JP2009147089A5 - - Google Patents

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Publication number
JP2009147089A5
JP2009147089A5 JP2007322469A JP2007322469A JP2009147089A5 JP 2009147089 A5 JP2009147089 A5 JP 2009147089A5 JP 2007322469 A JP2007322469 A JP 2007322469A JP 2007322469 A JP2007322469 A JP 2007322469A JP 2009147089 A5 JP2009147089 A5 JP 2009147089A5
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JP
Japan
Prior art keywords
electronic component
adhesive tape
mounting
predetermined length
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007322469A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009147089A (ja
JP5435861B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2007322469A external-priority patent/JP5435861B2/ja
Priority to JP2007322469A priority Critical patent/JP5435861B2/ja
Priority to CN2008801185239A priority patent/CN101884098B/zh
Priority to PCT/JP2008/070816 priority patent/WO2009075164A1/ja
Priority to KR1020107015375A priority patent/KR101148322B1/ko
Priority to TW097144848A priority patent/TWI460795B/zh
Publication of JP2009147089A publication Critical patent/JP2009147089A/ja
Publication of JP2009147089A5 publication Critical patent/JP2009147089A5/ja
Publication of JP5435861B2 publication Critical patent/JP5435861B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007322469A 2007-12-13 2007-12-13 電子部品の実装装置及び実装方法 Active JP5435861B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007322469A JP5435861B2 (ja) 2007-12-13 2007-12-13 電子部品の実装装置及び実装方法
CN2008801185239A CN101884098B (zh) 2007-12-13 2008-11-14 电子部件的安装装置和安装方法
PCT/JP2008/070816 WO2009075164A1 (ja) 2007-12-13 2008-11-14 電子部品の実装装置及び実装方法
KR1020107015375A KR101148322B1 (ko) 2007-12-13 2008-11-14 전자 부품 실장 장치 및 실장 방법
TW097144848A TWI460795B (zh) 2007-12-13 2008-11-20 Installation device and installation method of electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007322469A JP5435861B2 (ja) 2007-12-13 2007-12-13 電子部品の実装装置及び実装方法

Publications (3)

Publication Number Publication Date
JP2009147089A JP2009147089A (ja) 2009-07-02
JP2009147089A5 true JP2009147089A5 (enExample) 2012-11-22
JP5435861B2 JP5435861B2 (ja) 2014-03-05

Family

ID=40755407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007322469A Active JP5435861B2 (ja) 2007-12-13 2007-12-13 電子部品の実装装置及び実装方法

Country Status (5)

Country Link
JP (1) JP5435861B2 (enExample)
KR (1) KR101148322B1 (enExample)
CN (1) CN101884098B (enExample)
TW (1) TWI460795B (enExample)
WO (1) WO2009075164A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5572575B2 (ja) * 2010-05-12 2014-08-13 東京エレクトロン株式会社 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体
CN102879395A (zh) * 2011-07-11 2013-01-16 昆山华扬电子有限公司 Pcb板件辅助对位检查装置
US10952360B2 (en) * 2015-09-30 2021-03-16 Yamaha Hatsudoki Kabushiki Kaisha Component mounter and component holder imaging method
JP6767333B2 (ja) * 2017-09-28 2020-10-14 芝浦メカトロニクス株式会社 電子部品の実装装置
KR102748338B1 (ko) 2020-03-27 2025-01-02 삼성디스플레이 주식회사 본딩 장치 및 그것을 이용한 표시 장치의 제조 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3939159B2 (ja) * 2002-02-05 2007-07-04 芝浦メカトロニクス株式会社 テープ部材の貼着状態検査装置およびそれを用いたテープ部材貼着装置
JP2004021051A (ja) * 2002-06-19 2004-01-22 Takatori Corp フレキシブル基板を液晶パネルに圧着する方法及び装置
JP4538843B2 (ja) * 2004-03-05 2010-09-08 澁谷工業株式会社 ダイボンド用粘着テープの貼付方法
JP2006058411A (ja) * 2004-08-18 2006-03-02 Takatori Corp 液晶パネルへの偏光板貼り付け方法及び装置
KR100591074B1 (ko) * 2004-12-13 2006-06-19 (주) 선양디엔티 칩 온 필름용 이방성 도전물 부착 시스템
JP4591140B2 (ja) * 2005-03-16 2010-12-01 パナソニック株式会社 表示パネルの組立装置および組立方法
JP4708896B2 (ja) * 2005-07-20 2011-06-22 芝浦メカトロニクス株式会社 粘着性テープの貼着装置及び貼着方法

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