KR101016400B1 - Grinding apparatus for glass - Google Patents

Abstract

Chamfering device for flat panel display is disclosed. Chamfering device for a flat panel display of the present invention, the substrate loading unit (loading unit) is loaded substrate; And a chamfering processing unit having at least one stage on which the substrate is seated and supported by an upper surface, and a grinder for performing chamfering of the substrate, wherein the at least one stage comprises: at least one turntable for sucking and rotating the substrate; And a plurality of variable tables disposed at an outer side of the turntable so as to be accessible and spaced from the turntable, and adsorb and support the substrate together with the turntable at a position relative to the turntable predetermined according to the size of the substrate. It is done. According to the present invention, it can be mixed and applied to a substrate of various sizes while having a simple and simple structure can improve the productivity.

Description

Chamfering machine for flat panel display {GRINDING APPARATUS FOR GLASS}

The present invention relates to a flat display chamfering device, and more particularly, to a flat display chamfering device that can be used in a variety of sizes while having a simple and simple structure can improve the productivity.

Recently, the flat panel display (FPD) has begun to emerge as the electronic display industry is rapidly developing among the semiconductor industry.

A flat panel display (FPD) is an image display device that is thinner and lighter than a cathode ray tube (CRT), which has been mainly used as a display for a TV or a computer monitor, and includes a liquid crystal display (LCD, liquid). crystal displays, plasma display panels (PDPs), organic light emitting diodes (OLEDs), and the like.

Hereinafter, a panel of a flat panel display (FPD) including an LCD, a PDP and an OLED will be described as a substrate.

The substrate is usually rectangular in shape and made of glass. Therefore, the corner cut of four corners (edges) of the substrate, and the edge cut and edge cut of the short and long edges of the substrate, that is, the corner and Only the chamfering type of chamfering on the sides prevents the sharpness of the glass itself, making it easier to transfer and manipulate between processes, and preventing safety accidents. Chamfering machines are used for such chamfering.

In the conventional chamfering machine, there is an example in which all four corners, short edges, and long sides of the substrate are processed through one chamfering wheel. However, when machining all four corners, short edges and long edges by using one chamfering wheel as described above, there was a problem in that it takes a lot of tact time because continuous operation cannot be performed.

In addition, the stage disclosed in the conventional chamfering machine is a simple block-like structure that absorbs the substrate seated on the upper surface by vacuum, and the area of the upper surface has a predetermined size, so that the conventional chamfering machine has various sizes. There is a problem that can not be mixed to the substrate. Therefore, in order to chamfer substrates having different sizes, stages need to be replaced. Due to such replacement time, a tact time is increased and productivity is lowered.

SUMMARY OF THE INVENTION An object of the present invention is to provide a chamfering device for a flat panel display having a simple and simple structure, which can be mixedly applied to substrates of various sizes, thereby improving productivity.

The object is, according to the present invention, a substrate loading unit (loading unit) is loaded substrate; And a chamfering processing unit having at least one stage on which the substrate is seated and supported by an upper surface, and a grinder for performing chamfering of the substrate, wherein the at least one stage includes: One turntable; And a plurality of variables disposed at an outer side of the turntable so as to be accessible and spaced apart from the turntable, and adsorb and support the substrate together with the turntable at a position relative to the turntable predetermined according to the size of the substrate. It is achieved by a chamfer for a flat panel display characterized in that it comprises a table.

Here, the at least one turntable may be provided in one central area, and the plurality of variable tables may be provided in symmetry with each other at an outer side of the turntable.

A side of the variable table may be formed with a cutout to prevent the variable table from colliding with the turntable when approaching the turntable.

A plurality of first vacuum holes may be formed on the surface of the turntable to vacuum suck the substrate. On the surface of the variable table, the substrate may be vacuum sucked and the vacuum is individually turned on / off by a plurality of vacuum pipes. / off) may be formed a plurality of second vacuum holes.

The plurality of vacuum pipes may further include an intermediate pipe connected to the plurality of vacuum pipes, and the plurality of vacuum pipes may be branched symmetrically to each other in a pair of adjacent variable tables in each line of the intermediate pipes.

First and second electrodes disposed around the first and second vacuum holes and doubling the vacuum suction area of the substrate by forming a line having a predetermined shape in a state of being recessed downward from the surfaces of the turntable and the variable table. It may further include a vacuum suction line groove.

The first and second vacuum suction line grooves may be provided one for each of the first and second vacuum holes.

The apparatus may further include a table driver configured to access and space the four variable tables with respect to the turntable.

The table driving unit may include a pair of connection blocks that connect two pairs of variable tables, respectively; Ball screw shafts rotatably coupled to the pair of connecting blocks, respectively, for approaching and spaced apart from the pair of connecting blocks when rotating in the forward and reverse directions; And it may include a single drive motor for rotating the ball screw shaft in the forward and reverse directions.

The display device may further include a flatness control unit provided in the variable table and the connection block to adjust the flatness of the variable table with respect to the connection block.

The flatness adjustment unit, a plurality of adjustment bolts are screwed to both the variable table and the connecting block at both ends in a state in which the threads of both ends are processed in opposite directions; And a plurality of contact support bolts coupled to any one of the variable table and the connection block so that one end thereof is in contact with the other.

A substrate unloading unit provided on an opposite side of the substrate loading unit with the chamfering processing unit therebetween to unload the substrate; And a chamfering measuring unit provided in the substrate unloading unit to measure chamfering amounts of the chamfered substrates, wherein the at least one stage connects the substrate loading unit and the substrate unloading unit. It may be provided in plurality along the horizontal direction of the virtual X axis.

According to the present invention, while having a simple and simple structure, it can be mixedly applied to substrates of various sizes, thereby improving productivity.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

1 is a perspective view of a substrate for explaining a portion to be chamfered.

Prior to the description with reference to the drawings, the substrate to be described below means a TFT-LCD (Thin Film Transistor-Liquid Crystal Display) substrate, but since the scope of the present invention is not limited to the plasma display substrate (PDP, Plasma) It can also be applied to flat panel displays (FPDs) such as display panels, organic light emitting diodes (EL), and solar cells. However, hereinafter, the TFT-LCD substrate will be described as an example for convenience of description.

For reference, the TFT-LCD substrate G1 is made of two layers in which a top plate and a bottom plate are bonded together with a liquid crystal interposed therebetween, and a section in which the top plate does not overlap is usually present on the top surface of the bottom plate. However, in FIG. 1, for convenience of illustration and description, the TFT-LCD substrate G1 is schematically illustrated in a substantially rectangular plate shape.

Referring to this figure, through the chamfering of the present embodiment, the substrate G1 has four corners, namely, both front corners (see enlarged A) and rear both corners (see enlarged B), and both short side edges (see enlarged C). And both long side edges (see enlarged D) are chamfered.

As will be described later in detail, the chamfering method in the present embodiment, the short side edge processing of the substrate G1, the front side corner processing of the front surface of the substrate G1, the both sides corner processing of the back surface of the substrate G1, and the long side edge of the substrate G1 Follow the processing sequence. However, since the scope of the present invention is not limited thereto, the order of chamfering may be sufficiently changed according to the manufacturing process of the manufacturer as long as it can reduce the tact time.

FIG. 2 is a schematic plan view of a chamfer for a flat display according to an embodiment of the present invention, FIGS. 3 and 4 are partially enlarged perspective views of FIG. 2, and FIG. 5 is an enlarged perspective view of the stage shown in FIG. 3. 6 is a perspective view illustrating an operation of the stage of FIG. 5, FIG. 7A is a configuration diagram of a first vacuum hole formed on a surface of a turntable, and FIG. 7B is a surface of a variable table. Fig. 8 is a schematic side view of the stage, and Figs. 9A to 9F are constitutional steps showing a chamfering processing method by a chamfer for a flat panel display. .

2 to 4, the planar display chamfering device according to an embodiment of the present invention includes a substrate loading unit 210 loaded with a substrate G1 to be chamfered and processed. , A chamfering processing unit 220 in which chamfering is performed on the substrate G1, and a substrate unloading unit 240 in which the chamfering processing is completed, and the substrate G2 is unloaded.

Since both the substrate loading unit 210 and the substrate unloading unit 240 serve to transfer the substrates G1 and G2, the substrate loading unit 210 and the substrate unloading unit 240 may be applied as a roller type. That is, the substrate loading unit 210 and the substrate unloading unit 240 may have a structure in which a plurality of rollers 212 and 242 rotatably supporting the substrates G1 and G2 are respectively coupled to the plurality of rotation shafts 211 and 241. Can be.

However, since the scope of the present invention is not limited thereto, the substrate loading unit 210 and the substrate unloading unit 240 may be replaced with a conventional conveyor type or stage type. . As such, when the substrate loading unit 210 and the substrate unloading unit 240 are applied as a conveyor type or a stage type, an air floating module (not shown) for applying up the substrates G1 and G2 is applied together. Would be advantageous.

The plurality of rollers 212 and 242 is preferably made of a flexible material so that scratches do not occur on the substrates G1 and G2. The plurality of rotation shafts 211 and 241 may be rotated together by a single motor to facilitate the control of the rotational speed. However, the rotation shafts 211 and 241 each rotate individually by individual motors. You can also

The substrate loading unit 210 is provided with an alignment unit 215 for performing an alignment operation on the substrate G1 to be entered. The alignment unit 215 serves to align the substrate G1 correctly by pressing both sides of the substrate G1 by an operation of approaching and separating each other.

Unlike the substrate unloading unit 240, the substrate loading unit 210 further includes a plurality of entrance detection sensors 214 along the direction in which the substrate G1 enters. The plurality of entrance detection sensors 214 generates a detection signal for reducing or stopping the speed of the rotation shaft 211 based on the entry position of the substrate G1.

The substrate unloading unit 240 is further provided with a chamfering measurement unit 250. Chamfering measurement unit 250 serves to measure the chamfering for the substrate (G2) is completed chamfering processing through the chamfering processing unit 220.

With respect to the substrate G2 whose chamfering amount is measured by the chamfering measuring unit 250, if the chamfering is erroneously or if the chamfering amount is less than the reference value, the substrate is destroyed or The chamfering amount is fed back toward the chamfering wheels 225 and 227 so that the machining may proceed. In the present exemplary embodiment, the chamfering measurement unit 250 is provided in the substrate unloading unit 240, but in some cases, the chamfering measurement unit 250 may be provided in the chamfering processing unit 220.

In the substrate loading unit 210 and the substrate unloading unit 240, a plurality of lift pins 213 and 243 for raising a predetermined height up the substrates G1 and G2 with respect to the plurality of rollers 212 and 242 are provided with a plurality of rollers ( It is further provided between 212 and 242.

The lift pins 213 and 243 are provided in an area between the substrate loading unit 210 and the chamfering processing unit 220, and an area between the chamfering processing unit 220 and the substrate unloading unit 240. G2) is operated in conjunction with the operation of the transfer (280a, 280b) for feeding. That is, the lift pins 213 and 243 may have transfers 280a and 280b from the substrate loading unit 210 to the chamfering processing unit 220 or from the chamfering processing unit 220 to the substrate unloading unit 240. When the G2) is transferred, the operation is up.

Prior to the description of the chamfering processing unit 220, the transfer (280a, 280b) will be described first. As described above, the transfers 280a and 280b are provided in the region between the substrate loading unit 210 and the chamfering processing unit 220 and the region between the chamfering processing unit 220 and the substrate unloading unit 240. The substrate G1 on the 210 is transferred to the first and second stages 300a and 300b and the substrate G2 on the first and second stages 300a and 300b is transferred to the substrate unloading unit 240. Do it.

In this embodiment, the structure of the transfer (280a, 280b) provided in the region between the substrate loading unit 210 and the chamfering processing unit 220, and the region between the chamfering processing unit 220 and the substrate unloading unit 240 and The operations are all the same. Accordingly, for the convenience of illustration and description, the same reference numerals are given to detailed configurations of the transfers 280a and 280b.

The transfer members 280a and 280b partially support the lower surfaces of the substrates G1 and G2 while being in contact with both sides of the substrates G1 and G2 to hold the substrates G1 and G2. And a safety gripping unit provided around the basic gripping unit 281 and preventing the substrates G1 and G2 from falling off from the basic gripping unit 281 during transfer and stop of the substrates G1 and G2. 285).

In the present exemplary embodiment, four basic gripping units 281 are provided on both sides of the substrates G1 and G2, and the safety gripping units 285 are provided with the substrates G1 and G2 in the direction in which the substrates G1 and G2 are transferred. One side of the G2) is rotatably provided at the position to support the front and lower surfaces. However, the scope of the present invention is not limited thereto.

In addition, in order to hold all substrates of various sizes, the basic gripping units 281 are provided to be accessible and spaced apart from each other. In addition, the transfers 280a and 280b themselves are substrates on the substrate loading unit 210. X-axis and Y-axis to transfer the G1 to the first and second stages 300a and 300b and the substrate G2 on the first and second stages 300a and 300b to the substrate unloading unit 240. And a Z axis. To this end, the transfers 280a and 280b further include an X-axis driver 291, a Y-axis driver 293, and a Z-axis driver 294. The X-axis driver 291, the Y-axis driver 293, and the Z-axis driver 294 may be implemented by a structure such as a linear motor, a cylinder, or a combination of a motor and a ball screw, but a detailed description thereof will be omitted. do.

Meanwhile, the chamfering processing unit 220 substantially chamfers the four corners of the substrate G1 provided from the substrate loading unit 210, the short side edges of the substrate G1, and the long side edges of the substrate G1. (See FIG. 1).

As described above, in the present embodiment, both side short edge edge processing of the substrate G1, both sides corner processing of the front surface of the substrate G1, both sides corner processing of the rear surface of the substrate G1, and both side long edges of the substrate G1. Since the chamfering process proceeds in the order of processing will be described based on the order thereof.

The chamfering processing unit 220 according to the present embodiment includes two first and second stages 300a and 300b on which the substrate G1 is seated and supported on an upper surface thereof, and first and second chamfers spaced apart from each other along the X axis. And a grinder 221 having machining wheels 225 and 227.

First, the grinder 221 will be described. The grinder 221 is a portion for performing substantial chamfering on the substrate G1 supported by the first and second stages 300a and 300b.

In the present embodiment, since two first and second stages 300a and 300b are provided along the Y axis, the grinder 221 is applied as a shared grinder to simplify the equipment. As the grinder 221 is applied as a shared grinder, the two alignment cameras 223, the first chamfering wheel 225, and the second chamfering wheel 227 provided in the grinder 221 are first and second. While selectively moving toward the stages 300a and 300b, the chamfering operation of the substrate G1 is performed along with the first and second stages 300a and 300b.

However, since the scope of the present invention is not limited thereto, the grinder 221 does not necessarily need to be a shared grinder. That is, the two alignment cameras 223, the first chamfering wheels 225, and the second chamfers corresponding to the first and second stages 300a and 300b, respectively, for each of the first and second stages 300a and 300b. The chamfering wheel 227 may be provided exclusively.

The grinder 221 includes an alignment camera 223 for aligning the substrate G1 seated on the first and second stages 300a and 300b, and a first and second stage 300a, The first and second chamfering wheels 225 and 227 are disposed to be chamfered with respect to the substrate G1 mounted on the substrate 300b and spaced apart from each other along the X axis.

Two alignment cameras 223 are provided to photograph two alignment marks formed on one side of the substrate G1. That is, alignment of the substrate G1 is possible only by photographing at least two alignment marks, and intervals of the first chamfering wheel 225 and the second chamfering wheel 227 may be determined based on the alignment work on the substrate G1. In this embodiment, two alignment cameras 223 are provided.

The first chamfering wheel 225 performs chamfering on both side short edges of the substrate G1 and the rear corner processing of the substrate G1, and the second chamfering wheel 227 has a front corner of the substrate G1. Since the process and the chamfering process with respect to the long side edge of both sides of the board | substrate G1 advance, it is provided two by one.

Looking at the structure of the first and second chamfering wheels (225, 227), as shown in Figure 4, the first and second chamfering wheels (225,227) are arranged so that one region of the outer peripheral surface overlap each other along the Z axis With a plurality of first to fourth multi-wheels 225a to 225d, 227a to 227d, multi wheels for processing all four corners of the substrate G1, the short side edge of the substrate G1, and the long side edge of the substrate G1. Apply. In other words, the first chamfering wheel 225 is formed by a combination of four first to fourth multi wheels 225a to 225d, and the second chamfering wheel 227 is four first to fourth multi wheels. It is provided by the combination of (227a-227d). The first and second chamfering wheels 225 and 227 are rotatably coupled by the wheel rotating housings 231 and 232, respectively. The wheel rotating housings 231 and 232 serve to rotate the first and second chamfering wheels 225 and 227 using a motor, etc. in addition to supporting the first and second chamfering wheels 225 and 227.

In this configuration, the chamfering of the short side edge of the substrate G1 is performed by the first and third multi wheels 225a and 225c of the first chamfering wheel 225 and the second and fourth multi wheels 225b and 225d. ), And the rear corner processing of the substrate G1 is performed in the inclined surface regions of the third and fourth multi-wheels 225c and 225d of the first chamfering wheel 225. And the front corner processing of the board | substrate G1 progresses in the inclined surface area | region of the 3rd and 4th multi-wheels 227c and 227d of the 2nd chamfering wheel 227, and chamfers with respect to the long side edge of the board | substrate G1. Is performed in the region between the first and third multi wheels 227a and 227c of the second chamfering wheel 227 and the second and fourth multi wheels 227b and 227d.

On the other hand, since the grinder 221 of the present embodiment is a shared grinder, the alignment camera 223, the first chamfering wheel 225, and the second chamfering wheel 227 are together with the first stage 300a and the first stage. The chamfering operation of the substrate on 300a should also proceed, and the chamfering operation of the substrate on the second stage 300b should also proceed with the second stage 300b.

Accordingly, the alignment camera 223, the first chamfering wheel 225, and the second chamfering wheel 227 should be movable along the Y axis. To this end, a camera movement support 224, a first wheel movement support 226, and a second wheel movement support 228 are provided.

The camera movement supporter 224 supports the two alignment cameras 223 to be movable so that the two alignment cameras 223 can move individually or collectively along the Y axis, and the first wheel movement supporter 226 Two first chamfering wheels 225 are movably supported so that the two first chamfering wheels 225 can be moved individually or collectively along the Y axis, and the second wheel moving support 228 is made of two The two second chamfering wheels 227 are movably supported so that the two chamfering wheels 227 can move individually or collectively along the Y axis.

In this embodiment, the camera movement support 224, the first wheel movement support 226 and the second wheel movement support 228 may be implemented as a linear motor, but is not necessarily so. In addition, although the camera movement support 224, the first wheel movement support 226, and the second wheel movement support 228 are shown separately in the drawings, they may be interconnected in one body.

The two alignment cameras 223 are sufficient if they are moved to the Y axis by the camera moving support 224. However, the first and second chamfering wheels 225 and 227 are not only moved in the Y axis by the first and second wheel moving supports 226 and 228, but also four corners of the substrate G1 and short and long edges. In order to move up and down on the Z axis, it must be possible.

To this end, the grinder 221 of the present embodiment is coupled to the first wheel moving support 226, the first wheel lifting portion 226a for raising and lowering the two first chamfering wheels 225 on the Z axis, and A second wheel elevating portion 228a is further provided to be coupled to the two wheel moving support 228 to elevate the two second chamfering wheels 227 to the Z axis. The first wheel lifting unit 226a and the second wheel lifting unit 228a may be applied as a cylinder, but this may also be applied by a linear motor or a motor and ball screw combination.

On the other hand, in the present embodiment, when the four corner processing of the substrate G1, the short side edge processing of the substrate G1 and the long side edge processing of the substrate G1 through the chamfering processing unit 220, the substrate G1 The control unit further controls the operation of the grinder 221 so that the four corners of), the short edge of the substrate G1 and the long edge of the substrate G1 can proceed continuously without waiting time. This series of control operations will be described together with the chamfering processing method below.

Meanwhile, the stages 300a and 300b which are one configuration of the chamfering processing unit 220 will be described with reference to FIGS. 5 to 8 as follows.

In the present embodiment, the stages 300a and 300b are provided with two first and second stages 300a and 300b along the Y axis, as shown in FIGS. 2 and 3. Since the first and second stages 300a and 300b perform chamfering operations in parallel with the remaining components of the grinder 221, respectively, the tact time may be reduced, thereby improving productivity.

However, since the scope of the present invention is not limited thereto, only one stay may be provided, or three or more stages may be provided. However, when three or more stages are provided, it is sufficient if they have a parallel arrangement along the Y axis.

Like the transfers 280a and 280b described above, the first and second stages 300a and 300b have the same structure and operation except that only the positions thereof are different. Accordingly, for the convenience of illustration and description, the same reference numerals are given to detailed configurations of the first and second stages 300a and 300b.

Referring to the first and second stages 300a and 300b, the first and second stages 300a and 300b of the present exemplary embodiment may have a structure that may be mixedly applied to substrates of various sizes.

In other words, the stage (not shown) disclosed in the conventional chamfering machine is a simple block-like structure in which the substrate G1 seated on the upper surface is vacuum-adsorbed, and the surface of the upper surface has a predetermined size. Only substrates of which had to be adsorbed were supported. Therefore, such a conventional chamfering machine is not applicable to a variety of substrates of various sizes can not be mixed with the substrate (G1) previously chamfered and the stage (not shown) in order to chamfer substrates of different sizes (size) must be replaced And due to such a replacement time has a disadvantage that the tact time (tact time) is increased to decrease the productivity. However, the first and second stages 300a and 300b of the present exemplary embodiment have a structure that can be mixedly applied to various sizes of substrates because the entire area of the upper surface can be adjusted as necessary.

To this end, each of the first and second stages 300a and 300b to be applied to the chamfering machine of the present embodiment includes a turntable 310 for adsorbing and rotating the substrate G1, and a turntable 310 disposed outside the turntable 310. A plurality of variable tables 320 are provided to adsorb and support the substrate G1 and to access and space the turntable 310 so as to correspond to all substrates of various sizes.

As shown in FIGS. 5 and 6, one turntable 310 is provided in a central area of the first and second stages 300a and 300b, and the variable table 320 is mutually formed at the outside of the turntable 310. Four are provided symmetrically. The four variable tables 320 are paired two by two to approach and space the turntable 310.

The table driver 330 is further provided to allow the four variable tables 320 to be approached and spaced apart from the turntable 310 in a paired state.

Referring to FIG. 6, the table driver 330 may include a pair of connecting blocks 331a and 331b for connecting the paired variable tables 320 to each other and a pair of connecting blocks 331a and 331b. A drive motor for rotating the ball screw shaft 332 and the ball screw shaft 332 in the forward and reverse directions, respectively rotatably coupled to each other when the pair of connecting blocks (331a, 331b) are mutually approaching and spaced apart when rotating in the forward and reverse directions. 333.

The pair of connection blocks 331a and 331b each have a rectangular block structure, and a block support part 334 for supporting one variable table 320 is further provided on an upper surface thereof. Two block support units 334 are provided for each pair of connecting blocks 331a and 331b to support two variable tables 320. In the present embodiment, the same reference numerals are given to the block supporting portions 334 for the convenience of illustration and description.

The ball screw shaft 332 is a screw thread formed on the outer surface and connects a pair of connecting blocks 331a and 331b. The corresponding area of the ball screw shaft 332 to which the pair of connecting blocks 331a and 331b are connected. Threads are machined in opposite directions.

As such, the threads formed on the outer surface of the ball screw shaft 332 are machined in opposite directions, and a pair of connecting blocks 331a and 331b are screwed to the threads machined in opposite directions, respectively, for example, a ball screw shaft ( When the 332 is rotated in the forward direction, the pair of connection blocks 331a and 331b may be spaced apart from each other as shown in FIG. 5 to open the variable tables 320 so that a large substrate is adsorbed. When rotated in the reverse direction, the pair of connection blocks 331a and 331b may approach each other as shown in FIG. 6 to narrow the variable tables 320 so that a small substrate is adsorbed.

The drive motor 333 is a part that generates power for rotating the ball screw shaft 332 in the forward and reverse directions. In this embodiment, the ball screw shaft 332 is rotated in the forward and reverse directions as a single drive motor 333. Since the variable table 320 can be driven by a single drive motor 333 as described above, the configuration is simplified so that the installation and maintenance can be simplified, and the cost can be reduced.

The upper surface of the turntable 310 has a substantially circular shape, and the four variable tables 320 have a substantially rectangular shape with a portion cut away. However, since the scope of the present invention is not limited thereto, the shapes of the turntable 310 and the variable table 320 may be appropriately changed.

For example, at least the top surface of the turntable 310 may have a polygonal shape including an ellipse shape. In addition, since four variable tables 320 do not necessarily have to be provided, two variable tables 320 may be provided to be symmetrical to each other outside the turntable 310. Even in this case, the configuration and operation of the table driver 330 may be implemented in the same manner.

As described above, when the substrate size of the chamfering process is large, the four variable tables 320 with respect to the turntable 310 as shown in FIG. 5 so that the total adsorption area of the turntable 310 and the variable table 320 can be widened. ) Should be spaced apart, and if the substrate size of the chamfering process is small, four variable tables 320 should be approached to the turntable 310 as shown in FIG. 6. In this case, when four variable tables 320 are approached to the turntable 310 as shown in FIG. 6, since the side surfaces of the four variable tables 320 do not collide with the turntables 310, the variable tables 320 may not be used. The cutout 321 is formed on the side of the field. In the present embodiment, the cutout 321 may have an arc shape corresponding to the outer surface of the turntable 310, but is not necessarily the case.

As illustrated in FIG. 7, a plurality of first and second vacuum holes 315 and 325 are formed on the surfaces of the turntable 310 and the variable table 320 to adsorb and support the substrate G1. The first and second vacuum holes 315 and 325 are provided to penetrate through the thicknesses of the turntable 310 and the variable table 320, respectively.

The first and second vacuum holes 315 and 325 alone are sufficient to adsorb and support the substrate G1. However, in the present exemplary embodiment, the turntable 310 and the variable table 320 form a line having a predetermined shape in a state where the turntable 310 and the variable table 320 are recessed in a predetermined depth downward from the surfaces of the turntable 310 and the variable table 320. First and second vacuum suction line grooves 315a and 325a are further formed to double the vacuum suction area for G1). That is, when a vacuum suction force is generated in the first and second vacuum holes 315 and 325, the vacuum suction force acts in a wider area through the first and second vacuum suction line grooves 315a and 325a to adsorb the substrate G1. In this case, the vacuum adsorption area on the substrate G1 can be increased. In the present exemplary embodiment, one first and second vacuum suction line grooves 315a and 325a are provided for each of the first and second vacuum holes 315 and 325 but are not necessarily the same.

In the present embodiment, the first vacuum suction line groove 315a formed on the turntable 310 has a pizza shape, as shown in FIG. 7A, and a second vacuum suction line formed on the variable table 320. The groove 325a may be formed in a Korean letter 'b' shape as shown in FIG. 7B, but the scope of the present invention is not limited thereto. The unhatched portions on the surfaces of the turntable 310 and the variable table 320 illustrated in FIGS. 7A and 7B are recessed compared to the hatched portions.

As described above, since the four variable tables 320 are provided, if the vacuum pressures formed in the four variable tables 320 are significantly different from each other, the substrate G1 may not be stably supported or may be moved to one side. It may be crooked. Accordingly, the vacuum pressures provided to the four variable tables 320 and the variable tables 320 at least two of which need to be paired need to be substantially uniform. In addition, since the substrate G1 is aligned at the center, that is, disposed symmetrically with respect to the center, it is efficient to turn on / off the vacuum symmetrically.

Referring to FIG. 7B, the second vacuum holes 325 formed on the surface of the variable table 320 individually control a plurality of vacuum pipes 326a such that on / off of the vacuum is controlled. And 326b and 326c are connected, and the plurality of vacuum pipes 326a, 326b and 326c are connected to the plurality of intermediate pipes 327a, 327b and 327c.

At this time, the vacuum pipes 326a, 326b and 326c branch symmetrically to each other in a pair of adjacent variable tables 320 in each line of the intermediate pipes 327a, 327b and 327c. That is, for example, the intermediate piping of the reference numeral 327a constitutes one line, but the vacuum piping 326a, which is two lines branched from the intermediate piping of the reference numeral 327a, is formed of a pair of adjacent variable tables 320, respectively. 2 is directed to the vacuum hole (325). By constructing the pipe in such a manner, the vacuum pressures provided to the variable tables 320 paired with each other at least two can be symmetrically uniform with respect to the center, thereby increasing the adsorption efficiency on the substrate G1. Will be.

On the other hand, even if a uniform vacuum pressure is formed through the first and second vacuum holes 315 and 325, in particular, the second vacuum hole 325, if the flatness of the variable table 320 is not properly matched with the substrate G1. Since gaps are generated therebetween, the adsorption efficiency of the substrate G1 is inevitably lowered, causing a loss of vacuum.

In this embodiment, the flatness adjusting unit 340 is further provided to adjust the flatness of the variable table 320 with respect to the connection blocks 331a and 331b in a simple manner.

As shown in FIG. 8, the flatness adjusting unit 340 includes a plurality of adjusting bolts in which both ends are screwed to the variable table 320 and the connecting blocks 331a and 331b in a state in which threads of both ends are processed in opposite directions. 341 and a plurality of contact support bolts 342 coupled to the connection blocks 331a and 331b and having one end thereof in contact with the variable table 320.

By such a configuration, if it is necessary to adjust the flatness of the variable table 320, first, a plurality of contact support bolts 342 are released and one end of the contact support bolts 342 is adjusted from the variable table 320. After allowing it to be spaced apart to the required position, tighten or loosen the adjusting bolt 341 at that position. When both ends of the adjustment bolt 341 is formed with threads in the opposite direction and the threads in the opposite direction are connected to the variable table 320 and the connection blocks 331a and 331b, respectively, when the adjustment bolt 341 is tightened or loosened, The variable table 320 is lowered or raised relative to the connection blocks 331a and 331b. Therefore, the flatness of the variable table 320 may be adjusted through such manipulation. Once the flatness of the variable table 320 is adjusted, the contact support bolts 342 may be tightened again, and one end of the contact support bolts 342 may be adjusted. The variable table 320 may be prevented from tilting arbitrarily by being brought into contact with the 320.

A series of methods for chamfering the substrate G1 using a chamfer having such a configuration will first be described with reference to FIG. 9.

First, the substrate G1 to be chamfered is transferred through the roller 212 on the substrate loading unit 210. The substrate G1 transferred by the rotation of the roller 212 is stopped at the working position as the operation of the rotation shaft 211 is stopped based on the signal of the entry sensor 214. Subsequently, after the alignment unit 215 presses both sides of the substrate G1 to align the substrate G1, the lift pins 213 up the substrate G1.

When the substrate G1 is up, the transfer 280a moves along the X-axis, Y-axis, and Z-axis, and the substrate G1 is held by the basic gripping unit 281 and the safety gripping unit 285 to hold the substrate G1. ) Is moved to the upper surface of the first stage 300a. The substrate G1 raised to the upper surface of the first stage 300a is formed through the first and second vacuum holes 315 and 325 formed on the surfaces of the turntable 310 and the variable table 320 forming the first stage 300a. As the vacuum pressure is provided, it is sucked and supported on the surfaces of the turntable 310 and the variable table 320.

In this way, after the substrate G1 is supported by the upper surface of the first stage 300a, the first stage 300a moves in the X-axis direction. The alignment operation is performed on the substrate moved in the X-axis direction while the alignment mark is captured by the alignment camera 223 as shown in FIG. 9A. While the alignment operation is in progress, the first chamfering wheel 225 moves in advance to a work position for processing both side short edges of the substrate G1 and waits. In this case, the second chamfering wheel 227 is considered to be chamfering the other substrate on the second stage 300b side, and the dotted line is processed in FIG. 9A.

When the alignment operation is completed, as shown in FIG. 9B, the first stage 300a advances the substrate G1 toward the first chamfering wheel 225. At this time, since the first chamfering wheel 225 is moved to the working position for both short side edge processing of the substrate G1 in advance and is waiting, the substrate G1 is not stopped by the first stage 300a. Continue to advance through the area between the first and third multi-wheels 225a and 225c and the second and fourth multi-wheels 225b and 225d to form the first chamfering wheel 225, thereby providing a substrate G1. Chamfering processing for both short side edges of is completed.

As described above, while the chamfering processing of both short side edges of the substrate G1 is performed by the first chamfering wheel 225, the second chamfering wheel 227 moves on the movement path of the first stage 300a. In this case, the second chamfering wheel 227 is moved in advance to the working position for the front side corner processing of the substrate G1 to stand by.

Therefore, the board | substrate G1 on which the both short side edge processing was completed past the 1st chamfering wheel 225 is continued continuously by the 1st stage 300a without stopping, and waits in advance in a working position as shown in FIG.9 (c). By contacting the 3rd and 4th multi-wheels 227c and 227d of the 2nd chamfering wheel 227 which existed, chamfering process advances with respect to the front both sides corner.

As described above, while the chamfering process is performed on both front corners of the substrate G1, the first chamfering wheel 225 moves in advance to a work position for processing both corners of the rear surface of the substrate G1.

The board | substrate G1 in which the chamfering process was completed with respect to the front-side both corners did not stop, but reversed by the 1st stage 300a, and the 1st chamfering wheel 225 previously waiting at the working position as shown in FIG. 9 (d). By contacting the third and fourth multi-wheels 225c and 225d, the chamfering process proceeds to both rear corners of the rear surface.

Next, to chamfer the long side edges of both sides of the substrate G1, the substrate G1 is rotated on the first stage 300a as shown in FIG. 9E. The rotation of the substrate G1 is performed by the turntable 310 forming the first stage 300a. In this case, it is assumed that the first chamfering wheel 225 is chamfering the other substrate on the second stage 300b side, and the dotted lines are processed in FIGS. 9E and 9F.

As described above, while the substrate G1 is rotated for chamfering on both long side edges, the second chamfering wheel 227 moves to a working position for both long side edges of the substrate G1 and waits in advance.

Subsequently, the substrate G1, which has been rotated, is immediately advanced by the first stage 300a to form the second chamfering wheel 227 as shown in FIG. 9 (f). 227a, 227c and the area between the second and fourth multi-wheels 227b, 227d are passed, thereby completing the chamfering of the long side edges of both sides of the substrate G1.

On the other hand, in order to apply a substrate having a larger size or a smaller substrate than the substrate G1 applied in the above description to the chamfer described above, the entire upper surface of the first and second stages 300a and 300b supporting the substrate G1. The area needs to be adjusted. That is, the total area of the upper surfaces of the first and second stages 300a and 300b should be increased to chamfer the large substrate, and the upper surfaces of the first and second stages 300a and 300b to chamfer the small substrate. The total area should be small.

5 and 6, when the ball screw shaft 332 is rotated in the positive direction by the driving motor 333, the pair of connecting blocks 331a and 331b are spaced apart from each other as shown in FIG. 5. The variable table 320 may be opened to allow a large substrate to be adsorbed. On the contrary, when the ball screw shaft 332 is rotated in the reverse direction by the driving motor 333, the pair of connecting blocks 331a and 331b may be formed as shown in FIG. 6. As the variable table 320 is narrowed while accessing each other, a small substrate may be adsorbed.

As such, while having a simple and simple structure, it can be mixedly applied to substrates of various sizes, thereby improving productivity.

In the above embodiment, the short side of the substrate is first processed and the long side is processed, but the long side may be processed first, and the substrate may be rotated to form the short side.

In the above-described embodiment, the first and second chamfering wheels are spaced apart from each other along a virtual work line connecting the substrate loading unit and the substrate unloading unit. The substrate unloading unit may be spaced apart from each other in a direction crossing the virtual work line.

In addition, in the above-described embodiment, two first and second chamfering wheels are provided, but only one chamfering wheel may be provided.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

1 is a perspective view of a substrate for explaining a portion to be chamfered.

2 is a schematic plan view of a chamfering device for a flat panel display according to an embodiment of the present invention.

3 and 4 are partially enlarged perspective views of FIG. 2, respectively.

FIG. 5 is an enlarged perspective view of the stage shown in FIG. 3.

6 is a perspective view showing the operation of the stage of FIG.

FIG. 7A is a configuration diagram of the first vacuum hole formed on the surface of the turntable, and FIG. 7B is a configuration diagram of the second vacuum hole formed on the surface of the variable table.

8 is a schematic side view of the stage.

9 (a) to 9 (f) are configuration diagrams showing step by step chamfering processing by the chamfering machine for flat panel displays.

* Explanation of symbols for the main parts of the drawings

210: substrate loading unit 220: chamfering processing unit

221: Grinder 223: Align Camera

225: first chamfering wheel 227: second chamfering wheel

240: substrate unloading unit 250: chamfering measurement unit

280a, 280b: Transfer 300a, 300b: Stage

310: turntable 320: variable table

330: table driving unit 340: flatness adjustment unit

Claims (12)

A substrate loading unit into which a substrate is loaded; And And a chamfering processing unit having at least one stage on which the substrate is seated and supported by an upper surface, and a grinder for chamfering the substrate. The at least one stage, At least one turntable for sucking and rotating the substrate; And A plurality of variable tables disposed outside the turntable so as to be accessible and spaced from the turntable, and adsorbing and supporting the substrate together with the turntable at a position relative to the turntable that is predetermined according to the size of the substrate; Including; A plurality of first vacuum holes are formed on the surface of the turntable to vacuum suck the substrate. On the surface of the variable table, the substrate is vacuum sucked, but the vacuum is individually turned on / off by a plurality of vacuum pipes. Is formed, a plurality of second vacuum holes are controlled, And first and second vacuum adsorption line grooves provided around the first and second vacuum holes and recessed downward from surfaces of the turntable and the variable table to double the vacuum adsorption area for the substrate. Chamfering machine for flat display. The method of claim 1, The at least one turntable is provided in a central area, and the plurality of variable tables are chamfered for the flat display, characterized in that the four are provided symmetrically from the outside of the turntable. The method of claim 2, And a cutout formed on a side of the variable table to prevent the variable table from colliding with the turntable when the variable table approaches the turntable. delete The method of claim 1, Further comprising an intermediate pipe connected to the plurality of vacuum pipe, And said plurality of vacuum pipes are branched symmetrically to each other in a pair of adjacent variable tables in each line of said intermediate pipes. delete The method of claim 1, The first and second vacuum adsorption line grooves are one flat surface display, characterized in that provided for each one of the first and second vacuum holes. The method of claim 2, And a table driving unit for accessing and separating the four variable tables with respect to the turntable. The method of claim 8, The table driving unit, A pair of connection blocks that connect two pairs of variable tables, respectively; Ball screw shafts rotatably coupled to the pair of connecting blocks, respectively, for approaching and spaced apart from the pair of connecting blocks when rotating in the forward and reverse directions; And And a single drive motor for rotating the ball screw shaft in the forward and reverse directions. 10. The method of claim 9, And a flatness adjusting unit provided on the variable table and the connection block to adjust the flatness of the variable table with respect to the connection block. The method of claim 10, The flatness control unit, A plurality of adjusting bolts having both ends screwed to the variable table and the connecting block in a state where threads of both ends are processed in opposite directions; And Chamfer for flat display, characterized in that it comprises a plurality of contact support bolts coupled to any one of the variable table and the connection block one end is in contact with the other. The method of claim 1, A substrate unloading unit provided on an opposite side of the substrate loading unit with the chamfering processing unit therebetween to unload the substrate; And It further comprises a chamfering measurement unit provided in the substrate unloading unit for measuring the chamfering amount for the substrate chamfering is completed, And the at least one stage is provided in plural along the transverse direction of the virtual X axis connecting the substrate loading unit and the substrate unloading unit.

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