FR2914422B1 - Procede de detection de defauts de surface d'un substrat et dispositif mettant en oeuvre ledit procede. - Google Patents

Procede de detection de defauts de surface d'un substrat et dispositif mettant en oeuvre ledit procede.

Info

Publication number
FR2914422B1
FR2914422B1 FR0754088A FR0754088A FR2914422B1 FR 2914422 B1 FR2914422 B1 FR 2914422B1 FR 0754088 A FR0754088 A FR 0754088A FR 0754088 A FR0754088 A FR 0754088A FR 2914422 B1 FR2914422 B1 FR 2914422B1
Authority
FR
France
Prior art keywords
substrate
same
surface defects
detecting surface
detecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0754088A
Other languages
English (en)
Other versions
FR2914422A1 (fr
Inventor
Cecile Moulin
Sophie Moritz
Philippe Gastaldo
Francois Berger
Jean Luc Delcari
Patrice Belin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unity Semiconductor SAS
Original Assignee
Soitec SA
Altatech Semiconductor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38645726&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FR2914422(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Soitec SA, Altatech Semiconductor filed Critical Soitec SA
Priority to FR0754088A priority Critical patent/FR2914422B1/fr
Priority to CN2008800173982A priority patent/CN101711354B/zh
Priority to US12/057,367 priority patent/US7812942B2/en
Priority to KR1020097019902A priority patent/KR101408597B1/ko
Priority to PCT/EP2008/053663 priority patent/WO2008116917A1/fr
Priority to EP08735530.1A priority patent/EP2140252B1/fr
Priority to JP2010500278A priority patent/JP2010522872A/ja
Publication of FR2914422A1 publication Critical patent/FR2914422A1/fr
Publication of FR2914422B1 publication Critical patent/FR2914422B1/fr
Application granted granted Critical
Priority to JP2014159099A priority patent/JP5760129B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2518—Projection by scanning of the object
    • G01B11/2527—Projection by scanning of the object with phase change by in-plane movement of the patern
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8829—Shadow projection or structured background, e.g. for deflectometry
FR0754088A 2007-03-28 2007-03-28 Procede de detection de defauts de surface d'un substrat et dispositif mettant en oeuvre ledit procede. Expired - Fee Related FR2914422B1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FR0754088A FR2914422B1 (fr) 2007-03-28 2007-03-28 Procede de detection de defauts de surface d'un substrat et dispositif mettant en oeuvre ledit procede.
PCT/EP2008/053663 WO2008116917A1 (fr) 2007-03-28 2008-03-27 Procédé de détection de défauts de surface sur un substrat et dispositif utilisant ledit procédé
US12/057,367 US7812942B2 (en) 2007-03-28 2008-03-27 Method for detecting surface defects on a substrate and device using said method
KR1020097019902A KR101408597B1 (ko) 2007-03-28 2008-03-27 기판상의 표면결점 검출방법 및 그 방법을 사용하는 표면결점 검출장치
CN2008800173982A CN101711354B (zh) 2007-03-28 2008-03-27 检测衬底上表面缺陷的方法以及使用该方法的设备
EP08735530.1A EP2140252B1 (fr) 2007-03-28 2008-03-27 Procédé de détection de défauts de surface sur un substrat et dispositif utilisant ledit procédé
JP2010500278A JP2010522872A (ja) 2007-03-28 2008-03-27 基板表面の欠陥検査方法及び装置
JP2014159099A JP5760129B2 (ja) 2007-03-28 2014-08-04 基板表面の欠陥検査方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0754088A FR2914422B1 (fr) 2007-03-28 2007-03-28 Procede de detection de defauts de surface d'un substrat et dispositif mettant en oeuvre ledit procede.

Publications (2)

Publication Number Publication Date
FR2914422A1 FR2914422A1 (fr) 2008-10-03
FR2914422B1 true FR2914422B1 (fr) 2009-07-03

Family

ID=38645726

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0754088A Expired - Fee Related FR2914422B1 (fr) 2007-03-28 2007-03-28 Procede de detection de defauts de surface d'un substrat et dispositif mettant en oeuvre ledit procede.

Country Status (7)

Country Link
US (1) US7812942B2 (fr)
EP (1) EP2140252B1 (fr)
JP (2) JP2010522872A (fr)
KR (1) KR101408597B1 (fr)
CN (1) CN101711354B (fr)
FR (1) FR2914422B1 (fr)
WO (1) WO2008116917A1 (fr)

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FR2914422B1 (fr) 2007-03-28 2009-07-03 Soitec Silicon On Insulator Procede de detection de defauts de surface d'un substrat et dispositif mettant en oeuvre ledit procede.
CN102667544B (zh) 2009-07-17 2015-09-02 惠普开发有限公司 具有聚焦能力的非周期性光栅反射镜及其制作方法
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FR2981197B1 (fr) * 2011-10-07 2013-11-01 Altatech Semiconductor Dispositif et procede pour l'inspection de produits semi-conducteurs.
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JP6699365B2 (ja) * 2016-06-02 2020-05-27 コニカミノルタ株式会社 結像光学素子の評価方法および結像光学素子の評価装置
KR102065012B1 (ko) * 2016-07-26 2020-01-10 에이피시스템 주식회사 레이저 처리장치 및 레이저 처리방법
JP2018112470A (ja) * 2017-01-11 2018-07-19 リコーエレメックス株式会社 検査システムおよび検査方法
JP2018112471A (ja) * 2017-01-11 2018-07-19 リコーエレメックス株式会社 検査システムおよび検査方法
CN109839388A (zh) * 2017-11-29 2019-06-04 中微半导体设备(上海)股份有限公司 等离子运行状态实时监控方法、晶圆监测件和监控系统
CN108036736B (zh) * 2017-12-06 2020-03-13 长江存储科技有限责任公司 沟槽弯曲度测量方法及装置、缺陷数量预测方法及装置
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JP2019105458A (ja) * 2017-12-08 2019-06-27 株式会社日立ハイテクファインシステムズ 欠陥検査装置及び欠陥検査方法
CN108181320A (zh) * 2017-12-22 2018-06-19 广州锋立技术服务有限公司 工件表面缺陷识别、检测的方法、装置与系统
CN108151674B (zh) * 2017-12-27 2020-11-27 大连鉴影光学科技有限公司 一种提高光学检测仪器精度的方法与装置
CN110274907B (zh) * 2018-03-15 2021-10-15 广西师范大学 基于扇形条纹的镜平面缺陷检测系统及方法
CN110646376A (zh) * 2019-04-22 2020-01-03 天津大学 一种基于条纹偏折的透镜缺陷检测方法
US11543363B2 (en) * 2019-05-24 2023-01-03 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for wafer bond monitoring
CN110057835A (zh) * 2019-05-29 2019-07-26 深圳中科飞测科技有限公司 一种检测装置及检测方法
CN110517970B (zh) 2019-08-29 2022-10-21 上海华力集成电路制造有限公司 晶背缺陷的检测方法
KR102280538B1 (ko) * 2019-11-18 2021-07-22 한양대학교 산학협력단 연계형 현미경의 동일 위치 추적을 위한 시스템 및 그의 동작 방법
KR102306848B1 (ko) * 2019-12-27 2021-09-29 (주) 인텍플러스 배터리 외관 검사장치
CN111288929B (zh) * 2020-03-16 2021-08-17 苏州依诺维视智能科技有限公司 大曲率表面工件的三维高精度视觉测量方法
CN113188485B (zh) * 2021-05-06 2022-06-21 苏州天准科技股份有限公司 一种多工位智能表面waviness量检测系统
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Also Published As

Publication number Publication date
CN101711354A (zh) 2010-05-19
JP2010522872A (ja) 2010-07-08
EP2140252A1 (fr) 2010-01-06
WO2008116917A8 (fr) 2009-01-22
US20090051930A1 (en) 2009-02-26
FR2914422A1 (fr) 2008-10-03
CN101711354B (zh) 2012-05-09
JP5760129B2 (ja) 2015-08-05
EP2140252B1 (fr) 2018-11-21
KR20100014555A (ko) 2010-02-10
US7812942B2 (en) 2010-10-12
KR101408597B1 (ko) 2014-06-17
JP2015028482A (ja) 2015-02-12
WO2008116917A1 (fr) 2008-10-02

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