CN109590893B - Grinding method using grinding system and grinding system - Google Patents

Grinding method using grinding system and grinding system Download PDF

Info

Publication number
CN109590893B
CN109590893B CN201910006892.9A CN201910006892A CN109590893B CN 109590893 B CN109590893 B CN 109590893B CN 201910006892 A CN201910006892 A CN 201910006892A CN 109590893 B CN109590893 B CN 109590893B
Authority
CN
China
Prior art keywords
grinding
grinding wheel
groove
ground
wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910006892.9A
Other languages
Chinese (zh)
Other versions
CN109590893A (en
Inventor
李海博
张燕斌
邓晓聪
卫宏毅
张彤
边婉丽
孙立强
吕志伟
黄黎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201910006892.9A priority Critical patent/CN109590893B/en
Publication of CN109590893A publication Critical patent/CN109590893A/en
Priority to US16/551,845 priority patent/US20200215656A1/en
Application granted granted Critical
Publication of CN109590893B publication Critical patent/CN109590893B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/14—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of optical work, e.g. lenses, prisms
    • B24B9/148—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of optical work, e.g. lenses, prisms electrically, e.g. numerically, controlled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/14—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of optical work, e.g. lenses, prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/14—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of optical work, e.g. lenses, prisms
    • B24B9/146—Accessories, e.g. lens mounting devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention discloses a grinding method and a grinding system using a grinding system. Specifically, the invention provides a grinding method using a grinding system, which comprises the following steps: moving the grinding wheel to the sample table, and recording the position of the grinding wheel when the groove bottom of the grinding groove is contacted with the piece to be ground as a standard position; moving the grinding wheel to a position detection unit, and recording the position of the grinding wheel as a first reference position when the groove bottom of the grinding groove is superposed with the detection center of the position detection unit; moving the grinding wheel to the standard position, and grinding the part to be ground by the grinding wheel; and adjusting the position of the grinding wheel: and moving the grinding wheel to the position detection unit again, recording the position of the grinding wheel as a second reference position when the groove bottom of the grinding groove is superposed with the detection center of the position detection unit, adjusting the standard position based on the second reference position and the first reference position, and re-determining the position of the grinding wheel. The method can reduce the replacement time of the grinding wheel and improve the operation stability of the grinding system.

Description

Grinding method using grinding system and grinding system
Technical Field
The invention relates to the technical field of display panel production and manufacturing, in particular to a grinding method and a grinding system utilizing a grinding system.
Background
The display panel is an important component of a display, and is widely applied to equipment such as computers, televisions, mobile phones and the like. In the manufacturing process of the display panel, a cutting process and an edging and chamfering process after the cutting process are indispensable, and the cutting process and the like are generally performed by a grinder. For example, in the production of an organic light emitting display panel (OLED substrate), an Array (Array) process is required to cut a large-sized OLED substrate into 1/2 or 1/4 pieces. Laser cutting technology is generally used for cutting large-size OLED substrates at present, the laser cutting can ensure the cutting quality, and particles (particles) are not generated basically. However, due to the effect of thermal expansion and cold contraction, laser cutting can generate a micro-crack area in a small range on a cutting edge, the edge angle of the cutting edge is sharp after cutting, and the stress of the cutting edge is concentrated. Therefore, the cutting edge needs to be ground by a grinding process to eliminate micro-cracks, stress, and other process defects.
However, the polishing method and system using the polishing system still need to be improved.
Disclosure of Invention
The present invention is based on the discovery and recognition by the inventors of the following facts and problems:
the inventor finds that the existing grinding method utilizing the grinding system generally has the problems of unstable grinding quality, short service life of a grinding wheel, long replacement time of the grinding wheel, complex replacement process, low equipment utilization rate and the like. In the prior art, in the process of polishing a workpiece to be polished (such as an OLED substrate) by using a polishing wheel, the workpiece to be polished and a polishing groove of the polishing wheel need to be precisely aligned, so as to determine an initial polishing position and a polishing amount to be polished, and then polishing is performed. Since the display panel (e.g. OLED substrate) needs to be polished by a small amount (typically micron level), the alignment accuracy of the workpiece to be polished and the polishing groove and the polishing accuracy during the polishing process are high.
However, on one hand, there are errors in the mechanical precision of the grinding wheel and each grinding groove itself, for example, there are slight differences in the depth of the recess of each grinding groove, and in addition, after each time of replacing the grinding wheel, there are also slight differences in the installation position of the grinding wheel, so that if the grinding groove is switched or the grinding wheel is replaced each time, the actual contact position of the grinding groove and the member to be ground is not determined at the beginning of grinding if the grinding is directly performed at the original position without performing the alignment process again, that is, the actual grinding amount is larger or smaller than the preset grinding amount, which may result in adverse consequences, for example, product quality problems such as sparks, chips (chips), cracks, particles (particles), and fragments; and if the actual grinding amount is too large, excessive grinding can cause the diamond in the grinding groove to fall off, the diamond blade is easily blocked and passivated by scorched glass, and the service life of the grinding groove and the grinding wheel can be shortened. If after switching over the grinding groove or changing the grinding miller every time, all carry out debugging process many times again, then it is very consuming time, lead to the utilization rate of grinding equipment lower, production efficiency is lower. If the position of the grinding wheel is not aligned accurately, the grinding amount of the part to be ground is not accurate after the grinding wheel is replaced every time, and time and materials are wasted.
Therefore, if a new grinding method can be provided, which can reduce the time for switching grinding grooves and replacing grinding wheels, and can improve the quality of the ground product and the service life of the grinding wheels, the problems can be solved to a great extent.
The present invention aims to alleviate or solve at least to some extent at least one of the above mentioned problems.
In one aspect of the invention, a method of grinding using a grinding system is provided. According to an embodiment of the present invention, the grinding system includes a grinding wheel having a grinding groove surrounding an outer edge of the grinding wheel for one circle and configured to be rotatable along a rotation axis for grinding, one side of the rotation axis having a sample table for placing an object to be ground, the rotary grinding system further includes a position detection unit configured to detect a position of a groove bottom of the grinding groove, the method includes: moving the grinding wheel to the sample stage, and recording the position of the grinding wheel when the groove bottom of the grinding groove is contacted with the piece to be ground as a standard position; moving the grinding wheel to the position detection unit, and recording the position of the grinding wheel when the groove bottom of the grinding groove is superposed with the detection center of the position detection unit as a first reference position; moving the grinding wheel to the standard position, and grinding the to-be-ground piece by using the grinding wheel according to a preset grinding amount; and adjusting the position of the grinding wheel: moving the grinding wheel to the position detection unit again, and recording the position of the grinding wheel as a second reference position when the groove bottom of the grinding groove is coincided with the detection center of the position detection unit; and adjusting the standard position based on the second reference position and the first reference position to re-determine the position of the grinding wheel. Therefore, the method can rapidly and accurately determine the using position of the grinding wheel after the grinding wheel is replaced, the grinding groove is switched or the grinding wheel is deformed (such as retracted), so that the utilization rate of the grinding equipment and the quality of ground products are improved, and the service life of the grinding wheel is prolonged.
According to the embodiment of the invention, after one piece to be ground is ground by the grinding wheel, the position of the grinding wheel is adjusted. Therefore, the grinding wheel can automatically perform the position adjustment operation when grinding one piece to be ground, so that the grinding system can automatically and timely calibrate the use position of the grinding wheel, the grinding accuracy and the grinding product quality are improved, and the automation degree of the grinding system is improved.
According to an embodiment of the invention, the position of the grinding wheel is adjusted after the grinding wheel is replaced or the grinding groove is switched. Therefore, the method can adjust the use position of the replaced grinding wheel or the switched grinding groove based on the pre-recorded standard position of the grinding wheel and the first reference position after the grinding wheel is replaced or the grinding groove is switched, the adjustment time is short and accurate, the utilization rate of the grinding equipment and the quality of ground products are improved, and the service life of the grinding wheel is prolonged.
According to an embodiment of the invention, the grinding wheel is moved in a first direction, the first direction being perpendicular to the rotational axis; the detection direction of the position detection unit is perpendicular to a plane formed by the rotation axis and the first direction. Therefore, the grinding wheel is moved in the first direction, the alignment of the piece to be ground on the sample table and the grinding groove and the alignment of the position detection unit and the groove bottom of the grinding groove can be realized, the operation is simple, the error caused by multiple times of multi-directional movement of the grinding wheel is avoided, and the alignment accuracy and the grinding accuracy are improved.
According to an embodiment of the present invention, the grinding system further includes a grinding groove wear detection unit configured to determine a wear condition of the grinding groove by observing a groove bottom of the grinding groove, and after the grinding wheel grinds the member to be ground, the method further includes: detecting the abrasion condition of the grinding groove by using the grinding groove abrasion detection unit, and judging whether the grinding groove needs to be switched or the grinding wheel needs to be replaced according to the abrasion condition of the grinding groove; adjusting the position of the grinding wheel after switching the grinding groove or replacing the grinding wheel. Therefore, the grinding groove abrasion detection unit can clearly detect the use condition and the abrasion condition of the grinding groove (namely the condition that the grinding particles fall off from the alloy substrate), and the method can simply and accurately judge whether the grinding wheel needs to be replaced or the grinding groove needs to be switched.
According to an embodiment of the invention, the standard position is determined by: moving the grinding wheel in the first direction to a position where an outer edge of the grinding groove and an edge of the sample stage are in contact, and recording the position of the grinding wheel as a first position; in the first direction, the grinding wheel is firstly moved X from the first position along the first direction to a direction far away from the piece to be ground0Then, the piece to be ground is placed on the sample table, the edge of the piece to be ground exceeds the edge X of the sample table in the direction toward the grinding wheel0The distance of (d); presetting a standard value X of the grinding quantity of the to-be-ground piece in the first direction1Moving the grinding wheel along the first direction to a direction close to the part to be ground by X1(ii) a The concave depth of the grinding groove in the first direction is X2Moving the grinding wheel to a direction close to the part to be ground by X2(ii) a When the piece to be ground is placed on the sample stage, the position deviation X is formed in the first direction3Based on said position deviation X3Adjusting the position of the grinding wheel. Therefore, the method can accurately align the workpiece to be ground and the grinding groove, the grinding accuracy is improved, and the quality of the ground product is improved.
According to an embodiment of the invention, the position deviation X3Is determined by the following steps: correcting the placing position of the to-be-ground piece on the sample stage, wherein the deviation between the placing position of the to-be-ground piece and the preset position of the to-be-ground piece is the position deviation X3. Therefore, the method can correct errors in the alignment process of the workpiece to be ground and the grinding groove, further improves the alignment accuracy of the workpiece to be ground and the grinding groove, improves the grinding accuracy and improves the quality of ground products.
According to an embodiment of the invention, the position of the grinding wheel comprises a position coordinate X in the first direction and a position coordinate Z in a second direction, wherein the first direction and the second direction are perpendicular, the rotational axis being alongThe second direction is extended, and when the position of the grinding wheel is adjusted, a difference value between the second reference position and the first reference position is a reference position variation amount, and the reference position variation amount includes a first reference position variation amount X in the first directionmAnd a second reference position variation Z in the second directionm. Thus, the amount of change X can be based on the first reference positionmAnd a second reference position variation ZmThe position of the grinding wheel is adjusted.
According to an embodiment of the present invention, the operation of adjusting the position of the grinding wheel further comprises: moving the grinding wheel to the standard position; moving the grinding wheel X in the first direction from the standard positionmAnd moving the grinding wheel from the standard position in the second direction ZmThe distance of (c). Therefore, the variation of the actual use position of the grinding wheel can be determined based on the variation of the position when the groove bottom of the grinding groove and the position detection unit coincide before and after the position adjustment of the grinding wheel, and the variation of the reference position and the variation of the actual use position are identical, so that the use position of the grinding wheel can be simply and conveniently determined, and the time is saved and the accuracy is high.
According to an embodiment of the invention, the distance X that the edge of the piece to be ground exceeds the edge of the sample stage0Is 6-15 mm. Thereby, during the alignment of the grinding piece and the grinding wheel, the distance X can be used0The position of the grinding wheel is directly adjusted, so that the grinding wheel is simple and time-saving.
In another aspect of the invention, a grinding system is provided. According to an embodiment of the invention, the grinding system is configured to utilize the method of any of the preceding claims. Accordingly, the polishing system has all the features and advantages of any one of the polishing methods using the polishing system described above, and thus, the description thereof is omitted here. Generally, the grinding system has high production efficiency, and the produced product has good performance.
In yet another aspect of the present invention, a grinding system is provided. According to an embodiment of the present invention, the grinding system includes: a grinding wheel having a grinding groove surrounding an outer edge of the grinding wheel by one turn and configured to be rotatable along a rotation axis to perform grinding, one side of the rotation axis having a sample stage for placing an object to be ground, the grinding system further comprising a position detection unit configured to detect a position of a groove bottom of the grinding groove; and a position adjustment unit configured to adjust a position of the grinding wheel using the method of any of the preceding claims. Accordingly, the polishing system has all the features and advantages of any one of the polishing methods using the polishing system described above, and thus, the description thereof is omitted here. Generally, the grinding system has high production efficiency, and the produced product has good performance.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 shows a schematic diagram of a polishing system according to one embodiment of the present invention;
FIG. 2 shows a schematic diagram of a polishing system according to another embodiment of the present invention;
FIG. 3 shows a schematic diagram of a polishing system according to yet another embodiment of the present invention;
FIG. 4 shows a schematic diagram of a polishing system according to yet another embodiment of the present invention;
FIG. 5 shows a flow diagram of a grinding method using the grinding system according to one embodiment of the invention;
FIG. 6 shows a flow diagram of a grinding method using the grinding system according to another embodiment of the invention;
FIG. 7 shows a flow diagram of a grinding method using the grinding system according to yet another embodiment of the invention;
FIG. 8 shows a flow diagram of a grinding method using the grinding system according to yet another embodiment of the invention;
FIG. 9 shows a flow diagram of a grinding method using the grinding system according to yet another embodiment of the invention;
FIG. 10 shows a flow diagram of a grinding method using the grinding system according to yet another embodiment of the invention; and
fig. 11 shows a flow diagram of a grinding method using the grinding system according to yet another embodiment of the invention.
Description of reference numerals:
10: a grinding wheel; 20: a grinding groove; 21: an outer edge of the grinding groove; 30: a rotating shaft; 40: a sample stage; 41: a support plate; 42: a fixing member; 50: a position detection unit; 60: a part to be ground; 70: a grinding groove abrasion detection unit.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In one aspect of the invention, a method of grinding using a grinding system is provided. The method can quickly and accurately determine the using position of the grinding wheel after the grinding wheel is replaced, the grinding groove is switched or the grinding wheel is deformed (such as retracted), so that the utilization rate of the grinding equipment and the quality of ground products are improved, and the service life of the grinding wheel is prolonged.
For ease of understanding, the structure of the grinding system according to an embodiment of the present invention will be briefly described below. According to an embodiment of the present invention, referring to fig. 1, the grinding system includes a grinding wheel 10, a sample stage 40, and a position detecting unit 50, wherein the grinding wheel 10 has a grinding groove 20 surrounding an outer edge of the grinding wheel 10 by one turn, and a rotating shaft 30 provided at a center of the grinding wheel 10, and the grinding wheel 10 can rotate along the rotating shaft 30 to realize grinding; the rotating shaft 30 has a sample stage 40 at one side thereof for placing a member to be ground (not shown in the drawings), and the grinding system further includes a position detecting unit 50. It should be noted that, for the sake of understanding, the grinding wheel 10 shown in fig. 1 is a schematic cross-sectional structure of the grinding wheel.
According to an embodiment of the present invention, the grinding system may further include a motor (not shown) for providing power to the rotating shaft 30 to rotate the rotating shaft 30, so as to rotate the grinding wheel 10, and further grind a workpiece (not shown). Specifically, the outer edge of the grinding wheel 10 may be provided with one or more grinding grooves 20, for example, with reference to the edge of the grinding wheel 10 shown in fig. 1 being provided with 5 grinding grooves 20, the plurality of grinding grooves 20 may be arranged in sequence along the rotation axis 30 (i.e., in sequence in the Z direction shown in fig. 1). The grinding wheel 10 has a symmetrical structure, and the axis of symmetry is the rotation axis 30, and more specifically, the axis of symmetry is the central axis AA' of the rotation axis 30. Specifically, the grinding wheel 10 may be a circular disc or a circular ring, the grinding groove 20 is a circular ring surrounding the grinding wheel 10, and the use state and the wear state of the grinding wheel 10 at each position of the same grinding groove 20 are completely the same during the rotational grinding process. It should be noted that, the grinding groove in this application is generally a structure in which an alloy substrate is wrapped with grinding particles such as silicon carbide, and in the grinding process, the grinding particles such as silicon carbide contact with and grind the to-be-ground object, and the alloy substrate provides support for the grinding particles. The retraction, abrasion, deformation and the like of the grinding groove mentioned in the application refer to that the alloy substrate wrapping the grinding particles is abraded or damaged and the like in the long-term use process of the grinding groove, so that the grinding particles fall off to cause poor actual grinding effect, namely, the actual grinding amount is smaller than the preset grinding amount, or the actual grinding amount is larger than the preset grinding amount and the like, therefore, the retraction, abrasion, deformation and the like of the grinding groove are collectively referred to in the application.
Specifically, the location of the grinding wheel 10 referred to in this application may refer to the location of the center of the grinding wheel 10, i.e., the center of the rotational shaft 30, i.e., the location referred to as point a shown in fig. 1. According to an embodiment of the present invention, referring to fig. 1, the position of the grinding wheel 10 includes a position coordinate X in a first direction (i.e., X direction shown in fig. 1) and a position coordinate Z in a second direction (i.e., Z direction shown in the figure), wherein the first direction and the second direction are perpendicular, and a plurality of grinding grooves 20 are arranged in sequence in the Z direction, that is, a rotation shaft 30 extends in the Z direction, and the grinding wheel can be rotationally ground around the rotation shaft 30 in the Z direction during grinding.
According to the embodiment of the present invention, the shape and the arrangement position of the sample stage 40 are not particularly limited as long as the groove bottom of the grinding groove 20 (for example, two symmetrical points B and B' on the groove bottom of the grinding groove 20 shown in fig. 1) can be brought into effective contact with a member to be ground (not shown in the figure) placed on the sample stage 40 and ground.
According to an embodiment of the present invention, the position detecting unit 50 may include a charge coupled device image sensor (CCD detector) that may capture an image of an object and convert an optical signal into an electrical signal. Specifically, the CCD detector is fixed at a position in the grinding system, the CCD detector has a detection direction (photographing direction) and a detection area (photographing range), that is, when the object is located in the detection area of the CCD detector, the CCD detector can obtain the image information of the object, in other words, the position of the position detection unit 50 is fixed, and only when the grinding wheel enters the detection area (photographing range) of the CCD detector, the CCD detector can obtain the groove bottom image of the grinding wheel.
According to the embodiment of the present invention, the position at which the position detection unit 50 is disposed is not particularly limited as long as the position at which the bottom of the grinding groove 20 is located can be detected. Specifically, referring to fig. 1, after the grinding wheel 10 moves toward the sample stage 40 in the first direction (i.e., X direction), the bottom of the grinding groove 20 is brought into contact with a member to be ground (not shown) placed on the sample stage 40, and the standard position of the grinding wheel 10 is recorded. The rotation axis 30 of the grinding wheel 10 extends along the second direction (i.e., Z direction), and the detection direction of the position detection unit 50 may be perpendicular to the plane formed by the rotation axis 30 and the first direction (i.e., X direction), that is, when the position detection unit 50 is a CCD detector, the detection direction (photographing direction) of the CCD detector is perpendicular to the paper surface. It will be appreciated by those skilled in the art that since the grinding wheel 10 needs to be moved in the first direction into the detection area (photographing range) of the CCD detector, the CCD detector cannot affect the movement of the grinding wheel 10 when the CCD detector is set. That is, the CCD detector needs to be disposed at a position offset from a plane formed by the rotation axis 30 and the first direction (i.e., X direction). Therefore, by moving the grinding wheel 10 in the first direction (X direction), the alignment between the to-be-ground member (not shown) on the sample stage 40 and the grinding groove 20 and the alignment between the position detection unit 50 and the groove bottom of the grinding groove 20 can be realized (i.e. by moving the grinding wheel 10 in the first direction (X direction), the groove bottom of the grinding groove 20 can be moved into the detection area of the position detection unit 50, and therefore, the position detection unit 50 can acquire the image information and the position information of the groove bottom of the grinding groove 20), the operation is simple, the error caused by multiple multi-directional movements of the grinding wheel 10 is avoided, and the alignment accuracy and the grinding accuracy are improved.
Specifically, as shown in fig. 1, when the grinding wheel 10 moves to the side close to the position detection unit 50 along the X direction, the outer edge of the grinding wheel 10 may first enter the detection area of the position detection unit 50, and then the position detection unit 50 may first obtain the image and the position of the outer edge of the grinding wheel 10, and then the grinding wheel 10 may continue to move to the side close to the position detection unit 50 along the X direction until the position of the groove bottom (e.g., point B' in the figure) of the grinding groove coincides with the detection center of the detection area (shown in fig. 2), where the position of the grinding wheel 10 is the reference position (the first reference position or the second reference position) of the grinding wheel 10. Note that, the "coincidence of the groove bottom of the polishing groove and the detection center of the position detection unit" referred to herein means that the groove bottom of the polishing groove and the center of the detection area of the position detection unit coincide. For example, when the position detection unit is a CCD detector, the center of the detection area may be the center point of the photographing interface of the CCD detector.
According to the embodiment of the present invention, referring to fig. 2 and 3 (fig. 2 and 3 show schematic structural diagrams of the grinding system when the grinding wheel 10 is moved to the bottom of the grinding groove and the center of the position detection unit 50 coincide), the projection of the position detection unit 50 on the plane formed by the rotation axis 30 and the first direction (i.e., the X direction) (i.e., the projection on the paper surface) may be located between the sample stage 40 and the grinding wheel 10 (shown in fig. 3), on the side of the sample stage 40 away from the grinding wheel 10 (not shown in the figure), or on the side of the grinding wheel 10 away from the sample stage 40 (shown in fig. 2). Thereby, it is advantageous to move the grinding wheel 10 in the first direction and to position it in the detection area of the position detection unit 50. Specifically, referring to fig. 3, when the projection of the position detection unit 50 on the plane formed by the rotation axis 30 and the first direction (i.e., the X direction) is located between the sample stage 40 and the grinding wheel 10, by moving the grinding wheel 10, the groove bottom of the grinding groove on the side of the grinding wheel 10 close to the sample stage 40 (i.e., the point B shown in the drawing) and the center of the detection area of the position detection unit 50 can be easily made to coincide; specifically, when the position detecting unit 50 is disposed on the side of the sample stage 40 away from the grinding wheel 10, the sample stage 40 may be moved in a direction perpendicular to the paper surface and away from the position detecting unit 50, and then the grinding wheel 10 may be moved in a first direction toward the position detecting unit 50, so that the groove bottom (i.e., point B shown in the figure) of the grinding groove on the side of the grinding wheel 10 close to the sample stage 40 may coincide with the center of the detection area of the position detecting unit 50; specifically, referring to fig. 2, the projection of the position detecting unit 50 on the plane formed by the rotation axis 30 and the first direction (i.e., X direction) is located on the side of the grinding wheel 10 away from the sample stage 40, and by moving the grinding wheel 10, the groove bottom of the grinding groove on the side of the grinding wheel 10 away from the sample stage 40 (i.e., point B' shown in the figure) and the center of the detection area of the position detecting unit 50 can be easily made to coincide.
As mentioned above, the conventional grinding method using the grinding system has the problems of unstable grinding quality, short service life of the grinding wheel, long replacement time of the grinding wheel, complex replacement process, low equipment utilization rate, and the like. According to the method provided by the embodiment of the invention, after the grinding amount is adjusted and before grinding is carried out, the use position of the adjusted grinding wheel (namely the groove bottom of the grinding groove and the standard position of the grinding wheel when the to-be-ground piece is contacted) is recorded, then the grinding wheel is moved to the position where the groove bottom of the grinding groove is superposed with the detection center of the position detection unit, the first reference position of the grinding wheel is recorded, and then grinding is carried out. After the grinding wheel is used for a period of time, or the grinding groove is switched, or the grinding wheel is replaced, the used or replaced grinding wheel (grinding groove) is moved to a position where the groove bottom of the grinding groove and the detection center of the position detection unit coincide, a second reference position of the grinding wheel is recorded, and the standard position of the grinding wheel is adjusted based on the second reference position and the first reference position to determine the position of the grinding wheel again.
That is, the method uses the detection position to provide a reference to the use position by recording the use position of the previously dressed grinding wheel (resulting in the standard position) and skillfully using the position detection unit to determine the detection position of the dressed grinding wheel (resulting in the first reference position), i.e., correlating the use position of the grinding wheel with the detection position. After the grinding wheel (grinding groove) is replaced or the grinding wheel is deformed after being used for a period of time, the replaced or deformed grinding wheel (grinding groove) is moved to the detection position of the grinding wheel (a second reference position is obtained), and the variation of the use position of the grinding wheel relative to the standard position can be deduced based on the two-time detection position variation of the grinding wheel. Therefore, compared with the method that the position debugging is not carried out after the grinding wheel is replaced and the grinding is directly carried out or the grinding wheel is replaced and is subjected to a complicated debugging process, the method has the advantages of simplicity, rapidness and accuracy, the method can simplify the process of replacing the grinding wheel, reduce the time for replacing the grinding wheel, improve the utilization rate and the production efficiency of the grinding equipment, improve the grinding quality, and avoid the problems of service life reduction of the grinding wheel and the like caused by the fact that the actual grinding amount is overlarge.
According to an embodiment of the present invention, the grinding system may further include a grinding groove wear detection unit configured to judge a wear condition of the grinding groove by observing a groove bottom of the grinding groove. Specifically, the grinding groove wear detection unit 70 may also be an inductively coupled device image sensor (CCD detector). Specifically, the position where the grinding groove wear detection unit is disposed is not particularly limited as long as the wear condition of the groove bottom of the grinding groove can be clearly detected. Specifically, referring to fig. 4, the grinding groove wear detecting unit 70 may also be disposed along the first direction (X direction), and the detecting direction (referring to the arrow M direction shown in the figure) of the grinding groove wear detecting unit 70 is directed to the groove bottom of the grinding groove 20. Therefore, the grinding groove wear detection unit 70 can clearly take pictures of the bottom of the grinding groove 20 to obtain the wear condition of the grinding groove, so as to determine whether the grinding groove needs to be switched or the grinding wheel needs to be replaced or not according to the wear condition of the grinding groove in the subsequent step. It should be noted that the grinding groove wear detecting unit 70 faces the grinding groove, so that the grinding groove wear detecting unit 70 can clearly capture the actual usage state and the wear state of the grinding wheel. In other words, the photographing direction of the grinding groove wear detecting unit 70 may be perpendicular to the photographing direction of the position detecting unit 50. The grinding groove wear detection unit 70 is only responsible for observing the wear condition of the groove bottom, therefore, the position where the grinding groove wear detection unit 70 is placed may also be fixed, as long as the picture information facing the groove bottom direction can be obtained, and the movement of the grinding wheel 10 in the first direction is not affected.
In fig. 1 to 4, the grinding wheel 10 is illustrated in a cross-sectional view for the sake of understanding.
As can be seen from the above, in the grinding method according to the embodiment of the present invention, by recording the movement of the grinding wheel to the reference position corresponding to the position detection unit, the reference and the relative positioning can be easily provided for the use position of the grinding wheel, and after the subsequent grinding groove is deformed, the grinding groove is switched, or the grinding wheel is replaced, the grinding wheel can be adjusted to the reference position first, and then the position of the grinding wheel can be easily determined again based on the variation of the reference position. Therefore, in the method, after the grinding groove is deformed and switched or the grinding wheel is replaced, the use position of the grinding wheel can be rapidly determined again without carrying out complicated alignment and calibration processes, the use position is accurate, and the use performance of the grinding wheel is improved.
Referring to fig. 5 and 6, according to an embodiment of the present invention, the method includes:
s110: contacting the bottom of the grinding groove with the workpiece to be ground, and recording the standard position of the grinding wheel
In this step, the grinding wheel is moved toward the sample stage, and the position of the grinding wheel when the groove bottom of the grinding groove and the member to be ground are in contact is recorded as a standard position. Specifically, referring to fig. 7 and 8, the method further includes:
s10: moving the grinding wheel to the position where the outer edge of the grinding groove is contacted with the edge of the sample table
In this step, the grinding wheel is moved to a position where the first side edge contacts the edge of the sample table and this position is recorded as the first position of the grinding wheel. Specifically, the shape of the sample stage is not particularly limited, and referring to (a) in fig. 9, the sample stage 40 may include a support plate 41 and a fixing member 42. Specifically, the member to be ground (e.g., an OLED substrate, not shown in fig. 9 (a)) may be placed between the supporting plate 41 and the fixing member 42, and the fixing member 42 may well fix the member to be ground, preventing the member to be ground from moving on the sample stage 40. Specifically, referring to (a) in fig. 9, the edge of the sample stage 40 and the outer edge 21 of the grinding groove 20 may be brought into contact, and the position of the grinding wheel 10 at this time, i.e., the position of the point a shown in the drawing, i.e., the first position, may be recorded. Note that the X direction shown in fig. 9 is the first direction, and the second direction (Z) direction is perpendicular to the first direction, i.e., a direction perpendicular to the paper surface in fig. 9.
S20: moving the grinding wheel in the direction far away from the part to be ground by X0
In the step, the grinding wheel is firstly moved X from the first position along the first direction to a direction far away from the piece to be ground0The part to be ground is then placed on the sample table, and the edge of the part to be ground exceeds the edge X of the sample table in the direction of the grinding wheel0The distance of (c). Specifically, referring to (b) in fig. 8 and (b) in fig. 9, in order to ensure grinding groove contactWhen the workpiece to be ground is ground, the sample table is not damaged, so that the workpiece to be ground 60 needs to be extended a certain distance (for example, X) beyond the edge of the sample table 40 in the direction toward the grinding wheel 100) Subsequently, the specific grinding amount and the like are adjusted, and the distance X0The grinding amount is far larger than the preset grinding amount, so that the to-be-ground piece 60 always exceeds the edge of the sample table 40 by a certain distance in the direction towards the grinding wheel 10 in the subsequent process of adjusting the grinding amount, and therefore, the grinding wheel 10 is prevented from grinding the sample table 40. Specifically, the distance X that the edge of the member to be ground 60 exceeds the edge of the sample stage 400It may be 6 to 15mm, specifically, 10 mm. Thus, in this step, it is possible to determine the distance X0The range of (1) directly adjusts the position of the grinding wheel 10 and then correspondingly adjusts the part to be ground 60, which is simple and time-saving.
S30: moving the grinding wheel in the direction close to the part to be ground by X1
In this step, the grinding wheel is moved X from the above-mentioned position in the first direction in a direction approaching the member to be ground1. Specifically, a standard value X of the grinding amount of the to-be-ground piece in the first direction is preset1Therefore, it is necessary to move the grinding wheel in the first direction X toward the member to be ground1。
S40: moving the grinding wheel in the direction close to the part to be ground by X2
In this step, the grinding wheel is moved X from the above-mentioned position in the first direction in a direction approaching the member to be ground2. Specifically, referring to (c) in fig. 8, the recessed depth of the grinding groove 20A in the first direction (X direction) is X2Thus, the grinding wheel 10 is moved X from the above position in a direction to approach the member to be ground 602. The depth of the recess is X2I.e. the vertical distance from the groove bottom of the grinding groove (point B in the figure) to the outer edge 21 of the grinding groove.
S50: moving the grinding wheel X3Obtaining the standard position of the grinding wheel
In this step, the grinding wheel is brought along from the position described beforeMoving in a first direction X3And obtaining the standard position of the grinding wheel. Specifically, when the member to be ground is placed on the sample stage in the previous step, the position deviation X is provided in the first direction when the member is placed3Therefore, it is necessary to correct the positional deviation X3Compensation is performed. Specifically, when the member to be ground is placed on the sample table in the previous step, the edge of the member to be ground needs to be beyond the edge X of the sample table in the direction toward the grinding wheel0So that the edge of the member to be ground just contacts with the outer edge of the grinding wheel, and the position of the member to be ground in the first direction is the preset position of the member to be ground. However, in practice, when the piece to be ground is placed on the sample table, there is a certain deviation, namely: the edge of the actually placed member to be ground is not X beyond the edge of the sample table in the direction towards the grinding wheel0. Namely, when the to-be-ground piece is actually placed, the position deviation X in the placing process can exist in the first direction3I.e. the distance between the actual placement position of the piece to be ground and the previously mentioned predetermined position of the piece to be ground. Specifically, alignment marks (Mark) may be designed on a workpiece (e.g., an organic light emitting display panel) in advance, and the polishing system further includes a workpiece position detection unit, which may be a CCD detector and configured to acquire an image and position information of the alignment marks on the workpiece. Specifically, the distance (i.e., the standard distance) between the alignment mark on the workpiece to be ground and the detection center of the position detection unit of the workpiece to be ground when the workpiece to be ground is at the predetermined position may be predetermined, the distance (i.e., the actual distance) between the alignment mark on the workpiece to be ground and the detection center of the position detection unit of the workpiece to be ground may be detected again after the workpiece to be ground is placed on the sample stage each time, and the position deviation X in the first direction when the workpiece to be ground is placed on the sample stage as described above may be determined by calculating the difference between the actual distance and the standard distance3. Thus, the grinding wheel is moved X in the first direction from the position3The position is the standard position of the grinding wheel. Specifically, the positional deviation X3The position of the workpiece to be ground on the sample table may be close to the groundThe grinding groove may be deviated from the grinding groove, so that the grinding wheel is required to move along the first direction to a direction away from or close to the member to be ground3。
In conclusion, the method can accurately align the workpiece to be ground and the grinding groove, improves the grinding accuracy and improves the quality of ground products. And the standard position of the grinding wheel determined in the above steps can be used as a reference for adjusting the position of the grinding wheel when the use position of the grinding wheel is determined again after the subsequent grinding wheel is deformed or replaced.
S120: the bottom of the grinding groove is coincided with the detection center of the position detection unit, and the first reference position of the grinding wheel is recorded
In this step, the grinding wheel is moved from the standard position adjusted in the above step to a position where the groove bottom of the grinding groove and the detection center of the position detection unit coincide, and this position of the grinding wheel is recorded as a first reference position. Specifically, as described above with reference to fig. 1, the grinding wheel 10 may be moved from the standard position adjusted in the previous step to the side close to the position detecting unit 50 along the X direction, during the movement, the outer edge of the grinding wheel 10 may first enter the detection area of the position detecting unit 50, and then the position detecting unit 50 may first obtain the image and the position of the outer edge of the grinding wheel 10, and then the grinding wheel 10 may continue to move to the side close to the position detecting unit 50 along the X direction until the position of the groove bottom (e.g., point B' in the figure) of the grinding groove coincides with the center of the detection area of the position detecting unit 50 (as shown with reference to fig. 2), at which time the position of the grinding wheel 10 is the first reference position of the grinding wheel 10. Therefore, the method can accurately obtain the first reference position of the grinding wheel, is beneficial to accurately adjusting the use position of the grinding wheel in a subsequent method, and improves the quality of a product ground by the method.
S130: the grinding wheel is moved back to the standard position to grind the part to be ground
In this step, after the first reference position of the grinding wheel is recorded by the previous step, the grinding wheel is moved back to the standard position, and the grinding wheel grinds the member to be ground.
According to the embodiment of the invention, the grinding wheel can automatically move to the position detection unit every time one piece to be ground is processed in the grinding process, namely: the grinding wheel can automatically adjust the position of the grinding wheel when grinding a to-be-ground part, so that the method can automatically and timely calibrate the use position of the grinding wheel, improves the grinding accuracy and the grinding product quality, and improves the automation degree of the grinding system. According to the embodiment of the present invention, after the grinding groove is switched or the grinding wheel is replaced, the operation of adjusting the position of the grinding wheel may be performed, and specifically, the following steps may be performed:
s200: operation of adjusting the position of the grinding wheel
In this step, the position of the grinding wheel is adjusted after grinding each member to be ground, either switching the grinding grooves or replacing the grinding wheel. Specifically, referring to fig. 6, the method further includes the following steps:
s210: the groove bottom of the grinding groove is coincided with the detection center of the position detection unit again, and a second reference position of the grinding wheel is recorded
In this step, the groove bottom of the grinding groove and the detection center of the position detection unit are again made to coincide, and the position is recorded as a second reference position of the grinding wheel. Specifically, the grinding wheel may be retracted after a long-term use, and therefore, after each piece to be ground is ground by the grinding wheel, the groove bottom of the grinding groove may be brought into coincidence with the center of the detection area of the position detection unit again, and at this time, if the groove bottom of the grinding groove is retracted, the position of the grinding wheel (i.e., the second reference position) when the groove bottom of the grinding groove and the detection center of the position detection unit are brought into coincidence again is also changed from the first reference position recorded in the previous step. Specifically, after the grinding wheel is replaced, the grinding wheel may be adjusted to a position where the groove bottom of the grinding groove and the detection center of the position detection unit coincide with each other, and the position may be recorded as the second reference position.
S220: adjusting the standard position to reposition the grinding wheel
In this step, the standard position of the grinding wheel recorded in the previous step is adjusted based on the second reference position and the first reference position recorded in the previous step to re-determine the position of the grinding wheel. Specifically, the difference between the second reference position and the first reference position of the grinding wheel recorded in the previous step, that is, the reference position variation may be calculated, the grinding wheel may be moved to the standard position of the grinding wheel recorded in the previous step, and the position of the grinding wheel may be adjusted based on the reference position variation on the basis of the standard position, so as to determine the final use position of the grinding wheel. Specifically, the reference position variation may include a first reference position variation X in a first directionmAnd a second reference position variation Z in a second directionm. Specifically, the first reference position variation amount XmHaving positive and negative values, second reference position variation ZmAlso have positive and negative values. According to the embodiment of the present invention, the first reference position variation amount XmWhen the value is positive, when the using position of the grinding wheel is determined again, the grinding wheel can be moved in a first direction to a direction close to the workpiece at the standard position of the grinding wheel; when the first reference position changes by an amount XmIn the case of negative values, the grinding wheel can be moved in a first direction away from the component to be ground. Likewise, the second reference position variation amount ZmHas positive and negative values when the second reference position changes ZmWhen the grinding wheel is positive, the grinding wheel can be moved in the second direction to a direction away from the workpiece to be ground at the standard position of the grinding wheel; when the second reference position changes by an amount ZmIn the case of negative values, the grinding wheel can be moved in the second direction in the direction of approach to the element to be ground. Thus, the actual use position of the grinding wheel can be easily adjusted according to the reference position change amount.
According to an embodiment of the present invention, the first reference position variation amount in the first direction determined in the previous step is XmReferring to fig. 1, the position of the center of the rotational axis 20 of the grinding wheel 10 (i.e., the position of point a in the figure) has a first reference position variation in the first directionIs XmWhen the using position of the grinding wheel 10 is subsequently determined again, the grinding wheel 10 can be moved to the standard position, and since the grinding groove is in a circular ring structure surrounding the grinding wheel and is rotated during use, the using state and the wearing state of each position of the same grinding groove are completely the same, so that the variation of the reference position of the grinding wheel and the variation of the actual using position are the same, and the grinding wheel can be moved from the standard position along the first direction XmThe use position of the grinding wheel 10 can be determined anew. Therefore, the method can acquire the position information of any point on the groove bottom of the grinding groove through the position detection unit, obtain the reference position of the grinding wheel based on the position information, subsequently determine the abrasion loss and the like of the grinding wheel based on the change of the two reference positions, and further accurately adjust the use position of the grinding wheel.
Specifically, for example, in the X direction, when the grinding groove is retracted, for example, by 1 μm, and the groove bottom B or B' of the grinding groove is overlapped with the position detection unit 50, the first reference position change amount XmIt may be 1 μm, and accordingly, when the position of the grinding wheel 10 is re-determined, it is required to move the grinding wheel by a distance of 1 μm in a direction close to the sample stage 40 based on the standard position to compensate for the retraction amount of the grinding groove. Specifically, in the second direction, the second reference position variation amount is ZmThe grinding wheel can be moved from the standard position in the second direction ZmThe distance of (c). Therefore, the variation of the actual use position of the grinding wheel can be determined based on the variation of the position when the groove bottom of the grinding groove and the position detection unit coincide before and after the position adjustment of the grinding wheel, and then the use position of the grinding wheel can be simply and conveniently determined, so that the time is saved and the accuracy is realized.
As mentioned above, after the grinding wheel is used for a period of time, deformation, such as retraction of the grinding groove, may occur, which results in an insufficient actual grinding amount (i.e. a smaller actual grinding amount), and if the grinding error caused by retraction of the grinding groove cannot be compensated in time, the grinding amount of the ground product is unstable (e.g. the grinding amount is smaller), which results in poor quality of the ground product. According to the method provided by the embodiment of the invention, the grinding amount of the ground product can be automatically checked, for example, the state and the position of the grinding groove can be confirmed before each piece to be ground is processed, so as to ensure that the grinding groove is present at a preset position in the actual grinding process, and further ensure the grinding amount of the piece to be ground. Namely, the system can automatically correct and compensate the grinding amount when the grinding wheel grinds one piece to be ground, or can re-determine the use position of the grinding wheel according to the comprehensive method for adjusting the position of the grinding groove after the grinding groove is switched or the grinding wheel is changed when the grinding groove is seriously shrunk and the grinding groove needs to be switched or the grinding wheel needs to be changed. Therefore, the automation degree of the grinding equipment is improved, the grinding accuracy is improved, and the quality of the ground product is improved.
In accordance with an embodiment of the present invention, referring to fig. 10, after a period of use of the grinding wheel, the method further comprises:
s300: detecting the abrasion of the grinding groove by using a grinding groove abrasion detection unit
In the step, after the grinding wheel grinds the part to be ground for a period of time, the abrasion condition of the grinding groove can be checked through the grinding groove abrasion detection unit. Specifically, as described above, the grinding groove wear detection unit may also be an inductively coupled device image sensor (CCD detector). Specifically, the grinding groove wear detection unit may be fixed in the grinding system, or may be movable, as long as when the wear condition of the grinding groove needs to be detected or the grinding piece to be ground is broken due to production abnormality, the grinding groove wear detection unit may accurately obtain the use condition (groove bottom picture) of the groove bottom of the grinding groove, for example, the falling degree of the diamond grains embedded on the alloy substrate may be known. Specifically, referring to fig. 4, when detecting the wear condition of the grinding groove, the grinding groove wear detection unit 70 may be disposed at a side opposite to the grinding wheel 10 and away from the sample stage 40, so that the grinding groove wear detection unit 70 can clearly take a picture of the bottom of the grinding groove when at that position to obtain the wear condition of the grinding groove.
Specifically, in the long-term use of the grinding wheel, the number of the to-be-ground members ground by the grinding groove is a certain value (for example, 500 members), and the grinding groove usually reaches the limit of the service life, so that the need of replacing the grinding wheel or switching the grinding groove can be directly judged according to the number of the to-be-ground members ground by the grinding groove, or the service life (for example, 1 month) of the grinding groove, and the like. Specifically, after grinding the piece of treating of grinding a certain amount in grinding groove, can tentatively judge that this grinding groove reaches the life-span limit, then recycle grinding groove wearing and tearing detecting element, the actual wearing and tearing condition of accurate acquisition grinding groove, and then can confirm whether change grinding miller or switch grinding groove.
S200: entering into operation for adjusting the position of the grinding wheel
In this step, it can be determined whether the grinding groove can be used continuously or not according to the wear condition of the grinding groove detected by the grinding groove wear detection unit, and if the grinding groove cannot be used continuously, the grinding groove can be switched or the grinding wheel can be replaced, and after the grinding groove is switched or the grinding wheel is replaced, the position of the grinding wheel can be adjusted according to the method for adjusting the position of the grinding wheel.
In summary, the method can detect the actual use condition and the abrasion condition of the grinding groove, and can switch the grinding groove or replace the grinding wheel according to the inspected abrasion condition and the like so as to better ensure stable grinding quality. Therefore, the method improves the grinding accuracy and the quality of the ground product.
As mentioned above, after the grinding wheel is replaced, the problems of long replacement time, poor initial grinding quality and the like generally exist. According to an embodiment of the present invention, referring to fig. 11, after the operation of grinding the workpiece to be ground by the grinding wheel as described above, the method may further include:
s400: replacing grinding wheel
In this step, the grinding wheel is replaced, and after the replacement, the operation of adjusting the position of the grinding wheel as described above is performed. Therefore, the method can adjust the use position of the replaced grinding wheel based on the pre-recorded standard position and the first reference position of the grinding wheel after the grinding wheel is replaced, the adjustment time is short and accurate, the utilization rate of the grinding equipment and the quality of ground products are improved, and the service life of the grinding wheel is prolonged.
According to an embodiment of the present invention, the grinding wheel may be a grinding wheel for grinding the liquid crystal display panel and the organic light emitting display panel. Therefore, the grinding wheel can well grind the display panel, and the product quality of the display panel is improved.
In summary, according to the grinding method using the grinding system of the embodiment of the invention, the use position of the grinding wheel can be determined quickly and accurately after the grinding wheel is replaced or deformed (e.g. retracted), so that the utilization rate of the grinding equipment and the quality of ground products are improved, and the service life of the grinding wheel is prolonged.
In another aspect of the invention, a grinding system is provided. According to an embodiment of the present invention, the grinding system may be used for grinding using any of the methods described above. Accordingly, the polishing system has all the features and advantages of any one of the polishing methods using the polishing system described above, and thus, the description thereof is omitted here. Generally, the grinding system has high production efficiency, and the produced product has good performance.
In yet another aspect of the present invention, a grinding system is provided. According to an embodiment of the present invention, the grinding system includes: grinding wheel, sample platform and position control unit. The grinding wheel is provided with a grinding groove which surrounds the outer edge of the grinding wheel for one circle, the grinding wheel and the grinding groove can rotate along a rotating shaft to realize grinding, one side of the rotating shaft is provided with a sample table for placing a piece to be ground, the grinding system further comprises a position detection unit, the position detection unit is configured to detect the position of the groove bottom of the grinding groove, and the position adjustment unit can adjust and control the position of the grinding wheel by using the method in any one of the preceding claims. Accordingly, the polishing system has all the features and advantages of any one of the polishing methods using the polishing system described above, and thus, the description thereof is omitted here. Generally, the grinding system has high production efficiency, and the produced product has good performance.
In the description of the present invention, the terms "outer", "upper", "lower", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention but do not require that the present invention must be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description herein, references to the description of "one embodiment," "another embodiment," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction. In addition, it should be noted that the terms "first" and "second" in this specification are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

Claims (10)

1. A grinding method using a grinding system, wherein the grinding system includes a grinding wheel having a grinding groove formed around an outer edge of the grinding wheel and configured to be rotatable along a rotation axis for grinding, one side of the rotation axis having a sample table for placing an object to be ground, the grinding system further including a position detection unit configured to detect a position of a groove bottom of the grinding groove, the method comprising:
moving the grinding wheel to the sample stage, and recording the position of the grinding wheel when the groove bottom of the grinding groove is contacted with the piece to be ground as a standard position;
moving the grinding wheel to the position detection unit, and recording the position of the grinding wheel when the groove bottom of the grinding groove is superposed with the detection center of the position detection unit as a first reference position;
moving the grinding wheel to the standard position, and grinding the to-be-ground piece by using the grinding wheel according to a preset grinding amount; and
adjusting the position of the grinding wheel: moving the grinding wheel again to the position detecting unit, recording the position of the grinding wheel when the groove bottom of the grinding groove and the detection center of the position detecting unit coincide as a second reference position, and adjusting the standard position based on the second reference position and the first reference position to re-determine the position of the grinding wheel,
the grinding wheel moves in a first direction, the first direction being perpendicular to the axis of rotation; the detection direction of the position detection unit is perpendicular to a plane formed by the rotation axis and the first direction, and the standard position is determined by:
moving the grinding wheel to a position where an outer edge of the grinding groove and an edge of the sample stage are in contact, and recording the position of the grinding wheel as a first position; in the first direction, the grinding wheel is firstly moved X from the first position along the first direction to a direction far away from the piece to be ground0Then, the piece to be ground is placed on the sample table, the edge of the piece to be ground exceeds the edge X of the sample table in the direction toward the grinding wheel0The distance of (d); presetting a standard value X of the grinding quantity of the to-be-ground piece in the first direction1Moving the grinding wheel along the first direction to a direction close to the part to be ground by X1(ii) a The concave depth of the grinding groove in the first direction is X2Moving the grinding wheel to a direction close to the part to be ground by X2(ii) a When the piece to be ground is placed on the sample stage, the position deviation X is formed in the first direction3Based on said position deviation X3Adjusting the position of the grinding wheel.
2. A method according to claim 1, characterized in that the position of the grinding wheel is adjusted after grinding of one of the items to be ground by means of the grinding wheel.
3. The method of claim 1, wherein the position of the grinding wheel is adjusted after replacing the grinding wheel or switching the grinding groove.
4. The method according to claim 1, wherein the grinding system further comprises a grinding groove wear detection unit configured to judge a wear condition of the grinding groove by observing a groove bottom of the grinding groove,
after the grinding wheel is used for grinding the part to be ground, the method further comprises the following steps:
detecting the abrasion condition of the grinding groove by using the grinding groove abrasion detection unit,
judging whether the grinding groove needs to be switched or the grinding wheel needs to be replaced according to the abrasion condition of the grinding groove; adjusting the position of the grinding wheel after switching the grinding groove or replacing the grinding wheel.
5. Method according to claim 1, characterized in that said position deviation X3Is determined by the following steps:
correcting the placing position of the to-be-ground piece on the sample table, wherein the deviation between the placing position of the to-be-ground piece and the preset position of the to-be-ground piece is the position deviationX3。
6. The method of claim 1, wherein the position of the grinding wheel comprises a position coordinate X in the first direction and a position coordinate Z in a second direction, wherein the first direction and the second direction are perpendicular, wherein the rotation axis extends in the second direction, wherein the difference between the second reference position and the first reference position when adjusting the position of the grinding wheel is a reference position change amount comprising a first reference position change amount X in the first directionmAnd a second reference position variation Z in the second directionm。
7. The method of claim 6, wherein the adjusting the position of the grinding wheel further comprises:
moving the grinding wheel to the standard position;
moving the grinding wheel X in the first direction from the standard positionmAnd moving the grinding wheel from the standard position in the second direction ZmThe distance of (c).
8. The method of claim 1, wherein the edge of the member to be ground exceeds the edge of the sample stage by a distance X0Is 6-15 mm.
9. A grinding system configured to utilize the method of any one of claims 1-8.
10. A grinding system, comprising: a grinding wheel having a grinding groove surrounding an outer edge of the grinding wheel by one turn and configured to be rotatable along a rotation axis to perform grinding, one side of the rotation axis having a sample stage for placing an object to be ground, the grinding system further comprising a position detection unit configured to detect a position of a groove bottom of the grinding groove; and
a position adjustment unit configured to adjust the position of the grinding wheel using the method of any one of claims 1-8.
CN201910006892.9A 2019-01-04 2019-01-04 Grinding method using grinding system and grinding system Active CN109590893B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201910006892.9A CN109590893B (en) 2019-01-04 2019-01-04 Grinding method using grinding system and grinding system
US16/551,845 US20200215656A1 (en) 2019-01-04 2019-08-27 Grinding method using grinding system and grinding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910006892.9A CN109590893B (en) 2019-01-04 2019-01-04 Grinding method using grinding system and grinding system

Publications (2)

Publication Number Publication Date
CN109590893A CN109590893A (en) 2019-04-09
CN109590893B true CN109590893B (en) 2021-01-26

Family

ID=65965064

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910006892.9A Active CN109590893B (en) 2019-01-04 2019-01-04 Grinding method using grinding system and grinding system

Country Status (2)

Country Link
US (1) US20200215656A1 (en)
CN (1) CN109590893B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110281101B (en) * 2019-07-23 2021-10-29 西安奕斯伟材料科技有限公司 Edge grinding device and method
CN110653719A (en) * 2019-10-08 2020-01-07 彩虹（合肥）液晶玻璃有限公司 Polishing apparatus and polishing line
CN111037458A (en) * 2019-12-17 2020-04-21 西安奕斯伟硅片技术有限公司 Monitoring device and silicon wafer processing device
CN113211235A (en) * 2021-05-10 2021-08-06 山西光兴光电科技有限公司 Polishing apparatus and polishing method
CN114211328A (en) * 2021-12-09 2022-03-22 技感半导体设备(南通)有限公司 Grinding spindle coordinate measuring method
CN115431130A (en) * 2022-08-25 2022-12-06 山西光兴光电科技有限公司 Correcting device for glass grinding equipment and glass grinding equipment

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007098487A (en) * 2005-09-30 2007-04-19 Tokyo Seimitsu Co Ltd Wafer chamfering device
CN101024275A (en) * 2006-02-24 2007-08-29 中村留精密工业株式会社 Methods of measuring and compensating cutting size on chamfering machine of sheet material
WO2010113982A1 (en) * 2009-04-03 2010-10-07 旭硝子株式会社 Device for chamfering glass substrate
CN103029035A (en) * 2012-11-28 2013-04-10 上海华力微电子有限公司 Polishing pad and loss detecting method during polishing by using same
CN105895562A (en) * 2016-03-18 2016-08-24 京东方科技集团股份有限公司 Robot arm and method for substrate alignment
CN106903568A (en) * 2017-03-30 2017-06-30 郑州旭飞光电科技有限公司 Glass substrate grinding system
CN107427983A (en) * 2015-03-18 2017-12-01 埃尔温容克尔机械制造有限公司 Have the method and milling drum of slotted workpiece for being ground
JP2018114580A (en) * 2017-01-17 2018-07-26 株式会社ディスコ Processing method and cutting device for wafer

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007098487A (en) * 2005-09-30 2007-04-19 Tokyo Seimitsu Co Ltd Wafer chamfering device
CN101024275A (en) * 2006-02-24 2007-08-29 中村留精密工业株式会社 Methods of measuring and compensating cutting size on chamfering machine of sheet material
WO2010113982A1 (en) * 2009-04-03 2010-10-07 旭硝子株式会社 Device for chamfering glass substrate
CN103029035A (en) * 2012-11-28 2013-04-10 上海华力微电子有限公司 Polishing pad and loss detecting method during polishing by using same
CN107427983A (en) * 2015-03-18 2017-12-01 埃尔温容克尔机械制造有限公司 Have the method and milling drum of slotted workpiece for being ground
CN105895562A (en) * 2016-03-18 2016-08-24 京东方科技集团股份有限公司 Robot arm and method for substrate alignment
JP2018114580A (en) * 2017-01-17 2018-07-26 株式会社ディスコ Processing method and cutting device for wafer
CN106903568A (en) * 2017-03-30 2017-06-30 郑州旭飞光电科技有限公司 Glass substrate grinding system

Also Published As

Publication number Publication date
CN109590893A (en) 2019-04-09
US20200215656A1 (en) 2020-07-09

Similar Documents

Publication Publication Date Title
CN109590893B (en) Grinding method using grinding system and grinding system
JP3628538B2 (en) Substrate chamfering device
US7500902B2 (en) Thickness-measuring method during grinding process
JP2007096091A (en) Wafer processing method
US9835449B2 (en) Surface measuring device and method thereof
JP6676284B2 (en) Work processing equipment
US6881130B1 (en) Edge grinding
KR101944148B1 (en) Device and method for aligning substrates
KR20140118884A (en) Apparatus for circumference grinding of work
KR102330017B1 (en) Substrate processing apparatus and substrate processing method
KR20040031070A (en) Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method
US8599366B2 (en) Method and device for determining a deformation of a disk-shaped workpiece, particularly a mold wafer
JP2005022059A (en) Grinder and grinding method
JP5953574B2 (en) Method for manufacturing a substrate / product substrate combination
JP6539467B2 (en) Grinding machine
JPH06151586A (en) Method and device for dicing
JP2010194678A (en) Machining device
JP2019214109A (en) Processing device adjustment method and processing device
JP6736728B2 (en) Grinding machine
KR20220137014A (en) Substrate processing apparatus and substrate processing method
JP7362787B2 (en) Bonding device and bonding method
JP7394638B2 (en) Grinding device and grinding method
JP6712841B2 (en) Grinding method
JP2009283545A (en) Method of manufacturing semiconductor apparatus
CN219626624U (en) Auxiliary tool for calibrating target position of manipulator

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant