TWI586489B - Method for manufacturing glass substrates - Google Patents

Description

Method for manufacturing glass substrate

The present invention relates to a method of manufacturing a glass substrate.

A glass substrate for a flat panel display (FPD) such as a liquid crystal display or a plasma display is manufactured, for example, by an overflow down-draw method. In the overflow down-draw method, the molten glass which flows into the molded body and overflows flows down the surface of the formed body, and merges in the vicinity of the lower end of the formed body, thereby forming into a glass piece. The formed glass piece is cooled while being stretched downward, and cut into a specific size to manufacture a glass substrate. The glass substrate is bundled and shipped through an end surface processing step, a surface cleaning step, an inspection step, and the like.

In the step of cutting the formed glass sheet into a specific size, generally, a cutting method by a cutter or a laser is used. In the method of cutting a glass piece by a cutter, since the slit is mechanically added to the glass piece and cut, a crack having a depth of about several μm to 100 μm is formed on the end surface of the cut glass substrate. This crack causes deterioration of the mechanical strength of the glass substrate. Further, in the method of cutting a glass piece by laser, since the glass piece is cut by adding a slit to the glass piece by thermal stress, the end surface of the cut glass substrate becomes sharp and easily damaged. . The crack or sharp portion formed on the end surface of the cut glass substrate is removed by grinding and grinding the end faces. That is, in order to improve the mechanical strength of the glass substrate, suppress the occurrence of defects of the glass substrate, and facilitate the operation in the subsequent step, the end surface processing step of the glass substrate is performed.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-110648

As an example of the step of processing the end surface of the glass substrate, the patent document 1 (Japanese Patent Laid-Open Publication No. 2011-110648) discloses that the grinding glass is chamfered along the end surface of the cut glass substrate. The method. In this method, the position of the end surface of the glass substrate fixed to the stage is measured by a laser displacement meter, and the processing start position and the processing end position of the end surface of the grindstone are calculated. Specifically, the coordinates of the machining start position and the machining end position of the end face are calculated by the extrapolation interpolation method from the measured value of the laser displacement meter, and based on the difference between the coordinate and the coordinate to be the reference, The required grinding margin is corrected for the machining start position and machining end position of the end face.

However, in order to realize the space saving of the production line of the glass substrate, when the position measurement of the end surface of the glass substrate and the processing of the end surface are performed on the same platform in the end surface processing step, the position of the end surface of the glass substrate is used for measurement. Laser displacement meters are not suitable. For example, before the chamfering process is performed on the end surface of the glass substrate, when the grinding fluid is supplied to the contact portion between the chamfering grindstone and the end surface of the glass substrate, the grinding fluid adheres to the detecting portion of the laser displacement meter, thereby The detection accuracy of the displacement meter is reduced. Therefore, when the position measurement of the end surface of the glass substrate and the processing of the end surface are performed on the same platform, the method disclosed in Patent Document 1 for measuring the position of the glass substrate using a laser displacement meter is not easy to apply the glass substrate with high precision. The end faces are processed.

An object of the present invention is to provide a method for producing a glass substrate which can perform end surface processing of a glass substrate in a small space with high precision.

The method for producing a glass substrate of the present invention includes a substrate fixing step, a position information obtaining step, a processing position calculating step, and an end surface processing step. The substrate fixing step fixes the glass substrate placed on the platform to the platform. The location information acquisition step is fixed at flat The position information of the end face of the glass substrate of the table. The machining position calculation step calculates a machining start position and a machining end position of the chamfering grindstone for chamfering the end surface of the glass substrate based on the position information of the end surface of the glass substrate. In the end surface processing step, the end surface of the glass substrate is chamfered by supplying the grinding liquid to the contact portion between the chamfering grindstone and the end surface, and moving the chamfering grindstone from the processing start position to the processing end position. The chamfering grindstone can be moved along the first axis so that the distance to the end surface of the glass substrate can be changed. The chamfering grindstone is movable along a second axis orthogonal to the first axis so as to face the end surface of the glass substrate. In the position information obtaining step, position information of a plurality of points of the end surface of the glass substrate is obtained by the first sensor and the second sensor. The first sensor is coupled to the chamfered grindstone and movable together with the chamfering grindstone. The second sensor is movable along the first axis. In the machining position calculation step, a machining correction value that is a distance required to move the chamfering grindstone to the machining start position along the first axis is calculated.

In the method for producing a glass substrate, first, the position of the end surface of the glass substrate fixed on the stage is measured, and second, the end surface of the glass substrate is processed by chamfering the grindstone without moving the glass substrate. The end surface processing of the glass substrate is performed by supplying a grinding liquid to the contact portion between the end surface and the chamfering grindstone in a wet environment. The first sensor and the second sensor that measure the position of the end surface of the glass substrate are contact sensors that do not reduce the accuracy of the detection of the grinding fluid. The processing start position and the processing end position of the end surface of the glass substrate were calculated by the first sensor and the second sensor. Before the processing of the end faces of the glass substrate, the chamfering grindstone is moved to the processing start position by changing the machining correction value only by the position of the chamfering grindstone. Further, by moving the chamfering grindstone from the machining start position to the machining end position, the end surface of the glass substrate is processed by the chamfering grindstone.

Therefore, when the glass substrate is produced by performing the end surface processing of the glass substrate in a wet environment, the position of the end surface of the glass substrate and the processing of the end surface of the glass substrate can be performed on the same platform. The end face processing of the glass substrate is performed in a small space. Moreover, by the end face of the glass substrate before processing, based on the position of the end face The information is corrected for the position of the chamfering grindstone, and the end surface processing of the glass substrate can be performed with high precision.

Further, in the position information obtaining step, it is preferable that the position information of the end surface in the first axial direction obtained by the first sensor and the position information of the end surface in the first axial direction obtained by the second sensor are used. Association. In this case, the position information acquisition step moves the first sensor along the second axis to the same position as the second sensor in the second axis direction before acquiring the position information, and further uses the first sense. The detector takes the position of the second sensor in the first axis direction.

Further, in the machining position calculation step, it is preferable to calculate the machining correction value based on the first distance, the second distance, and the third distance. The first distance is a distance between the first sensor and the second sensor in the second axial direction. The second distance is the distance between the first sensor and the chamfering grindstone in the second axial direction. The third distance is a distance in the first axial direction between the reference position of the predetermined end face and the position of the end face measured by the second sensor.

Further, in the machining position calculation step, the machining correction value is preferably calculated by dividing the value obtained by multiplying the second distance by the third distance by the first distance.

In the method for producing a glass substrate, the first sensor and the first sensor are accurately measured by correlating the position of the first sensor with the position of the second sensor before measuring the position of the end surface of the glass substrate. 2 The distance between the sensors. Further, since the first sensor is coupled to the chamfering grindstone, the distance between the first sensor and the chamfering grindstone is predetermined. Therefore, the processing of the chamfering grindstone can be calculated based on the positional relationship between the first sensor, the second sensor, and the chamfering grindstone, and the position of the end surface of the glass substrate measured by the second sensor. Correction value.

Further, the first sensor is preferably disposed at a height position different from the height position of the chamfering grindstone, and is movable in the vertical direction together with the chamfering grindstone. Further, in the position information obtaining step, it is preferable to adjust the height position of the first sensor so that the height position of the first sensor is the same as the height position of the end surface. Further, in the end surface processing step, it is preferable that the height position of the chamfered grindstone is the same as the height position of the end surface, and the adjustment is performed. The height position of the angle grindstone.

In the method for producing a glass substrate, when the position of the end surface of the glass substrate is measured by the first sensor, since the chamfering grindstone is located at a different height from the glass substrate, the chamfering grindstone does not interfere with the 1 Determination of the end face of the sensor. On the other hand, when the end surface of the glass substrate is processed by the chamfering grindstone, since the first sensor is located at a different height from the glass substrate, the first sensor does not hinder the processing of the end surface by the chamfering grindstone.

The method for producing a glass substrate of the present invention can perform end surface processing of a glass substrate in a small space with high precision.

10‧‧‧ glass substrate

11‧‧‧ end face

11a‧‧‧Extension line

12‧‧‧ end face

13‧‧‧ end face

14‧‧‧ end face

19‧‧‧floor

20‧‧‧Glass substrate transfer device

22‧‧‧ Robot

30‧‧‧Adsorption platform (platform)

32‧‧‧Support pins

40, 42‧‧‧Chamfering grindstone

50, 52‧‧‧1st sensor

60, 62‧‧‧2nd sensor

64‧‧‧ cylinder

70‧‧‧Mobile agencies

72‧‧‧Mobile agencies

80‧‧‧grinding fluid supply device

90‧‧‧Water supply device

100‧‧‧Glass substrate end face processing device

140‧‧‧Chamfering grindstone

140a‧‧‧Diamond grinding wheel

140b‧‧‧Resin bonded grinding wheel

150‧‧‧Rotary axis

D‧‧‧Process correction value

L1‧‧‧1st distance

L2‧‧‧2nd distance

L3‧‧‧3rd distance

P1‧‧‧1st point

P2‧‧‧2nd point

P3‧‧‧3rd point

P4‧‧‧4th point

P5‧‧‧5th point

T1‧‧‧ triangle

T2‧‧‧ triangle

Y axis ‧‧‧1st axis

X-axis ‧‧‧2nd axis

ZL‧‧‧ zero baseline

Θ‧‧‧ angle

Fig. 1 is a flow chart showing the steps of manufacturing the glass substrate of the embodiment.

Fig. 2 is a plan view showing a glass substrate end surface processing apparatus according to an embodiment.

Fig. 3 is a side view of the glass substrate end surface processing apparatus of the embodiment.

4 is a view showing a state in which a glass substrate transfer device mounts a glass substrate on an adsorption stage.

Figure 5 is a flow chart showing the processing steps of the end faces of the glass substrate.

Fig. 6 is a schematic view showing the positional relationship between the end surface of the glass substrate, the chamfering grindstone, the first sensor, and the second sensor.

Fig. 7 is a schematic view showing the positional relationship between the end surface of the glass substrate, the chamfering grindstone, the first sensor, and the second sensor.

Fig. 8 is an external view of a chamfered grindstone of a variation.

(1) Outline of the manufacturing steps of the glass substrate

An embodiment of a method of manufacturing a glass substrate of the present invention will be described with reference to the drawings. First, a manufacturing procedure of the glass substrate 10 processed by the glass substrate end surface processing apparatus 100 used in the present embodiment will be described. Glass substrate 10 is used for liquid The manufacture of flat panel displays (FPDs) such as crystal displays, plasma displays, and organic EL (Electro Luminescence) displays. The glass substrate 10 has a thickness of, for example, 0.2 mm to 0.8 mm, and has a size of 680 mm to 2200 mm in length and 880 mm to 2500 mm in width.

As an example of the glass substrate 10, the glass which has the following composition is mentioned.

(a) SiO ₂ : 50% by mass to 70% by mass, (b) Al ₂ O ₃ : 10% by mass to 25% by mass, (c) B ₂ O ₃ : 5% by mass to 18% by mass, (d) MgO :O% by mass% to 10% by mass, (e) CaO: 0% by mass to 20% by mass, (f) SrO: 0% by mass to 20% by mass, (g) BaO: 0% by mass to 10% by mass, (h) RO: 5 mass% to 20 mass% (R is at least one selected from the group consisting of Mg, Ca, Sr, and Ba), and (i) R' ₂ O: 0% by mass to 2.0% by mass (R' is selected from At least one of Li, Na and K), (j) is at least one metal oxide selected from the group consisting of SnO ₂ , Fe ₂ O ₃ and CeO ₂ .

Further, the glass having the above composition allows other trace components to be present in the range of less than 0.1% by mass.

FIG. 1 is a view showing an example of a flow chart of a manufacturing step of the glass substrate 10. The manufacturing steps of the glass substrate 10 mainly include a forming step (step S1), a plate-shaped cutting step (step S2), a cutting step (step S3), a surface roughening step (step S4), and an end surface processing step (step S5). And a washing step (step S6), an inspection step (step S7), and a packing step (step S8).

In the forming step S1, the molten glass obtained by heating the glass raw material is continuously formed into a glass piece by a down-draw method or a floating method. For the formed glass piece, the temperature is controlled in such a manner that no deformation and warpage are caused, and the glass is cooled to the cold spot of the glass. under.

In the plate-like cutting step S2, the glass piece formed in the forming step S1 is cut to obtain a plain glass having a specific size.

In the cutting step S3, the plain plate glass obtained in the sheet-like cutting step S2 is cut to obtain the glass substrate 10 of the product size. In general, plain glass is cut using a cutter or a laser.

In the surface roughening step S4, surface roughening treatment for increasing the surface roughness of the glass substrate 10 obtained in the cutting step S3 is performed. The surface roughening treatment of the glass substrate 10 is, for example, wet etching using an etchant containing hydrogen fluoride.

In the end surface processing step S5, the end surface processing of the glass substrate 10 subjected to the surface roughening treatment in the surface roughening step S4 is performed. The end face processing is, for example, chamfering of the end surface of the glass substrate 10 and chamfering of the glass substrate 10.

In the cleaning step S6, the glass substrate 10 which has been subjected to the end surface processing in the end surface processing step S5 is cleaned. In the glass substrate 10, foreign matter such as the cutting of the factor plate glass, the minute glass piece produced by the end surface processing of the glass substrate 10, or the organic matter existing in the environment is adhered. These foreign matters are removed by cleaning the glass substrate 10.

In the inspection step S7, the glass substrate 10 which has been cleaned in the cleaning step S6 is inspected. Specifically, the shape of the glass substrate 10 is measured, and the defects of the glass substrate 10 are optically detected. The defects of the glass substrate 10 are, for example, scratches and cracks on the surface of the glass substrate 10, foreign matter adhering to the surface of the glass substrate 10, and minute bubbles existing inside the glass substrate 10.

In the packing step S8, the glass substrate 10 which has passed the inspection in the inspection step S7 and the spacer paper for protecting the glass substrate 10 are alternately laminated on the pallet and bundled. The bundled glass substrate 10 is shipped to a manufacturer of FPD (Flat Panel Display).

(2) Composition of the glass substrate end face processing device

2 is a plan view of the glass substrate end surface processing apparatus 100. Fig. 3 is a side view of the glass substrate end surface processing apparatus 100 as seen from the direction of the arrow III shown in Fig. 2. The glass substrate end surface processing apparatus 100 is an apparatus for chamfering the end surface of the glass substrate 10 in the horizontal state in the end surface processing step S5. The glass substrate end surface processing apparatus 100 mainly includes: a glass substrate transfer device 20; an adsorption stage 30; a pair of chamfering grindstones 40, 42; a pair of first sensors 50, 52; and a pair of second sensors 60, 62 a pair of moving mechanisms 70, 72; a grinding fluid supply device 80; a water supply device 90; and a control device (not shown).

The glass substrate 10 processed by the glass substrate end surface processing apparatus 100 has a rectangular shape. The glass substrate 10 has end faces 11, 12 parallel to its long sides, and end faces 13, 14 parallel to its short sides.

As shown in FIG. 2, a two-dimensional orthogonal coordinate system including an X-axis and a Y-axis is set on a plane parallel to the surface of the glass substrate 10. The Z axis orthogonal to the plane including the X axis and the Y axis and oriented in the vertical direction is set. The X-axis orientation is from the pair of first sensors 50 and 52 toward the pair of second sensors 60 and 62, and the Y-axis is oriented from the first sensor 50 toward the first sensor 52. direction.

Hereinafter, the step of chamfering the end faces 11 and 12 of the glass substrate 10 parallel to the long sides of the glass substrate end surface processing apparatus 100 will be described. However, the following description can also be applied to the step of chamfering the end faces 13, 14 of the glass substrate 10 parallel to the short sides of the glass substrate end face processing apparatus 100.

(2-1) Glass substrate conveying device

The glass substrate transfer device 20 is a robot that transports the glass substrate 10. The glass substrate transfer device 20 transports the glass substrate 10 and mounts the glass substrate 10 on the adsorption stage 30, or lifts the glass substrate 10 placed on the adsorption stage 30 to transport the glass substrate 10.

4 is a view showing a state in which the glass substrate transfer device 20 mounts the glass substrate 10 on the adsorption stage 30. The glass substrate transfer device 20 includes a comb-shaped robot 22 having a plurality of teeth. The robot 22 can adsorb and hold the lower surface of the glass substrate 10. Glass substrate transfer The device 20 can change the position of the robot 22 holding the glass substrate 10 or rotate it in a plane parallel to the horizontal plane. As shown in FIG. 4, the glass substrate transfer device 20 can insert the teeth of the robot 22 between the support pins 32 of the adsorption platform 30.

(2-2) adsorption platform

The adsorption platform 30 is shown in FIG. 4 and has a plurality of support pins 32. The support pins 32 are attached to the upper surface of the adsorption stage 30 at a specific interval in the X-axis direction and the Y-axis direction. A plurality of suction holes (not shown) for adsorbing the lower surface of the glass substrate 10 placed on the adsorption stage 30 are formed on the upper surface of the adsorption stage 30. The adsorption stage 30 fixes the placed glass substrate 10 by the suction force of the suction of the suction holes. The upper surface of the adsorption platform 30 has a rectangular shape. The long side of the upper surface of the adsorption platform 30 is parallel to the X axis, and the short side of the upper surface of the adsorption platform 30 is parallel to the Y axis. The lengths of the long sides and the short sides of the upper surface of the adsorption stage 30 are shorter than the sides of the glass substrate 10 parallel to the X-axis and the sides parallel to the Y-axis by 5 mm to 8 mm, respectively.

The process in which the glass substrate 10 is placed on the adsorption stage 30 by the glass substrate transfer apparatus 20 will be described. First, the robot 22 holding the glass substrate 10 is lowered in such a manner that the teeth of the robot 22 are positioned between the support pins 32. The robot 22 is lowered to a height position at which the support pin 32 is in contact with the lower surface of the glass substrate 10. Next, the adsorption by the glass substrate 10 of the robot 22 is released. Thereby, the glass substrate 10 is in a state of being supported only by the support pins 32. Next, the robot 22 is moved horizontally, and the robot 22 is pulled out between the support pins 32. Next, the support pins 32 are lowered, and the glass substrate 10 is placed on the adsorption stage 30. Next, the glass substrate 10 is fixed on the adsorption stage 30 by suction of the suction holes.

The process of taking out the glass substrate 10 placed on the adsorption stage 30 by the glass substrate transfer apparatus 20 will be described. First, the suction of the suction holes is released, and the support pins 32 are raised, and the glass substrate 10 is supported only by the support pins 32. Next, the robot 22 is moved in the horizontal direction and inserted between the support pins 32 of the adsorption platform 30. Second, start by The adsorption of the glass substrate 10 of the robot 22 causes the robot 22 to rise, and the glass substrate 10 is lifted. Next, the glass substrate 10 is transferred to the subsequent step by the action of the robot 22.

(2-3) chamfering grindstone

The pair of chamfering grindstones 40, 42 are grinding wheels for chamfering the end faces 11, 12 of the glass substrate 10, respectively. The chamfering grindstones 40, 42 are attached to the moving mechanisms 70, 72, respectively.

The chamfering grindstones 40 and 42 are movable in the X-axis direction, the Y-axis direction, and the Z-axis direction. The positions of the chamfering grindstones 40 and 42 in the X-axis direction and the Y-axis direction are respectively adjusted by the moving mechanisms 70 and 72. The positions of the chamfering grindstones 40 and 42 in the Z-axis direction can be arbitrarily adjusted by servo actuators (not shown) provided in the moving mechanisms 70 and 72, respectively.

The chamfering grindstones 40, 42 are, for example, diamond grinding wheels and resin bonded grinding wheels. The diamond grinding wheel is, for example, a grinding wheel obtained by solidifying diamond abrasive grains with an iron-containing metal-based bonding agent. The diamond abrasive particles are, for example, diamond abrasive grains having a particle size of #400. The resin-bonded grinding wheel is, for example, a grinding wheel obtained by solidifying abrasive grains which are generally used, by a resin-based bonding agent having flexibility and elasticity. The particle size of the abrasive grains is, for example, about #300 to #500 as defined in JIS R6001-1987.

(2-4) 1st sensor

The pair of first sensors 50 and 52 are sensors for measuring the positions of the end faces 11 and 12 of the glass substrate 10, respectively. Hereinafter, the positions of the end faces 11 and 12 are indicated by the positions of the measurement points located in the end faces 11 and 12 in the X-axis direction and the positions in the Y-axis direction. The first sensors 50 and 52 are attached to the moving mechanisms 70 and 72, respectively.

The first sensors 50 and 52 are movable in the X-axis direction, the Y-axis direction, and the Z-axis direction. The positions of the first sensors 50 and 52 in the X-axis direction and the Y-axis direction are adjusted by the moving mechanisms 70 and 72, respectively. The positions of the first sensors 50 and 52 in the Z-axis direction can be arbitrarily adjusted by servo actuators (not shown) provided in the moving mechanisms 70 and 72, respectively.

The first sensors 50 and 52 are contact sensors. In order to measure the positions of the end faces 11, 12, first, the height positions of the first sensors 50, 52 (i.e., the positions in the Z-axis direction) are adjusted. It is the height position of the end faces 11, 12 of the glass substrate 10. Next, the positions of the first sensors 50 and 52 in the Y-axis direction are adjusted so that the front ends of the first sensors 50 and 52 are in contact with the end faces 11 and 12 of the glass substrate 10. Next, the coordinates of the front end portions of the first sensors 50 and 52 that are in contact with the end surface 11 of the glass substrate 10 are measured. The "coordinate" includes the position in the X-axis direction and the position in the Y-axis direction.

As shown in FIG. 2, the first sensors 50 and 52 measure the positions of the end faces 11 and 12 in the vicinity of one end of the end faces 11 and 12 of the glass substrate 10. On the other hand, as shown in FIG. 2, the second sensors 60 and 62 measure the positions of the end faces 11 and 12 in the vicinity of the other end faces of the end faces 11 and 12 of the glass substrate 10.

(2-5) 2nd sensor

The pair of second sensors 60 and 62 are sensors for measuring the positions of the end faces 11 and 12 of the glass substrate 10, respectively. The second sensors 60, 62 are independently movable from the moving mechanisms 70, 72, respectively. The second sensors 60 and 62 are attached to the air cylinder 64 provided on the bottom plate 19 as shown in FIG. Further, the cylinder 64 may also be supported by a support member attached to the base of the adsorption platform 30.

The second sensors 60 and 62 are movable in the Y-axis direction and the Z-axis direction. The positions of the second sensors 60 and 62 in the Y-axis direction are adjusted in the high speed mode or the low speed mode by servo actuators (not shown) connected to the second sensors 60 and 62. The position of the second sensors 60, 62 in the Z-axis direction is adjusted by the air cylinder 64.

The second sensors 60 and 62 are contact sensors. In order to measure the positions of the end faces 11, 12, first, the height positions of the second sensors 60, 62 are adjusted to the height positions of the end faces 11, 12 of the glass substrate 10. Next, the positions of the second sensors 60 and 62 in the Y-axis direction are adjusted so that the front ends of the second sensors 60 and 62 are in contact with the end faces 11 and 12 of the glass substrate 10. Next, the coordinates of the front end portions of the second sensors 60 and 62 which are in contact with the end surface 11 of the glass substrate 10 are measured.

(2-6) Mobile agency

The pair of moving mechanisms 70 and 72 are units that are movable in the X-axis direction and the Y-axis direction. shift The moving mechanism 70 is a unit that mounts the chamfering grindstone 40 and the first sensor 50. The moving mechanism 72 is a unit that mounts the chamfering grindstone 42 and the first sensor 52. In the moving mechanism 70, the height position of the first sensor 50 is different from the height position of the chamfering grindstone 40. In the moving mechanism 72, the height position of the first sensor 52 is different from the height position of the chamfering grindstone 42.

The moving mechanisms 70 and 72 can independently adjust the positions of the chamfering grindstones 40 and 42 in the Z-axis direction and the positions of the first sensors 50 and 52 in the Z-axis direction by the servo actuators, respectively. The moving mechanisms 70 and 72 fix the relative positions of the first sensors 50 and 52 with respect to the X-axis direction and the Y-axis direction of the chamfering grindstones 40 and 42, respectively. Therefore, the distance between the chamfer grindstone 40 and the first sensor 50 in the X-axis direction and the Y-axis direction, and the X-axis direction and the Y-axis direction between the chamfer grindstone 42 and the first sensor 52 The distance is constant and is preset.

(2-7) Grinding fluid supply device

As shown in FIG. 2, the grinding fluid supply device 80 is a device that is disposed on the side of the glass substrate 10 and that is in the vicinity of the chamfering grindstones 40 and 42 and that blows the grinding liquid toward the end faces 11 and 12 of the glass substrate 10. . The grinding liquid is, for example, water, water to which a surfactant is added, or water to which another pharmaceutical agent is added. Further, as the grinding liquid, a liquid remaining in the glass substrate 10 after the cleaning step S6 and a liquid which promotes deterioration of the substrate end surface processing apparatus 100 are not used. Although not shown in FIG. 2 and FIG. 3, a protective layer for preventing the grinding liquid from adhering to the surface of the glass substrate 10 is provided above the glass substrate 10.

Since the grinding fluid has a small surface tension, it is easy to enter the contact point of the end faces 11, 12 of the glass substrate 10 and the chamfering grindstones 40 and 42, that is, the grinding point. Therefore, the grinding liquid has an effect of rinsing foreign matter such as glass fine particles generated by grinding of the glass substrate 10. Further, the grinding fluid has an effect of cooling the grinding point which is liable to become a high temperature by friction. In addition, when the surfactant used in the washing step S6 is used as the grinding liquid, even if the grinding liquid adheres to the surface of the glass substrate 10, air bubbles remain, and the first sensing is used as the contact sensor. The devices 50, 52 and the second sensors 60, 62 can also accurately measure the positions of the end faces 11, 12 of the glass substrate 10.

(2-8) Water supply device

As shown in FIG. 3, the water supply device 90 is provided above the glass substrate 10 and blows water to the end faces 11 and 12 of the glass substrate 10. By processing the end faces 11 and 12 of the glass substrate 10 by the chamfering grindstones 40 and 42, the glass flakes which are fine pieces of the glass are scattered from the end faces 11 and 12. The water supply device 90 ejects water from the inner side of the surface of the glass substrate 10 to the end faces 11 and 12 to form a water film. Thereby, the water supply device 90 can reduce the amount of glass swarf scattered to the inside of the surface of the glass substrate 10. Therefore, the water supply device 90 can suppress the amount of glass swarf attached to the surface of the glass substrate 10.

(2-9) Control device

The control device is, for example, a computer that controls the operation of the glass substrate end face processing device 100. The control device individually controls the glass substrate transfer device 20, the adsorption stage 30, a pair of chamfering grindstones 40, 42, a pair of first sensors 50, 52, a pair of second sensors 60, 62, and a pair of movements The actions of the mechanisms 70, 72 and the grinding fluid supply device 80. Next, a procedure of chamfering the end faces 11 and 12 of the glass substrate 10 by the control device will be described with respect to the glass substrate end surface processing apparatus 100.

(3) Action of the glass substrate end face processing device

5 is a flow chart showing the procedure of chamfering the end faces 11 and 12 of the glass substrate 10 by the glass substrate end surface processing apparatus 100. 6 and 7 are schematic views showing the positional relationship between the end surface 11 of the glass substrate 10, the chamfering grindstone 40, the first sensor 50, and the second sensor 60. Hereinafter, the position of the end surface 11 of the glass substrate 10 and the chamfering of the end surface 11 by the chamfering grindstone 40 are measured in the first sensor 50 and the second sensor 60 as described above with reference to FIGS. 6 and 7. The steps are explained. The following description can also be applied to the steps in which the first sensor 52 and the second sensor 62 measure the position of the end face 12 of the glass substrate 10 and the chamfering grindstone 42 chamfers the end face 12.

First, in step S11, the glass substrate transfer device 20 transfers the glass substrate 10 onto the adsorption stage 30. The glass substrate 10 placed on the adsorption platform 30 is not in position In the case of the adjustment, the adsorption platform 30 is fixed by the adsorption force of the plurality of suction holes formed on the upper surface of the adsorption platform 30.

Next, in step S12, the positions of the end faces 11 of the glass substrate 10 are measured by the first sensor 50 and the second sensor 60. Specifically, first, the height position (position in the Z-axis direction) of the first sensor 50 and the second sensor 60 is adjusted to the height position of the glass substrate 10, and the chamfered grindstone 40 is not bonded to the glass substrate. In the manner of 10 contact, the height position of the chamfering grindstone 40 is adjusted to a height position above or below the glass substrate 10. Then, the first sensor 50 and the second sensor 60 are moved in the Y-axis direction and brought into contact with the end surface 11, and the first point P1 at which the front end portion of the first sensor 50 is in contact with the end surface 11 is measured. The coordinates and the coordinates of the second point P2 at which the front end of the second sensor 60 is in contact with the end surface 11.

Next, in step S13, it is determined whether or not the glass substrate 10 measured in step S12 is the first glass substrate 10 of each manufacturing lot of the glass substrate 10. When the glass substrate 10 is the first glass substrate 10 of each manufacturing lot, it progresses to step S14. When the glass substrate 10 is not the first glass substrate 10 of each manufacturing lot, it progresses to step S15.

Next, in step S14, the position information of the first sensor 50 is associated with the position information of the second sensor 60. Step S14 is a step in which only one step is performed at the start of each manufacturing lot of the glass substrate 10. In step S14, first, the height position of the second sensor 60 is lowered, the first sensor 50 is moved in the X-axis direction, and the first sensor 50 is moved to the second sensor 60. The position in the X-axis direction is the same. Next, the first sensor 50 is moved in the Y-axis direction, and the first sensor 50 is moved to the same position as the position of the second sensor 60 in the Y-axis direction. In this state, the coordinates of the front end portion of the first sensor 50 are measured, and the position information of the first sensor 50 is associated with the position information of the second sensor 60. At this time, the coordinates of the coordinates of the first sensor 50, that is, the position in the X-axis direction and the Y-axis direction are the same as the coordinates of the second sensor 60. Therefore, even if the first sensor 50 and the second sensor 60 are moved in the future, the relative position between the first sensor 50 and the second sensor 60, that is, the distance can be always obtained. Furthermore, not only the first sensor is performed at the beginning of each manufacturing lot in step S14. In association with the second sensor 60, the first sensor 50 may be performed at a time point after processing a specific number of glass substrates 10 or at a time point after a specific time has elapsed since the start of the manufacturing lot. Associated with the second sensor 60.

Next, in step S15, the machining correction value D is calculated, and the machining start position and the machining end position required for chamfering the end surface 11 of the glass substrate 10 by the chamfering grindstone 40 are calculated. The machining correction value D is a distance required to move the chamfering grindstone 40 in the Y-axis direction to the machining start position.

In order to calculate the machining correction value D, first, the zero reference line ZL is set in the plane including the X axis and the Y axis. The zero reference line ZL is a reference for moving the chamfering grindstone 40 only in the Y-axis direction by the machining correction value D. As shown in FIGS. 6 and 7, the zero reference line ZL connects the third point P3 on the outer circumference of the chamfer grindstone 40 to the first point P1. The third point P3 is the point closest to the end face 12 of the opposite side of the end face 11 machined by the chamfering grindstone 40. In FIGS. 6 and 7, the zero reference line ZL is parallel to the X axis, but may not be parallel to the X axis. The orientation of the zero reference line ZL is determined by the positional relationship between the chamfered grindstone 40 attached to the moving mechanism 70 and the first sensor 50.

In order to calculate the machining correction value D, the first distance L1, the second distance L2, and the third distance L3 shown in FIGS. 6 and 7 are obtained. The first distance L1 is a distance between the first sensor 50 and the second sensor 60 in the X-axis direction. Specifically, the first distance L1 is a distance between the first point P1 and the second point P2 in the X-axis direction. Since the first distance L1 is related to the position information of the second sensor 60 in step S14, the position information of the first sensor L1 can be easily obtained by calculation. The second distance L2 is the distance between the first sensor 50 and the chamfering grindstone 40 in the X-axis direction. Specifically, the second distance L2 is a distance between the first point P1 and the third point P3 in the X-axis direction. Since the distance between the first sensor 50 and the chamfering grindstone 40 is fixed in the X-axis direction and the Y-axis direction, the second distance L2 can be obtained in advance. The third distance L3 is the distance between the fourth point P4 and the second point P2 shown in FIGS. 6 and 7 in the Y-axis direction. The fourth point P4 is a coordinate on the zero reference line ZL at the position of the second sensor 60 in the X-axis direction. The third distance L3 is because the position information of the first sensor 50 has been in contact with the position information of the second sensor 60 in step S14. Therefore, it can be easily obtained by calculation. Further, as shown in FIGS. 6 and 7, the fifth point P5 which is the machining start position of the chamfering grindstone 40 is defined. The fifth point P5 is located on the extension line 11a of the end surface 11, and has a point in the X-axis direction which is the same as the position of the third point P3 in the X-axis direction. The fifth point P5 can be easily obtained by calculation.

In FIGS. 6 and 7, the triangle T1 including the first point P1, the second point P2, and the fourth point P4 is similar to the triangle T2 including the first point P1, the third point P3, and the fifth point P5. Therefore, by calculation, the machining correction value D which is the distance between the third point P3 and the fifth point P5 can be calculated. Specifically, the machining correction value D is calculated by dividing the value obtained by multiplying the second distance L2 by the third distance L3 by the first distance L1. Further, the grinding allowance of the grinding process of the chamfering grindstone 40 may be further added to the calculated machining correction value D. The grinding allowance is, for example, several μm to 100 μm.

Next, in step S16, the position of the chamfering grindstone 40 is corrected based on the machining correction value D calculated in step S15. Specifically, first, the height position of the chamfer grindstone 40 is adjusted to the height position of the glass substrate 10, and the height of the first sensor 50 is set so that the first sensor 50 does not contact the glass substrate 10. The position is adjusted to a height position above or below the glass substrate 10. Moreover, the height position of the second sensor 60 is adjusted to a height position above or below the glass substrate 10 so that the second sensor 60 does not contact the glass substrate 10. Next, the chamfering grindstone 40 is moved only by the machining correction value D in the Y-axis direction. Thereby, the position of the third point P3 of the chamfer grindstone 40 becomes the fifth point P5 which is the processing start position of the end surface 11.

Next, in step S17, the chamfer grindstone 40 is moved from the fifth point P5 which is the machining start position to the second point P2 which is the machining end position, and the end surface 11 is ground. At this time, the grinding fluid is supplied to the contact portion between the end surface 11 and the chamfering grindstone 40 by the grinding fluid supply device 80.

Further, the machining correction value calculated in the step of chamfering one end surface 12 of the opposite end surface 11 of the glass substrate 10 by the chamfering grindstone 42 is performed on the end surface 11 by the chamfering grindstone 40 The machining correction value D calculated in the above steps of the corner is only different in sign, and absolutely The relationship is equal.

(4) Features

(4-1)

The glass substrate end surface processing apparatus 100 of the present embodiment first fixes the glass substrate 10 to the adsorption stage 30 without performing position adjustment, and secondly measures the positions of the end faces 11 and 12 of the glass substrate 10, and secondly chamfers the grindstones 40 and 42. The end faces 11, 12 are ground and chamfered. The chamfering of the end faces 11 and 12 is performed by supplying a grinding fluid to the contact portions of the end faces 11, 12 and the chamfering grindstones 40, 42 in a humid environment. The first sensors 50 and 52 and the second sensors 60 and 62 that measure the positions of the end faces 11 and 12 are contact sensors. Therefore, even if the grinding fluid adheres to the first sensors 50 and 52 and the second sensors 60 and 62, the detection accuracy does not decrease.

When the glass substrate end surface processing apparatus 100 performs chamfering processing of the end faces 11 and 12 of the glass substrate 10 in a humid environment, the position of the end faces 11 and 12 of the glass substrate 10 and the glass can be measured on the same adsorption stage 30. Processing of the end faces 11, 12 of the substrate 10. Therefore, the glass substrate end surface processing apparatus 100 can perform chamfering of the end faces 11, 12 of the glass substrate 10 in a small space.

(4-2)

In the glass substrate end surface processing apparatus 100 of the present embodiment, the processing start position and the processing end position of the end faces 11 and 12 of the glass substrate 10 are calculated in advance using the first sensors 50 and 52 and the second sensors 60 and 62. At this time, the machining correction value which is the distance required to move the chamfering grindstones 40 and 42 to the machining start position in the Y-axis direction is calculated. Further, before the machining of the end faces 11, 12, the chamfering grindstones 40, 42 can be set to the machining start position by moving only the machining correction value in the Y-axis direction. As a result, the glass substrate end surface processing apparatus 100 can accurately process the end faces 11 and 12 of the glass substrate 10 by moving the chamfering grindstones 40 and 42 from the processing start position to the processing end position.

Secondly, referring to Figure 6 and Figure 7, the following steps are specifically described: The glass substrate end surface processing apparatus 100 sets the third point P3 of the chamfer grindstone 40 to the fifth point P5 which is the processing start position by moving the chamfering grindstone 40 only by the machining correction value D in the Y-axis direction.

Fig. 6 is a view showing an example in which the end surface 11 of the glass substrate 10 is inclined only by an angle θ clockwise with respect to the zero reference line ZL. In this case, the fifth point P5 which is the machining start position of the end surface 11 is separated from the third point P3 of the chamfering grindstone 40 before the position correction by the machining correction value D in the positive direction of the Y-axis. Therefore, since the chamfering grindstone 40 before the position correction cannot be in contact with the end surface 11, the end surface 11 cannot be chamfered. However, by moving the machining correction value D by the position of the chamfering grindstone 40 in the Y-axis direction toward the positive direction of the Y-axis, the chamfering grindstone 40 can be brought into contact with the fifth point P5 as the machining start position. Thereby, the end surface 11 of the glass substrate 10 can be surely ground by the chamfering grindstone 40.

On the other hand, FIG. 7 is a view showing an example in which the end surface 11 of the glass substrate 10 is inclined by an angle θ counterclockwise with respect to the zero reference line ZL. In this case, the fifth point P5 as the machining start position of the end surface 11 is separated from the machining correction value D by the third point P3 of the chamfering grindstone 40 before the position correction in the negative direction of the Y-axis. Therefore, the chamfered grindstone 40 before the position correction has a flaw in which the glass substrate 10 is broken beyond the necessary grinding of the end face 11. However, by moving the position of the chamfering grindstone 40 in the Y-axis direction by only the machining correction value D in the negative direction of the Y-axis, the chamfering grindstone 40 can be brought into contact with the fifth point P5 as the machining start position. Thereby, the end surface 11 of the glass substrate 10 can be appropriately ground by the chamfering grindstone 40.

(4-3)

In the glass substrate end surface processing apparatus 100 of the present embodiment, the chamfering grindstones 40 and 42 for grinding the end faces 11 and 12 of the glass substrate 10 are, for example, a diamond grinding wheel and a resin bonded grinding wheel, and more preferably a resin bonded grinding wheel. The resin-bonded grinding wheel train is particularly effective for semi-finishing of the glass substrate 10 such as the end face processing step S5.

The resin-bonded grinding wheel can effectively remove the brittle fracture layer and the work-affected layer of the glass substrate 10. Moreover, the glass substrate end surface processing apparatus 100 is for removing the brittleness of the glass substrate 10. The fracture layer and the affected layer are processed, and the machining start position and the machining end position of the end faces 11 and 12 of the glass substrate 10 are accurately calculated, so that the grinding of the chamfering grindstones 40 and 42 can be suppressed. Volume and grinding pressure.

(5) Variations

Although the method of producing the glass substrate of the present invention has been described above, the present invention is not limited to the above-described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention.

In the present embodiment, the chamfering grindstones 40 and 42 are, for example, a diamond grinding wheel and a resin-bonded grinding wheel. However, the chamfering grindstone may have a chamfering grindstone 140 having a configuration in which the diamond grinding wheel 140a having the common rotating shaft 150 and the resin-bonding grinding wheel 140b are coupled in the direction of the rotation axis. .

In the present modification, the end surface processing step of the chamfering grindstone 140 for grinding the end faces 11 and 12 of the glass substrate 10 includes a first grinding step of solidifying the abrasive grains with the first binder. The first grinding wheel grinds the end faces 11 and 12 of the glass substrate 10; and the second grinding step is performed after the first grinding step, using a second binder having a hardness and rigidity lower than that of the first bonding material. The second grinding wheel formed by solidifying the abrasive grains grinds the end faces 11 and 12 of the glass substrate 10. In addition, the end faces 11 and 12 of the glass substrate 10 are subjected to end surface processing so that the arithmetic mean roughness Ra defined by JIS B 0601-1994 is less than 0.2 μm, preferably less than 0.1 μm.

In the end surface processing step of the chamfering grindstone 140 which is constituted by the two stages shown in FIG. 8, first, the first grinding of the end faces 11, 12 of the glass substrate 10 from one end to the other end using the diamond grinding wheel 140a is performed. The cutting step is followed by a second grinding step of changing the height position of the chamfering grindstone 140 and processing the end faces 11 and 12 of the glass substrate 10 from the other end toward the one end using the resin-bonding grinding wheel 140b.

In the present modification, the calculated machining correction value D can be generated by machining in the processing steps of the end faces 11 and 12 of the glass substrate 10 of the diamond grinding wheel 140a. The load on the end faces 11, 12 becomes small, and the formation of the work-affected layer is reduced. Further, based on the positional information of the end faces 11 and 12 of the glass substrate 10 to be processed, which is calculated based on the machining correction value D, the resin can be joined to the end faces 11 and 12 of the glass substrate 10 by using the resin-bonding grinding wheel 140b.

In the present modification, the variation in the depth of the work-affected layer after the shape of the end faces 11 and 12 of the glass substrate 10 can be reduced. That is, by calculating the depth of the work-affected layer formed by the diamond grinding wheel 140a in advance, the processing line of the resin-bonding grinding wheel 140b can be determined according to the depth of the work-affected layer to be removed. Therefore, by using the chamfered grindstone 140 composed of two stages, the work-affected layer generated by the shape processing can be removed with a minimum amount of processing.

10‧‧‧ glass substrate

11‧‧‧ end face

12‧‧‧ end face

13‧‧‧ end face

14‧‧‧ end face

30‧‧‧Adsorption platform (platform)

40, 42‧‧‧Chamfering grindstone

50, 52‧‧‧1st sensor

60, 62‧‧‧2nd sensor

70‧‧‧Mobile agencies

72‧‧‧Mobile agencies

80‧‧‧grinding fluid supply device

100‧‧‧Glass substrate end face processing device

Claims (7)

A method for manufacturing a glass substrate, comprising: a substrate fixing step of fixing a glass substrate placed on the platform to the platform; and a position information obtaining step of obtaining position information of an end surface of the glass substrate fixed to the platform a machining position calculation step of calculating a machining start position and a machining end position of the chamfering grindstone for chamfering the end surface based on the position information; and an end surface machining step by chamfering a grinding fluid is supplied to the contact portion between the grindstone and the end surface, and the chamfering grindstone is moved from the processing start position to the processing end position, and the end surface is chamfered; and the chamfering grindstone is The distance between the end faces can be changed along the first axis, and can be moved along the second axis orthogonal to the first axis so as to face the end face; in the position information obtaining step, a first sensor connected to the chamfering grindstone and movable together with the chamfering grindstone, and a second sensor movable along the first axis Said plurality of points the position information of the end faces; in the work position calculating step, calculating the desired order so that the chamfering grindstone to the machining start position along the first axis of movement that is processed from the correction value. The method of manufacturing a glass substrate according to claim 1, wherein in the position information obtaining step, the first sensor is moved along the second axis to the second sensor before the position information is acquired. Positions in the second axis direction are the same, and the first sensor is used to obtain the position of the second sensor in the first axis direction, thereby using the first sensor The position information in the first axial direction obtained is associated with the position information in the first axial direction obtained by the second sensor. The method of manufacturing a glass substrate according to claim 1, wherein in the processing position calculating step, a distance between the first sensor and the second sensor in the second axial direction, that is, a first distance, and the a distance between the first sensor and the chamfering grindstone in the second axial direction, that is, a second distance, and a predetermined reference position of the end surface measured by the second sensor and the end surface The processing correction value is calculated as the third distance which is the distance between the positions in the first axial direction. The method of manufacturing a glass substrate according to claim 2, wherein in the processing position calculating step, a distance between the first sensor and the second sensor in the second axial direction, that is, a first distance, and the a distance between the first sensor and the chamfering grindstone in the second axial direction, that is, a second distance, and a predetermined reference position of the end surface measured by the second sensor and the end surface The processing correction value is calculated as the third distance which is the distance between the positions in the first axial direction. The method of manufacturing a glass substrate according to claim 3, wherein in the processing position calculating step, the processing correction value is calculated by dividing a value obtained by multiplying the second distance by the third distance by the first distance. The method of manufacturing a glass substrate according to claim 4, wherein in the processing position calculating step, the processing correction value is calculated by dividing a value obtained by multiplying the second distance by the third distance by the first distance. The method of manufacturing a glass substrate according to any one of claims 1 to 6, wherein the first sensor is disposed at a height position different from a height position of the chamfering grindstone, and is combinable with the chamfering grindstone Moving in the vertical direction; in the position information obtaining step, the height position of the first sensor is Adjusting the height position of the first sensor in the same manner as the height position of the end surface; and in the end surface processing step, the height position of the chamfered grindstone is the same as the height position of the end surface. Adjust the height position of the chamfer grindstone above.