KR100939682B1 - Grinding apparatus for glass - Google Patents

Abstract

Chamfering device for flat panel display is disclosed. Chamfering device for a flat panel display of the present invention, the substrate loading unit (loading unit) is loaded substrate; A chamfering processing unit for chamfering the substrate transferred from the substrate loading unit; And a transfer provided in the area between the substrate loading unit and the chamfering processing unit to transfer the substrate, wherein the transfer includes: a plurality of basic gripping units provided to be spaced apart from each other and accessible to hold the substrate on both sides of the substrate; And at least one safety gripping unit gripping the substrate in a direction crossing the mutual separation and approaching directions of the basic gripping units to prevent the substrate from falling and falling from the basic gripping unit during transfer or stop of the substrate. do. According to the present invention, the substrate can be held more stably while having a simple and simple structure, and in particular, the substrate can be prevented from falling during the transfer or stop of the substrate.

Description

Chamfering machine for flat panel display {GRINDING APPARATUS FOR GLASS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chamfering device for flat panel displays, and more particularly, to have a simple and simple structure and to hold the substrate more stably, and in particular, to prevent the substrate from falling during the transfer or stop of the substrate. It relates to a chamfering machine for flat panel displays.

Recently, the flat panel display (FPD) has begun to emerge as the electronic display industry is rapidly developing among the semiconductor industry.

A flat panel display (FPD) is an image display device that is thinner and lighter than a cathode ray tube (CRT), which has been mainly used as a display for a TV or a computer monitor, and includes a liquid crystal display (LCD, liquid). crystal displays, plasma display panels (PDPs), organic light emitting diodes (OLEDs), and the like.

Hereinafter, a panel of a flat panel display (FPD) including an LCD, a PDP and an OLED will be described as a substrate.

The substrate is usually rectangular in shape and made of glass. Thus, corner cuts on the four corners (edges) of the substrate, and edge and edge cuts on the short and long edges of the substrate, i.e. the corners of the substrate and Only the chamfering type of chamfering process on the sides removes the sharpness of the glass itself, making it easier to transfer and manipulate between processes and preventing safety accidents. The chamfering machine is used for this chamfering process.

In the conventional chamfering machine, there is an example in which all four corners, short edges, and long sides of the substrate are processed through one chamfering wheel. However, when machining all four corners, short edges and long edges by using one chamfering wheel as described above, there was a problem in that it takes a lot of tact time because continuous operation cannot be performed.

Thus, the present applicant can reduce the tact time compared to the conventional when chamfering the substrate by providing a plurality of stages arranged in the transverse direction of the work line to solve the conventional problems, further improve the productivity In the case of the chamfering machine in which a plurality of stages are arranged along the work line, if a failure occurs in any one of the plurality of stages, a problem may arise that the entire equipment cannot be operated. It has applied for a technology for chamfering machine.

Such a chamfering machine is provided with transfer as a means for conveying a board | substrate. The transfer has a structure in which the substrate is transferred to a post process while the substrate is held on both sides.

By the way, in the conventional chamfering machine, since there is no support structure in the board | substrate conveyance direction in a transfer, there exists a problem that a board | substrate may fall in a board | substrate conveyance direction in a board | substrate conveyance process. In particular, if the transfer speed is increased to reduce the tact time or if the substrate becomes heavier as the substrate becomes larger, there is a high risk that the substrate will jump forward during the transfer and stop of the transfer. Action is needed.

SUMMARY OF THE INVENTION An object of the present invention is to provide a flat display chamfering device which can hold a substrate more stably while having a simple and simple structure, and in particular, can prevent the substrate from falling during the transfer or stop of the substrate.

The object is, according to the present invention, a substrate loading unit (loading unit) is loaded substrate; A chamfering processing unit for chamfering the substrate transferred from the substrate loading unit; And transfers provided in an area between the substrate loading unit and the chamfering processing unit to transfer the substrates, wherein the transfers are provided to be spaced apart from each other and accessible to hold the substrates on both sides of the substrate. ; And at least one safety gripping unit that grips the substrate in a direction crossing the mutual separation and approaching directions of the basic gripping units to prevent the substrate from falling and falling from the basic gripping unit during transfer or stop of the substrate. It is achieved by a chamfering device for a flat panel display comprising a.

Here, the transfer may further include a head portion to which the plurality of basic gripping units and the at least one safety gripping unit are coupled, and the plurality of basic gripping units may be provided at both side regions of the head portion. One safety gripping unit may be provided in the front area of the head portion facing the chamfering processing unit.

The plurality of basic gripping units may be provided two by two in both side regions of the head portion, and the at least one safety gripping unit may be provided.

The transfer may include a pair of connecting portions connecting the two basic gripping units, respectively; A pair of guide parts provided in the head part to guide the movement of the pair of connecting parts; And a driving unit for driving the pair of connecting portions such that the pair of connecting portions are guided by the pair of guide portions and are accessed and spaced apart from each other.

The transfer, the fixed rod is connected to the head portion; And a rotation support part rotatably supporting the safety gripping unit with respect to the fixed rod.

The plurality of basic gripping units and the at least one safety gripping unit may have a 'b' shape so as to partially support the bottom surface of the substrate while being in contact with the side surface of the substrate.

The plurality of basic gripping units and the at least one safety gripping unit may be made of MD-PA material to prevent scratches on the substrate.

The apparatus may further include a substrate unloading unit provided on an opposite side of the loading unit with the chamfering processing unit therebetween to unload the substrate.

The transfer unit may include an X-axis driving unit configured to drive the plurality of basic holding units and the at least one safety holding unit along a virtual X axis connecting the substrate loading unit and the substrate unloading unit; A Y-axis driving unit driving the plurality of basic gripping units and the at least one safety gripping unit along a Y-axis crossing the X-axis; And a Z-axis driving unit configured to drive the plurality of basic gripping units and the at least one safety gripping unit along a Z axis in a vertical direction.

The transfer may be provided in an area between the chamfering processing unit and the substrate unloading unit.

It may further include a chamfering measurement unit provided in the substrate unloading unit for measuring the chamfering amount for the substrate chamfering is completed.

According to the present invention, the substrate can be held more stably while having a simple and simple structure, and in particular, the substrate can be prevented from falling during the transfer or stop of the substrate.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

1 is a perspective view of a substrate for explaining a portion to be chamfered.

Prior to the description with reference to the drawings, the substrate to be described below means a TFT-LCD (Thin Film Transistor-Liquid Crystal Display) substrate, but since the scope of the present invention is not limited to the plasma display substrate (PDP, Plasma) It can also be applied to flat panel displays (FPDs) such as display panels, organic light emitting diodes (EL), and solar cells. However, hereinafter, the TFT-LCD substrate will be described as an example for convenience of description.

For reference, the TFT-LCD substrate G1 is made of two layers in which a top plate and a bottom plate are bonded together with a liquid crystal interposed therebetween, and a section in which the top plate does not overlap is usually present on the top surface of the bottom plate. However, in FIG. 1, for convenience of illustration and description, the TFT-LCD substrate G1 is schematically illustrated in a substantially rectangular plate shape.

Referring to this figure, through the chamfering of the present embodiment, the substrate G1 has four corners, namely, both front corners (see enlarged A) and rear both corners (see enlarged B), and both short side edges (see enlarged C). And both long side edges (see enlarged D) are chamfered.

As will be described later in detail, the chamfering method in the present embodiment, the short side edge processing of the substrate G1, the front side corner processing of the front surface of the substrate G1, the both sides corner processing of the back surface of the substrate G1, and the long side edge of the substrate G1 Follow the processing sequence. However, since the scope of the present invention is not limited thereto, the order of chamfering may be sufficiently changed according to the manufacturing process of the manufacturer as long as it can reduce the tact time.

FIG. 2 is a schematic plan view of a chamfering device for a flat display according to an embodiment of the present invention, FIGS. 3 and 4 are partially enlarged perspective views of FIG. 2, and FIG. 5 is a view of the transfer shown in FIGS. 6 is a perspective view partially illustrating an operation of the transfer of FIG. 5, and FIGS. 7A to 7F are sectional views illustrating a chamfering processing method using a chamfer for a flat panel display in stages. .

3 to 5, the planar display chamfering device according to an embodiment of the present invention includes a substrate loading unit 210 on which a substrate G1 of a chamfering processing object is loaded. , The chamfering processing unit 220 in which the chamfering processing is performed on the substrate G1, the substrate unloading unit 240 in which the chamfering processing is completed, and the substrate G2 is unloaded, and the substrate loading unit 210. And transfers 400a and 400b provided between the chamfering processing unit 220 and the area between the chamfering processing unit 220 and the substrate unloading unit 240 to transfer the substrates G1 and G2.

Since both the substrate loading unit 210 and the substrate unloading unit 240 serve to transfer the substrates G1 and G2, the substrate loading unit 210 and the substrate unloading unit 240 may be applied as a roller type. That is, the substrate loading unit 210 and the substrate unloading unit 240 may have a structure in which a plurality of rollers 212 and 242 rotatably supporting the substrates G1 and G2 are respectively coupled to the plurality of rotation shafts 211 and 241. Can be.

However, since the scope of the present invention is not limited thereto, the substrate loading unit 210 and the substrate unloading unit 240 may be replaced with a conventional conveyor type or stage type. . As such, when the substrate loading unit 210 and the substrate unloading unit 240 are applied as a conveyor type or a stage type, an air floating module (not shown) for applying up the substrates G1 and G2 is applied together. Would be advantageous.

The plurality of rollers 212 and 242 is preferably made of a flexible material so that scratches do not occur on the substrates G1 and G2. The plurality of rotating shafts 211 and 241 may be rotated together by a single motor to facilitate the control of the rotational speed. However, the plurality of rotating shafts 211 and 241 each rotate by the individual motor separately. You can also

The substrate loading unit 210 is provided with an alignment unit 215 for performing an alignment operation on the substrate G1 to be entered. The alignment unit 215 serves to align the substrate G1 correctly by pressing both sides of the substrate G1 by an operation of approaching and separating each other.

Unlike the substrate unloading unit 240, the substrate loading unit 210 further includes a plurality of entrance detection sensors 214 along the direction in which the substrate G1 enters. The plurality of entrance detection sensors 214 generates a detection signal for reducing or stopping the speed of the rotation shaft 211 based on the entry position of the substrate G1.

The substrate unloading unit 240 is further provided with a chamfering measurement unit 250. Chamfering measurement unit 250 serves to measure the chamfering for the substrate (G2) is completed chamfering processing through the chamfering processing unit 220.

With respect to the substrate G2 whose chamfering amount is measured by the chamfering measuring unit 250, if the chamfering is incorrect or if the chamfering amount is less than the reference value, the substrate is destroyed or The chamfering amount is fed back toward the chamfering wheels 225 and 227 so that the machining may proceed. In the present exemplary embodiment, the chamfering measurement unit 250 is provided in the substrate unloading unit 240, but in some cases, the chamfering measurement unit 250 may be provided in the chamfering processing unit 220.

In the substrate loading unit 210 and the substrate unloading unit 240, a plurality of lift pins 213 and 243 for raising a predetermined height up the substrates G1 and G2 with respect to the plurality of rollers 212 and 242 are provided with a plurality of rollers ( It is further provided between 212 and 242. The lift pins 213 and 243 are operated in conjunction with the operations of the transfers 400a and 400b that are responsible for the transfer of the substrates G1 and G2. That is, the lift pins 213 and 243 are transfers 400a and 400b from the substrate loading unit 210 to the chamfering processing unit 220 or from the chamfering processing unit 220 to the substrate unloading unit 240. When the G2) is transferred, the operation is up.

The chamfering processing unit 220 is a portion which performs chamfering processing on substantially four corners of the substrate G1, the short side edges of the substrate G1, and the long side edges of the substrate G1 provided from the substrate loading unit 210. (See FIG. 2).

As described above, in the present embodiment, both side short edge edge processing of the substrate G1, both sides corner processing of the front surface of the substrate G1, both sides corner processing of the rear surface of the substrate G1, and both side long edges of the substrate G1. Since the chamfering process proceeds in the order of processing will be described based on the order thereof.

As described above, in the chamfering processing method, there is a situation in which the corner processing is switched from edge processing to vice versa, or vice versa. In this case, the chamfering wheel (not shown) must be aligned as in the prior art. If the board | substrate G1 does not continue to chamfer continuously and needs to wait for a while, the tact time will inevitably increase by that much. Thus, in the present embodiment, even though a short time, the chamfering processing is not continuously progressed, and by fundamentally blocking the time loss generation that the substrate G1 has to wait, the tact time can be further reduced and the productivity can be improved. I'm doing it.

To this end, the chamfering processing unit 220 of the present embodiment, the first and second stages 260a and 260b on which the substrate G1 is seated and supported on the upper surface, and the first and second spaced apart along the X axis. And a grinder 221 having second chamfering wheels 225 and 227.

In the present embodiment, two first and second stages 260a and 260b are provided along the Y axis. Since the first and second stages 260a and 260b respectively proceed in the chamfering operation in parallel, the tact time can be reduced, thereby improving productivity.

However, since the scope of the present invention is not limited thereto, only one stay may be provided, or three or more stages may be provided. However, when three or more stages are provided, it is sufficient if they have a parallel arrangement along the Y axis.

The first and second stages 260a and 260b differ only in their positions, and both have the same structure and operation. Accordingly, for the convenience of illustration and description, the same reference numerals are given to detailed configurations of the first and second stages 260a and 260b.

Briefly referring to the first and second stages 260a and 260b, the first and second stages 260a and 260b of the present exemplary embodiment may have a structure that may be mixedly applied to substrates of various sizes.

That is, each of the first and second stages 260a and 260b is disposed at an outer side of the turntable 261 and one turntable 261 for attracting and rotating the substrate G1 and the substrate together with the turntable 261. Four variable tables 263 are provided to adsorb and support G1 and to be accessible and spaced apart from the turntable 261 so as to correspond to all substrates of various sizes.

With respect to the turntable 261 having an upper surface having a substantially circular shape and having one in the center, four variable tables 263 are provided symmetrically with each other on the outside of the turntable 261. However, since the scope of the present invention is not limited thereto, the top surface shape of the turntable 261 may be an elliptic shape or a polygonal shape in addition to the circular shape, and the variable table 263 may be mutually formed at the outside of the turntable 261. Two may be provided symmetrically.

If the substrate size of the chamfering target is large, four variable tables 263 should be spaced apart from the turntable 261 so that the entire adsorption area of the turntable 261 and the variable table 263 can be widened. If the substrate size to be processed is small, four variable tables 263 should be approached to the turntable 261. At this time, when the four variable tables 263 are approached with respect to the turntable 261, the sides of the four variable tables 263 should not be collided with the turntable 261, so the sides of the variable tables 263 are cut out. The part 264 is formed. The cutout 264 may have an arc shape, but is not necessarily so.

In addition, a plurality of vacuum holes (not shown) are formed on the surfaces of the turntable 261 and the variable table 263 for vacuum suction of the substrate G1. The vacuum hole is a vacuum suction line groove (not shown) that doubles the vacuum suction area of the substrate G1 by forming a line having a predetermined shape in a state of being recessed downward from the surfaces of the turntable 261 and the variable table 263. It is formed one by one. In this embodiment, the vacuum adsorption line groove (not shown) formed in the turntable 261 is, for example, a pizza (pizza) shape, and the vacuum adsorption line groove (not shown) formed in the variable table 263 has a Korean letter 'A' shape. It may be formed, but the scope of the present invention is not limited thereto.

On the other hand, the grinder 221 is a part which performs substantial chamfering process with respect to the board | substrate G1 adsorbed and supported by the 1st and 2nd stage 260a, 260b.

In the present embodiment, since two first and second stages 260a and 260b are provided along the Y axis, the grinder 221 is applied as a shared grinder to simplify the equipment. As the grinder 221 is applied as a shared grinder, the two alignment cameras 223, the first chamfering wheel 225, and the second chamfering wheel 227 provided in the grinder 221 are first and second. While selectively moving toward the stages 260a and 260b, the chamfering operation of the substrate G1 is performed along with the first and second stages 260a and 260b.

However, since the scope of the present invention is not limited thereto, the grinder 221 does not necessarily need to be a shared grinder. That is, the two alignment cameras 223, the first chamfering wheel 225, and the second chamfer corresponding to the first and second stages 260a and 260b for each of the first and second stages 260a and 260b, respectively. The processing wheel 227 may be configured to be dedicated.

The grinder 221 includes an alignment camera 223 for aligning the substrate G1 seated on the first and second stages 260a and 260b, and a first and second stage 260a, The first and second chamfering wheels 225 and 227 are disposed to be chamfered with respect to the substrate G1 seated on the 260b, and are spaced apart from each other along the X axis.

Two alignment cameras 223 are provided to photograph two alignment marks formed on one side of the substrate G1. That is, alignment of the substrate G1 is possible only by photographing at least two alignment marks, and intervals of the first chamfering wheel 225 and the second chamfering wheel 227 may be determined based on the alignment work on the substrate G1. In this embodiment, two alignment cameras 223 are provided.

The first chamfering wheel 225 performs chamfering on both side short edges of the substrate G1 and the rear corner processing of the substrate G1, and the second chamfering wheel 227 has a front corner of the substrate G1. Since the process and the chamfering process with respect to the long side edge of both sides of the board | substrate G1 advance, it is provided two by one.

Looking at the structure of the first and second chamfering wheels (225, 227), as shown in Figure 5, the first and second chamfering wheels (225,227) are arranged so that one region of the outer peripheral surface overlap each other along the Z axis With a plurality of first to fourth multi-wheels 225a to 225d, 227a to 227d, multi wheels for processing all four corners of the substrate G1, the short side edge of the substrate G1, and the long side edge of the substrate G1. Apply. In other words, the first chamfering wheel 225 is formed by a combination of four first to fourth multi wheels 225a to 225d, and the second chamfering wheel 227 is four first to fourth multi wheels. It is provided by the combination of the wheels 227a to 227d. The first and second chamfering wheels 225 and 227 are rotatably coupled by the wheel rotating housings 231 and 232, respectively. The wheel rotating housings 231 and 232 serve to rotate the first and second chamfering wheels 225 and 227 using a motor, etc. in addition to supporting the first and second chamfering wheels 225 and 227.

In this configuration, the chamfering of the short side edge of the substrate G1 is performed by the first and third multi wheels 225a and 225c of the first chamfering wheel 225 and the second and fourth multi wheels 225b and 225d. ), And the rear corner processing of the substrate G1 is performed in the inclined surface regions of the third and fourth multi-wheels 225c and 225d of the first chamfering wheel 225. And the front corner processing of the board | substrate G1 progresses in the inclined surface area | region of the 3rd and 4th multi-wheels 227c and 227d of the 2nd chamfering wheel 227, and chamfers with respect to the long side edge of the board | substrate G1. Is performed in the region between the first and third multi wheels 227a and 227c of the second chamfering wheel 227 and the second and fourth multi wheels 227b and 227d.

On the other hand, since the grinder 221 of the present embodiment is a shared grinder, the alignment camera 223, the first chamfering wheel 225, and the second chamfering wheel 227 are together with the first stage 260a and the first stage. The chamfering work with respect to the board | substrate on 260a should also be progressed, and the chamfering work with respect to the board | substrate on the 2nd stage 260b must also progress with the 2nd stage 260b.

Accordingly, the alignment camera 223, the first chamfering wheel 225, and the second chamfering wheel 227 should be movable along the Y axis. To this end, a camera movement support 224, a first wheel movement support 226, and a second wheel movement support 228 are provided.

The camera movement supporter 224 supports the two alignment cameras 223 to be movable so that the two alignment cameras 223 can move individually or collectively along the Y axis, and the first wheel movement supporter 226 Two first chamfering wheels 225 are movably supported so that the two first chamfering wheels 225 can be moved individually or collectively along the Y axis, and the second wheel moving support 228 is made of two The two second chamfering wheels 227 are movably supported so that the two chamfering wheels 227 can move individually or collectively along the Y axis.

In this embodiment, the camera movement support 224, the first wheel movement support 226 and the second wheel movement support 228 may be implemented as a linear motor, but is not necessarily so. In addition, although the camera movement support 224, the first wheel movement support 226, and the second wheel movement support 228 are shown separately in the drawings, they may be interconnected in one body.

The two alignment cameras 223 are sufficient if they are moved to the Y axis by the camera moving support 224. However, the first and second chamfering wheels 225 and 227 are not only moved in the Y axis by the first and second wheel moving supports 226 and 228, but also four corners of the substrate G1 and short and long edges. In order to move up and down on the Z axis, it must be possible.

To this end, the grinder 221 of the present embodiment is coupled to the first wheel moving support 226, the first wheel elevating unit 226a for raising and lowering the two first chamfering wheels 225 on the Z axis, and A second wheel elevating portion 228a is further provided to be coupled to the two wheel moving support 228 to elevate the two second chamfering wheels 227 to the Z axis. The first wheel lifting unit 226a and the second wheel lifting unit 228a may be applied as a cylinder, but this may also be applied by a linear motor or a motor and ball screw combination.

On the other hand, in the present embodiment, when the four corner processing of the substrate G1, the short side edge processing of the substrate G1 and the long side edge processing of the substrate G1 through the chamfering processing unit 220, the substrate G1 The control unit further controls the operation of the grinder 221 so that the four corners of), the short edge of the substrate G1 and the long edge of the substrate G1 can proceed continuously without waiting time. This series of control operations will be described together with the chamfering processing method below.

On the other hand, the transfer 400a, 400b is provided in the region between the substrate loading unit 210 and the chamfering processing unit 220, and the region between the chamfering processing unit 220 and the substrate unloading unit 240, the substrate loading unit 210 Transfer the processed substrate G1 on the first and second stages 260a and 260b to the substrate unloading unit 240 on the first and second stages 260a and 260b. It plays a role.

In this embodiment, the structure of the transfer (400a, 400b) provided in the region between the substrate loading unit 210 and the chamfering processing unit 220, and the region between the chamfering processing unit 220 and the substrate unloading unit 240 and The operations are all the same. Thus, for the convenience of illustration and description, the same reference numerals are given to the detailed configuration of the transfer (400a, 400b).

Mainly referring to FIGS. 5 and 6, the transfers 400a and 400b include a plurality of basic holding units 410 for holding the substrates G1 and G2 at both sides of the substrates G1 and G2, and a plurality of basic holding units. The safety gripping unit 430 is provided at a position different from the holding unit 410 to prevent the substrates G1 and G2 from falling and falling from the basic holding unit 410 during transfer or stop of the substrates G1 and G2. Equipped.

As shown, the basic holding unit 410 and the safety holding unit 430 is coupled to the head portion 440. Therefore, when the head unit 440 is moved to a desired position by the X-axis driver 461, the Y-axis driver 462, and the Z-axis driver 463, which will be described later, the basic grip unit 410 and the safety grip unit ( 430 may also be moved to the location.

In the present embodiment, the plurality of basic gripping units 410 are provided in two, two on each side (short side) of the head portion 440, and the safety gripping unit 430 is a chamfering processing unit 220 or a substrate unloading unit. One is provided in the front (long side) area | region of the head part 440 toward 240.

However, since the scope of the present invention does not need to be limited thereto, one basic gripping unit 410 is provided at each side surface area of the head part 440 or three at each side surface area of the head part 440, or The basic gripping unit 410 may be provided for each of the above numbers. In the case of the safety gripping unit 430, two or more may be provided in the front (long side) area of the head part 440, and provided in both the front (long side) area and the rear (long side) area of the head part 440. May be If the number of safety gripping unit 430 increases, there is an effect that can prevent sagging of a large substrate can be appropriately selected as an efficient structure.

Looking at the four basic gripping unit 410, four basic gripping unit 410 is provided in each of the two short-side region of the head portion 440 in this embodiment. At this time, the two basic holding units 410 are connected by a pair of connecting portions 411a and 411b, respectively.

The pair of connecting portions 411a and 411b are formed on the side of the head portion 440 so as to be movably coupled to the pair of guide portions 412a and 412b for guiding the movement of the pair of connecting portions 411a and 411b. It is. In the present embodiment, the guides 412a and 412b are paired, but the guides 412a and 412b may be integrally penetrated without being separated as illustrated.

In the transfer 400a and 400b, a pair of connecting portions 411a and 411b are guided by a pair of guide portions 412a and 412b according to a predetermined control signal, and a pair of connecting portions 412a and 412b are approached and spaced apart from each other. A driving unit 413 for driving) is further provided. Although not shown in detail with respect to the driving unit 413, the driving unit 413 is rotated in the forward and reverse directions by the motor and the motor, but the ball screw shaft is connected to the pair of connecting portions (411a, 411b) with threads in different directions. It can be implemented as.

Thus, when power is applied to the motor of the driving unit 413 and the ball screw shaft rotates in the forward direction, for example, the two basic gripping units 410 are connected by a pair of connecting parts 411a and 411b as shown in the dotted line of FIG. 6. When the ball screw shaft rotates in the reverse direction, the two basic gripping units 410 may be spaced apart from each other by a pair of connecting portions 411a and 411b. As such four basic gripping unit 410 is approached and spaced apart from each other there is an advantage that can be applied to the substrate of various sizes.

Looking at the structure of one safety gripping unit 430, the fixing rod 431 and the rotation support portion 433 is provided for mounting the safety gripping unit 430.

The fixed rod 431 is a configuration like a so-called bracket that is fixed to the head 440, the fixed rod 431 is a vertical rod 431a, and at the end of the vertical rod 431a to the vertical rod 431a It has a horizontal rod (431b) formed horizontally.

The rotation support part 433 supports the safety gripping unit 430 at the end of the horizontal rod 431b, and the rotation support part 433 rotatably supports the safety gripping unit 430 with respect to the horizontal rod 431b. The rotation operation of the rotation support unit 433 is operated in conjunction with the basic gripping unit 410 when the control signal is operated. That is, when the basic gripping units 410 are operated as shown in the dotted line of FIG. 6 to substantially support portions of both sides and the lower surface of the substrates G1 and G2, the rotation supporting unit 433 rotates as shown in the dotted line of FIG. 6. On the basis of this, the safety gripping unit 430 supports the front and lower portions of the substrates G1 and G2 to prevent the substrates G1 and G2 from dropping during the transfer or stop of the substrates G1 and G2.

As described above, the basic gripping units 410 and the safety gripping unit 430, which are provided to simply hold or stably hold the substrates G1 and G2, are both disposed at the corresponding positions of the substrates G1 and G2. The bottom surface of the substrate (G1, G2) in the state in contact with the side of the 'b' shape so that it can be supported by holding. However, the scope of the present invention is not limited to the shape thereof.

In addition, since the basic gripping units 410 and the safety gripping unit 430 both hold the substrates G1 and G2 while being in contact with the substrates G1 and G2, the substrates G1 and G2 are in contact with the substrates G1 and G2. There is a fear that scratches occur in G1 and G2).

Thus, in the present embodiment, both the basic gripping units 410 and the safety gripping unit 430 are made of MD-PA material to prevent scratches on the substrates G1 and G2. However, even if the MD-PA material does not damage the substrates (G1, G2) and the basic gripping unit 410 and the safety gripping unit 430 may be made of a different material as long as it can hold a certain rigidity. will be.

On the other hand, as described above, in order to hold all the substrates of various sizes, in particular the basic holding unit 410 is provided to be accessible and spaced apart from each other, in addition to the transfer (400a, 400b) itself is a substrate loading unit To transfer the substrate G1 on 210 to the first and second stages 260a and 260b and the substrate G2 on the first and second stages 260a and 260b to the substrate unloading unit 240. It is provided so that a movement to an X axis, a Y axis, and a Z axis is possible.

To this end, the transfer 400a, 400b of the present embodiment is coupled to the basic holding unit 410 and the safety holding unit 430 along the virtual X axis connecting the substrate loading unit 210 and the substrate unloading unit 240 The X-axis driver 461 for driving the head 440, the Y-axis driver 462 for driving the head 440 along the Y-axis crossing the X-axis, and the head 440 in the vertical direction. It further includes a Z-axis drive unit 463 for driving along the Z-axis.

The X-axis driver 461, the Y-axis driver 462, and the Z-axis driver 463 may be implemented by a linear motor that facilitates linear movement control. However, in some cases, a cylinder, a motor, or a ball screw combination may be used. It may be implemented by.

A series of methods for chamfering the substrate G1 using a chamfer having such a configuration will be described with reference to FIGS. 6 and 7.

First, the substrate G1 to be chamfered is transferred through the roller 212 on the substrate loading unit 210. The substrate G1 transferred by the rotation of the roller 212 is stopped at the working position as the operation of the rotation shaft 211 is stopped based on the signal of the entry sensor 214. Subsequently, after the alignment unit 215 presses both sides of the substrate G1 to align the substrate G1, the lift pins 213 up the substrate G1.

When the substrate G1 is up, the transfer 400a is moved along the X, Y, and Z axes by the X-axis driver 461, the Y-axis driver 462, and the Z-axis driver 463. The substrate G1 is gripped by the units 410 and the safety gripping unit 430. That is, as shown in FIG. 6, the basic gripping units 410 are operated to support portions of both sides and lower surfaces of the substrates G1 and G2, and then the safety gripping unit 430 operates according to the driving of the rotation support part 433. Thus, part of the front and bottom surfaces of the substrates G1 and G2 are supported. After the substrate G1 is gripped by the basic gripping units 410 and the safety gripping unit 430, the X-axis by the X-axis driver 461, the Y-axis driver 462, and the Z-axis driver 463. The transfer 400a moves along the Y axis and the Z axis to place the held substrate G1 on the upper surface of the first stage 260a, and then releases the operations of the basic gripping units 410 and the safety gripping unit 430. The substrate G1 is loaded onto the top surface of the first stage 260a.

The substrate G1 raised to the upper surface of the first stage 260a may be provided with a vacuum suction force through a vacuum hole formed in the surfaces of the turntable 261 and the variable table 263 constituting the first stage 260a. 261 and the variable table 263 are supported by suction.

After the substrate G1 is adsorbed and supported on the upper surface of the first stage 260a, the first stage 260a moves in the X-axis direction. The alignment operation is performed on the substrate moved in the X-axis direction while the alignment mark is captured by the alignment camera 223 as shown in FIG. 7A. While the alignment operation is in progress, the first chamfering wheel 225 moves in advance to a work position for processing both side short edges of the substrate G1 and waits. In this case, the second chamfering wheel 227 is considered to be chamfering to another substrate on the second stage 260b side, and the dotted line is processed in FIG.

When the alignment operation is completed, as shown in FIG. 7B, the first stage 260a advances the substrate G1 toward the first chamfering wheel 225. At this time, since the first chamfering wheel 225 is moved to the working position for both short side edge processing of the substrate G1 in advance and is waiting, the substrate G1 is not stopped by the first stage 260a. Continue to advance through the area between the first and third multi-wheels 225a and 225c and the second and fourth multi-wheels 225b and 225d to form the first chamfering wheel 225, thereby providing a substrate G1. Chamfering processing for both short side edges of is completed.

As described above, while the chamfering processing of both short side edges of the substrate G1 is performed by the first chamfering wheel 225, the second chamfering wheel 227 moves on the movement path of the first stage 260a. In this case, the second chamfering wheel 227 is moved in advance to the working position for the front side corner processing of the substrate G1 to stand by.

Therefore, the substrate G1 on which both short-side edge machining has been completed past the first chamfering wheel 225 is continuously stopped by the first stage 260a without stopping and waits in advance in the working position as shown in FIG. 7C. The chamfering process advances with respect to the both front corners by contacting the 3rd and 4th multi-wheels 227c and 227d of the 2nd chamfering wheel 227 currently performed.

As described above, while the chamfering process is performed on both front corners of the substrate G1, the first chamfering wheel 225 moves in advance to a work position for processing both corners of the rear surface of the substrate G1.

The board | substrate G1 with which chamfering process was completed with respect to the front both sides corners does not stop, but reverses by the 1st stage 260a, and the 1st chamfering wheel 225 previously waited at the working position as shown in FIG.7 (d). By contacting the third and fourth multi-wheels 225c and 225d, the chamfering process proceeds to both rear corners of the rear surface.

Next, to chamfer the long side edges of both sides of the substrate G1, the substrate G1 is rotated on the first stage 260a as shown in FIG. 7E. The rotation of the substrate G1 is performed by the turntable 261 forming the first stage 260a. In this case, it is assumed that the first chamfering wheel 225 is chamfering the other substrate on the second stage 260b side, and the dotted lines are processed in FIGS. 7E and 7F.

As described above, while the substrate G1 is rotated for chamfering on both long side edges, the second chamfering wheel 227 moves to a working position for both long side edges of the substrate G1 and waits in advance.

Subsequently, the substrate G1, which has been rotated, is immediately moved by the first stage 260a to form the second chamfering wheel 227 as shown in FIG. 7 (f). 227a, 227c and the area between the second and fourth multi-wheels 227b, 227d are passed, thereby completing the chamfering of the long side edges of both sides of the substrate G1.

The substrate G2 of which the chamfering process is completed is transferred to the substrate unloading unit 240 due to the operation of the transfer 400b provided in the region between the chamfering processing unit 220 and the substrate unloading unit 240 and is taken out. . At this time, since the transfer 400b transfers the substrate G2 while the substrate G2 is held by the basic holding units 410 and the safety holding unit 430, safe transfer is ensured.

As described above, according to the present embodiment, the substrates G1 and G2 can be held more stably while having a simple and simple structure, and in particular, it is possible to prevent the substrate from falling during the transfer or stop of the substrate.

In the above embodiment, the short side of the substrate is first processed and the long side is processed, but the long side may be processed first, and the substrate may be rotated to form the short side.

In the above-described embodiment, the first and second chamfering wheels are spaced apart from each other along a virtual work line connecting the substrate loading unit and the substrate unloading unit. The substrate unloading unit may be spaced apart from each other in a direction crossing the virtual work line.

In addition, in the above-described embodiment, two first and second chamfering wheels are provided, but only one chamfering wheel may be provided.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention. It will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

1 is a perspective view of a substrate for explaining a portion to be chamfered.

2 is a schematic plan view of a chamfering device for a flat panel display according to an embodiment of the present invention.

3 and 4 are partially enlarged perspective views of FIG. 2, respectively.

5 is an enlarged perspective view of the transfer illustrated in FIGS. 3 and 4.

6 is a perspective view partially showing the operation of the transfer of FIG. 5.

7 (a) to 7 (f) are block diagrams illustrating the chamfering processing method by the chamfering machine for flat display.

* Explanation of symbols for the main parts of the drawings

210: substrate loading unit 220: chamfering processing unit

221: Grinder 223: Align Camera

225: first chamfering wheel 227: second chamfering wheel

240: substrate unloading unit 250: chamfering measurement unit

260a, 260b: Stage 400a, 400b: Transfer

410: basic gripping unit 430: safety gripping unit

440: head portion 461: X axis drive portion

462: Y-axis driver 463: Z-axis driver

Claims (11)

A substrate loading unit into which a substrate is loaded; A chamfering processing unit for chamfering the substrate transferred from the substrate loading unit; And It is provided in the area between the substrate loading unit and the chamfering processing unit includes a transfer to transfer the substrate, The transfer, A plurality of basic gripping units provided to be spaced apart from each other and accessible to hold the substrate at both sides of the substrate; And At least one safety gripping unit for holding the substrate in a direction crossing the mutual separation and approach direction of the basic holding unit to prevent the substrate from falling and falling from the basic holding unit during the transfer or stop of the substrate Chamfering device for a flat panel display, characterized in that. The method of claim 1, The transfer further includes a head portion to which the plurality of basic gripping units and the at least one safety gripping unit are coupled. The plurality of basic gripping units are provided in both side regions of the head portion, And the at least one safety gripping unit is provided in the front region of the head portion facing the chamfering processing unit. The method of claim 2, The plurality of basic gripping units are provided in each of the two on both side surface areas of the head portion, the at least one safety gripping unit is flat surface display, characterized in that provided one. The method of claim 3, The transfer, A pair of connecting portions connecting the two basic gripping units, respectively; A pair of guide parts provided in the head part to guide the movement of the pair of connecting parts; And And a driving unit for driving the pair of connecting portions such that the pair of connecting portions are guided by the pair of guides and are mutually approached and spaced apart. The method of claim 3, The transfer, A fixed rod connected to the head; And Chamfering device for a flat display, characterized in that it further comprises a rotatable branch for supporting the safety holding unit rotatably with respect to the fixed rod. The method of claim 1, The plurality of basic gripping units and the at least one safety gripping unit may have a planar shape having a 'b' shape so as to partially support the bottom surface of the substrate while being in contact with the side surface of the substrate. Chamfer for display. The method of claim 1, And said at least one safety gripping unit and said at least one safety gripping unit can be fabricated from MD-PA material to prevent scratches on said substrate. The method of claim 1, And a substrate unloading unit provided on an opposite side of the loading unit with the chamfering processing unit therebetween, the substrate unloading unit being unloaded. The method of claim 8, The transfer, An X-axis driving unit driving the plurality of basic gripping units and the at least one safety gripping unit along a virtual X axis connecting the substrate loading unit and the substrate unloading unit; A Y-axis driving unit driving the plurality of basic gripping units and the at least one safety gripping unit along a Y-axis crossing the X-axis; And And a Z-axis driving unit for driving the plurality of basic gripping units and the at least one safety gripping unit along a Z axis in an up and down direction. The method of claim 8, And said transfer is provided in a region between said chamfering processing unit and said substrate unloading unit. The method of claim 8, Chamfering flat surface display unit further comprises a chamfering measurement unit for measuring the chamfering amount of the substrate provided in the substrate unloading unit is completed chamfering.

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