TWI560027B - Method and apparatus of symmetrically chamfering substrate - Google Patents

Method and apparatus of symmetrically chamfering substrate

Info

Publication number
TWI560027B
TWI560027B TW103118707A TW103118707A TWI560027B TW I560027 B TWI560027 B TW I560027B TW 103118707 A TW103118707 A TW 103118707A TW 103118707 A TW103118707 A TW 103118707A TW I560027 B TWI560027 B TW I560027B
Authority
TW
Taiwan
Prior art keywords
symmetrically
substrate
chamfering substrate
symmetrically chamfering
chamfering
Prior art date
Application number
TW103118707A
Other languages
Chinese (zh)
Other versions
TW201515773A (en
Inventor
Myeongbo Han
Original Assignee
Corning Prec Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Prec Materials Co Ltd filed Critical Corning Prec Materials Co Ltd
Publication of TW201515773A publication Critical patent/TW201515773A/en
Application granted granted Critical
Publication of TWI560027B publication Critical patent/TWI560027B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
TW103118707A 2013-05-28 2014-05-28 Method and apparatus of symmetrically chamfering substrate TWI560027B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130060306A KR101452250B1 (en) 2013-05-28 2013-05-28 Method and appratus of symmetrically chamfering a substrate

Publications (2)

Publication Number Publication Date
TW201515773A TW201515773A (en) 2015-05-01
TWI560027B true TWI560027B (en) 2016-12-01

Family

ID=51985634

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103118707A TWI560027B (en) 2013-05-28 2014-05-28 Method and apparatus of symmetrically chamfering substrate

Country Status (5)

Country Link
US (2) US20140357160A1 (en)
JP (2) JP6451004B2 (en)
KR (1) KR101452250B1 (en)
CN (1) CN104209836B (en)
TW (1) TWI560027B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101395055B1 (en) * 2013-05-28 2014-05-14 삼성코닝정밀소재 주식회사 Method of determining flatness of a chmfer table
KR101452250B1 (en) * 2013-05-28 2014-10-22 코닝정밀소재 주식회사 Method and appratus of symmetrically chamfering a substrate
JP6921054B2 (en) * 2015-07-08 2021-08-18 コーニング インコーポレイテッド A method of providing a glass substrate support device and a flexible glass substrate support
CN113211235A (en) * 2021-05-10 2021-08-06 山西光兴光电科技有限公司 Polishing apparatus and polishing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006026845A (en) * 2004-07-20 2006-02-02 Nakamura Tome Precision Ind Co Ltd Adjustment method for tool position of chamfering machine

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JPH08243891A (en) * 1995-03-07 1996-09-24 Kao Corp Chamfer work device for substrate
JPH10289413A (en) * 1997-04-10 1998-10-27 Fujitsu Ltd Manufacture of magnetic head
JP3625685B2 (en) * 1999-04-15 2005-03-02 富士通株式会社 Lapping device and lapping method
JP2001246539A (en) * 2000-03-03 2001-09-11 Inst Of Physical & Chemical Res Grinding work method for non-axisymmetric aspherical mirror
JP4441823B2 (en) * 2003-11-26 2010-03-31 株式会社東京精密 Truing method and chamfering device for chamfering grindstone
CN101877305B (en) * 2005-04-19 2012-01-11 株式会社荏原制作所 Substrate processing apparatus
JP4742845B2 (en) * 2005-12-15 2011-08-10 信越半導体株式会社 Method for processing chamfered portion of semiconductor wafer and method for correcting groove shape of grindstone
JP4915146B2 (en) * 2006-06-08 2012-04-11 信越半導体株式会社 Wafer manufacturing method
JP4862896B2 (en) * 2007-01-31 2012-01-25 信越半導体株式会社 Chamfering apparatus for silicon wafer, method for manufacturing silicon wafer, and etched silicon wafer
US8640497B2 (en) * 2007-01-31 2014-02-04 Hoya Corporation Method of manufacturing glass substrate for magnetic disk and system for manufacturing glass substrate for magnetic disk
JP5301818B2 (en) * 2007-11-26 2013-09-25 中村留精密工業株式会社 Method for registering correction value in side processing apparatus for glass substrate
JP2009283650A (en) * 2008-05-22 2009-12-03 Sumco Corp Method for regenerating semiconductor wafer
JP5352331B2 (en) * 2009-04-15 2013-11-27 ダイトエレクトロン株式会社 Wafer chamfering method
JP5439066B2 (en) * 2009-07-06 2014-03-12 中村留精密工業株式会社 Method and apparatus for chamfering hard brittle plate
WO2011162163A1 (en) * 2010-06-21 2011-12-29 旭硝子株式会社 Glass substrate and method for manufacturing glass substrate
WO2012005019A1 (en) * 2010-07-08 2012-01-12 旭硝子株式会社 Glass substrate end surface evaluation method, glass substrate end surface processing method, and glass substrate
US8986072B2 (en) * 2011-05-26 2015-03-24 Corning Incorporated Methods of finishing an edge of a glass sheet
CN202212831U (en) * 2011-08-18 2012-05-09 北京京东方光电科技有限公司 Edging device
JP6050086B2 (en) * 2012-10-30 2016-12-21 ＡｖａｎＳｔｒａｔｅ株式会社 Manufacturing method of glass substrate
CN103111922B (en) * 2013-01-31 2015-04-01 广东富山玻璃机械有限公司 Multifunctional rapid four-edge edge grinding machine
KR101452250B1 (en) * 2013-05-28 2014-10-22 코닝정밀소재 주식회사 Method and appratus of symmetrically chamfering a substrate
JP6007889B2 (en) * 2013-12-03 2016-10-19 信越半導体株式会社 Chamfering apparatus and notchless wafer manufacturing method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006026845A (en) * 2004-07-20 2006-02-02 Nakamura Tome Precision Ind Co Ltd Adjustment method for tool position of chamfering machine

Also Published As

Publication number Publication date
JP6451004B2 (en) 2019-01-16
US20180304430A1 (en) 2018-10-25
JP2018100216A (en) 2018-06-28
KR101452250B1 (en) 2014-10-22
US20140357160A1 (en) 2014-12-04
TW201515773A (en) 2015-05-01
JP2014231471A (en) 2014-12-11
CN104209836B (en) 2017-01-11
CN104209836A (en) 2014-12-17

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