CN111037458A - Monitoring device and silicon wafer processing device - Google Patents
Monitoring device and silicon wafer processing device Download PDFInfo
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- CN111037458A CN111037458A CN201911299173.7A CN201911299173A CN111037458A CN 111037458 A CN111037458 A CN 111037458A CN 201911299173 A CN201911299173 A CN 201911299173A CN 111037458 A CN111037458 A CN 111037458A
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- grinding wheel
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- screen
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 126
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 115
- 239000010703 silicon Substances 0.000 title claims abstract description 115
- 238000012806 monitoring device Methods 0.000 title claims abstract description 29
- 235000012431 wafers Nutrition 0.000 abstract description 86
- 230000007547 defect Effects 0.000 abstract description 9
- 238000012544 monitoring process Methods 0.000 description 9
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The invention provides a monitoring device and a silicon wafer processing device, wherein the monitoring device comprises: the light source is arranged on one side of the grinding wheel, a grinding groove extending along the circumferential direction of the grinding wheel is formed in the grinding wheel, the edge of the silicon wafer is placed in the grinding groove to grind the silicon wafer, and the light source is used for projecting light rays onto the grinding wheel; the screen is arranged at the other side of the grinding wheel, and when the light source projects light rays to the grinding wheel, the grinding wheel forms a projection image on the screen. According to the monitoring device, whether silicon chips exist in the grinding groove on the grinding wheel or not or whether the grinding groove is damaged or not can be monitored through the projected image of the grinding wheel on the screen, when the grinding wheel is ground or the silicon chips are accumulated in the grinding groove, the projected image of the grinding wheel on the screen can be found in time and adjusted in time, the chamfering processing quality is effectively controlled, the processing shape of the edge chamfer of the silicon wafer is prevented from being influenced, the processing defect of more silicon wafers is avoided, and the processing quality of the silicon wafers is improved.
Description
Technical Field
The invention relates to the field of silicon wafer processing, in particular to a monitoring device and a silicon wafer processing device.
Background
Wafers, which are the most basic materials in the semiconductor field, can be processed into various circuit device structures on the surface thereof, and become integrated circuit products with specific electrical functions. The preparation process of the large-size wafer is multiple, the process is complex, the finally obtained monocrystalline silicon wafer is required to have no defect on the surface, extremely low flatness, roughness and surface particle number, and extremely high cost. The edge chamfer grinding of the monocrystalline silicon wafer is vital, the silicon wafer is high in brittleness and hardness, mechanical stress can be generated on the silicon wafer due to small cracks or cracks on the edge, so that dislocation is generated, harmful contamination is gathered and falls off, and edge dislocation can cause edge dislocation growth during high-temperature treatment or surface epitaxy. The chamfering process can make the edge of the silicon wafer obtain a smooth radius contour, and the influence is reduced to the minimum.
The grinding wheel can be worn and torn in the chamfering process, so that diamond particles are stripped, silicon chips are accumulated in the groove, the processing shape of the edge chamfering of the silicon wafer is seriously influenced, the condition is difficult to detect in the processing process, the processing defects of more silicon wafers are often caused, and the processing quality of the silicon wafers is reduced.
Disclosure of Invention
In view of the above, the invention provides a monitoring device and a silicon wafer processing device, which are used for solving the problems that in the chamfering processing process of a grinding wheel, when the grinding wheel is worn, diamond particles are stripped or silicon chips are accumulated in a groove, the grinding wheel is not easy to find in time, the processing shape of the edge chamfer of a silicon wafer is seriously influenced, more processing defects of the silicon wafer are caused, and the processing quality of the silicon wafer is reduced.
In order to solve the technical problems, the invention adopts the following technical scheme:
in a first aspect, a monitoring device according to an embodiment of the present invention includes:
the light source is arranged on one side of the grinding wheel, a grinding groove extending along the circumferential direction of the grinding wheel is formed in the grinding wheel, the edge of a silicon wafer is placed in the grinding groove to grind the silicon wafer, and the light source is used for projecting light rays onto the grinding wheel;
the screen is arranged at the other side of the grinding wheel at a distance from the light source, and when the light source projects light rays onto the grinding wheel, the grinding wheel forms a projection image on the screen.
Wherein, still include:
the acquisition module is used for acquiring a projection image of the grinding wheel;
and the processor is used for detecting whether the grinding wheel meets the preset requirement or not according to the projected image.
The processor is used for comparing the projected image with a preset image, and when the projected image is matched with the preset image, the grinding wheel is detected to meet a preset requirement; and when the projected image is not matched with the preset image, detecting that the grinding wheel does not meet the preset requirement.
The light source is used for projecting light rays to the grinding wheel and the silicon wafer when the edge of the silicon wafer is placed in the grinding groove, and the grinding wheel and the silicon wafer form projection images of the grinding wheel and the silicon wafer on the screen.
Wherein, still include:
the acquisition module is used for acquiring projected images of the grinding wheel and the silicon wafer;
and the processor is used for detecting whether the silicon wafer is aligned with the grinding groove of the grinding wheel or not according to the projected images of the grinding wheel and the silicon wafer.
The acquisition module is used for acquiring a horizontal center line of a grinding groove of the grinding wheel and a horizontal center line of the silicon wafer;
the processor is used for comparing whether the horizontal center line of the grinding groove is coincident with the horizontal center line of the silicon wafer or not, and when the horizontal center line of the grinding groove is coincident with the horizontal center line of the silicon wafer, the silicon wafer is detected to be aligned with the grinding groove; and detecting that the silicon wafer is not aligned with the grinding groove when the horizontal center line of the grinding groove and the horizontal center line of the silicon wafer are not coincident.
Wherein, a movable horizontal reference line and/or a movable vertical reference line are arranged on the screen;
and/or horizontal scale marks and/or vertical scale marks are arranged on the screen.
Wherein, still include:
the supporting rod is rotatably arranged on the light source.
Wherein, the bracing piece includes:
the light source is rotatably arranged at the first end of the first rod body;
the second rod body is provided with a cavity extending along the length direction of the second rod body, and the second end of the first rod body is movably arranged in the cavity.
The second rod body is provided with a screw hole communicated with the cavity, a bolt is arranged in the screw hole, and the bolt can be stopped or far away from the second end of the first rod body.
Wherein, still include:
the support is provided with a first guide rail extending along the length direction perpendicular to the first rod body, and the second rod body is movably arranged on the first guide rail;
the base, be equipped with the second guide rail on the base, the extending direction perpendicular to of second guide rail the extending direction of first guide rail and perpendicular to the length direction of the first body of rod, the support is movably established on the second guide rail.
In a second aspect, a silicon wafer processing apparatus according to an embodiment of the present invention includes:
the grinding wheel is provided with a grinding groove extending along the circumferential direction of the grinding wheel, and the edge of a silicon wafer is placed in the grinding groove to grind the silicon wafer;
the grinding wheel is arranged at one end of the rotating shaft;
the driving structure is connected with the other end of the rotating shaft so as to drive the rotating shaft to rotate;
the monitoring device described in the above embodiments.
The technical scheme of the invention has the following beneficial effects:
according to the monitoring device of the invention, the light source is arranged on one side of the grinding wheel, the grinding wheel is provided with the grinding groove extending along the circumferential direction of the grinding wheel, the edge of the silicon wafer is arranged in the grinding groove to grind the silicon wafer, the light source projects light to the grinding wheel, the screen is arranged at a distance from the light source, the screen is arranged on the other side of the grinding wheel, when the light source projects light to the grinding wheel, the grinding wheel forms a projection image on the screen, whether silicon chips remain in the grinding groove on the grinding wheel can be monitored through the projection image of the grinding wheel on the screen, whether the grinding wheel is damaged or not is monitored, when the grinding wheel is worn, diamond particles are peeled off or the silicon chips are accumulated in the grinding groove, the projection image of the grinding wheel on the screen can be timely found, timely adjusted, the chamfering processing quality is effectively controlled, and the processing shape of, the processing defects of more silicon wafers are avoided, and the processing quality of the silicon wafers is improved.
Drawings
FIG. 1 is a schematic view of a silicon wafer processing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view showing a normal projection image of a grinding wheel in the silicon wafer processing apparatus according to the embodiment of the present invention;
FIG. 3 is a schematic view showing an image projected when the grinding wheel has debris in the silicon wafer processing apparatus according to the embodiment of the present invention.
Reference numerals
A light source 10;
a grinding wheel 20; a grinding groove 21;
a silicon wafer 30;
a screen 40; a horizontal reference line 41; a vertical reference line 42;
a support bar 50; a first rod 51; a second rod 52; a bolt 53;
a lumen 54; a support 55; a base 56;
the shaft 60 is rotated.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
The following describes a monitoring device according to an embodiment of the present invention in detail.
As shown in fig. 1 to 3, the monitoring apparatus according to the embodiment of the present invention includes a light source 10 and a screen 40.
Specifically, the light source 10 is disposed at one side of the grinding wheel 20, a grinding groove 21 extending along the circumferential direction of the grinding wheel 20 is formed on the grinding wheel 20, the edge of the silicon wafer 30 is placed in the grinding groove 21 to grind the silicon wafer 30, and the light source 10 is used for projecting light onto the grinding wheel 20; the screen 40 is spaced apart from the light source 10, the screen 40 is disposed at the other side of the grinding wheel 20, and the grinding wheel 20 forms a projection image on the screen 40 when the light source 10 projects light onto the grinding wheel 20.
That is to say, the monitoring device mainly includes the light source 10 and the screen 40, wherein the light source 10 may be disposed on one side of the grinding wheel 20, the grinding wheel 20 may be in a cylindrical shape, the grinding groove 21 is formed on the grinding wheel 20, the grinding groove 21 may extend along the circumferential direction of the grinding wheel 20, the grinding groove 21 is in a circular ring shape, the edge of the silicon wafer 30 is disposed in the grinding groove 21, the silicon wafer 30 is ground through the grinding groove 21, the light source 10 may be used to project light onto the grinding wheel 20, the light source 10 may be an LED light source, the light source 10 may be a high-intensity white light source, and the direction of the light projected onto the grinding wheel 20 by the light source 10 may be perpendicular to the axial direction of the grinding. The screen 40 is spaced apart from the light source 10, the screen 40 is disposed at the other side of the grinding wheel 20, the screen 40 and the light source 10 may be disposed opposite to each other, the axial direction of the grinding wheel 20 may be parallel to the screen 40, when the light source 10 projects light onto the grinding wheel 20, the grinding wheel 20 forms a projected image on the screen 40, when the light source 10 projects light onto the grinding wheel 20, the light may cover the whole grinding wheel 20 so that the grinding wheel 20 and the grinding groove 21 can completely form the projected image on the screen 40, or when the light source 10 projects light onto the grinding wheel 20, the light may cover a portion of one side of the axis of the grinding wheel 20 so that a half of the grinding wheel 20 or the grinding groove 21 on one side of the axis of the grinding wheel 20 can completely project on the screen 40, whether silicon chips remain in the grinding groove on the grinding wheel can be detected by forming the projected image on the screen 40 by the grinding wheel 20, whether damage occurs, the grinding wheel 20 may be rotated at a rate of 1-3r/min, where damage to the grinding wheel or grinding groove may be indicated if irregularities in the shape of the grinding wheel are displayed on the screen 40.
The light projected from the light source 10 onto the grinding wheel 20 may be perpendicular to the screen 40, and the light projected from the light source 10 onto the grinding wheel 20 may also form an acute angle with the screen 40. When the light direction projected by the light source 10 onto the grinding wheel 20 is perpendicular to the screen 40, the projected image of the grinding wheel 20 on the screen 40 can present an image similar to the side view of the grinding wheel 20, the shape of the grinding groove 21 can be observed, and when the inner side wall and the shape of the grinding groove 21 are normal, the projected image of the grinding groove 21 on the screen 40 is normal and can be used as a standard projected image, which can be shown in fig. 2; if the wearing and tearing damage appears on the inside wall of grinding groove 21 or there is the sweeps, grind the projection image of groove 21 on screen 40 unusual, grind the projection image of groove 21 on screen 40 and mismatch with standard projection image, for example, grind the projection image of groove 21 on screen 40 when grinding the inner wall of groove 21 and having the sweeps can be as shown in fig. 3, grind the projection image of groove 21 on screen 40 in fig. 2 and 3 and mismatch, whether normal with the inside wall that the comparison of standard projection image matches can detect grinding groove 21 through the projection image of grinding groove 21 on screen 40, if the wearing and tearing damage appears on the inside wall of grinding groove 21 or there is the sweeps, can in time discover.
Therefore, according to the monitoring device, the light source is arranged on one side of the grinding wheel, light rays are projected onto the grinding wheel through the light source, the screen is arranged on the other side of the grinding wheel, when the light source projects the light rays onto the grinding wheel, the grinding wheel forms a projected image on the screen, whether silicon chips remain in a grinding groove on the grinding wheel can be monitored through the projected image of the grinding wheel on the screen, whether the grinding wheel is damaged or not is monitored, when the grinding wheel is worn, diamond particles are stripped or the silicon chips are accumulated in the grinding groove, the projected image of the grinding wheel on the screen can be timely found and adjusted, chamfering processing quality is effectively controlled, the processing shape of the edge chamfer of the silicon wafer is prevented from being influenced, more processing defects of the silicon wafer are avoided, and the processing quality of the silicon wafer is improved.
In some embodiments of the present invention, the monitoring device may further include an obtaining module and a processor, wherein the obtaining module may be configured to obtain a projection image of the grinding wheel 20, and the processor may be configured to detect whether the grinding wheel 20 meets a preset requirement according to the projection image, so as to achieve automatic monitoring, avoid manual monitoring, reduce manpower, reduce risks of harming personal safety, and improve reliability of a monitoring result. When the inner side wall and the shape of the grinding groove 21 are normal and no abrasion damage or debris appears on the inner side wall, the projected image of the grinding groove 21 on the screen 40 is normal and can be used as a standard projected image; can match grinding groove 21 projecting image and standard projecting image on screen 40, if appear wearing and tearing damage or have the bits of broken glass on grinding groove 21's the inside wall, grinding groove 21 is unusual at the projecting image on screen 40, and grinding groove 21 is unmatched with standard projecting image at the projecting image on screen 40, can in time discover.
In other embodiments of the present invention, the processor may be configured to compare the projected image to a predetermined image, the predetermined image may be a standard projected image, or may be a scaled-down or scaled-up standard projected image, and when the projected image matches the predetermined image, the grinding wheel 20 is detected as meeting the predetermined requirements; the processor can be used for when the projection image does not match with the predetermined image, detects for grinding wheel 20 is not conform to preset the requirement, can in time discover the adjustment, increases the life of grinding wheel, avoids causing the processing defect of more silicon chips, improves the processingquality of silicon chip.
According to some embodiments of the present invention, the light source 10 may be used to project light onto the grinding wheel 20 and the silicon wafer 30 when the edge of the silicon wafer 30 is placed in the grinding groove 21, and the grinding wheel 20 and the silicon wafer 30 form a projected image of the grinding wheel 20 and the silicon wafer 30 on the screen 40. When the edge of silicon chip 30 is arranged in grinding groove 21, the axis of grinding miller 20 and silicon chip 30 are parallel, when throwing light to grinding miller 20 and silicon chip 30, grinding miller 20 and silicon chip 30 form the projection image of grinding miller 20 and silicon chip 30 on screen 40, according to the projection image of grinding miller 20 and silicon chip 30, can monitor whether remain the silicon chip in the grinding groove 21 on the grinding miller, whether appear damaging on the monitoring grinding miller 20, simultaneously, can detect whether the grinding groove 21 and the silicon chip 30 of grinding miller 20 aim at, if the position deviation appears can in time discover, prevent to appear damaging when leading to grinding because of the position deviation, the effectual machining precision and the quality that has guaranteed the silicon chip. When the silicon wafer and the grinding wheel have alignment errors, the silicon wafer and the grinding wheel are in a high-speed rotating state and can feed to the grinding wheel in the radial direction, the edge breakage defect of the edge of the silicon wafer is easily caused in the instant of contact, the loss is large, and the silicon wafer and the grinding wheel can be aligned through the scheme.
According to other embodiments, the monitoring device further comprises an acquisition module and a processor, wherein the acquisition module can be used for acquiring projected images of the grinding wheel 20 and the silicon wafer 30, and the processor can be used for detecting whether the silicon wafer 30 is aligned with the grinding groove 21 of the grinding wheel 20 according to the projected images of the grinding wheel 20 and the silicon wafer 30, so that automatic monitoring can be realized, manual monitoring is not needed, manpower is reduced, the risk of harming personal safety is reduced, and the reliability of a monitoring result is improved.
In an embodiment of the present invention, the obtaining module may be configured to obtain a horizontal center line of the grinding groove 21 of the grinding wheel 20 and a horizontal center line of the silicon wafer 30; the processor may be configured to compare whether the horizontal center line of the grinding groove 21 and the horizontal center line of the silicon wafer 30 coincide, and detect that the silicon wafer 30 is aligned with the grinding groove 21 when the horizontal center line of the grinding groove 21 and the horizontal center line of the silicon wafer 30 coincide; the processor may be configured to detect misalignment of the silicon wafer 30 with the grinding groove 21 when the horizontal centerline of the grinding groove 21 and the horizontal centerline of the silicon wafer 30 are not coincident. The projection positions of the horizontal center line of the grinding groove 21 and the horizontal center line of the silicon wafer 30 on the screen 40 can be obtained according to the horizontal center line of the grinding groove 21 and the horizontal center line of the silicon wafer 30, and whether the silicon wafer 30 is aligned with the grinding groove 21 of the grinding wheel 20 is judged by comparing whether the horizontal center line of the grinding groove 21 and the horizontal center line of the silicon wafer 30 coincide on the projection, so that the position deviation can be found timely and accurately. When the silicon wafer is aligned with the grinding groove 21, the horizontal center line of the grinding groove 21 coincides with the horizontal reference line 41 on the screen 40, the horizontal center line of the silicon wafer 30 coincides with the horizontal reference line 41 on the screen 40, and whether the silicon wafer is aligned with the grinding groove 21 is judged by judging whether the silicon wafer coincides with the horizontal reference line 41 on the screen 40.
Optionally, as shown in fig. 2, a movable horizontal reference line 41 and/or a vertical reference line 42 is provided on the screen 40; and/or, horizontal scale marks and/or vertical scale marks are arranged on the screen 40. That is, the screen 40 may be separately provided with a movable horizontal reference line 41 and/or a movable vertical reference line 42, or may be separately provided with a horizontal scale mark and/or a vertical scale mark on the screen 40; in addition, a movable horizontal reference line 41 and/or a vertical reference line 42 may be provided on the screen 40, and horizontal scale lines and/or vertical scale lines may also be provided on the screen 40, so that whether the silicon wafer 30 is aligned with the grinding grooves 21 of the grinding wheel 20 can be accurately determined.
In some embodiments, as shown in fig. 1, the monitoring device further includes a support bar 50, the light source 10 is rotatably disposed on the support bar 50, and the angle of the light source 10 can be adjusted by rotating the light source 10.
Alternatively, the supporting rod 50 may include a first rod 51 and a second rod 52, wherein the light source 10 is rotatably disposed at a first end of the first rod 51, the second rod 52 is formed with a channel 54 extending along a length direction thereof, a second end of the first rod 51 is movably disposed in the channel 54, and a second end of the first rod 51 is movable along the length direction of the channel 54 so as to adjust a height of the light source 10.
In some embodiments of the present invention, a screw hole communicated with the cavity 54 is formed on the second rod 52, a bolt 53 is disposed in the screw hole, the bolt 53 can abut against or be away from the second end of the first rod 51, when the height of the light source 10 needs to be adjusted, the bolt 53 can be unscrewed to make the bolt 53 be away from the second end of the first rod 51, the position of the second end of the first rod 51 in the cavity 54 is moved, when the height of the light source 10 meets the setting requirement, the bolt 53 can be screwed, and the bolt 53 abuts against the second end of the first rod 51, so that the second end of the first rod 51 is fixed, and the height of the light source 10 is conveniently adjusted through the bolt 54.
In the embodiment of the present invention, the monitoring device further includes a support 55 and a base 56, wherein the support 55 is provided with a first guide rail extending in a direction perpendicular to the length direction of the first rod 51, the second rod 52 is movably provided on the first guide rail, and the position of the light source 10 in the direction of the first guide rail can be adjusted by moving the second rod 52; the base 56 is provided with a second guide rail, an extending direction of the second guide rail is perpendicular to an extending direction of the first guide rail and perpendicular to a length direction of the first rod 51, the support 55 is movably arranged on the second guide rail, and a position of the light source 10 in the direction of the second guide rail can be adjusted by moving the support 55.
The embodiment of the invention also provides a silicon wafer processing device.
As shown in fig. 1, the silicon wafer processing apparatus includes a grinding wheel 20, a rotating shaft 60, a driving structure and the monitoring device described in the above embodiment, wherein the grinding wheel 20 is formed with a grinding groove 21 extending along a circumferential direction of the grinding wheel 20, an edge of the silicon wafer 30 is placed in the grinding groove 21 to grind the silicon wafer 30, the grinding wheel 20 is provided at one end of the rotating shaft 60, and the driving structure is connected to the other end of the rotating shaft 60 to drive the rotating shaft 60 to rotate.
Set up light source 10 in one side of grinding miller 20, throw light to grinding miller 20 through light source 10, screen 40 is established at the opposite side of grinding miller 20, when light source 10 throws light to grinding miller 20, grinding miller 20 forms the projection image on screen 40, can monitor whether remain the silicon chip in the grinding groove 21 on grinding miller 20 through the projection image of grinding miller 20 on screen 40, whether appear damaging on the monitoring grinding miller 20, when wearing and tearing appear in grinding miller 20, diamond granule is peeled off or the silicon chip is piled up in grinding groove 21, can in time discover through the projection image of grinding miller 20 on screen 40, in time make the adjustment, effective control chamfer processingquality, avoid influencing the processing shape of silicon chip edge chamfer, avoid causing the processing defect of more silicon chips, improve the processingquality of silicon chip.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (12)
1. A monitoring device, comprising:
the light source is arranged on one side of the grinding wheel, a grinding groove extending along the circumferential direction of the grinding wheel is formed in the grinding wheel, the edge of a silicon wafer is placed in the grinding groove to grind the silicon wafer, and the light source is used for projecting light rays onto the grinding wheel;
the screen is arranged at the other side of the grinding wheel at a distance from the light source, and when the light source projects light rays onto the grinding wheel, the grinding wheel forms a projection image on the screen.
2. The monitoring device of claim 1, further comprising:
the acquisition module is used for acquiring a projection image of the grinding wheel;
and the processor is used for detecting whether the grinding wheel meets the preset requirement or not according to the projected image.
3. The monitoring device of claim 2, wherein the processor is configured to compare the projected image to a predetermined image and detect that the grinding wheel meets a predetermined requirement when the projected image matches the predetermined image; and when the projected image is not matched with the preset image, detecting that the grinding wheel does not meet the preset requirement.
4. The monitoring device of claim 1, wherein the light source is configured to project light onto the grinding wheel and the silicon wafer when the edge of the silicon wafer is disposed in the grinding groove, the grinding wheel and the silicon wafer forming a projected image of the grinding wheel and the silicon wafer on the screen.
5. The monitoring device of claim 4, further comprising:
the acquisition module is used for acquiring projected images of the grinding wheel and the silicon wafer;
and the processor is used for detecting whether the silicon wafer is aligned with the grinding groove of the grinding wheel or not according to the projected images of the grinding wheel and the silicon wafer.
6. The monitoring device of claim 5, wherein the acquisition module is configured to acquire a horizontal centerline of a grinding groove of the grinding wheel and a horizontal centerline of the silicon wafer;
the processor is used for comparing whether the horizontal center line of the grinding groove is coincident with the horizontal center line of the silicon wafer or not, and when the horizontal center line of the grinding groove is coincident with the horizontal center line of the silicon wafer, the silicon wafer is detected to be aligned with the grinding groove; and detecting that the silicon wafer is not aligned with the grinding groove when the horizontal center line of the grinding groove and the horizontal center line of the silicon wafer are not coincident.
7. The monitoring device according to claim 1, wherein a movable horizontal reference line and/or a movable vertical reference line are provided on the screen;
and/or horizontal scale marks and/or vertical scale marks are arranged on the screen.
8. The monitoring device of claim 1, further comprising:
the supporting rod is rotatably arranged on the light source.
9. The monitoring device of claim 8, wherein the support rod comprises:
the light source is rotatably arranged at the first end of the first rod body;
the second rod body is provided with a cavity extending along the length direction of the second rod body, and the second end of the first rod body is movably arranged in the cavity.
10. The device of claim 9, wherein the second shaft defines a threaded bore in communication with the channel, the threaded bore having a bolt disposed therein, the bolt being adapted to stop against or away from the second end of the first shaft.
11. The monitoring device of claim 9, further comprising:
the support is provided with a first guide rail extending along the length direction perpendicular to the first rod body, and the second rod body is movably arranged on the first guide rail;
the base, be equipped with the second guide rail on the base, the extending direction perpendicular to of second guide rail the extending direction of first guide rail and perpendicular to the length direction of the first body of rod, the support is movably established on the second guide rail.
12. An apparatus for processing a silicon wafer, comprising:
the grinding wheel is provided with a grinding groove extending along the circumferential direction of the grinding wheel, and the edge of a silicon wafer is placed in the grinding groove to grind the silicon wafer;
the grinding wheel is arranged at one end of the rotating shaft;
the driving structure is connected with the other end of the rotating shaft so as to drive the rotating shaft to rotate;
the monitoring device of any one of claims 1-11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201911299173.7A CN111037458A (en) | 2019-12-17 | 2019-12-17 | Monitoring device and silicon wafer processing device |
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| CN201911299173.7A CN111037458A (en) | 2019-12-17 | 2019-12-17 | Monitoring device and silicon wafer processing device |
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| CN111037458A true CN111037458A (en) | 2020-04-21 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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