JP2006026845A - Adjustment method for tool position of chamfering machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize adjustment for a tool position by working of less dummy work in a short time in an adjustment method for a tool position in a chamfering machine for a side of a transparent substrate such as a glass substrate for a liquid crystal display panel. <P>SOLUTION: When working of upper chamfering width a and lower chamfering width b is required, the tool position is moved to a position where the lower chamfering width B becomes wider than the upper chamfering width A, the chamfering working of the dummy work 1d is performed and a lower chamfering line 3b and an upper chamfering line 3a of the dummy work 1d are detected. Thereby, the tool position required for performing working of the upper and lower chamfering width a, b required for the actual work is operated. If the tool position is set by an NC device or the like based on the operation result, it becomes possible to set the position of the tool at accuracy of ±20 micron. Repeating working of the dummy work is not required, an operation time is outstandingly shortened and accuracy of the tool position can be enhanced. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for adjusting a tool position in a chamfering machine for a side of a transparent substrate such as a glass substrate for a liquid crystal display panel, and the chamfering width of upper and lower ridge lines (edges) is a predetermined chamfering width. It is related with the method of setting the position of a tool.

  A glass substrate such as a liquid crystal display panel is divided into predetermined dimensions by cleaving (breaking and cutting) using its brittleness, but sharp edges are formed above and below the divided sides. The sharp edge of the glass damages the operator's hand or causes chipping or cracking, so that chamfering is performed to obliquely scrape off the top edge of the edge. As this chamfering tool, a rotating grindstone is usually used.

  FIG. 1 is a schematic perspective view of a chamfering machine that simultaneously processes upper and lower ridgelines 11a and 11b (see FIG. 2) of opposite sides 10 of a rectangular glass substrate 1, and 2 is a tool unit. The glass substrate 1 is fixed to the upper surface of a table (not shown) by vacuum suction or the like, and is chamfered over the entire length of the side by relative movement in a direction parallel to the processing side 10 with respect to the tool unit 2 of the table.

  The tool unit 2 shown in the drawing has upper and lower grindstone shafts 12a, 12b parallel to the machining edge 10, and one or a plurality of disc grindstones 5a, 5b are fixed to each grindstone shaft. As shown in FIG. 2, the upper and lower grindstones 5a and 5b have their outer peripheral surfaces 13a or end surface outer peripheral portions 13b in contact with the upper and lower ridge lines 11a and 11b of the glass substrate 1, and the grindstones 5a and 5b are shown by arrows in FIG. By rotating in the R direction, the upper and lower ridgelines 11a and 11b are chamfered simultaneously as shown in FIG. The chamfer widths (chamfer dimensions) a and b are predetermined, and the required accuracy is about ± 50 microns.

  The position of the tool unit 2 can be adjusted according to the thickness of the glass substrate 1 to be processed, the workpiece width, and the chamfer width. In the illustrated tool unit, the relative positions of the upper and lower grindstone shafts 12a and 12b. The relationship is fixed, and the position of the entire unit can be adjusted in the vertical direction (Z direction) and the work width direction (X direction). As understood from FIG. 2, when the tool unit 2 is moved upward, the bottom surface removal width b is widened and the top surface removal width a is narrowed. Moreover, if it moves to the X direction which leaves | separates from the glass substrate 1, both upper and lower chamfering widths a and b will become narrow. Accordingly, it is possible to set the upper surface chamfering a and the lower surface chamfering width b specified by the combination of the positions of the tool unit 2 in the vertical direction and the workpiece width direction. The change (error) in the chamfering width in the longitudinal direction of the processing edge 10 is corrected by the angle around the vertical axis of the table to which the glass substrate 1 is fixed.

In actual chamfered widths a and b of the processed glass substrate, errors occur due to wear of the grindstones 5a and 5b and thermal deformation of the machine. Therefore, the camera 4 installed above the side of the processed glass substrate detects the upper and lower chamfer lines (intersection lines between the chamfered oblique surface and the front and back surfaces of the substrate) 3a and 3b, and measures the chamfer widths a and b. And the operation | work of adjusting the position of the tool unit 2 is performed so that the difference of this measured value and the designated chamfering width may be corrected. This adjustment operation is performed every time when the workpiece is changed, or when the same workpiece is continuously machined more than a predetermined quantity, for each predetermined quantity.
Japanese Patent Laid-Open No. 2003-251551

  When the workpiece to be chamfered is a transparent substrate, as shown in FIG. 4, the chamfering lines 3 a and 3 b on the front and back surfaces of the workpiece can be detected by the camera 4 disposed above the substrate 1. Then, the chamfer widths a and b are measured from the detected positions of the upper and lower chamfer lines. As shown in FIG. 5, when the upper and lower chamfer widths a and b are substantially equal, When the width b is narrower than the top chamfer width a, an error occurs in the measured value. If the chamfer width measurement, the tool position adjustment, and the dummy workpiece machining are not repeated several times (3 to 5 times), the tool is It was happening that the position could not be set correctly.

  Accordingly, an object of the present invention is to obtain technical means capable of adjusting the tool position of the chamfering machine with a small number of dummy workpieces and therefore in a short time.

  The method for adjusting the tool position of the chamfering machine according to the present invention that has solved the above-mentioned problem is the following: In the adjustment method, the tool position is set so that the required chamfer width b of the lower ridge line is wider than the required chamfer width a of the upper ridge line by a predetermined difference amount d, and the dummy workpiece 1d is chamfered. The upper and lower chamfering widths A and B of the processed dummy workpiece 1d are measured by the optical measuring instrument 4 arranged above the substrate, and the measured values A and B and the required chamfering widths a and b are measured. A tool position when machining an actual workpiece is set based on the difference.

  When measurement is performed by a conventional method, when the bottom surface width b and the top surface width a are substantially the same or when the bottom surface width b is narrower than the top surface width a as shown in FIG. An error of about ± 50 microns was generated between the position of the bottom line 3b detected at 4 and the actual position. On the other hand, as shown in FIG. 5, when the bottom surface width b is wider than the top surface width a, the error between the position of the bottom surface line 3b detected by the camera 4 and the actual position is ± 20 microns. It was about.

  In the method of the present invention, the tool position is moved to a position where the lower surface chamfering width B is wider than the upper surface chamfering width A, away from the required chamfering widths a and b of the workpiece, and the chamfering of the dummy workpiece 1d is performed. The tool position required for machining the upper and lower chamfering widths a and b required for the actual workpiece by machining and detecting the lower surface machining line 3b and the upper surface machining line 3a of the dummy workpiece 1d. Is calculated to determine the tool position. The amount of movement of the tool to the tool position necessary for machining the actual workpiece with the specified chamfering widths a and b from the tool position moved for machining the dummy workpiece 1d is the upper and lower surfaces of the dummy workpiece 1d. It can be calculated using the measured values of the clearances A and B. Therefore, if the tool position is set with an NC device or the like based on this calculation result, it is possible to set the tool position with an accuracy of ± 20 microns, which eliminates the need for repeated machining of the dummy workpiece, which is economical. At the same time, the working time required for adjusting the tool position is greatly shortened, and the accuracy of the tool position can be increased compared to the prior art.

  The method of the present invention will be specifically described below with reference to the drawings. As shown in FIG. 2, it is assumed that the upper and lower ridge lines of the side of the transparent substrate 1 are required to be chamfered with chamfering widths a and b so that the respective angles are θ. At this time, when the lower surface chamfer width b is narrower than the dimension obtained by adding a predetermined expected error amount d to the upper surface chamfer width a, the lower surface chamfer width B of the dummy workpiece is at least d wider than the upper surface chamfer A. The tool unit 2 is set at a position raised by δH, and the dummy workpiece is chamfered.

  As shown in FIG. 6, the processed dummy workpiece has a lower chamfering width B that is wider than the upper chamfering width A. Therefore, a camera in which the upper and lower chamfering lines 3a and 3b of this dummy workpiece are installed above the workpiece. When detected at 4, the bottom chamfer 3b is detected by the camera 4 through the workpiece surface (surface not diagonally chamfered), so the upper and lower chamfering widths A and B are measured with an accuracy of ± 20 microns, respectively. can do.

If the deviations of the measured values A and B from the chamfer widths a and b to be processed are δa and δb,
A = a + δa
B = b + δb
It can be expressed as. If the diameter of the disc grindstones 5a and 5b is sufficiently larger than the chamfer widths a and b, the change in the chamfer angle θ when the tool unit 2 is moved by δH can be ignored. From
Move the tool unit 2 in the X direction away from the workpiece 1 by (δa + δb) / 2,
If the tool unit 2 is moved upward by (δa−δb) / 2 tan θ (which is a negative value in the example shown in the figure), the tool unit 2 has a chamfer width a in which the upper and lower ridge lines of the side of the workpiece 1 are designated. , B are set at positions to be processed.

  The tool to be chamfered is not limited to the one shown in the figure, for example, one having a structure for chamfering with a circular end face of a bowl-shaped grindstone, or one having a structure for machining with a flat portion of a disc grindstone. However, the tool position can be set in the same way. In the case of a structure that can individually adjust the position of the upper and lower whetstones that machine the upper and lower ridgelines, only one of the upper and lower whetstones is repositioned to process the dummy workpiece and measure the upper and lower chamfer width Thus, the positions of the upper and lower grindstones can be adjusted.

Perspective view showing an outline of chamfering of a rectangular glass substrate 1 is an enlarged front view of the main part of FIG. Enlarged front view showing edges of chamfered glass substrate Figure for detecting upper and lower chamfering lines with a camera installed above the glass substrate Figure similar to Figure 4 when the bottom chamfer width is narrow Illustration of chamfering and setting of chamfer width of dummy workpiece

Explanation of symbols

1 Transparent substrate
10 Sides a Chamfering width of the upper ridge line b Chamfering width of the lower ridge line A Chamfering width of the upper ridge line of the dummy workpiece B B Chamfering width of the lower ridge line of the dummy workpiece

Claims (1)

   In the method of adjusting the tool position of the chamfering machine that chamfers the upper and lower ridge lines of the side (10) of the transparent substrate (1), the chamfer width (b) of the lower ridge line is more than the chamfer width (a) of the upper ridge line. Chamfering the dummy workpiece (1d) by setting the tool position so that it is widened by a predetermined difference amount (d), and using the optical measuring instrument (4) placed above the substrate, the processed dummy workpiece (1d) Tool for measuring the vertical chamfer width (A, B) and machining the actual workpiece based on the difference between the measured value (A, B) and the required chamfer width (a, b) A method for adjusting a tool position of a chamfering machine, wherein the position is set.

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