KR101712484B1 - Grinding system for flat panel display - Google Patents

Abstract

A chamfering system for a flat display is disclosed. A chamfering processing system for a flat display according to an embodiment of the present invention includes: a chamfering processing unit for chamfering an end region of a substrate for a flat display; And a stage unit on which the substrate is placed and which is conveyed in the direction of the chamfering unit, the stage unit comprising: a first stage on which an end region of the substrate is seated, the stage being adapted to absorb and fix an end region of the substrate; And a second stage spaced apart from the first stage apart from the first stage, supporting the substrate with the first stage and rotating the substrate.

Description

Technical Field [0001] The present invention relates to a grinding system for a flat display,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chamfering processing system for a flat display, and more particularly, to a chamfering processing system for a flat display capable of improving chamfering quality with respect to a substrate for a flat display.

Recently, as the electronic display industry has rapidly developed in the semiconductor industry, a flat panel display (FPD) has begun to emerge.

A flat panel display (FPD) is thinner and lighter image display device than a cathode ray tube (CRT), which was conventionally used as a display in a TV or a computer monitor, and includes a liquid crystal display crystal displays, plasma display panels (PDPs), and organic light emitting diodes (OLEDs).

Hereinafter, a flat panel display (FPD) including an LCD, a PDP, and an OLED will be described as a substrate.

The substrate usually has a rectangular shape and is made of a glass material. Therefore, corner cutting for four corners of the substrate, and edge cutting and edge cutting for short and long edge of the substrate, that is, corner and side of the substrate So that the sharpness of the glass is removed.

A chamfering processing system for a conventional substrate is conveyed in the direction of the chamfering processing unit with the substrate placed on the stage unit, and chamfering the substrate with the chamfering processing unit.

At this time, if the flatness of the stage unit is precisely secured, the chamfering quality can be improved and a certain chamfering amount can be derived.

However, since the conventional stage unit is formed integrally, it is difficult to adjust the flatness and it is difficult to keep the flatness of the stage constant in order to rotate the stage in order to change the processing direction of the substrate have.

Korean Registered Patent No. 10-0636510 (Samsung SDI Co., Ltd.)

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a planar display for planar display capable of precisely maintaining the flatness of a stage unit on which a substrate is placed so as to improve chamfering quality with respect to a flat display substrate.

According to an aspect of the present invention, there is provided a planar display comprising: a chamfering processing unit for chamfering an end region of a substrate for a flat display; And a stage unit on which the substrate is seated and which is conveyed in the direction of the chamfering processing unit, the stage unit comprising: a first stage on which an end region of the substrate is seated, the stage region adsorbing and fixing an end region of the substrate; And a second stage arranged to be spaced apart from the first stage apart from the first stage and supporting the substrate with the first stage and rotating the substrate is provided Can

The first stage includes a fixing table which is elongated along the width direction of the end region of the substrate intersecting with the direction in which the stage unit is conveyed and supports the end region of the substrate; And a plurality of vacuum holes provided on the upper surface of the fixed table and spaced apart from each other to absorb the end regions of the substrate.

The fixing table may be formed in a bar shape to support an end region of the substrate.

The second stage includes: a support table supporting an area other than an end area of the substrate; And a substrate rotating part connected to a lower portion of the support table and rotating the support table together with the substrate.

Wherein the support table comprises: a frame portion disposed at a lower portion of the substrate; And a plurality of pin members spaced apart from each other on an upper surface of the frame portion, the pin members contacting and supporting the lower surface of the substrate to prevent sagging of the substrate.

The top height of the pin member and the top surface height of the fixing table may be the same.

The substrate rotating part may include a rotating motor connected to a lower portion of the frame part, for rotating the frame part.

The second stage may further include a table elevator disposed at a lower portion of the substrate rotating portion, for elevating the support table and the substrate rotating portion together in a height direction.

The table elevating portion includes: a support plate for supporting a lower surface of the substrate rotating portion; A guide rail disposed at a side of the support frame disposed at a lower portion of the support plate and long in the height direction; A guide block having one side connected to the guide rail and the other side connected to the support plate; And a driving unit connected to the guide block to elevate the guide block along the guide rail.

The stage unit may further include a second stage transferring part connected to the second stage, the second stage transferring part transferring the second stage to the first stage in such a manner that the second stage is moved toward and away from the first stage.

Wherein the second stage transfer unit comprises: a guide rail long in the first stage direction; A guide block having one side connected to the second stage and the other side connected to the guide rail; And a driving unit connected to the guide block and moving the guide block along the guide rail so that the second stage is moved toward and away from the first stage.

Further comprising: a stage transfer unit connected to the stage unit and transferring the stage unit toward the chamfering unit, wherein the stage transfer unit comprises: a guide rail long in the direction of the chamfering unit; A guide block having one side connected to the guide rail and the other side connected to the stage unit; And a driving unit connected to the guide block and moving the guide block along the guide rail.

Wherein the chamfering processing unit comprises: a grinder having chamfering wheels for chamfering the corners and sides of the substrate, which is an end region of the substrate; And a control unit for moving the chamfering wheel to a working position for chamfering the side and sides of the substrate when chamfering the corners and sides of the substrate.

A cleaning unit disposed adjacent to the chamfering unit for cleaning the chamfered substrate by the chamfering unit; And a surface area measuring unit provided in the cleaning unit, for measuring a surface area of a corner and a side of the substrate, which is chamfered by the chamfering unit.

According to another aspect of the present invention, there is provided a method of manufacturing a flat display, comprising: transferring a stage unit on which a substrate for flat display is placed, Chamfering an end region of the substrate placed on the stage unit with a chamfering wheel of the chamfering unit; Measuring a surface area for an end region of the substrate; Comparing the measured surface coverage of the end region of the substrate with a set point; And correcting the face wiping amount for the end region of the substrate when the amount of chamfering for the measured end region of the substrate is different from the set value.

Further comprising the step of cleaning the chamfered substrate when the end region of the substrate is chamfered, wherein measuring the surface area for the end region of the substrate comprises: measuring the area of the end region of the substrate step; And calculating the surface area for the end area of the substrate based on the image information of the end area of the substrate that is photographed.

Wherein the step of correcting the surface area of the end region of the substrate comprises the steps of: determining whether the chamfered amount to the both short side and long side of the substrate is different from the set value (T1) The relative position of the substrate with respect to the processing wheel can be adjusted.

Wherein the step of correcting the surface area of the end region of the substrate includes the step of adjusting the amount of chamfering on both sides of the substrate and the height direction edge of the long side of the substrate, The height of the chamfering wheel can be adjusted so that the chamfering amount of the chamfering wheel is the same.

Wherein the step of correcting the surface area of the end region of the substrate is performed such that the amount of chamfering with respect to both the front and both side corners of the substrate is different from the set value T3, The relative positions of the chamfering wheels with respect to the both front corners and the rear both corners of the substrate can be adjusted.

And a step of sucking and fixing the substrate to the stage unit and rotating the stage unit.

The embodiment of the present invention can precisely maintain the flatness of the stage unit by having the second stage separately from the first stage and individually controlling them in supporting the substrate.

Further, the embodiment of the present invention can improve the quality of chamfering with respect to the substrate by comparing the measured surface area with a predetermined set value to correct the surface area of the substrate.

1 is a view showing a chamfered substrate.
2 is a plan view showing a chamfering processing system for a flat display according to an embodiment of the present invention.
3 is a side view showing a chamfering processing system for a flat display according to an embodiment of the present invention.
4 is a front view showing a partition according to an embodiment of the present invention.
5 is an enlarged view of part E of Fig.
6 is a side view showing a stage unit according to an embodiment of the present invention.
7 is a plan view showing a stage unit according to an embodiment of the present invention.
8 is a side view showing a substrate protection unit according to an embodiment of the present invention.
9 is an enlarged view of a portion F in Fig.
10 is a view showing a chamfering unit according to an embodiment of the present invention.
11 is a flowchart showing a chamfering method for a flat display according to an embodiment of the present invention.
12 to 14 are diagrams illustrating a surface area correction operation for an end region of a substrate according to an embodiment of the present invention.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

Hereinafter, the present invention will be described in detail with reference to the preferred embodiments of the present invention with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

Hereinafter, the substrate refers to a substrate for a flat display including an LCD (Liquid Crystal Display) substrate, a PDP (Plasma Display Panel) substrate, an OLED (Organic Light Emitting Diodes) substrate, For convenience of explanation, they are referred to as substrates without distinguishing them.

2 is a plan view showing a chamfering processing system for a flat display according to an embodiment of the present invention, and Fig. 3 is a plan view showing a chamfering processing system for a flat display according to an embodiment of the present invention. Fig. FIG. 4 is a front view showing a partition according to an embodiment of the present invention, FIG. 5 is an enlarged view of part E of FIG. 3, and FIG. 6 is a side view showing a stage unit according to an embodiment of the present invention. 8 is a side view showing a substrate protection unit according to an embodiment of the present invention, and Fig. 9 is a partial enlarged view of part F of Fig. 8 10 is a view showing a chamfering unit according to an embodiment of the present invention.

Referring to FIG. 1, a chamfering processing system for a flat display according to an embodiment of the present invention chamfer an end region G2 of a substrate.

The chamfering according to the present embodiment is a process for chamfering the four corners of the substrate G in the end region G2 of the substrate, that is, the front two corners (see enlargement A) and the rear both corners (see enlargement B) Edge cutting for both sides of the substrate G in the height direction of the short side of the substrate G (see enlargement C) and for both sides of the longitudinal direction of the substrate G (see enlargement D) And chamfering (for example, chamfering of both side short sides and both long side sides of the substrate G), which are chamfered, with respect to both long sides of the substrate G are performed.

In the case of chamfering the substrate G as described above, there is a problem that foreign matter generated during chamfering contaminates the thin film G1 formed on the substrate G, thereby deteriorating the quality of the thin film G1.

Therefore, the chamfering processing system for a flat display according to an embodiment of the present invention is intended to prevent contamination of the substrate G due to foreign matter generated during chamfering processing.

2 and 3, a chamfering processing system for a flat panel display according to an embodiment of the present invention includes a chamber 100, chambers 100 disposed inside the chambers 100 and chamfering the end regions G2 of the chamfering chambers A stage unit 300 disposed inside the chamber 100 and on which the substrate G is placed and conveyed toward the chamfering unit 200 and a stage unit 300 placed inside the chamber 100, And a partition 150 separating the interior space of the chamber 100 into a processing area S1 in which the chamfering unit 200 is accommodated and a processing area S2 in which the stage unit 300 is accommodated.

The partition wall 150 according to the present embodiment is partitioned into a processing region S1 where chamfering processing is performed for the substrate G and a processing region S2 where chamfering processing is not performed.

This is because foreign matter generated during chamfering of the end region G2 of the substrate is introduced into the non-processing region S2 inside the chamber 100 and is transferred to the substrate G or formed on the substrate G disposed in the non- Thereby preventing contamination of the thin film G1.

That is, chamfering of the substrate G is performed in the machining area S1, and foreign matter generated during chamfering (e.g., water generated from the machining water and the nozzle unit 413, which will be described later, In this embodiment, the partition wall 150 is provided in the chamber 100 to prevent the interior of the chamber 100 from being filled with the processing region S1, And a non-machining area S2.

4 and 5, the barrier rib 150 according to the present embodiment includes an opening hole 151 for allowing the end region G2 of the substrate to be introduced into the processing region S1 from the non-processing region S2, And a sealing member 153 which is provided in the opening hole 151 and seals a gap between the end region G2 of the substrate and the opening hole 151. [

The substrate G is transferred in the direction of the chamfering unit 200 in a state of being mounted on the stage unit 300 and the end region G2 of the substrate is transferred to the partition wall 150 Through the opening hole 151 provided in the processing area S1. Here, the opening hole 151 serves as a passage through which the end region G2 of the substrate is carried.

In order to prevent foreign matter from flowing into the non-machining area S2 by a gap between the end area G2 of the substrate and the opening hole 151 during chamfering of the substrate G, And a sealing member 153 for sealing a gap between the sealing member 153 and the opening hole 151 is provided.

The sealing member 153 serves to prevent foreign substances generated during chamfering of the substrate G from flowing into the non-machining region S2 from the machining region S1.

The sealing member 153 is provided at the lower end of the opening hole 151 to seal a gap between the fixing table 311 of the stage unit 300 and the opening hole 151 to be described later, Are provided at the upper end of the opening hole 151 to seal a gap between the cover body 411 of the nozzle section 413 and the opening section 151 and the nozzle section 413, respectively.

The sealing member 153 according to the present embodiment is configured such that when the end region G2 of the substrate is carried into the processing region S1 through the opening hole 151, the fixing table 311 of the stage unit 300, The cover body portion 411 or the nozzle portion 413 of the unit 400 so as to be in close contact with the upper surface of the cover body portion 411 or the nozzle portion 413, Rubber, silicon, or the like.

In this embodiment, in order to prevent foreign matter or particles remaining in the non-machining area S2 from contaminating the substrate G, the cleaned external air is discharged to the machining area S1 via the non-machining area S2 do.

3, the chamfering processing system for a flat display according to an embodiment of the present invention includes a chamber 100 in which a non-machining region S2 is located, and a non-machining region S2 And a ventilation unit (500) provided in the chamber (100) in which the machining area (S1) is located, for discharging outside air introduced into the machining area (S1) And an exhaust unit (550) for exhausting the exhaust gas to the outside of the engine (100).

4, the partition wall 150 further includes a plurality of exhaust holes 155 through which outside air passes from the non-processing area S2 to the processing area S1.

The ventilation unit 500 is installed on the upper surface of the chamber 100 in which the non-processing area S2 is located, and supplies the purified air to the non-processing area S2.

The outside air supplied to the non-machining region S2 flows into the machining region S1 via a plurality of exhaust holes 155 provided in the partition wall 150 and flows into the chamber 100 in which the machining region S1 is located. And is discharged to the outside by the exhaust unit 550 installed in the exhaust pipe.

As described above, the external air is supplied to the machining area S1 via the non-machining area S2 to remove foreign matter or particles remaining in the non-machining area S2, S2), it is possible to prevent the substrate G from being contaminated further.

On the other hand, chamfering of the end region G2 of the substrate is performed by transferring the stage unit 300 in the direction of the chamfering unit 200 (X direction) while the substrate G is seated on the stage unit 300 The stationary table 311 of the stage unit 300 and the cover body portion 411 of the substrate protecting unit 400 to be described later together with the end region G2 of the substrate are inserted into the opening hole 151 of the aforementioned partition wall 150, And chamfering the end region G2 of the substrate by the chamfering unit 200. [

6 and 7, in this embodiment, the stage unit 300 includes a first stage 310 on which an end region G2 of the substrate is placed and which sucks and fixes the end region G2 of the substrate, Includes a second stage 320 spaced apart from the first stage 310 apart from the first stage 310 and supporting the substrate G with the first stage 310 and rotating the substrate G do. In addition, in this embodiment, the first stage 310 and the second stage 320 can be individually controlled to precisely maintain the flatness of the stage unit 300. [

In this embodiment, the first stage 310 serves to suck and fix the end region G2 of the substrate to be chamfered.

The first stage 310 is formed to extend along the width direction (Y direction) of the end region G2 of the substrate which intersects the direction in which the stage unit 300 is conveyed (X direction) And a plurality of vacuum holes 313 provided on the upper surface of the fixed table 311 and spaced from each other to absorb the end region G2 of the substrate.

The end region G2 of the substrate is attracted by the plurality of vacuum holes 313 and fixed to the fixed table 311. [ Here, the fixed table 311 is formed in a bar shape to support the end region G2 of the substrate. That is, the fixed table 311 is formed in a bar shape elongated in the width direction (Y direction) of the end region G2 of the substrate.

In this embodiment, the second stage 320 is spaced apart from the fixed table 311 and supports the remaining area except the end area G2 of the substrate. The second stage 320 also serves to rotate the substrate G so that cornering of the substrate G and chamfering such as edge processing can be performed.

The second stage 320 includes a support table 321 for supporting the remaining region except for the end region G2 of the substrate and a support table 321 connected to the lower portion of the support table 321, And a substrate rotating part 323 for rotating the substrate rotating part 323.

The support table 321 serves to support the remaining area except for the end area G2 of the substrate on which chamfering is to be performed.

In this embodiment, the support table 321 includes a frame portion 321a disposed at a lower portion of the substrate G, and a support portion 321b provided at the upper surface of the frame portion 321a so as to be spaced apart from each other, And a plurality of pin members 321b for contacting and supporting the lower surface of the substrate G. [

The substrate G is supported by the pin member 321b and the flatness of the substrate G is maintained by making the top height of the pin member 321b and the top surface height of the fixed table 311 the same, do.

The substrate rotation part 323 rotates the support table 321 to rotate the substrate G. [

The substrate rotating portion 323 includes a rotating motor 323a connected to the lower portion of the frame portion 321a to rotate the frame portion 321a. Chamfering with respect to the substrate G is performed by chamfering the end region G2 of the substrate in turn by rotating the substrate G by 90 degrees when the substrate G is formed into a quadrangle.

The second stage 320 is disposed below the rotation motor 323a of the substrate rotation unit 323 and is supported by the support table 321 and the substrate rotation unit 323 so as to be smoothly rotated with respect to the substrate G. [ And a table elevating portion 325 for elevating the elevating portion 325 in the height direction together.

The support table 321 and the substrate G are simultaneously rotated by rotating the rotary motor 323a while the table elevator 325 elevates the support table 321 and the substrate rotary section 323 in the height direction at the same time .

The table elevating portion 325 includes a supporting plate 325a for supporting the lower surface of the substrate rotating portion 323 and a supporting frame 325b disposed on the side of the supporting frame 325b, A first guide block 325c connected to the first guide rail 325c and one end connected to the support plate 325a and a second guide block 325d connected to the first guide block 325d, And a first driving unit (not shown) for moving the first guide block 325d up and down along the first guide rail 325c.

The first driving unit (not shown) includes a first lead screw (not shown) disposed parallel to the first guide rail 325c, and a second lead screw connected to one end of the first lead screw, And a first drive motor (not shown) for moving the first guide block 325d along the first guide rail 325c.

Specifically, when the first and second lead screws are rotated by the rotation of the first driving motor, the first and second guide blocks 325d and 325d are rotated by the table elevator 325, Is elevated in the height direction along the first guide rail 325c arranged in the height direction and the supporting plate 325a connected to the first guide block 325d is elevated in the height direction .

Since the support plate 325a supports the lower surface of the substrate rotation part 323 and the support table 321, the substrate rotation part 323 and the support table 321 are lifted and lowered simultaneously with the lifting and lowering of the support plate 325a.

The substrate rotating portion 323 and the support table 321 are raised by the table elevating portion 325 and the support table 321 and the substrate G are rotated by the substrate rotating portion 323, The driving motor is rotated in the reverse direction to lower the substrate rotating portion 323 and the support table 321. [

The stage unit 300 further includes a second stage transfer unit 330 for adjusting the distance between the first stage 310 and the second stage 320 in accordance with the size of the substrate G. [

The second stage transfer part 330 is connected to the second stage 320 and serves to transfer the second stage 320 to the first stage 310 in such a manner that the second stage 320 is moved toward and away from the first stage 310.

The second stage feeder 330 includes a second guide rail 331 that is long in the direction of the first stage 310 and a second guide rail 332 that has one side connected to the second stage 320 and the other side connected to the second guide rail 331. [ A second guide block 333 connected to the second stage 331 and a second guide block 333 connected to the second guide block 333 so that the second stage 320 is moved toward and away from the first stage 310 And a second driving unit 335 for moving the second guide rail 331 along the second guide rail 331.

The second driving unit 335 includes a second lead screw 335a disposed in parallel with the second guide rail 331 and a second lead screw 335a connected to one end of the second lead screw 335a, And a second driving motor 335b for moving the second guide block 333 along the second guide rail 331. [

The distance between the fixed table 311 of the first stage 310 and the support table 321 of the second stage 320 by the second stage transfer unit 330 is controlled by the second drive motor 335b, The second guide block 333 is moved along the second guide rail 331 toward the fixed table 311 and the second guide block 333 is moved in the direction of the second guide block 333 The support table 321 connected to the second guide block 333 is conveyed in the direction of the fixed table 311 at the same time of conveyance.

As described above, the interval between the fixed table 311 and the support table 321 can be adjusted according to the size of the substrate G by the second stage transfer unit 330.

The stage unit 300 described above reciprocates in the direction of the chamfering unit 200 (X direction), which is performed by the stage transfer unit 350 installed on the bottom surface of the chamber 100.

2 and 3, the stage transfer unit 350 is provided inside the chamber 100 in which the non-machining area S2 is located, so that the stage unit 300 is moved in the direction of the chamfering unit 200 (X direction) As shown in FIG.

The stage transfer unit 350 includes a third guide rail 351 disposed on the bottom surface of the chamber 100 in the direction of the chamfering processing unit 200 and a third guide rail 351 having one side connected to the third guide rail 351 A third guide block 353 connected to the stage unit 300 and connected to the third guide block 353 to move the third guide block 353 along the third guide rail 351, 3 driving unit 355. [

The third driving unit 355 includes a third leadscrew (not shown) disposed in parallel with the third guide rail 351 and a second leadscrew 352 connected to one end of the third leadscrew, And a third drive motor (not shown) for moving the third guide block 353 along the third guide rail 351.

Specifically, when the third lead screw is rotated by the rotation of the third drive motor, the third guide block 353 is moved to the chamfering processing unit (not shown) The stage unit 300 connected to the third guide block 353 at the same time of the conveyance of the third guide block 353 is conveyed along the third guide rail 351 arranged in the X direction Unit 200 direction.

As described above, the stage unit 300 can be caused to reciprocate in the direction of the chamfering unit 200 with the stage transfer unit 350.

2 and 3, a chamfering processing system for a flat display according to an embodiment of the present invention includes a stage unit 300 on which a substrate G is placed is transferred toward the chamfering unit 200 The stage unit 300 is brought into contact with the stage unit 300 at an upper portion of the stage unit 300 so as to prevent foreign matter from flowing into the thin film G1 formed on the substrate G, And a substrate protecting unit (400) surrounding the substrate protecting unit (400).

The substrate protection unit 400 is provided inside the chamber 100 in which the non-machining area S2 is located and is installed above and above the stage unit 300 so as to be able to approach and separate from the stage unit 300.

8 and 9, in the present embodiment, the substrate protection unit 400 includes a stage unit 300 and a stage unit 300. The substrate protection unit 400 includes a stage unit 300, a stage unit 300, And a cover lifting unit 420 connected to the protective cover 410 and lifting the protective cover 410 in the height direction of the stage unit 300. [ .

The protective cover 410 serves to prevent foreign matter from flowing into the thin film G1 formed on the substrate G. [

The protective cover 410 includes a cover body portion 411 connected to the cover lifting portion 420 and lifted and lowered to be in contact with the stage unit 300 and surrounding an area other than the end region G2 of the substrate, A thin film G1 which is connected to one side of the cover main body 411 and which is disposed on the upper end region G2 of the substrate and which is formed on the substrate G during the chamfering process of the end region G2 of the substrate, And a nozzle portion 413 for spraying air or water to the end region G2 of the substrate so as to prevent the air or water from flowing into the end region G2 of the substrate.

The cover main body 411 surrounds the remaining area except the end area G2 of the substrate to be chamfered so as to prevent foreign matter from being introduced into the thin film G1.

The cover body portion 411 is connected to the cover lifting portion 420 and is raised and lowered to approach and separate the stage unit 300 from the upper portion of the stage unit 300. The front portion of the cover main body portion 411 is lowered to be seated on the fixing table 311 and the thin film G1 is positioned inside the cover main body portion 411 in this embodiment.

The nozzle portion 413 is connected to the front portion of the cover main body portion 411.

The nozzle unit 413 is disposed above the end region G2 of the substrate placed on the fixed table 311 and is provided with air or water To prevent foreign substances generated during the chamfering process from flowing into the inside of the cover main body part 411.

The nozzle unit 413 in this embodiment includes a nozzle body 413a connected to the cover body unit 411 and an end portion region 413b provided on the nozzle body 413a and crossing the direction in which the stage unit 300 is fed A discharge port 413b extending in the width direction (Y direction) of the discharge port G2 and having a slit shape and a discharge port 413b connected to the discharge port 413b, Lt; / RTI >

In this embodiment, the discharge port 413b is inclined with respect to a virtual line extending vertically in the fixed table 311 of the stage unit 300 so that water or air ejected from the discharge port 413b is processed To flow in the direction of the area S1.

In addition, a plurality of the ejection openings 413b may be provided on the nozzle body 413a. That is, a plurality of the discharge ports 413b may be provided on the nozzle body 413a so as to be spaced apart from each other along the X direction.

In this embodiment, the cover lifting unit 420 is connected to the cover body unit 411 and serves to raise and lower the cover body unit 411 in such a manner that the cover body unit 411 approaches and separates from the fixed table 311.

The cover lifting unit 420 includes a fourth guide rail 421 disposed in the height direction of the stage unit 300 and a second guide rail 421 having one side connected to the fourth guide rail 421 and the other side connected to the cover main body 411 4 guide block 423 and a fourth driving unit 425 connected to the fourth guide block 423 to move the fourth guide block 423 along the fourth guide rail 421.

The fourth driving unit 425 includes a fourth lead screw (not shown) disposed in parallel with the fourth guide rail 421, and a fourth lead screw (not shown) connected to one end of the fourth lead screw, And a fourth drive motor 425a for moving the fourth guide block 423 along the fourth guide rail 421.

Specifically, when the fourth lead screw is rotated by the rotation of the fourth driving motor 425a, the fourth guide block 423 is rotated The cover body portion 413 is lifted and raised along the fourth guide rail 421 arranged in the height direction of the fixed table 311 and connected to the fourth guide block 423 at the same time as the fourth guide block 423 is lifted and lowered 411 are also elevated in the height direction.

The chamfering processing system for a flat panel display according to an embodiment of the present invention includes a substrate G for performing a relative alignment operation of the substrate protecting unit 400 with respect to the substrate G mounted on the stage unit 300, And an aligning camera 450 for photographing the image.

 2 and 3, the aligning camera 450 is provided inside the chamber 100 in which the non-machining area S2 is located, and between the stage unit 300 and the substrate protecting unit 400 .

The alignment camera 450 photographs at least two alignment marks (not shown) formed on either side of the substrate G and detects the alignment of the substrate G mounted on the stage unit 300 on the basis of the photographed image. So that the relative alignment of the protective cover 410 of the substrate protection unit 400 with respect to the substrate can be performed.

Specifically, based on the image information obtained by the alignment camera 450, the relative alignment of the cover body 411 with respect to the fixed table 311 on which the end region G2 of the substrate is mounted is performed.

8, the substrate protection unit 400 according to the present embodiment includes a cover body portion 411 in the X direction (X direction) to perform a relative alignment operation of the cover body portion 411 with respect to the fixed table 311, (Not shown).

The cover conveyance portion 430 according to the present embodiment is provided on the upper surface of the cover body portion 411 and is connected to the cover lift portion 420 and supports the cover body portion 411 with respect to the cover lift portion 420 in the X direction Thereby enabling relative movement.

The cover conveyance unit 430 includes a fifth guide rail 431 disposed on the upper surface of the cover body unit 411 in the conveying direction of the stage unit 300 and a second guide rail 432 having one side connected to the fifth guide rail 431, A fifth guide block 433 connected to the cover lifting part 420 and a fifth guide block 433 connected to the fifth guide block 433 to move the cover main body part 411 relative to the cover lifting part 420 And a fifth driving unit 435 for moving the driving unit 435 in the direction (X direction).

The fifth driving unit 435 includes a fifth lead screw 435a disposed in parallel to the fifth guide rail 431 and a fifth lead screw 435b connected to one end of the fifth lead screw 435a, And a fifth driving motor 435b for moving the cover body portion 411 relative to the cover lifting portion 420. [

Specifically, when the fifth lead screw 435a is rotated by the rotation of the fifth driving motor 435b in the X-direction movement of the cover body portion 411 by the cover transferring portion 430, 433 are relatively moved in the X direction with respect to the cover lifting part 420 along the fifth guide rail 431 arranged in the X direction and the fifth guide block 433 is moved simultaneously with the movement of the fifth guide block 433. [ The cover body portion 411 connected to the cover lifting portion 420 is also moved in the X direction relative to the cover lifting portion 420. [

As described above, the cover main body 411 is moved in the X direction by the cover transfer unit 430 based on the image information photographed by the alignment camera 450, and the substrate G mounted on the stage unit 300 The cover body portion 411 is lowered to the stage unit 300 by the cover lifting portion 420 to move the front portion of the cover body portion 411 to the fixed table 311 so that the thin film G1 is positioned inside the cover body portion 411. [

The stage unit 300 on which the substrate G is placed and the substrate protecting unit 400 are mounted on the stage unit 300 after the substrate protecting unit 400 is mounted on the opening hole 151).

Then, the edge region G2 of the substrate carried into the opening hole 151 is chamfered by the chamfering processing unit 200. [

The chamfering processing unit 200 in this embodiment is a grinder having a chamfering wheel 211 for advancing chamfering of the corners and sides of the substrate G which is the end region G2 of the substrate, And a control unit (not shown) for moving the chamfering wheel 211 to a working position for chamfering the chamfer and sides of the substrate G when chamfering the corners and sides of the substrate G .

The grinder 210 serves to chamfer the end region G2 of the substrate supported by the stage unit 300 by suction.

The chamfering wheel 211 of the grinder 210 is moved to the end region G2 of the substrate carried in the opening hole 151 to proceed chamfering with respect to the end region G2 of the substrate.

1, the chamfering wheel 211 includes four corners of the substrate G in the end region G2 of the substrate, that is, front two corners (see enlargement A) and rear corners (see enlargement B) (See enlargement C) on both sides of the substrate G and an edge cut (refer to enlargement D) on both sides of the substrate G and edge cutting on both sides of the substrate G (For example, the amount of indentation on both sides of the substrate G and on both sides of the both sides themselves) is performed on both short sides of the substrate G and both sides of the substrate G. [

For example, chamfering of the substrate G is carried out by first bringing the short side of the substrate G into the opening hole 151 and edge-processing the short side of the substrate G with the chamfering wheel 211. The stage unit 300 is transferred to take out the short side of the substrate G from the opening hole 151 and rotate the stage unit 300 to position the long side of the substrate G opposite to the opening hole 151 . Then, the long side of the substrate G is carried into the opening hole 151 to perform edge processing on the long side of the substrate G.

As described above, when chamfering the substrate G using the chamfering wheel 211, the machining water jetted onto the end region G2 of the substrate, the water sprayed from the nozzle portion 413, There arises a problem that the foreign matter including the dust generated as the chamfering of the work G is dropped and scattered to the bottom of the machining area S1 to contaminate the machining area S1.

Therefore, the chamfering processing system for a flat display according to an embodiment of the present invention further includes a dust collecting unit 600 for collecting foreign substances generated by chamfering the end region G2 of the substrate.

The dust collecting unit 600 is provided in the machining area S1 of the chamber 100 and disposed below the opening hole 151 to collect foreign substances generated by chamfering the end area G2 of the substrate do.

10, in the present embodiment, the dust collecting unit 600 includes a dust collecting portion 610 disposed at the lower portion of the opening hole 151 and collecting foreign substances generated by chamfering the end region G2 of the substrate A gas-liquid separator (not shown) connected to the dust collecting part 610 and separating the foreign substances generated by chamfering the end area G2 of the substrate into gas and liquid, And a suction pump (not shown) for allowing the foreign substances collected in the gas-liquid separator to flow into the gas-liquid separator.

The dust collecting unit 610 serves to collect foreign substances dropped on the bottom surface of the machining area S1 during the chamfering process to prevent the machining area S1 from being contaminated.

In the present embodiment, the dust collecting portion 610 is formed in the shape of a water tray disposed below the opening hole 151. However, the scope of the present invention is not limited thereto, and the shape of the dust collecting portion 610 may be any shape All available.

The foreign substances collected by the dust collecting unit 610 are introduced into the gas-liquid separator by the suction pump, separated into the liquid and the gas in the gas-liquid separator, the liquid is discharged to the lower portion of the gas-liquid separator, and the gas is discharged to the upper portion of the gas- In this embodiment, since the gas-liquid separator and the suction pump use a known gas-liquid separator and a suction pump, a detailed description thereof will be omitted.

On the other hand, when the chamfering of the substrate G is completed, the substrate G mounted on the stage unit 300 should remove foreign matter adhering to the end region G2 of the substrate during chamfering.

2, the chamfering processing system for a flat display according to an embodiment of the present invention includes an unloading unit 700 for unloading a chamfered substrate G by the chamfering processing unit 200 A cleaning unit 800 for cleaning the chamfered substrate G disposed adjacent to the unloading unit 700 and a cleaning unit 800 for cleaning the substrate G placed on the stage unit 300 from the unloading unit 700. [ To a transfer unit (650).

The substrate G having been chamfered is removed from the cleaning unit 800 through the unloading unit 700. At this time, the substrate G having been chamfered is transferred from the stage unit 300 to the unloading unit 700 by the transfer unit 650.

The transfer unit 650 includes a grip portion 651 for holding the substrate G while supporting the lower surface of the substrate G partially in contact with both side surfaces of the substrate G, And a holding and conveying unit 653 for conveying the stage unit 300 in the Y-axis direction intersecting the conveying direction of the stage unit 300.

When cleaning of the substrate G flowing into the cleaning unit 800 is completed, it is checked whether or not the amount of chamfering of the chamfered substrate G by the chamfering processing unit 200 coincides with the set value .

Therefore, the chamfering processing system for a flat display according to an embodiment of the present invention is characterized in that the chamfered edge region G2 of the chamfered substrate, that is, the corners of the substrate G, the height direction edges of the long and short sides, (Not shown) for measuring a face take-up amount.

The surface area measuring unit according to the present embodiment is provided in the cleaning unit 800 and measures the surface area of the substrate G at the corners and sides.

Although not shown in the present embodiment, the surface area measuring unit (not shown) includes at least one camera (not shown) for photographing the short side and the long side of the cleaned substrate G, And a calculating unit (not shown) for calculating the surface area of the substrate G. [

As described above, the control unit of the chamfering unit 200 re-adjusts the position of the chamfering wheel 211 in order to correct the face draw based on the measured value in the face-area measuring unit. That is, when the substrate G is chamfered according to a predetermined set value and the chamfering amount is measured, the position of the chamfering wheel 211 is maintained as it is. On the other hand, when a chamfering amount smaller than the set value is measured, Adjusts the position of the chamfering wheel 211 based on the measured face wear value.

Therefore, the substrate G chamfered by the chamfering wheel 211 can be chamfered while the chamfered amount is corrected based on the measured face wear. That is, the chamfering amount of the chamfered substrate G is fed back to the control unit, and the position of the chamfering wheel 211 is corrected so that the substrate G can be chamfered to a set value.

Hereinafter, a chamfering method using the chamfering processing system for flat display according to an embodiment of the present invention will be described.

FIG. 11 is a flowchart showing a chamfering method for a flat display according to an embodiment of the present invention, and FIGS. 12 to 14 are diagrams illustrating a face area correcting operation for an end region of a substrate according to an embodiment of the present invention .

Referring to Fig. 11, chamfering of the end region G2 of the substrate places the substrate G to be chamfered in advance on the stage unit 300.

As described above, the end region G2 of the substrate to be chamfered is fixedly attached to the fixed table 311 of the first stage 310, and the front and rear side corners of the substrate G to be chamfered, (S100) so that both the short side and the long side of the substrate G are brought into the machining area S1.

Here, the rotation of the substrate G is performed as the second stage 320 supporting the region except the end region G2 of the substrate is raised and rotated.

Then, the stage unit 300 on which the substrate G is placed is transferred to the chamfering unit 200 (S200).

The transfer of the stage unit 300 is performed by the stage transfer unit 350 described above. The end region G2 of the substrate to be chamfered is carried into the opening hole 151 formed in the partition wall 150. [

Then, the edge region G2 of the substrate carried into the opening hole 151 by the chamfering wheel 211 is chamfered (S300).

Then, the chamfered substrate G is transferred to the cleaning unit 800 to remove foreign substances adhering to the substrate G (S400).

Then, the surface area of the cleaned substrate with respect to the edge area G2 is measured (S500).

The surface area G2 of the cleaned substrate is photographed by the camera (S510), and the surface area G2 of the cleaned substrate is measured on the basis of the image information of the end area G2 of the photographed substrate (S530).

The calculated surface area is transmitted to the control unit of the chamfering unit 200. The control unit compares the surface area with respect to the edge area G2 of the substrate to the predetermined set values T1, T2 and T3 (S600) .

If it is determined that the chamfered amount with respect to the measured end region G2 of the substrate is different from the set values T1, T2, and T3, the face takeoff amount with respect to the end region G2 of the substrate is corrected (S700).

That is, when the chamfered amount with respect to the measured end region G2 of the substrate is different from the set values T1, T2, and T3, the substrate G is moved back to the set values T1, T2, The substrate G is further chamfered after being placed on the stage unit 300 and conveyed toward the chamfering unit 200. [

Specifically, as shown in Fig. 12, when the amount of chamfering with respect to both the short side and the long side of the substrate G is different from the set value T1, The substrate G is further chamfered by adjusting the relative position of the substrate G with respect to the chamfering wheel 211 vertically entering the long side. 12 shows the infeed amount d as an additional chamfering operation for the substrate G. Fig.

The adjustment of the relative position of the substrate G with respect to the chamfering wheel 211 may be performed by adjusting the distance of movement of the stage unit 300 or changing the moving distance of the chamfering wheel 211 into the substrate G .

When the amount of chamfering is different from the set value T2 with respect to both the short sides of the substrate G and the heightwise edges of the long side of the substrate G, the control unit sets the both sides of the substrate G in the height direction The height of the chamfering wheel 211 is adjusted so that the chamfering amount of the edge is the same, thereby chamfering the substrate G additionally.

Specifically, as shown in Fig. 13, the height of the chamfering wheel 211 is adjusted so that the both side short sides of the substrate G and the long side edge top face take-off amount e1 and the bottom edge face take amount e2 are the same do.

When the amount of chamfering with respect to both the front and rear side corners of the substrate G differs from the set value T3, the control unit controls the front and rear corners of the substrate G The substrate G is further chamfered by adjusting the relative positions of the chamfering wheels 211 with respect to both the front and rear side corners of the substrate G so that the chamfer amount is the same.

Specifically, the substrate G is placed at the corner of the substrate G such that the surface area c1 of the substrate G positioned at the lower side in FIG. 14 is equal to the surface area c2 of the substrate G located at the upper side, The relative position of the chamfering wheel 211 for the chamfer is adjusted.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

100: chamber 150: partition wall
200: chamfering processing unit 300: stage unit
310: first stage 320: second stage
350: stage transfer unit 400: substrate protection unit
410: protective cover 420: cover lifting portion
430: Cover conveying part 450: Aligning camera
500: ventilation unit 550: exhaust unit
600: dust collecting unit 650: transfer unit
700: Unloading unit 800: Cleaning unit

Claims (20)

A chamfering unit for chamfering an end region of the substrate for a flat display;
A stage unit on which the substrate is placed and which is conveyed in the direction of the chamfering processing unit;
And a protective cover for preventing foreign matter from entering the thin film formed on the substrate during the chamfering process, the substrate protecting unit being provided so as to be able to approach and separate from the stage unit;
A cleaning unit disposed adjacent to the chamfering unit for cleaning the chamfered substrate by the chamfering unit; And
And a surface area measuring unit provided on the cleaning unit for measuring a surface area of a corner and a side of the substrate chamfered by the chamfering unit,
The stage unit includes:
A first stage on which an end region of the substrate is seated, the first stage for adsorbing and fixing an end region of the substrate;
A second stage disposed apart from the first stage apart from the first stage, the second stage supporting the substrate with the first stage and rotating the substrate; And
And a second stage transferring portion connected to the second stage, the second stage transferring portion transferring the second stage toward and away from the first stage,
The first stage includes:
A stationary table which is elongated along a width direction of an end region of the substrate intersecting the direction in which the stage unit is transported and is formed in a bar shape to support an end region of the substrate; And
And a plurality of vacuum holes provided on the upper surface of the fixed table and spaced apart from each other to absorb the end regions of the substrate,
Wherein the second stage comprises:
A lower surface of the frame, and a lower surface of the frame, the upper surface of the frame being spaced apart from the upper surface of the frame, the lower surface of the substrate being contactably supported to prevent sagging of the substrate, A support table having a plurality of pin members to support an area other than an end area of the substrate; And
And a substrate rotation part connected to a lower portion of the support table and rotating the support table together with the substrate,
And the second stage conveying portion includes:
A guide rail disposed long in the first stage direction;
A guide block having one side connected to the second stage and the other side connected to the guide rail; And
And a driving unit connected to the guide block for moving the guide block along the guide rail so as to approach and separate the second stage from the first stage. delete delete delete delete delete The method according to claim 1,
Wherein,
And a rotating motor connected to a lower portion of the frame portion and rotating the frame portion. The method according to claim 1,
Wherein the second stage comprises:
Further comprising a table elevating portion disposed at a lower portion of the substrate rotating portion and for elevating and lifting the supporting table and the substrate rotating portion together in a height direction. 9. The method of claim 8,
The table-
A support plate for supporting the lower surface of the substrate rotating part;
A guide rail disposed at a side of the support frame disposed at a lower portion of the support plate and long in the height direction;
A guide block having one side connected to the guide rail and the other side connected to the support plate; And
And a driving unit connected to the guide block to move the guide block along the guide rail. delete delete The method according to claim 1,
And a stage transfer unit connected to the stage unit for transferring the stage unit in the direction of the chamfering processing unit,
The stage transfer unit includes:
A guide rail disposed long in the direction of the chamfering unit;
A guide block having one side connected to the guide rail and the other side connected to the stage unit; And
And a driving unit connected to the guide block to move the guide block along the guide rail. The method according to claim 1,
Wherein the chamfering processing unit comprises:
A grinder having a chamfering wheel for chamfering the corners and sides of the substrate which is an end region of the substrate; And
And a controller for moving the chamfering wheel to a working position for chamfering the chamfer and sides of the substrate when chamfering the corners and sides of the substrate. delete delete delete delete delete delete delete

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