US20200215656A1

US20200215656A1 - Grinding method using grinding system and grinding device

Info

Publication number: US20200215656A1
Application number: US16/551,845
Authority: US
Inventors: Haibo Li; Yanbin Zhang; Xiaocong DENG; Hongyi WEI; Tong Zhang; Wanli BIAN; Liqiang SUN; Zhiwei LV; Li Huang
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2019-01-04
Filing date: 2019-08-27
Publication date: 2020-07-09
Also published as: CN109590893A; CN109590893B

Abstract

The disclosure discloses a grinding method using a grinding device, and a grinding device. The disclosure provides a grinding method using a grinding device, where the method includes: moving a grinding wheel toward a sample stage, and recording a position of the grinding wheel when the bottom of a grinding groove comes into contact with a piece to be ground as a standard position; moving the grinding wheel toward a position detector, and recording a position of the grinding wheel when a position of the bottom of the grinding groove coincides with a detecting center of the position detector as a first reference position; moving the grinding wheel back to the standard position, and grinding the piece to be ground, according to a preset grinding amount using the grinding wheel; and adjusting the position of the grinding wheel.

Description

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority of Chinese Patent Application No. 201910006892.9, filed with the Chinese Patent Office on Jan. 4, 2019, the content of which is hereby incorporated by reference in its entirety.

FIELD

The present disclosure relates to the field of fabricating a display panel, and particularly to a grinding method using a grinding device, and a grinding device.

BACKGROUND

A display panel, which is an important component of a display device, has been widely applied to a computer, a TV set, a mobile device, etc. In a flow of fabricating the display panel, a cutting process, and edge grinding and corner rounding process subsequent to the cutting process are indispensable, where the cutting process is typically performed using a grinding machine.

SUMMARY

In an aspect of the disclosure, embodiments of the disclosure provide a grinding method using a grinding device. In the embodiments of the disclosure, the grinding device includes: a grinding wheel including a grinding groove around tan outer edge of the grinding wheel, where the grinding wheel is configured to rotate around a rotation shaft for grinding; a sample stage on one side of the rotation shaft for placing thereon a piece to be ground; and a position detector configured to detect ta position of a bottom of the grinding groove; and the method includes: moving the grinding wheel toward the sample stage, and recording a position of the grinding wheel when the bottom of the grinding groove comes into contact with the piece to be ground as a standard position; moving the grinding wheel toward the position detector, and recording a position of the grinding wheel when a position of the bottom of the grinding groove coincides with a detecting center of the position detector as a first reference position; moving the grinding wheel back to the standard position, and grinding the piece to be ground, according to a preset grinding amount using the grinding wheel; and adjusting the position of the grinding wheel by: moving the grinding wheel again toward the position detector, recording a position of the grinding wheel when a position of the bottom of the grinding groove coincides with the detecting center of the position detector as a second reference position, and adjusting the standard position based upon the first reference position and the second reference position to thereby determine the position of the grinding wheel.
In the embodiments of the disclosure, the method further includes: adjusting the position of the grinding wheel after one piece to be ground is ground using the grinding wheel. In this way, the adjustment above for the position of the grinding wheel can be performed automatically every time a piece to be ground is ground using the grinding wheel.
In the embodiments of the disclosure, the method further includes: adjusting the position of the grinding wheel after the grinding wheel is replaced, or the grinding groove is switched. With this method, after the grinding wheel is replaced or the grinding groove is switched, the operating position of the replaced grinding wheel or the switched grinding groove can be adjusted based upon the standard position of the grinding wheel, and the first reference position.
In the embodiments of the disclosure, the method further includes: moving the grinding wheel in a first direction; wherein the first direction is perpendicular to the rotation shaft, and a detecting direction of the position detector is perpendicular to a plane defined by the rotation shaft and the first direction. In this way, the grinding wheel moves in the first direction so that the piece to be ground, on the sample stage can be aligned with the grinding groove, and the position detector can be aligned with the bottom of the grinding groove.
In the embodiments of the disclosure, the method further includes: the grinding device further includes a grinding groove abrasion detector configured to determine an abrasion condition of the grinding groove by observing the bottom of the grinding groove; and after the piece to be ground is ground using the grinding wheel, the method further includes: detecting the abrasion condition of the grinding groove using the grinding groove abrasion detector; and determining whether to switch the grinding groove, or to replace the grinding wheel, according to the abrasion condition of the grinding groove, and adjusting the position of the grinding wheel after switching the grinding groove or replacing the grinding wheel.
In the embodiments of the disclosure, the method further includes: the standard position is determined by: moving the grinding wheel to a position that an outer edge of the grinding groove comes into contact with an edge of the sample stage, and recording the position of the grinding wheel as a first position; firstly moving the grinding wheel from the first position by a distance X₀away from the piece to be ground, in the first direction, and then placing the piece to be ground, on the sample stage, wherein an edge of the piece to be ground, protrudes by the distance X₀beyond the edge of the sample stage toward the grinding wheel; presetting a standard value of grinding amount X₁of the piece to be ground, in the first direction, and moving the grinding wheel by the standard value X₁toward the piece to be ground, in the first direction; moving the grinding wheel by a value X₂toward the piece to be ground, wherein X₂is a value of a depth by which the grinding groove is recessed in the first direction; and placing the piece to be ground, on the sample stage, and adjusting the position of the grinding wheel based a positional displacement X₃of the piece to be ground, in the first direction. In the embodiments of the disclosure, the positional displacement X₃is determined by correcting a position of the piece to be ground, which is placed on the sample stage, and determining a difference between the position of the placed piece to be ground and a preset position of the piece to be ground as the positional displacement X₃. In this method, this method can correct an error of aligning the piece to be ground with the grinding groove.
In the embodiments of the disclosure, the method further includes: the position of the grinding wheel includes a positional coordinate X in the first direction, and a positional coordinate Z in a second direction, where the first direction is perpendicular to the second direction, the rotation shaft extends in the second direction, and when the position of the grinding wheel is adjusted, where a difference between the second reference position and the first reference position is a reference position variation including a first reference position variation X_min the first direction, and, and a second reference position variation Z_min the second direction. In this way, the position of the grinding wheel can be adjusted based upon the first reference position variation X_mand the second reference position variation Z_m.
In the embodiments of the disclosure, the adjusting the position of the grinding wheel further includes: moving the grinding wheel to the standard position; and moving the grinding wheel from the standard position by the distance X_min the first direction, and moving the grinding wheel from the standard position by the distance Z_min the second direction. In this way, the variation of the real operating position of the grinding wheel can be determined based upon the variation between the positions of the grinding wheel before and after it is adjusted, when the position of the bottom of the grinding groove coincides with the position detector, and the reference position variation is substantially the same as the variation of the real operating position.
In the embodiments of the disclosure, the distance X₀by which the edge of the piece to be ground protrudes beyond the edge of the sample stage is from 6 mm to 15 mm. In this way, the position of the grinding wheel can be adjusted directly according to the distance X0 while the piece to be ground is being aligned with the grinding wheel.
In another aspect of the disclosure, embodiments of the disclosure provide a grinding device. In the embodiments of the disclosure, the grinding device comprises: a grinding wheel comprising a grinding groove around an outer edge of the grinding wheel, wherein the grinding wheel is configured to rotate around a rotation shaft for grinding; a sample stage on one side of the rotation shaft for placing thereon a piece to be ground; and a position detector configured to detect a position of a bottom of the grinding groove; the display grinding device further comprises at least one processor and a memory, wherein the memory is configured to store readable program codes, and the at least one processor is configured to execute the readable program codes to:
move the grinding wheel toward the sample stage, and record a position of the grinding wheel when the bottom of the grinding groove comes into contact with the piece to be ground as a standard position;
move the grinding wheel toward the position detector, and record a position of the grinding wheel when a position of the bottom of the grinding groove coincides with a detecting center of the position detector as a first reference position;
move the grinding wheel back to the standard position, and grind the piece to be ground, according to a preset grinding amount using the grinding wheel; and
adjust the position of the grinding wheel by: move the grinding wheel again toward the position detector, record a position of the grinding wheel when a position of the bottom of the grinding groove coincides with the detecting center of the position detector as a second reference position, and adjust the standard position based upon the first reference position and the second reference position to thereby determine a position of the grinding wheel.
In the embodiments of the disclosure, the at least one processor is further configured to execute the readable program codes to:
adjust the position of the grinding wheel after one piece to be ground is ground using the grinding wheel.
In the embodiments of the disclosure, the at least one processor is further configured to execute the readable program codes to:
adjust the position of the grinding wheel after the grinding wheel is replaced, or the grinding groove is switched.
In the embodiments of the disclosure, the at least one processor is further configured to execute the readable program codes to:
move the grinding wheel in a first direction;
wherein the first direction is perpendicular to the rotation shaft, and a detecting direction of the position detector is perpendicular to a plane defined by the rotation shaft and the first direction;
and wherein the position of the grinding wheel comprises a positional coordinate X in the first direction, and a positional coordinate Z in a second direction, wherein the first direction is perpendicular to the second direction, the rotation shaft extends in the second direction, and when the position of the grinding wheel is adjusted, a difference between the second reference position and the first reference position is a reference position variation comprising a first reference position variation Xm in the first direction, and, and a second reference position variation Zm in the second direction.
In the embodiments of the disclosure, the grinding device further comprises a grinding groove abrasion detector configured to determine an abrasion condition of the grinding groove by observing the bottom of the grinding groove; and
after the piece to be ground is ground using the grinding wheel, the at least one processor is further configured to execute the readable program codes to:
detect the abrasion condition of the grinding groove using the grinding groove abrasion detector;
determine whether to switch the grinding groove, or to replace the grinding wheel, according to the abrasion condition of the grinding groove; and
adjust the position of the grinding wheel after switching the grinding groove or replacing the grinding wheel.
In the embodiments of the disclosure, the at least one processor is further configured to execute the readable program codes to:
move the grinding wheel to a position that an outer edge of the grinding groove comes into contact with an edge of the sample stage, and recording the position of the grinding wheel as a first position;
firstly move the grinding wheel from the first position by a distance X0 away from the piece to be ground, in the first direction, and then place the piece to be ground, on the sample stage, wherein an edge of the piece to be ground, protrudes by the distance X0 beyond the edge of the sample stage toward the grinding wheel;
preset a standard value of grinding amount X1 of the piece to be ground, in the first direction, and move the grinding wheel by the standard value X1 toward the piece to be ground, in the first direction;
move the grinding wheel by a value X2 toward the piece to be ground, wherein X2 is a value of a depth by which the grinding groove is recessed in the first direction; and
place the piece to be ground, on the sample stage, and adjust the position of the grinding wheel based a positional displacement X3 of the piece to be ground, in the first direction.
In the embodiments of the disclosure, the at least one processor is further configured to execute the readable program codes to:
correct a position of the piece to be ground, which is placed on the sample stage, and determine a difference between the position of the placed piece to be ground and a preset position of the piece to be ground as the positional displacement X3. In the embodiments of the disclosure,
In the embodiments of the disclosure, the at least one processor is further configured to execute the readable program codes to:
move the grinding wheel to the standard position; and
move the grinding wheel from the standard position by the distance Xm in the first direction, and move the grinding wheel from the standard position by the distance Zm in the second direction.
In the embodiments of the disclosure, the at least one processor is further configured to execute the readable program codes to control that:
the distance X0 by which the edge of the piece to be ground protrudes beyond the edge of the sample stage is from 6 mm to 15 mm.
The grinding device can perform the method according to any one of the embodiments above of the disclosure. Accordingly this grinding device has all the features of the grinding method using a grinding device according to the embodiments above of the disclosure.
In a still another aspect of the disclosure, embodiments of the disclosure provides a grinding device. In the embodiments of the disclosure, the grinding device includes: a grinding wheel including a grinding groove around the outer edge of the grinding wheel, where the grinding wheel is configured to rotate around the rotation shaft for grinding; a sample stage on one side of the rotation shaft for placing thereon a piece to be ground; a position detector configured to detect the position of the bottom of the grinding groove; and a position adjustor configured to adjust the position of the grinding wheel using the method according to any one of the embodiments above of the disclosure. Accordingly this grinding device has all the features of the grinding method using a grinding device according to the embodiments above of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and/or other aspects and advantages of the disclosure will become apparent and readily understood from the following description of the embodiments thereof with reference to the drawings.

FIG. 1 illustrates a first schematic structural diagram of a grinding device according to embodiments of the disclosure.

FIG. 2 illustrates a second schematic structural diagram of a grinding device according to the embodiments of the disclosure.

FIG. 3 illustrates a third schematic structural diagram of a grinding device according to the embodiments of the disclosure.

FIG. 4 illustrates a fourth schematic structural diagram of a grinding device according to the embodiments of the disclosure.

FIG. 5 illustrates a first flow chart of a grinding method using a grinding device according to the embodiments of the disclosure.

FIG. 6 illustrates a second flow chart of a grinding method using a grinding device according to the embodiments of the disclosure.

FIG. 7 illustrates a third flow chart of a grinding method using a grinding device according to the embodiments of the disclosure.

FIG. 8A to FIG. 8C illustrates a fourth flow chart of a grinding method using a grinding device according to the embodiments of the disclosure;

FIG. 9A to FIG. 9B illustrates a fifth flow chart of a grinding method using a grinding device according to the embodiments of the disclosure.

FIG. 10 illustrates a sixth flow chart of a grinding method using a grinding device according to the embodiments of the disclosure.

FIG. 11 illustrates a seventh flow chart of a grinding method using a grinding device according to the embodiments of the disclosure.

DETAILED DESCRIPTION OF THE EMBODIMENTS

An Organic Light-Emitting Diode (OLED) display panel (an OELD substrate) is fabricated by cutting a large-size OLED substrate fabricated in an array substrate into two or four OLED substrates. At present, the large-size OLED substrate is typically cut through laser cutting, where the quality of laser cutting can be guaranteed without generating any particles. However there may be a small area of micro cracks around a cut edge due to the effect of thermal expansion and contraction, a sharp angle at the cut edge, and a stress concentrated at the cut edge as a result of laser cutting. Accordingly the cut edge shall be ground in a grinding process to thereby remove the micro cracks, the stress, and other process defects.
However it is still desirable to improve the grinding methods using a grinding device, and the grinding devices in the related art.
The existing grinding methods using a grinding device generally suffer from an unstable quality of grinding, a short service lifetime of a grinding wheel, a long period of time for replacing a grinding wheel in a complex flow, a low activation ratio, etc. A piece to be ground (e.g., an OLED substrate) is currently ground using a grinding wheel by firstly aligning the piece to be ground, precisely with a grinding groove of the grinding wheel to thereby determine the start position of grinding, and an grinding amount, and then grinding the piece. Since a display panel (e.g., an OLED substrate) is to be ground according to a small grinding amount (typically at a micrometer order), the piece to be ground shall be both aligned precisely with the grinding groove, and ground precisely in the grinding process.
However there is an error of the mechanical precision of the grinding wheel and each grinding groove, and for example, there is an insignificant difference between the depths by which the respective grinding grooves are recessed, there is also an insignificant difference in installation position of the grinding wheel each time it is replaced, etc., so if the piece is ground directly at the original position without being aligned again each time the grinding groove is switched or the grinding wheel is replaced, then the real contact position of the grinding groove with the piece to be initially ground will not be determinate, that is, a real grinding amount may be more than or less than a preset grinding amount, thus resulting in a sparkle, chipping, a crack, particles, a fragment, or another product defect, for example; and if the real grinding amount is too large, then a diamond cutter in the grinding groove may fall off due to excessive grinding, the edge of the diamond cutter may be easily blocked by melt glass, and thus passivated, due to excessive grinding, etc., thus shortening the service lifetimes of the grinding groove and the grinding wheel. If the grinding groove or the grinding wheel is debugged each time the grinding groove is switched or the grinding wheel is replaced, then it will be very time-consuming, thus degrading the activation ratio and the production efficiency of the grounding device. If the grinding wheel is not aligned precisely in position, then the grinding amount the piece to be ground may be not precise each time the grinding wheel is replaced, thus consuming time and wasting a material.
Accordingly, embodiments of the disclosure can significantly address the problems above if such a new grounding method is provided that can shorten a period of time for switching a grind groove, and a period of time for replacing a grinding wheel, and can improve the quality of a product after grinding, and prolong the service lifetime of the grinding wheel.
The embodiments of the disclosure can alleviate at least to some extent, or address at least one of the problems above.
The embodiments of the disclosure will be described below in details, and examples of the embodiments have been illustrated in the drawings, where identical or like reference numerals refer to identical or like elements, or elements with identical or like functions throughout the drawings.
In an aspect of the disclosure, embodiments of the disclosure provide a grinding method using a grinding device. With this method, an operating position of a grinding wheel can be determined rapidly and accurately after a grinding wheel is replaced, a grinding groove is switched, or the grinding wheel is deformed (contracted inward), to thereby improve the activation ratio of the grinding device, and the quality of a ground product, and prolong the service lifetime of the grinding wheel.
For the sake of convenient understanding, firstly a structure of a grinding device according to embodiments of the disclosure will be described below in brevity. As illustrated in FIG. 1, the grinding device according to the embodiments of the disclosure includes: a grinding wheel 10, a sample stage 40, and a position detector 50; where the grinding wheel 10 includes a grinding groove 20 around an outer edge of the grinding wheel 10 and a rotation shaft 30 through the center of the grinding wheel 10, where the grinding wheel 10 can rotate around the rotation shaft 30 for grinding; where the sample stage 40 is on one side of the rotation shaft 30 for placing thereon a piece to be ground (not illustrated). It shall be noted that FIG. 1 illustrates a schematic structural diagram of the grinding wheel 10 in a sectional view for the sake of convenient understanding.
In the embodiments of the disclosure, the grinding device can further include a motor (not illustrated) configured to power the rotation shaft 30 to thereby bring the rotation shaft 30 into rotation and further the grinding wheel 10 into rotation so as to grind the piece to be ground (not illustrated). In some embodiments, one or more grinding grooves 20 can be at the outer edge of the grinding wheel 10, and for example, five grinding grooves 20 are at the outer edge of the grinding wheel 10 as illustrated in FIG. 1, where the grinding grooves 20 can be arranged sequentially along the rotation shaft 30 (that is, arranged sequentially in the Z direction as illustrated in FIG. 1). The grinding wheel 10 is structured symmetric about a symmetry axis which is the rotation shaft 30, and more particularly the central axis AA′ of the rotation shaft 30. In some embodiments, the grinding wheel 10 can be structured like a disk or a ring, and the grinding groove 20 is structured like a ring around the grinding wheel 10; and an operating state and an abrasion state of the same grinding groove 20 at each position remain totally the same throughout a rotation and grinding process of the grinding wheel 10. It shall be noted that the grinding groove in the embodiments of the disclosure is typically structured as an alloy base wrapped with diamond dust or other grinding particles, and in the grinding process, the diamond dust or the other grinding particles come into contact with and grind the piece to be ground, and the alloy base support the grinding particles. In the embodiments of the disclosure, the grinding groove is contracted inward, abraded, deformed, etc., in such a way that after the grinding groove has operated for a long period of time, the alloy base wrapped with the grinding particles are abraded, damaged etc., so that the grinding particles fall off, thus resulting in a poor real grinding effect, that is, a smaller or larger real grinding amount than a preset grinding amount, etc., all of which can be referred to as the “grinding groove is contracted inward, abraded, deformed, etc.”
In some embodiments, the position of the grinding wheel 10 in the embodiments of the disclosure can refer to the position of the center of the grinding wheel 10, i.e., the position of the center of the rotation shaft 30, which is the position of the point A as illustrated in FIG. 1. In the embodiments of the disclosure, as illustrated in FIG. 1, the position of the grinding wheel 10 includes a positional coordinate X in the first direction (i.e., the X direction as illustrated in FIG. 1), and a positional coordinate Z in the second direction (i.e., the Z direction as illustrated in FIG. 1), where the first direction is perpendicular to the second direction, the grinding grooves 20 are arranged sequentially in the Z direction, that is, the rotation shaft 30 extends in the Z direction, and the grinding wheel can rotate around the rotation shaft 30 in the Z direction, and grind the piece to be grounded.
In the embodiments of the disclosure, the shape and the position of the sample stage 40 will not be limited to any particular shape and the position as long the bottom of the grinding groove 20 (such as two symmetric points B and B′ at the bottom of the grinding groove 20 as illustrated in FIG. 1) can come into contact in effect with and can grind the piece to be ground (not illustrated), placed on the sample stage 40.
In the embodiments of the disclosure, the position detector 50 can include a Charge Coupled Device (CCD) image sensor (a CCD detector) configured to take an image of an object, and to convert an optical signal into an electric signal. In some embodiments, the CCD detector is fixed at some position in the grinding device, and includes a detecting direction (an image-taking direction) and a detecting area (an image-taking range), that is, the CCD detector can obtain image information of the object only when the object is located in the detecting area of the CCD detector. Stated otherwise, the position of the position detector 50 is fixed, and the CCD detector can obtain an image of the bottom of the grinding groove only after the grounding wheel enters the detecting area (i.e., the image-taking range) of the CCD detector.
In the embodiments of the disclosure, the position of the position detector 50 will not be limited to any particular position as long as it can detect the position of the bottom of the grinding groove 20. In some embodiments, as illustrated in FIG. 1, after the grinding wheel 10 moves to the sample stage 40 in the first direction (i.e., the X direction), the bottom of the grinding groove 20 can come into contact with the piece to be ground (not illustrated), placed on the sample stage 40, and a standard position of the grinding wheel 10 can be recorded. The rotation shaft 30 of the grinding wheel 10 extends in the second direction (i.e., the Z direction), and the detecting direction of the position detector 50 can be perpendicular to a plane defined by the rotation shaft 30 and the first direction (i.e., the X direction), that is, when the position detector 50 is a CCD detector, a detecting direction (an image-taking direction) of the CCD detector is a direction perpendicular to the paper. Those skilled in the art can appreciate that the grinding wheel 10 needs to be moved in the first direction to thereby enter a detecting area (an image-taking range) of the CCD detector, so the CCD detector shall be arranged without hindering the grinding wheel 10 from being moved. Stated otherwise, the position of the CCD detector needs to be displaced from the plane defined by the rotation shaft 30 and the first direction (i.e., the X direction) by some distance. Accordingly the grinding wheel 10 is moved in the first direction (the X direction) so that the piece to be ground (not illustrated), placed on the sample stage 40 can be aligned with the grinding groove 20, and the position detector 50 can be aligned with the bottom of the grinding groove 20 (that is, the grinding wheel 10 is moved in the first direction (the X direction) so that the bottom of the grinding groove 20 can be moved into the detecting area of the position detector 50, so the position detector 50 can obtain image information and positional information of the bottom of the grinding groove 20), thus simplifying the operations, avoiding an error from occurring after the grinding wheel 10 has been moved repeatedly in a plurality of directions, and improving the precision of alignment, and the precision of grinding.
In some embodiments, as illustrated in FIG. 1, while the grinding wheel 10 is moved to the side proximate to the position detector 50 in the X direction, the outer edge of the grinding wheel 10 can firstly enter the detecting area of the position detector 50 so that the position detector 50 can firstly obtain an image and the position of the outer edge of the grinding wheel 10; and thereafter the grinding wheel 10 can further be moved to the side proximate to the position detector 50 in the X direction until the position of the bottom of the grinding groove (e.g., the point B′ as illustrated) coincides with the center of the detecting area (as illustrated in FIG. 2), and the position of the grinding wheel 10 at this time is the reference position of the grinding wheel 10 (a first reference position or a second reference position). It shall be noted that “the position of the bottom of the grinding groove coincides with the detecting center of the position detector” as described herein refers to that the bottom of the grinding groove coincides with the center of the detecting area of the position detector. For example, when the position detector is a CCD detector, the center of the detecting area can be the center of an image-taking interface of the CCD detector.
In the embodiments of the disclosure, as illustrated in FIG. 2 and FIG. 3 (which illustrate schematic structural diagrams of the grinding device when the grinding wheel 10 is moved until the bottom of the grinding groove coincides with the detecting center of the position detector), a projection of the position detector 50 onto a plane defined by the rotation shaft 30 and the first direction (i.e., the X direction) (i.e., a projection thereof onto the paper) can lie between the sample stage 40 and the grinding wheel 10 (as illustrated in FIG. 3), or can lie on the side of the sample stage 40 away from the grinding wheel 10 (not illustrated), or can lie on the side of the grinding wheel 10 away from the sample stage 40 (as illustrated in FIG. 2), thus making it convenient for the grinding wheel 10 to be moved in the first direction, and to be located in the detecting area of the position detector 50. In some embodiments, as illustrated in FIG. 3, when the projection of the position detector 50 onto the plane defined by the rotation shaft 30 and the first direction (i.e., the X direction) lies between the sample stage 40 and the grinding wheel 10, the grinding wheel 10 is moved so that the bottom (i.e., the point B as illustrated) of the grinding groove on the side of the grinding wheel 10 proximate to the sample stage 40 can simply coincide with the center of the detecting area of the position detector 50. In some embodiments, when the position detector 50 is on the side of the sample stage 40 away from the grinding wheel 10, firstly the sample stage 40 can be moved in the direction perpendicular to the paper and away from the position detector 50, and then the grinding wheel 10 can be moved toward the position detector 50 in the first direction, so that the bottom (i.e., the point B as illustrated) of the grinding groove on the side of the grinding wheel 10 proximate to the sample stage 40 can also coincide with the center of the detecting area of the position detector 50. In some embodiments, as illustrated in FIG. 2, the projection of the position detector 50 onto the plane defined by the rotation shaft 30 and the first direction (i.e., the X direction) lies on the side of the grinding wheel 10 away from the sample stage 40, and the grinding wheel 10 is moved so that the bottom (i.e., the point B′ as illustrated) of the grinding groove on the side of the grinding wheel 10 away from the sample stage 40 can simply coincide with the center of the detecting area of the position detector 50.
As described above, the existing grinding methods using a grinding device generally suffer from an unstable quality of grinding, a short service lifetime of a grinding wheel, a long period of time for replacing a grinding wheel in a complex flow, a low activation ratio, etc.
In the method according to the embodiments of the disclosure, after the grinding wheel is debugged, and before the piece to be ground is ground, firstly the operating position of the debugged grinding wheel (i.e., the standard position of the grinding wheel when the bottom of the grinding groove comes into contact with the piece to be ground) is recorded, and then the grinding wheel is moved to such a position that the bottom of the grinding groove coincides with the detecting center of the position detector, the first reference position of the grinding wheel is recorded, and then the piece to be grounded is ground. Thereafter after the grinding wheel has operated for a period of time, or the grinding groove is switched, or the grinding wheel is replaced, firstly the operating grinding wheel or the replaced grinding wheel (grinding groove) moves to such a position that the bottom of the grinding groove coincides with the detecting center of the position detector, the second reference position of the grinding wheel is recorded, and the standard position of the grinding wheel is adjusted based upon the first reference position and the second reference position to thereby determine a position of the grinding wheel again.
Stated otherwise, in this method, the operating position of the grinding wheel debugged in advance is recorded (to thereby obtain the standard position), and the detection position of the debugged grinding wheel is determined smartly by the position detector (to thereby obtain the first reference position), so that the operating position of the grinding wheel can be associated with the detection position thereof, and the operating position can be determined with reference to the detection position. After the grinding wheel (the grinding groove) is replaced, or the grinding wheel which has operated for a period of time is deformed, firstly the replaced or deformed grinding wheel (grinding groove) can be moved to the detection position of the grinding wheel (to thereby obtain the second reference position), and the variation of the operating position of the grinding wheel relative to the standard position can be concluded based upon the change in detection position of the grinding wheel, so that the operating position of the grinding wheel can be adjusted simply and rapidly, that is, firstly the grinding wheel can be moved to the standard position recorded in the previous step, and then the grinding wheel can be further finely adjusted according to the change in reference position, so that the real operating position of the grinding wheel can be determined. Accordingly this method has the advantages of being simple, rapid, and accurate over the existing method in which the piece to be grounded is grounded directly by the grinding wheel after the grinding wheel is replaced, or the grinding wheel is debugged in a complex process after the grinding wheel is replaced, so this method can simplify the flow of replacing the grinding wheel, shorten a period of time for replacing the grinding wheel, and improve the activation ratio and the production efficiency of the grounding device, and this method can improve the quality of grinding, and avoid the service lifetime of the grinding wheel from being shortened due to excessive grounding in reality.
In the embodiments of the disclosure, the grinding device can further include a grinding groove abrasion detector configured to determine an abrasion condition of the grinding groove by observing the bottom of the grinding groove. In some embodiments, the grinding groove abrasion detector 70 can also be a Charge Coupled Device (CCD) image sensor (a CCD detector). In some embodiments, the position of the grinding groove abrasion detector will not be limited to any particular position as long as it can detect the abrasion condition of the bottom of the grinding groove accurately. In some embodiments, as illustrated in FIG. 4, the grinding groove abrasion detector 70 can also be arranged in the first direction (the X direction), and a detecting direction of the grinding groove abrasion detector 70 (the direction of the arrow M as illustrated) faces the bottom of the grinding groove 20, so the grinding groove abrasion detector 70 can take a clear image of the bottom of the grinding groove 20, and obtain the abrasion condition of the grinding groove so that it can be subsequently determined whether to replace the grinding groove, to replace the grinding wheel, etc., according to the abrasion condition of the grinding groove. It shall be noted that the grinding groove abrasion detector facing the grinding groove can take a clear image of the real operating state and abrasion state of the grinding wheel. Stated otherwise, the image-taking direction of the grinding groove abrasion detector 70 can be perpendicular to the image-taking direction of the position detector 50. The grinding groove abrasion detector 70 is only responsible for observing the abrasion condition of the bottom of the grinding groove, the grinding groove abrasion detector 70 can alternatively be fixed in position as long as it can obtain image information in the direction facing the bottom of the grinding groove without hindering the grinding wheel 10 from moving in the first direction.
It shall be noted that all of FIG. 1 to FIG. 4 above illustrate schematic structural diagrams of the grinding wheel 10 in a sectional view for the sake of convenient understanding.
In summary, in the embodiments of the disclosure, a reference position when the grinding wheel is moved to the position detector is recorded so that the operating position of the grinding wheel can be determined simply and conveniently relative to the standard position, and after subsequently the grinding groove is deformed or switched, or the grinding wheel is replaced, firstly the grinding wheel can be adjusted to a reference position, and then the operating position of the grinding wheel can be determined again simply and conveniently based upon the variation between the reference positions, so in this method, after the grinding groove is deformed or switched, or the grinding wheel is replaced, no complex alignment or calibration process will be performed, and the operating position of the grinding wheel can be determined again rapidly and precisely, thus improving the performance of the grinding wheel in operation.
In the embodiments of the disclosure, as illustrated in FIG. 5 and FIG. 6, the method includes the following steps.
Step S110 is to have the bottom of the grinding groove come into contact with the piece to be grounded, and to record a standard position of the grinding wheel.
In this step, the grinding wheel is moved toward the sample stage, and the position of the grinding wheel when the bottom of the grinding groove comes into contact with the piece to be grounded is recorded as the standard position. In some embodiments, as illustrated in FIG. 7 and FIG. 8A to 8C, the method further includes the following steps.
Step S10 is to move the grinding wheel to such a position that the outer edge of the grinding groove comes into contact with the edge of the sample stage.
In this step, the grinding wheel is moved to such a position that the first side thereof comes into contact with the edge of the sample stage, and this position is recorded as a first position of the grinding wheel. In some embodiments, the shape of the sample stage will not be limited to any particular shape, and as illustrated in FIG. 9A, for example, the sample stage 40 can include a support plate 41 and a fixing piece 42. In some embodiments, the piece to be ground (e.g., an OLED substrate not illustrated in FIG. 9A) can be placed between the support plate 41 and the fixing piece 42, and fixed by the fixing piece 42 to thereby prevent the piece to be ground, from being moved on the sample stage 40. In some embodiments, as illustrated in FIG. 9A, the edge of the sample stage 40 can come into contact with the outer edge 21 of the grinding groove 20, and the position of the grinding wheel 10 at this time, i.e., the position of the point A as illustrated, can be recorded as the first position. It shall be noted that as illustrated in FIG. 9A or 9B, the X direction is the first direction, and the second direction (the Z direction) is perpendicular to the first direction, i.e., the direction perpendicular to the paper in FIG. 9A or 9B.
Step S20 is to move the grinding wheel by a distance X₀away from the piece to be ground.
In this step, firstly the grinding wheel is moved by the distance X₀from the first position above in the first direction away from the piece to be ground, and then the piece to be ground is placed on the sample stage, where the edge of the piece to be ground protrudes toward the grinding wheel by the distance X₀beyond the edge of the sample stage. In some embodiments, as illustrated in FIG. 8B and FIG. 9B, in order to protect the sample stage from being damaged by the grinding groove coming into contact with the piece to be ground and by grinding the piece to be ground, firstly the piece to be ground 60 shall protrude toward the grinding wheel 10 by some distance (e.g., the distance X₀) beyond the edge of the sample stage 40, and then the particular grinding amount, etc., will be further adjusted, where the distance X₀is more than a preset grinding amount, so the grinding amount will be subsequently adjusted while the piece to be ground 60 is protruding toward the grinding wheel 10 by some distance beyond the edge of the sample stage 40 all the time to thereby avoid the grinding wheel 10 from abrading and damaged the sample stage 40. In some embodiments, the distance X₀by which the edge of the piece to be ground 60 protrudes beyond the edge of the sample stage 40 may be from 6 mm to 15 mm, and in some embodiments, may be 10 mm. Accordingly in this step, the position of the grounding wheel 10 can be adjusted directly according to the range of the distance X₀, and then the piece to be ground 60 can be adjusted simply and rapidly.
Step S30 is to move the grinding wheel by a standard value of grinding amount X₁toward the piece to be ground.
In this step, the grinding wheel moves by the standard value of grinding amount X₁toward the piece to be ground, from the position above in the first direction. In some embodiments, the standard value of grinding amount X₁of the piece to be ground, in the first direction is preset, so the grinding wheel shall move by the standard value X₁toward the piece to be ground, in the first direction.
Step S40 is to move the grinding wheel by a value X₂toward the piece to be ground.
In this step, the grinding wheel moves by the value X₂from the position above toward the piece to be ground, in the first direction. In some embodiments, as illustrated in FIG. 8C, the depth by which the grinding groove 20A is recessed in the first direction (the X direction) is the value X₂, so the grinding wheel 10 moves by the value X₂from the position above toward the piece to be ground 60. It shall be noted that the value X₂of the recessed depth is the vertical distance between the bottom of the grinding groove (the point B as illustrated) to the outer edge 21 of the grinding groove.
Step S50 is to move the grinding wheel by a positional displacement X₃to thereby obtain the standard position of the grinding wheel.
In this step, the grinding wheel is moved by the positional displacement X₃from the position above in the first direction to thereby obtain the standard position of the grinding wheel.
In some embodiments, when the piece to be ground is placed on the sample stage in the step above, there is a positional displacement X₃in the first direction, so the positional displacement X₃shall be compensated for. In some embodiments, when the piece to be ground is placed on the sample stage in the step above, the edge of the piece to be ground shall protrude toward the piece to be ground, by the distance X₀beyond the edge of the sample stage so that the edge of the piece to be ground exactly comes into contact with the outer edge of the grinding wheel, and the position of the piece to be ground, in the first direction at this time is a predetermined position of the piece to be ground. However there may be some displacement when the piece to be ground is really placed on the sample stage, that is, the edge of the really placed piece to be ground protrudes toward the grinding wheel by another distance than X₀beyond the edge of the sample stage. Stated otherwise, there may be a positional displacement X₃in the first direction when the piece to be ground is really placed, that is, there is a distance between the real position of the placed piece to be ground, and the predetermined position of the piece to be ground. In some embodiments, an alignment mark can be designed in advance on the piece to be ground (e.g., an organic light-emitting diode display panel), and the grinding device further includes a position detector for a piece to be ground, where the position detector can be a CCD detector and configured to obtain image and positional information of the alignment mark on the piece to be ground. In some embodiments, the distance (i.e., a reference distance) between the alignment mark on the piece to be ground, and a detecting center of the position detector for the piece to be ground when the piece to be ground is located at the predetermined position can be determined in advance, and each time the piece to be ground is subsequently placed on the sample stage, the distance (i.e., a real distance) between the alignment mark on the piece to be ground, and a detecting center of the position detector for the piece to be ground can be detected again, the difference between the real distance and the reference distance can be calculated, and the positional displacement X₃in the first direction when the piece to be ground is placed on the sample stage can be determined. Accordingly the grinding wheel moves by the distance X₃from the position above in the first direction, where the position is the standard position of the grinding wheel. In some embodiments, the positional displacement X₃can be positive or negative, that is, the position of the piece to be ground, placed on the sample stage may be displaced toward or away from the grinding groove, so the grinding wheel shall move by X₃away from or toward the piece to be ground, in the first direction as needed in reality.
In summary, this method can align the piece to be ground, precisely with the grinding groove, and improve the precision of grinding, and the quality of a ground product. Furthermore the position of the grinding wheel can be adjusted by determining the operating position of the grinding wheel again with reference to the standard position of the grinding wheel determined in the step above, after the grinding wheel is subsequently deformed or replaced.
The methods further includes step S120, where the step S120 is to have the bottom of the grinding groove coincide with the detecting center of the position detector, and to record a first reference position of the grinding wheel.
In this step, the grinding wheel is moved from the standard position adjusted in the step above to such a position that the bottom of the grinding groove coincides with the detecting center of the position detector, and the position of the grinding wheel is recorded as the first reference position. In some embodiments, as described above, as illustrated in FIG. 1, the grinding wheel 10 can be moved from the standard position adjusted in the step above toward the position detector 50 side in the X direction, where the outer edge of the grinding wheel 10 can firstly enter the detecting area of the position detector 50 so that the position detector 50 can firstly obtain an image and the position of the outer edge of the grinding wheel 10, and thereafter the grinding wheel 10 can be further moved toward the position detector 50 side in the X direction until the position (e.g., the point B′ as illustrated) of the bottom of the grinding groove coincides with the center of the detecting area of the position detector 50 (as illustrated in FIG. 2), and the position of the grinding wheel 10 at this time is the first reference position of the grinding wheel 10. In this way, this method can obtain the first reference position of the grinding wheel precisely to thereby facilitate subsequent precision adjustment of the operating position of the grinding wheel so as to improve the quality of a product ground in this method.
Step S130 is to move the grinding wheel back to the standard position, and to grind the piece to be ground.
In this step, after the first reference position of the grinding wheel is recorded in the step above, the grinding wheel is moved back to the standard position, and the piece to be ground is ground by the grinding wheel.
In the embodiments of the disclosure, the grinding wheel can be moved automatically toward the position detector in the grinding process to thereby grind each piece to be ground, that is, the position of the grinding wheel can be adjusted automatically to thereby grind each piece to be ground using the grinding wheel, so that the operating position of the grinding wheel can be calibrated automatically in a timely manner in this method to thereby improve the precision of grinding, the quality of a ground product, and the extent to which the grinding device becomes automatic. In the embodiments of the disclosure, after the grinding groove is switched, or the grinding wheel is replaced, the position of the grinding wheel can also be adjusted, in the following steps in some embodiments.
Step S200 is to adjust the position of the grinding wheel.
In this step, the position of the grinding wheel is adjusted after a piece to be ground is ground, or the grinding groove is switched, or the grinding wheel is replaced. In some embodiments, as illustrated in FIG. 6, the method further includes the following steps.
Step S210 is to have the bottom of the grinding groove coincide with the detecting center of the position detector again, and to record a second reference position of the grinding wheel.
In this step, the bottom of the grinding groove coincides with the detecting center of the position detector again, and the position of the grinding wheel is recorded as the second reference position thereof. In some embodiments, the grinding wheel may be contracted inward after it has operated for a long period of time, so after each piece to be ground is grounded by the grinding wheel, the bottom of the grinding groove can coincide with the detecting center of the position detector again, and at this time, if the bottom of the grinding groove is contracted inward, then the position (i.e., the second reference position) of the grinding wheel when the bottom of the grinding groove coincides with the detecting center of the position detector will be also changed from the first reference position recorded in the step above. In some embodiments, after the grinding wheel is replaced, the grinding wheel can be firstly adjusted to such a position that the bottom of the grinding groove coincides with the detecting center of the position detector, and the position can be recorded as the second reference position.
Step S220 is to adjust the standard position, and to determine a position of the grinding wheel again.
In this step, the standard position of the grinding wheel recorded in the step above is adjusted based upon the first reference position and the second reference position recorded in the step above to thereby determine the position of the grinding wheel again. In some embodiments, firstly the difference between the first reference position and the second reference position recorded in the step can be determined as a reference position variation, and then the grinding wheel can be moved to the standard position of the grinding wheel recorded in the step above, and the position of the grinding wheel can be adjusted according to the standard position, and the reference position variation to thereby determine the final operating position of the grinding wheel. In some embodiments, the reference position variation can include a first reference position variation X_min the first direction, and, and a second reference position variation Z_min the second direction. In some embodiments, the first reference position variation X_mmay be positive or negative, and the second reference position variation Z_mmay also be positive or negative. In the embodiments of the disclosure, when the first reference position variation X_mis positive, the operating position of the grinding wheel can be determined again in such a way that the grinding wheel is moved from the standard position of the grinding wheel toward the piece to be ground, in the first direction, and when the first reference position variation X_mis negative, the operating position of the grinding wheel can be determined again in such a way that the grinding wheel is moved away from the piece to be ground, in the first direction. Alike when the second reference position variation Z_mis positive, the grinding wheel is moved from the standard position of the grinding wheel away from the piece to be ground, in the second direction, and when the second reference position variation Z_mis negative, the operating position of the grinding wheel can be determined again in such a way that the grinding wheel moves toward the piece to be ground, in the second direction. In this way, the real operating position of the grinding wheel can be adjusted simply and conveniently according to the reference position variation.
In the embodiments of the disclosure, when the first reference position variation in the first determined in the step above is X_m, as illustrated in FIG. 1, the first reference position variation of the position (i.e., the position of the point A as illustrated) of the center of the rotation shaft 30 of the grinding wheel 10 is X_m, and the operating position of the grinding wheel 10 can be subsequently determined again in such a way that firstly the grinding wheel 10 is moved to the standard position, and since the grinding groove is structured like a ring around the grinding wheel, and rotating in operation, the operating state and the abrasion state of the same grinding wheel at each position remain totally the same, so the reference position variation of the grinding wheel is substantially the same as the real operating position variation, and the grinding wheel can be moved from the standard position by the distance X_min the first direction so that the operating position of the grinding wheel 10 can be determined again. Accordingly in this method, the position detector can obtain the position information of any one point at the bottom of the grinding groove, the reference position of the grinding wheel can be obtained based upon the positional information, and subsequently the amount of abrasion of the grinding wheel, etc., can be determined based upon a variation between two reference positions to thereby adjust the operating position of the grinding wheel accurately.
In some embodiments, when the grinding groove is contracted inward by 1 μm in the X direction, for example, the position of B or B′ the bottom of the grinding groove coincides with the position detector 50, so the first reference position variation X_mcan be 1 μm, and correspondingly the position of the grinding wheel 10 shall be determined again by moving the grinding wheel from the standard position toward the sample stage 40 by the distance 1 μm to thereby compensate for the amount of inward contraction of the grinding wheel. In some embodiments, when the second reference position variation in the second direction is Z_m, the grinding wheel can be moved from the standard position by the distance Z_min the second direction. In this way, the real operating position variation of the grinding wheel can be determined based upon the variation between the positions of the grinding wheel before and after it is adjusted, when the bottom of the grinding groove coincides with the detecting center the position detector, so that the operating position of the grinding wheel can be determined simply, conveniently, rapidly, and precisely.
As described above, the grinding wheel may be deformed, e.g., contracted inward, etc., after it has operated for a period of time, thus resulting in an insufficient real grinding amount (i.e., a lower real grinding amount), and if an error of grinding arising from inward contraction of the grinding groove is not compensated for in a timely manner, then there will be an instable grinding amount (e.g., a lower grinding amount) of a ground product, thus degrading the quality of the ground product. In the method according to the embodiments of the disclosure, the grinding amount of the ground product can be checked automatically, and for example, the shape and the position of the grinding groove can be validated before each piece to be ground is machined, to thereby ensure the grinding groove to be located at a predetermined position in a real grinding process, so as to guarantee the grinding amount of the piece to be ground. Stated otherwise, each time the grinding wheel grinds piece to be ground the grinding device can correct and compensate for the grinding amount automatically, or when the grinding groove is contracted inward so seriously that the grinding groove shall be switched, or the grinding wheel shall be replaced, the operating position of the grinding wheel can be determined again in the process as described above of adjusting the position of the grinding groove, after the grinding groove is switched, or the grinding wheel is replaced. In this way, the extent to which the grinding device becomes automatic can be improved, the precision of grinding can be improved, and the quality of a ground product can be improved.
In the embodiments of the disclosure, as illustrated in FIG. 10, after the grinding wheel has operated for a period of time, the method further includes the following steps.
Step S300 is to detect an abrasion condition of the grinding groove using the grinding groove abrasion detector.
In this step, after the piece to be ground has been ground by the grinding wheel for a period of time, the grinding groove abrasion detector can check the abrasion condition of the grinding groove. In some embodiments, as described above, the grinding groove abrasion detector can also be a Charge Coupled Device (CCD) image sensor (a CCD detector). In some embodiments, the grinding groove abrasion detector can be fixed or movable in the grinding device as long as the grinding groove abrasion detector can obtain an operating condition of the bottom of the grinding groove (an image of the bottom thereof) accurately, e.g., the extent to which the diamond dust embedded on the alloy base falls off, to thereby detect the abrasion condition of the grinding groove, or the fragmentation of the piece to be ground, due to abnormal production. In some embodiments, as illustrated in FIG. 4, the grinding groove abrasion detector 70 can be on the side facing the grinding wheel 10 and away from the sample stage 40 to thereby detect the abrasion condition of the grinding groove, so that the grinding groove abrasion detector 70 at that position can take a clear image of the bottom of the grinding groove to thereby obtain the abrasion condition of the grinding groove.
In some embodiments, while the grinding has been operating for a long period of time, the number of pieces to be ground, which have been grounded by the grinding groove is increasing to some value (e.g., 500) until the service lifetime of the grinding groove expires, so it can be determined whether to replace the grinding wheel or to switch the grinding groove, directly according to the number of pieces to be ground, which have been grounded by the grinding groove, or the period of time for which the grinding groove has operated (e.g., a month). In some embodiments, after some number of pieces to be grounded have been grounded by the grinding groove, it can be firstly determined that the service lifetime of the grinding groove expires, and then the grinding groove abrasion detector can obtain the real abrasion condition of the grinding groove accurately, and further determine whether to replace the grinding wheel or to switch the grinding groove.
Step S200 is to adjust the position of the grinding wheel.
In this step, it can be determined whether the grinding groove can further operate, according to the abrasion condition of the grinding groove detected by the grinding groove abrasion detector, and if not, then the grinding groove may be switched, or the grinding wheel may be replaced, and after the grinding groove is switched, or the grinding wheel is replaced, the position of the grinding wheel can be adjusted in the process as described above of adjusting the position of the grinding wheel.
In summary, this method can detect the real operating condition and abrasion condition of the grinding groove, and can switch the grinding groove, or replace the grinding wheel according to the detected abrasion condition to thereby better guarantee a stable quality of grinding. In this way, this method can improve the precision of grinding, and the quality of a ground product.
As described above, due to the problems in the related art of a long period of time for replacing a grinding wheel, a poor quality of grinding shortly after the grinding wheel is replaced, etc., in the embodiments of the disclosure, as illustrated in FIG. 11, after the piece to be grounded is grounded by the grinding wheel as described above, the method can further include the following step.
Step S400 is to replace the grinding wheel.
In this step, the grinding wheel is replaced, and the position of the grinding wheel can be adjusted as described above after the grinding wheel is replaced. In this way, in this method, after the grinding wheel is replaced, the operating position of the replaced grinding wheel can be adjusted rapidly and precisely based upon the standard position of the grinding wheel, and the first reference position, both of which are previously recorded, to thereby improve the activation ratio of the grinding device, and the quality of a ground product, and prolong the service lifetime of the grinding wheel.
In the embodiments of the disclosure, the grinding wheel can be a grinding wheel for grinding a liquid crystal display panel and an organic light-emitting display panel. In this way, the display panel can be better ground by the grinding wheel to thereby improve the product quality of the display panel.
In summary, in the grinding method using a grinding device according to the embodiments of the disclosure, the operating position of the grinding wheel can be determined rapidly and accurately after the grinding wheel is replaced or deformed (e.g., contracted inward), thereby improve the activation ratio of the grinding device, and the quality of a ground product, and prolong the service lifetime of the grinding wheel.
In another aspect of the disclosure, embodiments of the disclosure provide a grinding device. In the embodiments of the disclosure, the grinding device can grind a piece to be ground, using the method according to any one of the embodiments above of the disclosure. Accordingly this grinding device has all the features and advantages of the grinding method using a grinding device according to any one of the embodiments above of the disclosure, so a repeated description thereof will be omitted here. In general, the production efficiency of the grinding device is high, and the performance of a product produced by the grinding device is high.
In still another aspect of the disclosure, embodiments of the disclosure provide grinding device, where the grinding device comprises: a grinding wheel comprising a grinding groove around an outer edge of the grinding wheel, wherein the grinding wheel is configured to rotate around a rotation shaft for grinding; a sample stage on one side of the rotation shaft for placing thereon a piece to be ground; and a position detector configured to detect a position of a bottom of the grinding groove; the display grinding device further comprises at least one processor and a memory, wherein the memory is configured to store readable program codes, and the at least one processor is configured to execute the readable program codes to perform the grinding method above.
In yet another aspect of the disclosure, embodiments of the disclosure provide a grinding device. In the embodiments of the disclosure, the grinding device includes a grinding wheel, a sample stage, and a position adjustor, where the grinding wheel includes a grinding groove around an outer edge of the grinding wheel, and the grinding wheel and the grinding groove can rotate around a rotation shaft for grinding; the sample stage for placing thereon a piece to be ground is on one side of the rotation shaft; and the position detector is configured to detect a position of a bottom of the grinding groove, and to adjust the position of the grinding wheel using the method according to any one of the embodiments above of the disclosure. Accordingly this grinding device has all the features and advantages of the grinding method using a grinding device according to any one of the embodiments above of the disclosure, so a repeated description thereof will be omitted here. In general, the production efficiency of the grinding device is high, and the performance of a product produced by the grinding device is high.
In the description of the disclosure, the orientation or positional relationships indicated by the terms “outer”, “above”, “below”, etc., are orientation or positional relationships as illustrated in the drawings only for the sake of a convenient description of the disclosure, but this shall not require any specific orientation construction or operation indispensable to the disclosure, so the disclosure will not be limited thereto.
In the description of this specification reference to the terms “an embodiment”, “another embodiment”, etc., refers to that particular features, structures, materials, or characteristics described in connection with the embodiments is included in at least one embodiments of the disclosure. In this specification, any schematic expression of the terms above may not refer to the same embodiment or example. Furthermore the particular features, structures, materials, or characteristics as described can be combined as appropriate in any one or more embodiments or examples. Moreover the different embodiments or examples described in the disclosure, and the features in the different embodiments or examples can be combined with each other by those skilled in the art unless they conflict with each other. It shall be further noted that in this specification, the terms “first”, “second”, etc., are only intended to refer to specific features, but not intended to require or suggest their importance relative to each other, or to imply the number of indicated technical features.
Although the embodiments of the disclosure have been illustrated and described above, it can be appreciated that the embodiments above are exemplary, but not intended to limit the disclosure thereto, and those ordinarily skilled in the art can make changes, modifications, alternatives, and variations thereto.

Claims

1. A grinding method using a grinding device, wherein the grinding device comprises: a grinding wheel comprising a grinding groove around an outer edge of the grinding wheel, wherein the grinding wheel is configured to rotate around a rotation shaft for grinding; a sample stage on one side of the rotation shaft for placing thereon a piece to be ground; and a position detector configured to detect a position of a bottom of the grinding groove; and the method comprises:

moving the grinding wheel toward the sample stage, and recording a position of the grinding wheel when the bottom of the grinding groove comes into contact with the piece to be ground as a standard position;

moving the grinding wheel toward the position detector, and recording a position of the grinding wheel when a position of the bottom of the grinding groove coincides with a detecting center of the position detector as a first reference position;

moving the grinding wheel back to the standard position, and grinding the piece to be ground, according to a preset grinding amount using the grinding wheel; and

adjusting the position of the grinding wheel by: moving the grinding wheel again toward the position detector, recording a position of the grinding wheel when a position of the bottom of the grinding groove coincides with the detecting center of the position detector as a second reference position, and adjusting the standard position based upon the first reference position and the second reference position to thereby determine a position of the grinding wheel.

2. The method according to claim 1, wherein the method further comprises:

adjusting the position of the grinding wheel after one piece to be ground is ground using the grinding wheel.

3. The method according to claim 1, wherein the method further comprises:

adjusting the position of the grinding wheel after the grinding wheel is replaced, or the grinding groove is switched.

4. The method according to claim 1, wherein the method further comprises:

moving the grinding wheel in a first direction; wherein the first direction is perpendicular to the rotation shaft, and a detecting direction of the position detector is perpendicular to a plane defined by the rotation shaft and the first direction.

5. The method according to claim 4, wherein the grinding device further comprises a grinding groove abrasion detector configured to determine an abrasion condition of the grinding groove by observing the bottom of the grinding groove; and

after the piece to be ground is ground using the grinding wheel, the method further comprises:

detecting the abrasion condition of the grinding groove using the grinding groove abrasion detector;

determining whether to switch the grinding groove, or to replace the grinding wheel, according to the abrasion condition of the grinding groove; and

adjusting the position of the grinding wheel after switching the grinding groove or replacing the grinding wheel.

6. The method according to claim 4, wherein the standard position is determined by:

moving the grinding wheel to a position that an outer edge of the grinding groove comes into contact with an edge of the sample stage, and recording the position of the grinding wheel as a first position;

firstly moving the grinding wheel from the first position by a distance X₀away from the piece to be ground, in the first direction, and then placing the piece to be ground, on the sample stage, wherein an edge of the piece to be ground, protrudes by the distance X₀beyond the edge of the sample stage toward the grinding wheel;

presetting a standard value of grinding amount X₁of the piece to be ground, in the first direction, and moving the grinding wheel by the standard value X₁toward the piece to be ground, in the first direction;

moving the grinding wheel by a value X₂toward the piece to be ground, wherein X₂is a value of a depth by which the grinding groove is recessed in the first direction; and

placing the piece to be ground, on the sample stage, and adjusting the position of the grinding wheel based a positional displacement X₃of the piece to be ground, in the first direction.

7. The method according to claim 6, wherein the positional displacement X₃is determined by:

correcting a position of the piece to be ground, which is placed on the sample stage, and determining a difference between the position of the placed piece to be ground and a preset position of the piece to be ground as the positional displacement X₃.

8. The method according to claim 4, wherein the position of the grinding wheel comprises a positional coordinate X in the first direction, and a positional coordinate Z in a second direction, wherein the first direction is perpendicular to the second direction, the rotation shaft extends in the second direction, and when the position of the grinding wheel is adjusted, a difference between the second reference position and the first reference position is a reference position variation comprising a first reference position variation X_min the first direction, and, and a second reference position variation Z_min the second direction.

9. The method according to claim 8, wherein the adjusting the position of the grinding wheel further comprises:

moving the grinding wheel to the standard position; and

moving the grinding wheel from the standard position by the distance X_min the first direction, and moving the grinding wheel from the standard position by the distance Z_min the second direction.

10. The method according to claim 6, wherein the distance X₀by which the edge of the piece to be ground protrudes beyond the edge of the sample stage is from 6 mm to 15 mm.

11. A grinding device, wherein the grinding device comprises: a grinding wheel comprising a grinding groove around an outer edge of the grinding wheel, wherein the grinding wheel is configured to rotate around a rotation shaft for grinding; a sample stage on one side of the rotation shaft for placing thereon a piece to be ground; and a position detector configured to detect a position of a bottom of the grinding groove; the display grinding device further comprises at least one processor and a memory, wherein the memory is configured to store readable program codes, and the at least one processor is configured to execute the readable program codes to:

move the grinding wheel toward the sample stage, and record a position of the grinding wheel when the bottom of the grinding groove comes into contact with the piece to be ground as a standard position;

move the grinding wheel toward the position detector, and record a position of the grinding wheel when a position of the bottom of the grinding groove coincides with a detecting center of the position detector as a first reference position;

move the grinding wheel back to the standard position, and grind the piece to be ground, according to a preset grinding amount using the grinding wheel; and

adjust the position of the grinding wheel by: move the grinding wheel again toward the position detector, record a position of the grinding wheel when a position of the bottom of the grinding groove coincides with the detecting center of the position detector as a second reference position, and adjust the standard position based upon the first reference position and the second reference position to thereby determine a position of the grinding wheel.

12. The device according to claim 11, wherein the at least one processor is further configured to execute the readable program codes to:

adjust the position of the grinding wheel after one piece to be ground is ground using the grinding wheel.

13. The device according to claim 11, wherein the at least one processor is further configured to execute the readable program codes to:

adjust the position of the grinding wheel after the grinding wheel is replaced, or the grinding groove is switched.

14. The device according to claim 11, wherein the at least one processor is further configured to execute the readable program codes to:

move the grinding wheel in a first direction;

wherein the first direction is perpendicular to the rotation shaft, and a detecting direction of the position detector is perpendicular to a plane defined by the rotation shaft and the first direction;

and wherein the position of the grinding wheel comprises a positional coordinate X in the first direction, and a positional coordinate Z in a second direction, wherein the first direction is perpendicular to the second direction, the rotation shaft extends in the second direction, and when the position of the grinding wheel is adjusted, a difference between the second reference position and the first reference position is a reference position variation comprising a first reference position variation X_min the first direction, and, and a second reference position variation Z_min the second direction.

15. The device according to claim 14, wherein the grinding device further comprises a grinding groove abrasion detector configured to determine an abrasion condition of the grinding groove by observing the bottom of the grinding groove; and

after the piece to be ground is ground using the grinding wheel, the at least one processor is further configured to execute the readable program codes to:

detect the abrasion condition of the grinding groove using the grinding groove abrasion detector;

determine whether to switch the grinding groove, or to replace the grinding wheel, according to the abrasion condition of the grinding groove; and

adjust the position of the grinding wheel after switching the grinding groove or replacing the grinding wheel.

16. The device according to claim 14, wherein the at least one processor is further configured to execute the readable program codes to:

move the grinding wheel to a position that an outer edge of the grinding groove comes into contact with an edge of the sample stage, and recording the position of the grinding wheel as a first position;

firstly move the grinding wheel from the first position by a distance X₀away from the piece to be ground, in the first direction, and then place the piece to be ground, on the sample stage, wherein an edge of the piece to be ground, protrudes by the distance X₀beyond the edge of the sample stage toward the grinding wheel;

preset a standard value of grinding amount X₁of the piece to be ground, in the first direction, and move the grinding wheel by the standard value X₁toward the piece to be ground, in the first direction;

move the grinding wheel by a value X₂toward the piece to be ground, wherein X₂is a value of a depth by which the grinding groove is recessed in the first direction; and

place the piece to be ground, on the sample stage, and adjust the position of the grinding wheel based a positional displacement X₃of the piece to be ground, in the first direction.

17. The device according to claim 16, wherein the at least one processor is further configured to execute the readable program codes to:

correct a position of the piece to be ground, which is placed on the sample stage, and determine a difference between the position of the placed piece to be ground and a preset position of the piece to be ground as the positional displacement X₃.

18. The device according to claim 14, wherein the at least one processor is further configured to execute the readable program codes to:

move the grinding wheel to the standard position; and

move the grinding wheel from the standard position by the distance X_min the first direction, and move the grinding wheel from the standard position by the distance Z_min the second direction.

19. The device according to claim 16, wherein the at least one processor is further configured to execute the readable program codes to control that:

the distance X₀by which the edge of the piece to be ground protrudes beyond the edge of the sample stage is from 6 mm to 15 mm.

20. A grinding device, comprising: a grinding wheel comprising a grinding groove around the outer edge of the grinding wheel, wherein the grinding wheel is configured to rotate around the rotation shaft for grinding; a sample stage on one side of the rotation shaft for placing thereon a piece to be ground; a position detector configured to detect the position of the bottom of the grinding groove; and a position adjustor configured to adjust the position of the grinding wheel using the method according to claim 1.