JP2003251551A - Working method for liquid crystal substrate, or the like and its device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chamfering method and its device capable of automatically correcting as well as precisely measuring chambering width by taking in a chamfering part as an image data by using a CCD camera by taking notice of the CCD camera being used when aligning the substrate on a table of a chamfering machine. <P>SOLUTION: This chamfering device is furnished with the CCD camera to take in an image of an alignment mark mentioned on the substrate and a control means to align a position of the substrate in accordance with the image data taken in by the CCD camera on the table to place the substrate and is furnished with a control means to automatically the chamfering width by measuring it by taking in the chamfering width as the image data by the CCD camera. The chamfering method is also provided. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to chamfering of substrates such as liquid crystal substrates and glass substrates, and in particular, it is possible to automatically measure and automatically correct chamfer width by directly utilizing a CCD camera used for aligning the position of the substrate. And a device therefor.

[0002]

2. Description of the Related Art For example, in various substrates such as a liquid crystal substrate and a glass substrate, a C of about 0.1 to 0.4 mm is used to prevent chipping or cracking defects from starting from an edge portion.
Chamfering, R-chamfering is performed, corner edges of a rectangular substrate are ground, and external shaping is performed to adjust the external dimensions of the substrate. That).

Since a liquid crystal substrate or the like is required to have a processing precision of the above chamfering width, conventionally, as shown in FIG. 4 (1), for example, a peripheral portion of the substrate is first chamfered for trial processing and then once processed. Then, this substrate is taken out and the chamfer widths a1 and b1 are measured using a microscope measuring instrument. The difference between the Nerai widths a0 and b0 is calculated based on this measurement data,
Each time, this value was manually input to the NC device of the processing machine, and after adjustment, the product was processed as shown in FIG. 4 (2). However, in such a method, not only it takes time to measure the chamfering width, but also there is a large error because it is a microscopic measurement by visual inspection, and it may be necessary to perform trial machining and readjustment many times. A high degree of skill was required. Further, in order to measure the chamfer width with a microscope, the chamfering width has to be taken out from the chamfering machine once, which is one of the reasons that the machining line cannot be automated. .

[0004]

The present invention focuses on the fact that a CCD camera is used when aligning a substrate on the table of a chamfering machine, and utilizing this CCD camera, the chamfered portion is used as image data. An object of the present invention is to provide a method and apparatus for chamfering a substrate, which can take in and measure a chamfer width with high accuracy and can perform automatic correction.

[0005]

The invention according to claim 1 is
A CCD camera that captures an image of an alignment mark on a substrate when chamfering the substrate, and this CCD
At least the XY directions and the angle θ control means for recognizing the positional deviation of the board from the image data of the camera and correcting the positional deviation are provided in the chamfering apparatus for the board, and the CC
The chamfer width is captured as image data using a D camera, and the chamfer width is measured. Here, having the control means in at least the XY directions means that the control means in the Z direction may be provided as necessary.

According to the second aspect of the present invention, the error adjustment with respect to the machining neli size is automated based on the chamfering width measurement data.

A third aspect of the present invention relates to a substrate chamfering apparatus using the chamfering width adjusting method of the first and second aspects, and a CCD camera for capturing an image of an alignment mark written on the substrate, and a CCD camera. A control means for aligning the position of the substrate based on the image data captured by the CCD camera is provided on the table on which the substrate is placed, and the chamfer width is captured as image data by the CCD camera to measure the chamfer width, The chamfering apparatus is provided with a control means for automatically correcting the chamfer width.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the flow chart shown in FIG. "Flowchart (1)" for inputting predetermined data such as the external dimensions of the liquid crystal substrate to be chamfered, the center distance of the alignment mark from the substrate cutting surface, and the chamfering reference processing dimension to the NC device. Next, the liquid crystal substrate or the like is an NC having a suction means or the like.
"Flowchart (2)" placed on a table with a device. In order to ensure the processing accuracy when chamfering this substrate, first, the substrate 1 must be accurately centered on the table. Therefore, at least two or more alignment marks 2 are written at predetermined positions on the substrate as shown in FIG.
"Flowchart (3)" read by a CD camera. "Flowchart (4)" in which the image data is analyzed to recognize the positional deviation amount. The table on which the substrate is placed is provided with means for adjusting the X-axis direction, the Y-axis direction, and the angle θ using a servomotor or the like, and the position of the substrate is aligned based on the measurement data.

Next, a "flow chart (6)" in which the substrate is subjected to chamfering trial processing. The CCD camera that first took in the alignment mark and used for data analysis moved to this chamfered portion, and took in the image data 3 as shown in FIG. 2 "Flowchart (7)", and the chamfer shown in FIG. 2 (1). "Flowchart (8)" for analyzing and measuring the widths A1 and B1. (Note that the A1 and B1 dimensions are shown larger than they actually are in FIG. 2 for the sake of clarity.) Next, the error from the machining Nerai dimension is recognized, and "Flowchart (9)" is transferred to the NC device, The chamfering width is adjusted and the "flowchart (10)" is performed to chamfer the substrate. As a result, the chamfering process matching the Nerai chamfering widths A0 and B0 shown in FIG. 2B can be performed.

Further, since the chamfered portion is taken in as image data by this CCD camera and chamfering can be performed while automatically adjusting the chamfer width, the feed direction Y of the table and the vertical cutting direction Z of the grindstones arranged vertically are defined. By synchronizing the control, the chamfer widths A2 and B2 that look like a taper when the substrate is viewed from above as shown in FIG.
On the contrary, the taper chamfering can be automatically corrected so as to be parallel.

[0011]

According to the present invention, the chamfer width of the substrate is captured as image data by utilizing the CCD camera for alignment of the substrate, the chamfer width is measured by the analysis, and an error from the Nerai chamfer width is recognized and then the Since the data can be transferred to the NC device, it is possible to build an automated line from measurement to processing.

Further, it becomes possible to centrally manage the measurement data in which the image is processed by the CCD camera and the predetermined dimensions of the substrate which are input in advance, and the work which has been required by the conventional skill can be abolished, and the measurement by the person can be performed. No mistakes are made and the situation where the grinding wheel is accidentally damaged is eliminated.

[Brief description of drawings]

FIG. 1 shows an example of a flowchart of a chamfering processing method according to the present invention.

FIG. 2 shows a schematic view of chamfering.

FIG. 3 shows an example of another chamfering method.

FIG. 4 shows an example of a conventional chamfering method.

[Explanation of symbols]

1 substrate 2 Alignment mark 3 CCD camera imaging section A1, B1 Trial processing chamfer width A0, B0 Chamfer width with error correction A2, B2 Chamfer with tapered shape in plan view

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Claims (3)

[Claims] 1. In a chamfering process of a substrate, a CCD camera that captures an image of an alignment mark written on the substrate and a position shift of the substrate is recognized from image data of the CCD camera, and the position shift amount is corrected in at least XY directions. And the angle θ control means is provided in the chamfering apparatus for the substrate, and the chamfering width is measured as image data by using the CCD camera, and the chamfering width is measured. 2. A method for chamfering a substrate, wherein the processing means is automatically corrected to a processing nely dimension based on the chamfer width measurement data according to claim 1. 3. A CCD camera for capturing an image of an alignment mark on a substrate and a control means for aligning the position of the substrate based on the image data captured by the CCD camera are mounted on a table on which the substrate is placed. A chamfering apparatus for a substrate, which is provided with a control means for capturing the chamfer width as image data by the CCD camera, measuring the chamfer width, and automatically correcting the chamfer width.