CN103286452B - Laser micropore processing method and laser micropore process equipment - Google Patents
Laser micropore processing method and laser micropore process equipment Download PDFInfo
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- CN103286452B CN103286452B CN201210053640.XA CN201210053640A CN103286452B CN 103286452 B CN103286452 B CN 103286452B CN 201210053640 A CN201210053640 A CN 201210053640A CN 103286452 B CN103286452 B CN 103286452B
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- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000003672 processing method Methods 0.000 title claims abstract description 15
- 238000003384 imaging method Methods 0.000 claims abstract description 165
- 238000012545 processing Methods 0.000 claims abstract description 68
- 238000010408 sweeping Methods 0.000 claims description 16
- 210000003371 toe Anatomy 0.000 claims description 13
- 238000007493 shaping process Methods 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 8
- 238000009826 distribution Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 230000003252 repetitive effect Effects 0.000 claims description 6
- 238000003754 machining Methods 0.000 abstract description 11
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 29
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 7
- 230000006978 adaptation Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 241001270131 Agaricus moelleri Species 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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Abstract
The present invention is applicable to semiconductor processing technology field, discloses a kind of laser micropore processing method and laser micropore process equipment.Above-mentioned processing method comprises the following steps, laser micropore process equipment is set, on workpiece to be added, gauge point is set, workpiece to be added is fixed on servo platform, then imaging navigation system is made to aim at workpiece to be added, utilize the azimuth information of imaging navigation system identification marking point, determine by industrial PC position workpiece to be added needing carry out capillary processing, then carry out Laser Processing.Above-mentioned process equipment comprises microscope carrier, laser via machine, servo platform, imaging navigation system and industrial PC, laser via machine is arranged on described microscope carrier, microscope carrier is fixedly installed support, imaging navigation system is arranged on support, servo platform is arranged on microscope carrier, and industrial PC is connected to imaging navigation system.A kind of laser micropore processing method provided by the invention and laser micropore process equipment, its working (machining) efficiency is high, processing cost is low, the process-cycle is short.
Description
Technical field
The invention belongs to semiconductor processing technology field, particularly relate to a kind of laser micropore processing method and laser micropore process equipment.
Background technology
The processing of traditional silicon through hole (TSV) mainly first makes need carry out the corresponding half tone of silicon through hole, half tone makes and is covered by full wafer wafer, expose the micropore that corresponding need carry out silicon through hole, then gas attack is carried out, with the coating removal by corresponding micropore place, and reach the technical requirement of silicon through hole.This mode passing through half tone and gas attack in prior art, its need for different wafer manufacturing corresponding half tone, cannot the processing of wafer of adaptation diversity, and need by gas attack wafer, need in process to consume more production consumptive material, there is the shortcomings such as working (machining) efficiency is low, processing cost is high, the process-cycle is long.
Summary of the invention
The object of the invention is to overcome above-mentioned the deficiencies in the prior art, provide a kind of laser micropore processing method and laser micropore process equipment, it is without the need to making half tone, producing figure can be diversified, simple to operation without the need to any production consumptive material, and process velocity is fast, processing characteristics is stable, working (machining) efficiency is high, processing cost is low, the process-cycle is short.
Technical scheme of the present invention is: a kind of laser micropore processing method, comprise the following steps, laser micropore process equipment is set, described laser micropore process equipment comprise can lasing laser via machine, for the fixing servo platform of workpiece to be added, the imaging navigation system for positioning described workpiece to be added, the gauge point that at least one positions for supplying described imaging navigation system is set on described workpiece to be added, described workpiece to be added is fixed on described servo platform, then imaging navigation system is made to aim at workpiece to be added, utilize the azimuth information of imaging navigation system identification marking point, then determined exact position workpiece to be added needing to carry out capillary processing by the calculating of industrial PC, then control described laser via machine and carry out laser micropore processing to machined part according to above-mentioned exact position, described imaging navigation system comprises first imaging navigation system for carrying out Primary Location to described workpiece to be added and for carrying out pinpoint smart imaging navigation system to described workpiece to be added, when described workpiece to be added is positioned, first by described servo platform, described workpiece to be added is moved to described just imaging navigation system place, carry out Primary Location by described just imaging navigation system gauge point to machined part and determine that workpiece to be added is in the Position Approximate of described servo platform and angle, and then described workpiece to be added is moved to the below of described smart imaging navigation system, and by described smart imaging navigation system, the gauge point on described workpiece to be added is located accurately, exact position workpiece to be added needing to carry out capillary processing is determined again by the calculating of industrial PC.
Particularly, before laser micropore processing is carried out to described workpiece to be added, first the surface sweeping galvanometer square toes assembly on laser via machine is corrected.
Particularly, before laser micropore processing is carried out to described workpiece to be added, first the repetitive positioning accuracy of described servo platform is corrected.
Particularly, when first imaging navigation system and smart imaging navigation system position described gauge point, by gauge point described in light illuminating.
Present invention also offers a kind of laser micropore process equipment, comprise microscope carrier, can lasing laser via machine, for fixing workpiece to be added and the servo platform of removable described workpiece to be added, imaging navigation system and industrial PC, described laser via machine is arranged on described microscope carrier, described microscope carrier is fixedly installed support, described imaging navigation system is arranged on described support, described servo platform is arranged on described microscope carrier, and described industrial PC is connected to described imaging navigation system; Described imaging navigation system comprises first imaging navigation system for carrying out Primary Location to described workpiece to be added and for carrying out pinpoint smart imaging navigation system to described workpiece to be added; Imaging navigation system at the beginning of described comprises the first image camera, the first installing plate, the first imaging lens, the first coaxial light source and the first longitudinal direction and regulates platform assembly; Described first longitudinally regulates platform assembly to be connected on described lengthwise position adjusting part, described first installing plate is connected to described first and longitudinally regulates on platform assembly, described first image camera, the first imaging lens are all fixed on described first installing plate, and described first coaxial light source is connected on described first imaging lens; Described smart imaging navigation system comprises the second image camera, the second installing plate, the second imaging lens, the second coaxial light source and the second longitudinal direction and regulates platform assembly; Described second longitudinally regulates platform assembly to be connected on described lengthwise position adjusting part, described second installing plate is connected to described second and longitudinally regulates on platform assembly, described second image camera, the second imaging lens are all fixed on described second installing plate, and described second coaxial light source is connected on described second imaging lens.
Particularly, described laser via machine comprise housing, laser generator, for adjust laser beam spot sizes and Laser beam energy distribution the outer optical path component of built-in shaping, can reflection be carried out to laser and carry out the surface sweeping galvanometer square toes assembly of surface sweeping and the lengthwise position adjusting part of adjustable laser scanning manufacturing focus to machined part; Described laser generator, built-in shaping outer optical path component, surface sweeping galvanometer square toes assembly and lengthwise position adjusting part are all connected to described housing.
Particularly, described servo platform comprises vacuum suction microscope carrier, the first slide rail and the second slide rail, arrange in " ten " font between described first slide rail and the second slide rail, described first slide rail is fixed on described microscope carrier, described second slide rail slides and is arranged on described first slide rail, and described vacuum suction microscope carrier slides and is arranged on described second slide rail.
A kind of laser micropore processing method provided by the invention and laser micropore process equipment, it utilizes CCD image-forming principle to position, without the need to preparing half tone, also without the need to using etching gas, can directly directly process difform workpiece to be added, can the processing of workpiece to be added of adaptation diversity, and due to without the need to preparing half tone, the figure of product can be diversified, and Laser Processing to have process velocity fast, processing characteristics is stablized, accurate to dimension advantages of higher, improve the crudy of product, and it is simple to operation, substantially reduce the process-cycle of product, improve working (machining) efficiency, process produces consumptive material without the need to consuming, reduce processing cost.
Accompanying drawing explanation
Fig. 1 is the stereogram of the laser micropore process equipment that the embodiment of the present invention provides;
Fig. 2 is the close-up schematic view at A place in Fig. 1;
Fig. 3 is the stereogram of laser via machine in the laser micropore process equipment that provides of the embodiment of the present invention;
Fig. 4 is the stereogram of imaging navigation system in the laser micropore process equipment that provides of the embodiment of the present invention;
Fig. 5 is the stereogram of the first guide rail and the second guide rail in the laser micropore process equipment that provides of the embodiment of the present invention;
Fig. 6 is the stereogram of vacuum suction microscope carrier in the laser micropore process equipment that provides of the embodiment of the present invention;
Fig. 7 is the profile of the workpiece to be added that the embodiment of the present invention provides.
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
A kind of laser micropore processing method that the embodiment of the present invention provides, can be used for the semi-conducting materials such as the wafer that machine silicon material makes, as chip etc.
As shown in FIG. 1 to 3, above-mentioned laser micropore processing method comprises the following steps: arrange a laser micropore process equipment, laser micropore process equipment comprise can lasing laser via machine 100, for the fixing servo platform 200 of workpiece to be added, the imaging navigation system 300 for positioning to machined part.Workpiece to be added can be CSP wafer (wafer-level package wafer) etc.Imaging navigation system 300 also claims CCD navigation system, and it can gather the figure of set point, and utilizes software to carry out analyzing, locating.Before processing, prior to workpiece to be added being arranged the gauge point that at least one positions for supplying imaging navigation system 300, gauge point is as a unified datum mark, it or can adopt specific material to be formed by specific shape, structure, so that imaging navigation system 300 identification marking point rapidly and accurately, thus contribute to the relevant information such as position, angle judging workpiece to be added.Again workpiece to be added is fixed on servo platform 200, then imaging navigation system 300 is made to aim at workpiece to be added, utilize the azimuth information of imaging navigation system 300 identification marking point, then determined exact position workpiece to be added needing to carry out capillary processing by the calculating of industrial PC, then control laser via machine 100 and carry out laser micropore processing to machined part according to above-mentioned exact position.Micropore can blind hole or through hole, and its diameter is generally less than 100 microns.In the present embodiment, as shown in Figure 7, workpiece to be added is CSP wafer, it comprises stacked coating 910 and metal level 920, micropore is blind hole, and the shadow region in Fig. 7 is the region of capillary processing, continues to process metal level 920 after the coating 910 on laser breakdown surface, by controlling the power of laser and frequency to realize the control to the micropore degree of depth, metal level 920 need puncture certain thickness.Shape, the structure of workpiece to be added can be determined according to actual conditions, all belong to protection scope of the present invention.Generally owing to same workpiece to be added needing the micropore quantity of processing more, therefore each bright dipping of laser all can process to form micropore to certain area, just can complete laser via processing to full wafer wafer, and reach corresponding technical requirement after continuing processing.By such design, without the need to the half tone that preparation and workpiece to be added adapt, also without the need to using etching gas, can directly directly process difform workpiece to be added, can the processing of workpiece to be added of adaptation diversity, and due to without the need to preparing half tone, the figure of product can be diversified, and Laser Processing to have process velocity fast, processing characteristics is stablized, accurate to dimension advantages of higher, improve the crudy of product, and it is simple to operation, substantially reduce the process-cycle of product, improve working (machining) efficiency, process produces consumptive material without the need to consuming, reduce processing cost.
Particularly, before processing, first according to aperture, pass technological requirement, the diameter of the laser beam exported by laser generator in adjustment laser via machine 100 and Laser beam energy distribution thereof, the Gaussian Profile of standard laser energy to be changed into the Energy distribution of flat-top light form, by corresponding laser shaping and beam expander, reach the specific requirement of processing respective aperture, pass.
Particularly, as shown in Figure 1 and Figure 4, imaging navigation system 300 comprises first imaging navigation system 310 for carrying out Primary Location to machined part and for carrying out pinpoint smart imaging navigation system 320 to machined part; First imaging navigation system 310 and smart imaging navigation system 320 are at a distance of arranging.When positioning to machined part, first by servo platform 200, workpiece to be added is moved to just imaging navigation system 310 place, carry out Primary Location by first imaging navigation system 310 gauge point to machined part and determine that workpiece to be added is in the Position Approximate of servo platform 200 and angle, and then workpiece to be added is moved to the below of smart imaging navigation system 320, and the gauge point gone up to machined part by smart imaging navigation system 320 is located accurately, then determined exact position workpiece to be added needing to carry out capillary processing by the calculating of industrial PC.The areas imaging of first imaging navigation system 310 is greater than the areas imaging of smart imaging navigation system 320, but imaging precision does not have smart imaging navigation system 320 high; First imaging navigation system 310 can carry out imaging to the workpiece to be added compared with large regions, and by the approximate location of software identification marking point, and then by smart imaging navigation system 320 in alignment with above-mentioned approximate location, the smart imaging navigation system 320 pairs of gauge points utilizing imaging precision high and the relevant information of workpiece to be added are located accurately.By such design, make imaging navigation system 300 can the positional information of identification marking point quickly and accurately.And, by arranging just imaging navigation system 310 and smart imaging navigation system 320, effectively can reduce the cost of equipment, creatively make use of the advantage that just imaging navigation system 310 and smart imaging navigation system 320 are respective.
Particularly, before laser micropore processing is carried out to described workpiece to be added, first the surface sweeping galvanometer square toes assembly on laser via machine 100 is corrected, to improve crudy.
Particularly, as shown in Figure 1 and Figure 5, before laser micropore processing is carried out to described workpiece to be added, first the repetitive positioning accuracy of described servo platform 200 is corrected.Servo platform 200 is waitd upon as two dimension and is taken platform, for making workpiece to be added move in two-dimentional linear extent, because the required precision of laser micropore processing is high, so corresponding accuracy compensation will be carried out to servo platform 200, to improve the repetitive positioning accuracy of servo platform 200, reach corresponding requirements.
Particularly, before carrying out laser micropore processing to machined part, first by industrial PC to machined part people for being divided into multiple machining area, then controlling laser via machine 100 and precisely carry out subregion processing to machined part in an orderly manner, to improve the precision of processing.
Particularly, in process, periodically laser power stability is tested, to ensure the stability of laser power in laser processing procedure, be beneficial to the stable of the quality ensureing processing, improve the uniformity of product.
Particularly, before first imaging navigation system 310 and smart imaging navigation system 320 pairs of gauge points position, first regulate the focal length of just imaging navigation system 310 and smart imaging navigation system 320, to improve speed and the precision of location.
Particularly, when first imaging navigation system 310 and smart imaging navigation system 320 pairs of gauge points position, by light illuminating gauge point.In embody rule, coaxial light source can be set the respective regions of workpiece to be added is illuminated, to make the image captured by first imaging navigation system 310 and smart imaging navigation system 320 enough clear.
As shown in Fig. 1 ~ Fig. 6, present invention also offers a kind of laser micropore process equipment, comprise microscope carrier 410, can lasing laser via machine 100, for fixing workpiece to be added and the servo platform 200 of removable workpiece to be added, imaging navigation system 300 and industrial PC, laser via machine 100 is arranged on microscope carrier 410, microscope carrier 410 is fixedly installed support 420, imaging navigation system 300 is arranged on support 420, servo platform 200 is arranged on microscope carrier 410, industrial PC is connected to imaging navigation system 300 and servo platform 200, associated components such as laser via machine 100 grade.Laser via machine 100 can produce the laser beam being adapted to concrete capillary processing requirement, servo platform 200 can drive workpiece to be added planar to move, imaging navigation system 300 utilizes the principle of CCD imaging, determine the orientation of micropore, with the orientation making laser beam can act on required processing accurately, in industrial PC, be integrated with corresponding software.In embody rule, first the workpiece to be added being provided with gauge point is fixed on servo platform 200, then imaging navigation system 300 is made to aim at workpiece to be added, utilize the azimuth information of imaging navigation system 300 identification marking point, then determined exact position workpiece to be added needing to carry out capillary processing by the calculating of industrial PC, then control laser via machine 100 and carry out laser micropore processing to machined part according to above-mentioned exact position.The half tone that whole process adapts without the need to preparation and workpiece to be added, also without the need to using etching gas, can directly directly process difform workpiece to be added, can the processing of workpiece to be added of adaptation diversity, and due to without the need to preparing half tone, the figure of product can be diversified, and Laser Processing to have process velocity fast, processing characteristics is stablized, accurate to dimension advantages of higher, improve the crudy of product, and it is simple to operation, substantially reduce the process-cycle of product, improve working (machining) efficiency, process produces consumptive material without the need to consuming, reduce processing cost.
Preferably, microscope carrier 410 and support 420 all can select marble to be material, and the advantages such as it is little that it has thermal deformation coefficient, dimensionally stable, are conducive to the reliability of raising equipment.
Particularly, as shown in figures 1 and 3, described laser via machine 100 comprise housing 110, laser generator 120, for adjust laser beam spot sizes and Laser beam energy distribution the outer optical path component of built-in shaping, can reflection be carried out to laser and carry out the surface sweeping galvanometer square toes assembly 130 of surface sweeping and the lengthwise position adjusting part 140 of adjustable laser scanning manufacturing focus to machined part; Described laser generator 120, built-in shaping outer optical path component, surface sweeping galvanometer square toes assembly 130 and lengthwise position adjusting part 140 are all connected to described housing 110.The outer optical path component of built-in shaping is arranged in housing 110.Lengthwise position adjusting part 140 can be set to the drive mechanisms such as feed screw nut, the fore-and-aft distance between its adjustable surface sweeping galvanometer square toes assembly 130 parts such as grade and workpiece to be added.Laser generator 120 can laser needed for laser, and it can be the laser generator 120 of the suitable type such as ultraviolet laser.Built-in shaping outward optical path component to the corresponding shaping of standard laser Shu Jinhang and can expand, and becomes shape and the diameter of machining need, to meet processing request with the laser produced by laser generator 120.Laser after the 130 pairs of shapings of surface sweeping galvanometer square toes assembly, by the reflection of X, Y-axis galvanometer sheet, carries out large-scale surface sweeping; Lengthwise position adjusting part 140 is used for regulating the focus of laser scanning manufacturing.
Further, as shown in figures 1 and 3, the lower end of lengthwise position adjusting part 140 is fixedly installed displacement transducer 150, and displacement transducer 150 can detect the factual focus location of processing, to improve the quality of processing.
Particularly, as shown in Figure 1 and Figure 4, imaging navigation system 300 comprises first imaging navigation system 310 for carrying out Primary Location to machined part, for carrying out pinpoint smart imaging navigation system 320 to machined part.First imaging navigation system 310 and smart imaging navigation system 320 are at a distance of arranging.When positioning to machined part, first by servo platform 200, workpiece to be added is moved to just imaging navigation system 310 place, carry out Primary Location by first imaging navigation system 310 gauge point to machined part and determine that workpiece to be added is in the Position Approximate of servo platform 200 and angle, and then workpiece to be added is moved to the below of smart imaging navigation system 320, and the gauge point gone up to machined part by smart imaging navigation system 320 is located accurately, then determined exact position workpiece to be added needing to carry out capillary processing by the calculating of industrial PC.The areas imaging of first imaging navigation system 310 is greater than the areas imaging of smart imaging navigation system 320, but imaging precision does not have smart imaging navigation system 320 high, and its cost is also lower; First imaging navigation system 310 can carry out imaging to the workpiece to be added compared with large regions, and by the approximate location of software identification marking point, and then by smart imaging navigation system 320 in alignment with above-mentioned approximate location, the smart imaging navigation system 320 pairs of gauge points utilizing imaging precision high and the relevant information of workpiece to be added are located accurately.By such design, first imaging navigation system 310 carries out Primary Location to machined part, so that the respective markers point that smart imaging navigation system 320 can accurately identify, makes imaging navigation system 300 can the positional information of identification marking point quickly and accurately.And, by arranging just imaging navigation system 310 and smart imaging navigation system 320, effectively can reduce the cost of equipment, creatively make use of the advantage that just imaging navigation system 310 and smart imaging navigation system 320 are respective.
More specifically, as shown in Figure 1 and Figure 4, first imaging navigation system 310 comprises the first installing plate 311, first image camera 312, first imaging lens 313, first coaxial light source 314 and first longitudinal adjustment platform assembly 315; First image camera 312 can be CCD camera, and its imaging effect is good.This reverberation for collecting the reverberation of workpiece subscript to be added note point, and is gathered on the first image camera 312 and carries out imaging by the first imaging lens 313.First longitudinally regulates platform assembly 315 to be connected on lengthwise position adjusting part 140, first longitudinally regulates platform assembly 315 can regulate the lengthwise position of just imaging navigation system 310, it can regulate the position of just imaging navigation system 310 by drive mechanisms such as feed screw nuts, so that regulate the parameters such as the focal length of just imaging navigation system 310, make the image of shooting enough clear.First installing plate 311 is connected to first and longitudinally regulates on platform assembly 315, first image camera 312, first imaging lens 313 is all fixed on the first installing plate 311, first coaxial light source 314 is connected on the first imaging lens 313, to illuminate imaging region, improves imaging effect and positioning precision.
Particularly, as shown in Figure 1 and Figure 4, smart imaging navigation system 320 comprises the second installing plate 321, second image camera 322, second imaging lens 323, second coaxial light source 324 and second longitudinal adjustment platform assembly 325; Second image camera 322 can be CCD camera, and its imaging effect is good.Second longitudinally regulates platform assembly 325 to be connected on lengthwise position adjusting part 140, second installing plate 321 is connected to second and longitudinally regulates on platform assembly 325, second image camera 322, second imaging lens 323 is all fixed on the second installing plate 321, and the second coaxial light source 324 is connected on the second imaging lens 323.Second imaging lens 323 is fixedly connected on the second image camera 312 by camera lens retainer ring 326.This reverberation for collecting the reverberation of workpiece subscript to be added note point, and is gathered on the second image camera 322 and carries out imaging by the second imaging lens 323.Second longitudinally regulates platform assembly 325 can regulate the lengthwise position of smart imaging navigation system 320, it can regulate the position of smart imaging navigation system 320 by drive mechanisms such as feed screw nuts, so that regulate the parameters such as the focal length of smart imaging navigation system 320, make the image of shooting enough clear.
Particularly, as shown in Figure 1 and Figure 5, servo platform 200 comprises vacuum suction microscope carrier 230, first slide rail 210 and the second slide rail 220, arrange in " ten " font between first slide rail 210 and the second slide rail 220, first slide rail 210 is fixed on microscope carrier 410, second slide rail 220 slides and is arranged on the first slide rail 210, and vacuum suction microscope carrier 230 slides and is arranged on the second slide rail 220, vacuum suction microscope carrier 230 is provided with vacuum adsorption plate 231.Vacuum suction microscope carrier 230 can reliably fix workpiece to be added.Like this, by mutually vertically arranging the first slide rail 210 and the second slide rail 220, first slide rail 210 can make vacuum suction microscope carrier 230 and workpiece to be added slide within the scope of X-axis, second slide rail 220 can make vacuum suction microscope carrier 230 and workpiece to be added slide within the scope of Y-axis, thus makes vacuum suction microscope carrier 230 can drive workpiece to be added two-dimensional movement extremely corresponding position within the specific limits.
Particularly, as shown in Figure 1 and Figure 5, servo platform 200 is connected with control cable, control cable is provided with drag chain 240, drag chain 240 can be used for protecting control cable, and avoid it to damage in servo platform 200 motion process, structural reliability is high.
Particularly, as shown in figures 1 to 6, vacuum suction microscope carrier 230 is provided with gas-tpe fitting 250, gas-tpe fitting 250 is connected to compressed air source, is fixed on vacuum suction microscope carrier 230 by workpiece to be added to utilize vacuum suction.
Further, as shown in figures 1 to 6, vacuum suction microscope carrier 230 is also provided with laser power meter 260, for the stability of detection laser power output, to ensure crudy.
Before processing, first according to aperture, pass technological requirement, the diameter of the laser beam exported by laser generator 120 in adjustment laser via machine 100 and Laser beam energy distribution thereof, the Gaussian Profile of standard laser energy to be changed into the Energy distribution of flat-top light form, by corresponding laser shaping and beam expander, reach the specific requirement of processing respective aperture, pass.
Because the precision of big width laser scanning machining is high, therefore need first to carry out high-precision correction to scanning galvanometer square toes (108), to ensure that the laser processing beam after vibration mirror scanning can accurately scan the accurate location in requisition for silicon through hole.First the certain limit dot matrix of vibration mirror scanning is analyzed, the position of the point finding position to be forbidden, by the compensation of software kit, reach the high accuracy of vibration mirror scanning.
Although vibration mirror scanning has certain scope, but due to the size comparatively large (6 inch, 8 inch or 12 inch etc.) of CSP wafer, once all hole machined on a slice CSP wafer cannot be completed, therefore need artificially to carry out subregion to CSP wafer, Laser Processing is then carried out in ground, a region in a region, just needs movement CSP wafer being carried out respective range.The repetitive positioning accuracy of servo platform 200 is very high, but due to silicon through hole processing required precision high, so corresponding accuracy compensation will be carried out to servo platform 200, to improve the repetitive positioning accuracy of servo platform 200, reach corresponding requirements.In embody rule, by the movement locus of interferometer measurement servo platform 200, to carry out accuracy compensation.
First imaging navigation system 310 and smart imaging navigation system 320 also should position test and the adjustment of precision, to reach the requirement on machining accuracy of silicon through hole.
After good surface sweeping galvanometer square toes assembly 130 to be debugged, servo platform 200, first imaging navigation system 310 and smart imaging navigation system 320, the processing of the laser micropore of CSP wafer can be carried out.
Idiographic flow is as follows:
CSP wafer to be processed is placed on vacuum suction microscope carrier 230, by vacuum suction, CSP wafer is fixed on vacuum suction microscope carrier 230, servo platform 200 drives vacuum suction microscope carrier 230 and CSP wafer to move to just imaging navigation system 310, gauge point on first imaging navigation system 310 pairs of CSP wafers carries out Primary Location, determine the Position Approximate of CSP wafer on vacuum suction microscope carrier 230 and angle, then servo platform 200 drives vacuum suction microscope carrier 230 and CSP wafer to move to below smart imaging navigation system 320, the gauge point of the demarcation of essence imaging navigation system 320 pairs of CSP wafers is accurately located, calculated by software, determine exact position CSP wafer needing carry out Laser Processing silicon through hole.Now, the exact position of CSP wafer is decided, and CSP wafer people, according to the area principle of prior confirmation, is be divided into several little machining areas by software kit, to ensure the high accuracy processing of laser silicon through hole.Industrial PC is accurately located and ready-portioned region according to the gauge point of the demarcation on smart imaging navigation system 320 pairs of CSP wafers, controls processing CSP wafer being carried out to laser silicon through hole that laser silicon through-hole machine is precisely orderly.
In process, consider the stability of laser power, namely a period of time that often works needs the test being carried out laser power stability by laser power meter 260, to ensure the stability of laser power in laser processing procedure.
These are only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement or improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. a laser micropore processing method, it is characterized in that, comprise the following steps, laser micropore process equipment is set, described laser micropore process equipment comprise can lasing laser via machine, for the fixing servo platform of workpiece to be added, the imaging navigation system for positioning described workpiece to be added, the gauge point that at least one positions for supplying described imaging navigation system is set on described workpiece to be added, described workpiece to be added is fixed on described servo platform, then imaging navigation system is made to aim at workpiece to be added, utilize the azimuth information of imaging navigation system identification marking point, then determined exact position workpiece to be added needing to carry out capillary processing by the calculating of industrial PC, then control described laser via machine and carry out laser micropore processing to machined part according to above-mentioned exact position, described imaging navigation system comprises first imaging navigation system for carrying out Primary Location to described workpiece to be added and for carrying out pinpoint smart imaging navigation system to described workpiece to be added, when described workpiece to be added is positioned, first by described servo platform, described workpiece to be added is moved to described just imaging navigation system place, carry out Primary Location by described just imaging navigation system gauge point to machined part and determine that workpiece to be added is in the Position Approximate of described servo platform and angle, and then described workpiece to be added is moved to the below of described smart imaging navigation system, and by described smart imaging navigation system, the gauge point on described workpiece to be added is located accurately, exact position workpiece to be added needing to carry out capillary processing is determined again by the calculating of industrial PC.
2. laser micropore processing method as claimed in claim 1, is characterized in that, before carrying out laser micropore processing to described workpiece to be added, first correct the surface sweeping galvanometer square toes assembly on laser via machine.
3. the laser micropore processing method according to any one of claim 1 to 2, is characterized in that, before carrying out laser micropore processing to described workpiece to be added, first corrects the repetitive positioning accuracy of described servo platform.
4. laser micropore processing method as claimed in claim 1 or 2, is characterized in that, when first imaging navigation system and smart imaging navigation system position described gauge point, by gauge point described in light illuminating.
5. a laser micropore process equipment, it is characterized in that, comprise microscope carrier, can lasing laser via machine, for fixing workpiece to be added and the servo platform of removable described workpiece to be added, imaging navigation system and industrial PC, described laser via machine is arranged on described microscope carrier, described microscope carrier is fixedly installed support, described imaging navigation system is arranged on described support, and described servo platform is arranged on described microscope carrier, and described industrial PC is connected to described imaging navigation system; Described imaging navigation system comprises first imaging navigation system for carrying out Primary Location to described workpiece to be added and for carrying out pinpoint smart imaging navigation system to described workpiece to be added; Imaging navigation system at the beginning of described comprises the first image camera, the first installing plate, the first imaging lens, the first coaxial light source and the first longitudinal direction and regulates platform assembly; Described first longitudinally regulates platform assembly to be connected on described lengthwise position adjusting part, described first installing plate is connected to described first and longitudinally regulates on platform assembly, described first image camera, the first imaging lens are all fixed on described first installing plate, and described first coaxial light source is connected on described first imaging lens; Described smart imaging navigation system comprises the second image camera, the second installing plate, the second imaging lens, the second coaxial light source and the second longitudinal direction and regulates platform assembly; Described second longitudinally regulates platform assembly to be connected on described lengthwise position adjusting part, described second installing plate is connected to described second and longitudinally regulates on platform assembly, described second image camera, the second imaging lens are all fixed on described second installing plate, and described second coaxial light source is connected on described second imaging lens.
6. laser micropore process equipment as claimed in claim 5, it is characterized in that, described laser via machine comprise housing, laser generator, for adjust laser beam spot sizes and Laser beam energy distribution the outer optical path component of built-in shaping, can reflection be carried out to laser and carry out the surface sweeping galvanometer square toes assembly of surface sweeping and the lengthwise position adjusting part of adjustable laser scanning manufacturing focus to machined part; Described laser generator, built-in shaping outer optical path component, surface sweeping galvanometer square toes assembly and lengthwise position adjusting part are all connected to described housing.
7. the laser micropore process equipment as described in claim 5 or 6, it is characterized in that, described servo platform comprises vacuum suction microscope carrier, the first slide rail and the second slide rail, arrange in " ten " font between described first slide rail and the second slide rail, described first slide rail is fixed on described microscope carrier, described second slide rail slides and is arranged on described first slide rail, and described vacuum suction microscope carrier slides and is arranged on described second slide rail.
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