the alignment camera 350 captures an alignment mark displayed on a substrate and transmits the same to the upper and lower driving units 341 for the chamfer processing unit based on the captured image information. And the operation of the left and right driving unit 342 for the chamfer processing unit, the up and down driving unit 343 for the polishing processing unit, and the left and right driving unit 344 for the polishing processing unit.

In the present embodiment, the upper and lower driving unit 331 for the chamfer processing unit, the left and right driving unit 332 for the chamfer processing unit, the upper and lower driving unit 333 for the polishing processing unit, and the left and right driving unit 334 for the polishing processing unit are schematically illustrated in FIGS. 2 to 4. Although illustrated, they may be implemented by a structure such as a linear motor or a cylinder, or a combination of a motor and a ball screw, and thus a detailed description thereof will be omitted.

The operation of the chamfering machine having such a configuration will be described with reference to FIGS. 7 to 11.

First, as shown in FIG. 7, the substrate to be chamfered is transferred through the roller 112 on the substrate loading unit 100. The substrate conveyed by the rotation of the roller 112 is stopped at the working position as the operation of the rotary shaft 111 is stopped based on the signal of the entry detection sensor 114 (see FIG. 3). Subsequently, after the alignment unit 115 presses both sides of the substrate to align the substrate, the lift pins 113 up the substrate.

When the substrate is up, the first transfer 410 moves along the X-axis, Y-axis, and Z-axis as shown by the solid line in FIG. 7 to move the substrate on the substrate loading unit 100 to the top surface of the stage 500. The substrate raised to the upper surface of the stage 500 is adsorbed and supported on the surfaces of the turntable 561 (see FIG. 12) and the variable table 563 (see FIG. 12).

When the substrate is adsorbed on the upper surface of the stage 500, the stage 500 is moved toward the chamfering processing unit 300. In the middle of the movement, the alignment mark of the substrate is first photographed by the alignment camera 350. The photographed image information is transmitted to a control unit (not shown), and the control unit is based on the image information. The upper and lower driving units 341 for the chamfer processing unit, the left and right driving units 342 for the chamfer processing unit, and the vertical driving unit 343 and the polishing unit for the polishing processing unit are polished. The operation of the left and right drive unit 344 for the processing unit is controlled.

The stage 500 on which the substrate is mounted in association with the control passes through the chamfer processing unit 320 and the polishing processing unit 330 in sequence as shown in FIG. 8. First, the chamfering process is performed on both sides of the front surface of the substrate while the chamfering portion 320 passes, and the chamfering process is performed on the short edges of the substrate. Polishing process for the short side edge of the chamfered substrate is performed.

Next, as shown in FIG. 9, the stage 500 on which the substrate is seated is returned to the position of FIG. 7. At this time, since the chamfer processing unit 320 and the polishing processing unit 330 are up by a predetermined height by the chamfer processing unit vertical drive unit 341 and the polishing processing unit vertical drive unit 343, the stage 500 on which the substrate is seated. ) May be reversed without collision as shown in FIG. 8.

Thereafter, the stage 500 is rotated 90 degrees for the long side processing of the substrate, and then passes again through the chamfer processing unit 320 and the polishing processing unit 330 as shown in FIG. 10. First, the chamfering process is performed on both sides of the rear side of the substrate while the chamfering unit 320 passes, and the chamfering process is performed on the long side edge of the substrate. Polishing process for the long side edge of the chamfered substrate is performed.

When the chamfering and polishing processing for each part of the substrate is completed as described above, as shown in FIG. 11, the second transfer 420 grips the substrate on the stage 500 and is transferred to the substrate unloading unit 200. The above operation is repeated again with respect to the new substrate.

In the above description, the short side of the substrate is first processed, and the long side is processed. Therefore, as long as the tact time can be reduced, the order of the chamfering process can be sufficiently changed according to the process situation of the manufacturer.

As described above, according to the present embodiment, fine cracks or burrs that may be present at the chamfered ends can be removed appropriately and efficiently, resulting in edge cracking caused by fine cracks or particle defects caused by burrs. It is possible to prevent, and in particular, while providing an excellent effect, such as a conventional rounding process can reduce the time required for chamfering processing compared to the rounding process and can be easily performed chamfering processing.

13 is a layout view of a multi-wheel in the chamfering machine according to the second embodiment of the present invention.

In the above-described embodiment, the chamfering wheel 321 and the polishing wheel 321 are provided separately, but in the present embodiment, the chamfering wheel 370 as a multi wheel that can perform these roles together. To raise.

That is, in the present embodiment, the chamfering wheel 370 is a multi wheel that chamfers the end region of the substrate in an oblique direction and polishes the burrs by polishing the front end portion of the chamfered substrate. Prepared.

The chamfering wheel 370 may have a disk shape and may include a plurality of unit wheels 370a to 370e spaced apart from each other, and three of these unit wheels 370a to 370e are chamfering wheels 370a to 370c. ), The rest can be used as polishing wheels 370d and 370e. Of course, their number does not limit the scope of the present invention.

Considering that the substrate moves in the direction of the arrow in Fig. 13, the effect of the present invention can be achieved even when the front one is used as the chamfering wheels 370a to 370c and the rear one is used as the polishing wheels 370d and 370e. have.

In this case, the chamfering wheels 370a to 370c may be made of diamond, and the polishing wheels 370d and 370e may be made of a soft material having a lower hardness than diamond.

14 is a layout view of a chamfering wheel and a polishing wheel in a chamfering machine according to a third embodiment of the present invention.

Referring to this figure, the chamfering machine of this embodiment also includes a chamfering wheel 380 for chamfering and a polishing wheel 390 for polishing, which is different from the above-described embodiments in this respect. not.

However, in the present embodiment, the structure or arrangement of the chamfering wheel 380 and the polishing wheel 390 is provided differently from the above-described embodiments.

In other words, the chamfering wheel 380 may be provided in an X type to cross each other, and the polishing wheel 390 may be provided in a cup type.

Accordingly, when the substrate is transferred in the direction of the arrow in FIG. 14, the end region of the substrate is chamfered in the X-type chamfering wheel 380, and then a sharp portion (sharp burr) of the chamfered tip portion is provided. ) May be polished by a cup type polishing wheel 390.

In the present embodiment, the gap between the polishing wheel 390 and the chamfer is sufficient to remove the pointed portion after the chamfering.

In FIG. 14, except for the chamfering wheel 380 and the polishing wheel 390, the remaining parts are the actuators 381 and 391 that rotationally drive the chamfering wheel 380 and the polishing wheel 390.

Even when the chamfering wheel 380 and the polishing wheel 390 are disposed and used as shown in FIG. 14, the effects of the present invention can be achieved.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

1 is a view showing various forms of chamfering processing for a substrate.

2 is a side view of a chamfering machine according to a first embodiment of the present invention.

3 is a plan view of FIG. 2.

4 is a front view of FIG. 2.

5 is a perspective view of a chamfered portion and a polished portion;

6 is an exploded perspective view of FIG. 5.

7 to 11 are views showing step by step the operation of the chamfering machine according to the first embodiment of the present invention.

12 is a schematic perspective view of the stage.

13 is a layout view of a multi-wheel in the chamfering machine according to the second embodiment of the present invention.

14 is a layout view of a chamfering wheel and a polishing wheel in a chamfering machine according to a third embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

100: substrate loading unit 200: substrate unloading unit

300: chamfering processing unit 310: gantry part

320: chamfer processing part 330: polishing processing part

410,420 Transfer 500: Stage

Claims (14)

A substrate loading unit into which a substrate is loaded; A substrate unloading unit in which an end region of the substrate chamfered is unloaded; And A chamfering portion provided between the substrate loading unit and the substrate unloading unit to chamfer an end region of the substrate, and to chamfer the end region of the substrate in an oblique direction, and to be disposed adjacent to the chamfer processing portion, And a chamfering processing unit having a polishing processing portion for removing burrs by polishing a front end of the processed substrate. The method of claim 1, The chamfering processing unit further includes a gantry portion provided along a direction crossing the virtual line connecting the substrate loading unit and the substrate unloading unit. The chamfering machine and the polishing processing unit is chamfering, characterized in that each provided in a pair to be spaced apart from each other on the gantry portion. The method of claim 2, The chamfering processing unit, A vertical drive unit for a chamfer processing unit coupled to one side of the gantry unit and driving the pair of chamfer processing units in a vertical direction; Left and right drive unit for the chamfer processing unit for driving the pair of chamfer processing unit in the left and right direction on one side of the gantry unit coupled to the vertical drive unit for the chamfer processing unit; An up and down drive unit for a polishing processing unit coupled to the other side of the gantry and driving the pair of polishing processing units in a vertical direction; And And a left and right driving unit for a polishing processing unit for driving the pair of polishing processing units in the left and right direction on the other side of the gantry unit to which the upper and lower driving units for the polishing processing unit are coupled. The method of claim 3, The chamfer processing unit, A plurality of chamfering wheels for chamfering the substrate; A first wheel rotation driving unit which rotationally drives the chamfering wheel; A first driving part casing coupled to an outer side of the first wheel rotation driving part and connected to a vertical driving part for the chamfer processing part and a left and right driving part for the chamfer processing part; And And a first wheel casing coupled to an outer side of the chamfering wheel to form an exterior of the chamfering wheel, wherein a first substrate entrance to which the substrate enters and exits is formed on one side. The method of claim 4, wherein The polishing processing unit, A plurality of polishing wheels for polishing the substrate; A second wheel rotation driving unit which rotationally drives the polishing wheel; A second driving part casing coupled to an outer side of the second wheel rotation driving part and connected to a vertical driving part for the polishing processing part and a left and right driving part for the polishing processing part; And And a second wheel casing coupled to an outer side of the polishing wheel to form an exterior of the polishing wheel, and having a second substrate entrance through which the substrate enters and exits on one side thereof. The method of claim 5, The second wheel casing is provided in a pair separated from each other, Chamfering device, characterized in that the second wheel casing is provided with a locking portion for preventing disassembly during the assembly of the divided pair. The method of claim 5, The chamfering wheel is made of diamond, the polishing wheel is chamfering, characterized in that made of a soft material of lower hardness than the chamfering wheel. The method of claim 1, The chamfering processing unit, the chamfering apparatus further comprises an alignment camera for photographing the substrate entering the chamfering processing unit. The method of claim 1, At least one stage on which the substrate is seated and supported but movable or rotatable on an imaginary line connecting the substrate loading unit and the substrate unloading unit; A first transfer provided between the substrate loading unit and the chamfering processing unit; And Chamfering apparatus further comprises a second transfer provided between the chamfering processing unit and the substrate unloading unit. The method of claim 1, The substrate is a chamfering device, characterized in that the substrate for a flat display or a substrate for thin-film solar cells (thin-film solar cells). A substrate loading unit into which a substrate is loaded; A substrate unloading unit in which an end region of the substrate chamfered is unloaded; And A chamfering processing unit provided between the substrate loading unit and the substrate unloading unit, the chamfering processing unit having a plurality of chamfering wheels for chamfering the end region of the substrate; The chamfering wheel is a multi wheel for chamfering an end region of the substrate in an oblique direction and polishing a front end of the chamfered substrate to remove burrs. Chamfering machine. The method of claim 11, The multi-wheel includes a plurality of unit wheels having a disk shape and spaced apart from each other, At least one of the plurality of unit wheels is the chamfering wheel, and the other is the polishing wheel. The method of claim 12, And the chamfering wheel is made of diamond, and the polishing wheel is made of a soft material having a lower hardness than the chamfering wheel. A substrate loading unit into which a substrate is loaded; A substrate unloading unit in which an end region of the substrate chamfered is unloaded; And A plurality of chamfering wheels are provided between the substrate loading unit and the substrate unloading unit to chamfer the end region of the substrate, and chamfer the end region of the substrate in an oblique direction, and the front end portion of the chamfered substrate is polished. It comprises a chamfering processing unit having a plurality of polishing wheels to remove the burrs by polishing (polishing), And the plurality of chamfering wheels are provided in an X shape to cross each other, and the plurality of polishing wheels are provided in a cup type.

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