WO2009041003A1 - 検査装置及び検査方法 - Google Patents

検査装置及び検査方法 Download PDF

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Publication number
WO2009041003A1
WO2009041003A1 PCT/JP2008/002570 JP2008002570W WO2009041003A1 WO 2009041003 A1 WO2009041003 A1 WO 2009041003A1 JP 2008002570 W JP2008002570 W JP 2008002570W WO 2009041003 A1 WO2009041003 A1 WO 2009041003A1
Authority
WO
WIPO (PCT)
Prior art keywords
panel
component
recognition mark
inspecting
rear side
Prior art date
Application number
PCT/JP2008/002570
Other languages
English (en)
French (fr)
Inventor
Ryuji Hamada
Akira Kameda
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to JP2009534163A priority Critical patent/JP4659908B2/ja
Priority to US12/679,955 priority patent/US8405715B2/en
Publication of WO2009041003A1 publication Critical patent/WO2009041003A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

ＡＣＦを介してパネルに実装された部品のずれ量を検出することが可能な検査装置及び検査方法を提供する。ＡＣＦを介してパネル表面に実装された部品の所定の実装位置からのずれ量を検出する検査装置であって、部品が実装されないパネルの裏面側に配設され、パネル表面に形成されたパネル認識マークに可視光を照射する可視光照明（３０４）と、部品が実装されないパネルの裏面側から該パネル認識マークを撮像する可視カメラ（３０６）と、パネルと接合しない部品の裏面側に配設され、部品表面に形成された部品認識マークに赤外光を照射する赤外光照明（３０５）と、パネルと接合しない部品の裏面側から該部品認識マークを撮像する赤外線カメラ（３０７）と、前記可視カメラ（３０６）及び赤外線カメラ（３０７）の撮像結果から、前記パネル認識マークと前記部品認識マークの所定の位置関係に対するずれ量を算出するずれ量算出部と、を備える。
PCT/JP2008/002570 2007-09-28 2008-09-18 検査装置及び検査方法 WO2009041003A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009534163A JP4659908B2 (ja) 2007-09-28 2008-09-18 検査装置及び検査方法
US12/679,955 US8405715B2 (en) 2007-09-28 2008-09-18 Inspection apparatus and inspection method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007255363 2007-09-28
JP2007-255363 2007-09-28

Publications (1)

Publication Number Publication Date
WO2009041003A1 true WO2009041003A1 (ja) 2009-04-02

Family

ID=40510911

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002570 WO2009041003A1 (ja) 2007-09-28 2008-09-18 検査装置及び検査方法

Country Status (4)

Country Link
US (1) US8405715B2 (ja)
JP (1) JP4659908B2 (ja)
TW (1) TW200921088A (ja)
WO (1) WO2009041003A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011102873A (ja) * 2009-11-10 2011-05-26 Hitachi High-Technologies Corp アライメントマーク管理装置、アライメントマーク管理システム及びプログラム
WO2015022850A1 (ja) * 2013-08-12 2015-02-19 住友化学株式会社 光学部材貼合体の製造装置
JP2016201427A (ja) * 2015-04-09 2016-12-01 パナソニックＩｐマネジメント株式会社 部品実装装置及び部品実装方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5786261B2 (ja) * 2011-04-26 2015-09-30 Ｊｕｋｉオートメーションシステムズ株式会社 実装システム、電子部品の実装方法、基板の製造方法及びプログラム
US9190100B2 (en) * 2012-04-25 2015-11-17 Seagate Technology Determining at least one of alignment and bond line thickness between an optical component and a mounting surface
JP2019066750A (ja) * 2017-10-04 2019-04-25 株式会社ジャパンディスプレイ 表示装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07273497A (ja) * 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd 電子部品実装方法及び装置
JP2000276233A (ja) * 1999-03-24 2000-10-06 Moritex Corp 位置ずれ検出装置及びそれを用いた位置決め装置
JP2004031868A (ja) * 2002-06-28 2004-01-29 Toray Eng Co Ltd 実装方法および実装装置
JP2004146785A (ja) * 2002-08-30 2004-05-20 Murata Mfg Co Ltd 部品装着方法および部品装着装置
JP2004309422A (ja) * 2003-04-10 2004-11-04 Fuji Mach Mfg Co Ltd 撮像装置
JP2006040978A (ja) * 2004-07-22 2006-02-09 Fuji Mach Mfg Co Ltd 電子部品実装方法および装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5854745A (en) * 1994-03-30 1998-12-29 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic component
US5590456A (en) * 1994-12-07 1997-01-07 Lucent Technologies Inc. Apparatus for precise alignment and placement of optoelectric components
US6085407A (en) * 1997-08-21 2000-07-11 Micron Technology, Inc. Component alignment apparatuses and methods
JP4167790B2 (ja) * 2000-03-10 2008-10-22 東レエンジニアリング株式会社 チップ実装装置
JP4651886B2 (ja) * 2001-09-14 2011-03-16 東北パイオニア株式会社 電子機器及び電子機器の製造方法
KR101065899B1 (ko) * 2002-04-04 2011-09-19 토레이 엔지니어링 컴퍼니, 리미티드 얼라이먼트 방법 및 그 방법을 이용한 실장 방법
JP4495250B2 (ja) * 2007-09-28 2010-06-30 パナソニック株式会社 検査装置及び検査方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07273497A (ja) * 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd 電子部品実装方法及び装置
JP2000276233A (ja) * 1999-03-24 2000-10-06 Moritex Corp 位置ずれ検出装置及びそれを用いた位置決め装置
JP2004031868A (ja) * 2002-06-28 2004-01-29 Toray Eng Co Ltd 実装方法および実装装置
JP2004146785A (ja) * 2002-08-30 2004-05-20 Murata Mfg Co Ltd 部品装着方法および部品装着装置
JP2004309422A (ja) * 2003-04-10 2004-11-04 Fuji Mach Mfg Co Ltd 撮像装置
JP2006040978A (ja) * 2004-07-22 2006-02-09 Fuji Mach Mfg Co Ltd 電子部品実装方法および装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011102873A (ja) * 2009-11-10 2011-05-26 Hitachi High-Technologies Corp アライメントマーク管理装置、アライメントマーク管理システム及びプログラム
WO2015022850A1 (ja) * 2013-08-12 2015-02-19 住友化学株式会社 光学部材貼合体の製造装置
JP2016201427A (ja) * 2015-04-09 2016-12-01 パナソニックＩｐマネジメント株式会社 部品実装装置及び部品実装方法

Also Published As

Publication number Publication date
JP4659908B2 (ja) 2011-03-30
JPWO2009041003A1 (ja) 2011-01-13
TW200921088A (en) 2009-05-16
US8405715B2 (en) 2013-03-26
US20100201805A1 (en) 2010-08-12

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