JP2007223005A - Method of measuring and correcting machining dimensions in plate material chamfering device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To automatically measure machining dimensions without taking out a workpiece from a chamfering device, and to correct the position of a table or a tool of the chamfering device on the basis of the measured value, concerning a method of measuring and correcting chamfering dimensions of an edge of a rectangular glass substrate. <P>SOLUTION: In the method of measuring the chamfering dimensions, positioning marks 4 are attached to positions which are the apexes of a right triangle on the plate material 1. After machining of a side edge parallel with a feeding direction of the plate material 1, the plate material 1 is sent in a feed-back direction, and either one of two cameras reads the two marks 4 attached in the feeding direction to detect a difference between positions in a feeding right angle direction of the two marks, in a first measuring step. In a second measuring step, the plate material 1 is sent after the camera 5 is moved to a position for reading the side edge of the plate material 1, and the machining dimensions of the side edge is detected by the two cameras 5. Correction values of the angle of the table and the height of the tool is obtained on the basis of the detection result. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for measuring and correcting a processing dimension of a chamfering apparatus for processing an edge of a rectangular glass substrate used for a display panel or the like, and automatically measures a processing dimension of a plate material to be subjected to test processing or sampling inspection. Then, the present invention relates to a method for correcting the position of the table or tool of the chamfering device based on the measured value.

  A chamfering device for a glass substrate is a device that chamfers or rounds a sharp edge or corner generated at the edge of a glass substrate cut by cleaving or the like with a tool (generally a grindstone). As shown in FIG. 8, a general chamfering apparatus of this type includes a table 2 for adsorbing the glass substrate 1 with a negative pressure, and tools 3 arranged on both sides of the table. The table 2 and the tools 3 and 3 can be moved relative to each other in a predetermined feeding direction, and the substrate 1 can move the edge 8 to be processed in the feeding direction. It is fixed to the table in parallel.

  A glass substrate used as a display panel has a thin substrate thickness in order to increase the size and weight, and the chamfer width is about 0.3 mm, and high processing accuracy is required. In order to realize this high processing accuracy, a positioning mark (alignment mark) is placed at the apex position of a right triangle on the glass substrate 1 (or a sheet affixed thereto) whose two orthogonal sides are in the direction of the edge of the glass substrate 1. 4, two of the three positioning marks 4 in the width direction are read by two cameras 5 and 5 arranged in a direction (hereinafter referred to as “width direction”) orthogonal to the feed direction of the table. The table turning angle and tool position are set.

  That is, the angle of the table 2 is adjusted so that the direction perpendicular to the line connecting the positions of the two marks 4 and 4 detected from the images read by the image sensors of the two cameras in the width direction is the feed direction, The widths of the tools 3 and 3 are set so that the chamfer width becomes a specified target value based on the center position of the substrate 1 detected from the positions of the marks 4 and 4 and the substrate dimensions registered in advance in the control device. The substrate is processed by adjusting the position in the direction.

  Then, when the processing of one of the opposing edges 8 and 8 of the substrate is completed, the table 2 is turned 90 degrees, the position in the width direction of the tool 3 is set to a new position, and the processing of the second opposing edges 9 and 9 is performed. It is carried out.

  As shown in FIG. 9, the chamfering tool 3 includes a plurality of disk-shaped grindstones 16 and 16 fixed to upper and lower rotary shafts 15u and 15l provided substantially parallel to the substrate feed direction. The upper and lower ridges of the edge of the substrate are simultaneously processed on the outer periphery, and the height of the tools 3 and 3 is set so that the intermediate height of the two rotary shafts 15u and 15l is the center of the thickness of the substrate 1 on the table 2. By adjusting the height, the chamfering widths of the upper and lower ridge lines are adjusted to be the same width. Further, in the tool 3 shown in the figure, a corner chamfering grindstone 17 having a conical circumferential surface with an apex angle of 45 degrees is fixed to the front and rear ends of the lower rotating shaft 15l, and the corners (four corners) of the substrate are chamfered. This is performed with a chamfering grindstone 17.

  This type of chamfering device is provided with an automatic substrate transfer device, and continuously chamfers a large number of substrates. The direction of the table 2 and the positions of the tools 3 and 3 at the time of processing are adjusted based on the position of the positioning mark 4 attached to the glass substrate 1 as described above so that accurate processing is performed. For example, when there is an error in the positional relationship between the two cameras 5 and 5, the tool 3 is worn out, or there is an error in the height of the tool, an error occurs in the chamfer dimension of the processed substrate. .

  Therefore, conventionally, the test processed substrate is taken out from the processing machine and placed on a measuring instrument, and the operator uses the measuring instrument microscope to measure the distances a and b from the positioning mark 4 (see FIG. 10) to the chamfer line 7 and the chamfering width c. , D, corner chamfer dimensions e, f are measured, and the table direction, the width direction of the tool, and the height position are adjusted based on the measured values. Furthermore, in order to correct changes in the processing dimensions due to changes over time, such as tool wear, the processed substrate was appropriately extracted and the chamfer dimensions were measured in the same manner as described above to correct the tool position. .

  However, in the conventional method described above, since processing dimensions are measured by humans, operator skill is required, measurement errors due to carelessness and misreading may occur, and table angles from measured values It is necessary to calculate the correction value of the tool and the tool position, and the work takes time, and the operator needs to manually input the calculated correction value to the controller of the chamfering device, which may cause an input error. As a problem specific to chamfering equipment, as the glass substrate, which is a workpiece, becomes larger and thinner, the test processed substrate and the substrate to be inspected are removed from the chamfering device. There are problems that the difficulty of setting the measuring instrument is increasing, and that the error of the processing dimension increases with the increase in size of the table.

  In other words, if the substrate is inadvertently transported to increase the area and thickness of the glass, the substrate will break during the transport, so a dedicated transport device is prepared and the substrate to be measured is taken out from the chamfering device. In addition, it is necessary to perform setting to the measuring device or to transport the substrate by careful joint work of a plurality of workers, which causes a problem that the equipment burden or work burden increases and the transportation takes time. In addition, due to the increase in the size of the substrate and the accompanying increase in the area of the table, changes in the chamfering width in the direction along the edge of the workpiece, as well as the chamfering width change in the direction of the table feed direction and flatness or horizontality, There is a problem of increasing the error of width mismatch.

  This invention was made to solve the above-described problems of the conventional method, and automatically measures the processing dimensions without taking out the plate material as a workpiece from the chamfering device, and based on the measured values, It is an object to obtain technical means capable of correcting a chamfer dimension error with high accuracy.

  In the chamfering dimension measuring method in the chamfering apparatus according to the first aspect of the present invention that solves the above problem, a positioning mark 4 is attached to the plate material 1 to be chamfered at the three vertexes of a right triangle, A method for measuring a chamfer dimension in a chamfering device for chamfering the four sides 8 and 9 of the plate material on the basis of the position of the mark read by a camera 5 mounted on the chamfering device. The two marks attached in the direction orthogonal to the relative feed direction of the sheet are read to determine the direction with respect to the feed direction of the plate material, and the side edge parallel to the feed direction is processed, and the plate material is processed in the first measurement step. In the feed-back direction, one of the two cameras 5 reads the two marks attached in the feed direction, and detects the difference in position in the feed perpendicular direction between the two marks. The side edge of the plate It is a measurement method of chamfer dimension and detecting the feature size of the side edge at send after the plate has moved the two cameras in a position to take.

  The invention of claim 2 of the present application is the measurement method according to the invention of claim 1, wherein a lower camera 6 for reading the lower surface of the side edge of the plate member 1 is installed, and the lower camera is mounted on the plate member in the second measurement step. After the side edge is moved to the position for reading, the plate material is sent, and the processing dimensions above and below the side edge are detected by the two cameras 5 and the two lower cameras 6. It can measure chamfer dimensions at the same time.

  The invention of claim 3 of the present application is a method of correcting the machining dimension based on the chamfer dimension measured by the above method. The positioning mark 4 is attached to the plate material 1 at the three apexes of a right triangle, and the chamfering is performed. A method for correcting chamfer dimensions in a chamfering apparatus that chamfers the four sides 8 and 9 of the plate material with reference to the position of the mark read by the upper camera 4 arranged above the plate material placement table 2 of the device. A lower camera 6 for reading the lower surface of the side edge of the plate material is installed, the two marks attached in a direction perpendicular to the relative feed direction of the plate material 1 with respect to the tool 3 are read, and the direction with respect to the feed direction of the plate material The side edges parallel to the feed direction are processed, and the plate material is sent in the feed back direction in the first measurement step, and the two upper cameras 5 are attached to the two feed directions in the feed direction. Read the mark and send the two marks A difference in position in the angular direction is detected, and the upper camera 5 and the lower camera 6 are moved to a position where the side edge of the plate material is read in the second measurement step, and then the plate material is sent to the two upper cameras and 2 The machining dimension above and below the side edge is detected by a lower camera, and the angle error of the table is calculated from the difference between the positions of the two marks detected in the first measurement step in the direction perpendicular to the feed direction. The tool height error is calculated from the difference in machining dimensions above and below the side edges detected in the process, the table angle command value is corrected with the calculated angle error, and the tool height is calculated with the calculated height error. This is a method for correcting a chamfer dimension in a chamfering apparatus, wherein the command value is corrected.

  In the method of the present invention, since the two positioning marks arranged in the feeding direction are read by one camera while the plate material 1 is moved in the feeding direction or the feeding back direction, the angle error of the table 2 can be improved with higher accuracy. It can be measured. Since both the table angle error and the chamfer dimension error can be measured, the correction of the tool position to correct the error is calculated by adding the table angle error at the time of machining to the measured chamfer dimension. be able to. That is, in the test machining, it is possible to save the trouble of performing the trial machining after correcting the angle error of the table, and it is possible to both correct the table angle and the tool position from the plate material subjected to the sampling inspection. As for the tool position, the position correction amount in the width direction is calculated from the average value of the distances of the detected upper and lower chamfer lines from the positioning mark 4 or the difference between the average value of the upper and lower chamfer widths and their target values. The vertical position correction value is calculated from the difference between the upper and lower chamfer widths.

  In the method of the present invention, machining dimensions are measured on the chamfering device using a camera mounted on the chamfering device, and a correction value of the table angle and the tool position is calculated from the measured value in the controller of the chamfering device. It is possible to automatically correct by registering the calculation formulas, automatically calculating them, and correcting the command value from the controller based on the calculated value. Therefore, the work of taking out the plate material from the chamfering device for measurement is unnecessary, and the time and work load required for the measurement are greatly reduced, and there is a possibility that it may be caused by manual measurement or input of a correction value. It is possible to prevent the occurrence of defective products due to certain measurement errors, correction value calculation errors, and input errors. Further, since the measurement and the calculation and input of the correction value based on the measurement value can be automatically performed, the time required for them can be shortened and the operator's work load can be eliminated.

  Furthermore, it is possible to correct the plate material feeding direction with higher accuracy than the conventional method, and by arranging the cameras above and below the table 2, the vertical chamfer width is automatically measured and the tool height is corrected. There is an effect that the error of the upper and lower chamfer width can be automatically corrected.

  Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 7, the chamfering apparatus for carrying out the method of the present invention is provided with lower cameras 6 and 6 for reading the chamfering lines on the lower surface of the opposing edge of the plate 1 to be processed. The table 2, the tool 3, the positioning mark reading camera (upper camera) 5, the mounting structure thereof, and the positioning mark 4 provided on the plate 1 are the same as in the prior art. The upper and lower cameras 5 and 6 are individually mounted on the same support base (not shown) as the tool 3 so as to be movable in the width direction, and the positional relationship in the feed direction between the tool 3 and the cameras 5 and 6 does not change. . The lower cameras 6 and 6 are moved to a position directly below the upper cameras 5 and 5 only when processing dimensions described later are read, and are retracted outside in other cases.

  A plate material to be tested and a plate material to be subjected to sampling inspection (hereinafter simply referred to as “workpiece”) are processed and measured according to the procedure shown in FIGS.

  FIG. 1 is a diagram showing a procedure for processing the first opposing edges 8, 8, and two upper cameras 5, 5 read two positioning marks 4, 4 in the width direction attached to the work 1, The position of the table 2 and the position of the tool 3 are set by calculating the tilt of the table and the center position of the workpiece feed direction and width direction from the position coordinates of the positioning marks 4 and 4 obtained by image processing (FIG. 1A). ). Next, the work 1 is sent in the + Y direction (upward in the figure) by relative movement of the table and the tool 3, and the first opposing edges 8 and 8 are chamfered by the tool 3 (FIG. 1B). When the machining is completed, the tool 3 is retracted to the outside (FIG. 1 (c)).

  Before and after the edge machining shown in FIG. 1B, the corners 1a and 1b of the workpiece are chamfered (e and f in FIG. 10) by the corner chamfering grindstones 17 and 17 described above. .

  FIG. 2 is a diagram showing an operation for measuring the tilt error of the table. The workpiece 1 is moved in the −Y direction (downward in the figure) with respect to the camera 5 from the state of FIG. 1C where the processing of the first opposing edge of the workpiece has been completed, and one of the upper cameras 5 (on the left side in the figure) The two positioning marks 4 arranged in the feed direction are read (FIGS. 2A and 2B). Then, after the workpiece has passed the camera position, the upper and lower cameras 5 and 6 are moved to the position of the first opposing edge 8 (FIG. 2 (c)).

  FIG. 3 is a diagram showing an operation for measuring a processing dimension. The workpiece is again fed in the + Y direction from the state of FIG. 2C where the process of detecting the tilt of the workpiece with high accuracy is completed, and the upper and lower cameras 5 and 6 follow the center portion or the edge 8 of the edge 8 in the feeding direction. Reading a plurality of locations 8a, from the image shown in FIG. 10B, the chamfer width c of the first side 8 shown in FIG. 10 and the distance a from the positioning mark 4 to the chamfer line (measured chamfer line 7). And the coordinates of the positioning mark 4 already read). The chamfer width c is measured by the upper and lower cameras 5 and 6 for the upper and lower surfaces.

  If the amount of illumination light during measurement is too weak, as shown in FIG. 3C, both the chamfer line 7 on the camera side and the chamfer line 7a on the opposite side may be read. In that case, it is impossible to determine which is the chamfer line to be read. In this case, the reading line on the opposite side can be prevented from being read by increasing the illuminance of the illumination light applied to the reading position.

  FIG. 4 is a view showing the processing operation of the second opposing edge 9. From the state indicated by the imaginary line in FIG. 4A when the measurement of the first opposing edge 8 is completed, the table is turned 90 degrees in the direction of arrow A, the lower camera 6 is retracted to the outside, and the position of the tool 3 is determined. After the new setting, the workpiece 1 is sent to the tool 3 in the -Y direction, thereby chamfering the second opposing edge 9 (FIG. 4B). The corner chamfering is not necessary when machining the second opposing edge 9 because all four corners are finished when the first opposing edge 8 in FIG. 1 is machined. When the machining is completed, the tool 3 is retracted (FIG. 4C).

  FIG. 5 is a diagram showing an operation for accurately measuring the tilt error of the table at the time of processing the second opposing edge 9, and corresponds to FIG. 2 (a) because it is the same as the operation described in FIG. Only the figure to be shown is shown.

  FIG. 6 is a diagram showing an operation for measuring the machining dimension of the second opposing edge 9. In this embodiment, the measurement of the chamfer dimension of the corner is performed here. That is, the upper and lower cameras 5 and 6 read the front and rear corners 1a and 1b and the central portion of the edge 9 in the feed direction or a plurality of locations 9a along the edge 9, and the images and diagrams shown in FIGS. From the image similar to that shown in FIG. 3B, the chamfer dimensions e and f of the corners shown in FIG. 10, the chamfer width d of the second opposing edge 9, and the positioning marks 4 to the chamfer line 7. The distance b is measured. When this measurement is completed, the workpiece 1 returns to the position where it is first carried into the chamfering device, and is carried out to the next step by the carry-out device provided in the chamfering device.

  In this way, when the test workpiece or the workpiece to be inspected by sampling is measured, based on the measured value, the necessary correction value of the angle of the table 2 and the correction value of the width direction and the vertical direction of the tool 3 are calculated. When processing the subsequent plate material, the command value of the NC device is corrected with the calculated correction value, and the table angle position and the position in the width direction X and the vertical direction Z of the tool are set. The plate material that is not measured is processed by an operation of processing the first opposing edge in FIG. 1 and an operation of turning the plate material of FIG. 4 by 90 degrees to process the second opposing edge. The position of the plate material in FIG. 4C where the processing of the second facing edge has been completed is the same position as the plate material loading position, and is a device for loading and unloading a normal plate material provided at this position. It is also possible to carry out workpieces that have undergone sampling inspection.

The figure which showed the procedure which processes a 1st opposing edge The figure which showed the operation which measures the tilt error of the table Diagram showing machining dimension measurement operation The figure which showed the processing operation of the 2nd counter edge The figure which showed the operation | movement which measures the inclination error of the table at the time of the process of the 2nd opposing edge The figure which showed the operation | movement which measures the process dimension of a 2nd opposing edge Schematic perspective view showing equipment arrangement of chamfering device Schematic perspective view showing an example of device arrangement of a conventional chamfering device Perspective view showing an example of chamfering tool Partial plan view of plate material showing chamfer dimensions

Explanation of symbols

1 Plate 2 Table 3 Tool 4 Positioning Mark 5 Camera (Upper Camera)
6 Lower camera 7 Chamfer line

Claims (3)

A surface in a chamfering device that chamfers the four sides of the plate material with reference to the position of the mark read by a camera mounted on the chamfering device with a positioning mark at the position of the vertex of the right triangle on the plate material. A measuring method for measuring dimensions,
The two measurement marks attached in a direction orthogonal to the relative feed direction of the plate material with respect to the tool are read, a direction with respect to the feed direction of the plate material is determined, and side edges parallel to the feed direction are processed, and a first measurement step The plate material is fed in the feed back direction, the two marks attached in the feed direction on one of the two cameras are read, and the difference in the feed perpendicular direction between the two marks is detected. The surface in the chamfering apparatus, wherein the camera is moved to a position where the side edge of the plate material is read in two measurement steps, and then the plate material is sent to detect a processing dimension of the side edge by the two cameras. Measuring method of dimensions.   A lower camera (6) for reading the lower surface of the side edge of the plate material is installed, and the lower camera is moved to a position for reading the side edge of the plate material in the second measuring step, and then the plate material is sent to the two cameras. 2. The method for measuring a chamfer dimension in a chamfering apparatus according to claim 1, wherein a machining dimension above and below the side edge is detected by the two lower cameras. A positioning mark is attached to the plate material at the three apexes of a right triangle, and the four sides of the plate material are faced with reference to the position of the mark read by the upper camera placed above the plate mounting table of the chamfering device. A method for correcting a chamfer dimension in a chamfering apparatus for machining,
A lower camera (6) for reading the lower surface of the side edge of the plate material is installed, and the two marks attached in the direction perpendicular to the relative feed direction of the plate material to the tool are read to determine the direction with respect to the feed direction of the plate material. The side edge parallel to the feed direction is processed, the plate material is sent in the feed back direction in the first measurement step, and the two marks attached to the feed direction in one of the two upper cameras are read. The difference between the positions of the two marks in the direction perpendicular to the feed direction is detected, and in the second measurement step, the upper camera and the lower camera are moved to a position for reading the side edge of the plate material, and then the plate material is sent to the two pieces. The upper and lower cameras and two lower cameras detect the machining dimensions above and below the side edge,
The angle error of the table is calculated from the difference between the positions of the two marks detected in the first measurement step in the direction perpendicular to the feed direction, and the difference between the machining dimensions above and below the side edge detected in the second measurement step is calculated. Calculate the height error,
A method of correcting a chamfer dimension in a chamfering apparatus, wherein the command value of a table angle is corrected with the calculated angle error, and the command value of a tool height is corrected with the calculated height error.

Images