JP2009142864A - レーザ加工装置、レーザ加工装置の設定方法及びレーザ加工装置の設定プログラム並びにコンピュータで読取可能な記録媒体 - Google Patents

レーザ加工装置、レーザ加工装置の設定方法及びレーザ加工装置の設定プログラム並びにコンピュータで読取可能な記録媒体 Download PDF

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Publication number
JP2009142864A
JP2009142864A JP2007323685A JP2007323685A JP2009142864A JP 2009142864 A JP2009142864 A JP 2009142864A JP 2007323685 A JP2007323685 A JP 2007323685A JP 2007323685 A JP2007323685 A JP 2007323685A JP 2009142864 A JP2009142864 A JP 2009142864A
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Prior art keywords
temperature
laser
wavelength conversion
conversion element
processing apparatus
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Pending
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JP2007323685A
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English (en)
Japanese (ja)
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JP2009142864A5 (https=
Inventor
Hideyuki Suzuki
秀行 鈴木
Takaaki Ito
貴章 伊藤
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Keyence Corp
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Keyence Corp
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Priority to JP2007323685A priority Critical patent/JP2009142864A/ja
Priority to US12/270,152 priority patent/US7778292B2/en
Publication of JP2009142864A publication Critical patent/JP2009142864A/ja
Publication of JP2009142864A5 publication Critical patent/JP2009142864A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/106—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity
    • H01S3/108—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity using non-linear optical devices, e.g. exhibiting Brillouin or Raman scattering
    • H01S3/109—Frequency multiplication, e.g. harmonic generation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0401—Arrangements for thermal management of optical elements being part of laser resonator, e.g. windows, mirrors, lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/094049—Guiding of the pump light
    • H01S3/094053—Fibre coupled pump, e.g. delivering pump light using a fibre or a fibre bundle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
    • H01S3/09415—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode the pumping beam being parallel to the lasing mode of the pumped medium, e.g. end-pumping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/11—Mode locking; Q-switching; Other giant-pulse techniques, e.g. cavity dumping
    • H01S3/1123—Q-switching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
    • H01S3/1305—Feedback control systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
    • H01S3/131—Stabilisation of laser output parameters, e.g. frequency or amplitude by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
    • H01S3/1317—Stabilisation of laser output parameters, e.g. frequency or amplitude by controlling the active medium, e.g. by controlling the processes or apparatus for excitation by controlling the temperature

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Nonlinear Science (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
JP2007323685A 2007-12-14 2007-12-14 レーザ加工装置、レーザ加工装置の設定方法及びレーザ加工装置の設定プログラム並びにコンピュータで読取可能な記録媒体 Pending JP2009142864A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007323685A JP2009142864A (ja) 2007-12-14 2007-12-14 レーザ加工装置、レーザ加工装置の設定方法及びレーザ加工装置の設定プログラム並びにコンピュータで読取可能な記録媒体
US12/270,152 US7778292B2 (en) 2007-12-14 2008-11-13 Laser processing apparatus, method for making settings for the laser processing apparatus, program for making settings for the laser processing apparatus, and computer-readable recording medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007323685A JP2009142864A (ja) 2007-12-14 2007-12-14 レーザ加工装置、レーザ加工装置の設定方法及びレーザ加工装置の設定プログラム並びにコンピュータで読取可能な記録媒体

Publications (2)

Publication Number Publication Date
JP2009142864A true JP2009142864A (ja) 2009-07-02
JP2009142864A5 JP2009142864A5 (https=) 2011-01-06

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Country Status (2)

Country Link
US (1) US7778292B2 (https=)
JP (1) JP2009142864A (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013065753A (ja) * 2011-09-20 2013-04-11 Shimadzu Corp 固体レーザ装置
JP2013065750A (ja) * 2011-09-20 2013-04-11 Shimadzu Corp 固体パルスレーザ装置
JP2013074155A (ja) * 2011-09-28 2013-04-22 Mitsutoyo Corp 光出力信号の安定化判定方法、及びレーザ周波数安定化装置
JP2019106511A (ja) * 2017-12-14 2019-06-27 株式会社キーエンス レーザ加工装置及びレーザ発振器
JP2019106512A (ja) * 2017-12-14 2019-06-27 株式会社キーエンス レーザ加工装置及びレーザ発振器
JP2019104046A (ja) * 2017-12-14 2019-06-27 株式会社キーエンス レーザ加工装置及びレーザ加工方法
JP2019106513A (ja) * 2017-12-14 2019-06-27 株式会社キーエンス レーザ加工装置
JP6912025B1 (ja) * 2020-08-26 2021-07-28 三菱電機株式会社 波長変換装置、レーザ発振器及びレーザ加工装置
WO2023105722A1 (ja) * 2021-12-09 2023-06-15 日本電信電話株式会社 波長変換装置

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JPWO2008114492A1 (ja) * 2007-03-19 2010-07-01 パナソニック株式会社 光出力制御装置及びその制御方法
US8050302B2 (en) * 2007-12-07 2011-11-01 Panasonic Corporation Wavelength conversion laser light source, laser light source device and two-dimensional image display device adopting the same, and method of setting temperature of wavelength conversion element
DE102010032800A1 (de) * 2010-07-30 2012-02-02 Isedo Ag Verfahren und Vorrichtung zum Kalibrieren einer Laserbearbeitungsmaschine
JP2013045054A (ja) * 2011-08-26 2013-03-04 Ushio Inc レーザ光源装置、及び、レーザ光源装置における波長変換素子の温度制御方法
US9019499B2 (en) * 2011-09-30 2015-04-28 Corning Incorporated Tunable light source system and method having wavelength reference capability
RU2529053C1 (ru) * 2013-03-07 2014-09-27 Закрытое акционерное общество "Полупроводниковые приборы" Драйвер полупроводникового лазера
US9048616B1 (en) * 2013-11-21 2015-06-02 Christie Digital Systems Usa, Inc. Method, system and apparatus for automatically determining operating conditions of a periodically poled lithium niobate crystal in a laser system
US20170014945A1 (en) * 2015-07-17 2017-01-19 Laserax Inc. Methods and systems for laser marking an identifier on an industrial product
WO2017060967A1 (ja) * 2015-10-06 2017-04-13 株式会社島津製作所 波長変換装置
US20170242424A1 (en) * 2016-02-19 2017-08-24 General Electric Company Laser power monitoring in additive manufacturing
JP6840581B2 (ja) * 2017-03-15 2021-03-10 株式会社東芝 積層造形装置、処理装置、及び積層造形方法
JP6616368B2 (ja) * 2017-09-14 2019-12-04 ファナック株式会社 レーザ加工前に光学系の汚染レベルに応じて加工条件を補正するレーザ加工装置
TWI763995B (zh) * 2019-05-16 2022-05-11 承賢科技股份有限公司 高功率多波長可見光之拉曼雷射
CN115377777B (zh) * 2021-05-20 2025-10-21 上海名古屋精密工具股份有限公司 激光器控温方法和机加工设备
CN114226957B (zh) * 2021-11-29 2023-05-12 北京信息科技大学 一种基于多色激光测距的激光骨头精密加工方法及装置
CN115502568B (zh) * 2022-11-21 2023-08-01 深圳市创想三维科技股份有限公司 激光器的工作方法、装置、计算机存储介质及电子设备
CN116787009B (zh) * 2023-01-04 2026-04-14 安庆师范大学 一种激光焊接机器人

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JPH1020351A (ja) * 1996-07-01 1998-01-23 Sony Corp レーザ光源装置および当該装置の制御方法
JP2001042371A (ja) * 1999-07-27 2001-02-16 Ushio Sogo Gijutsu Kenkyusho:Kk 加工用レーザ装置
JP2002158383A (ja) * 2000-11-17 2002-05-31 Fuji Photo Film Co Ltd レーザ光源の適正駆動温度を決定するための方法および装置

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013065753A (ja) * 2011-09-20 2013-04-11 Shimadzu Corp 固体レーザ装置
JP2013065750A (ja) * 2011-09-20 2013-04-11 Shimadzu Corp 固体パルスレーザ装置
JP2013074155A (ja) * 2011-09-28 2013-04-22 Mitsutoyo Corp 光出力信号の安定化判定方法、及びレーザ周波数安定化装置
JP7169062B2 (ja) 2017-12-14 2022-11-10 株式会社キーエンス レーザ加工装置及びレーザ発振器
JP2019106512A (ja) * 2017-12-14 2019-06-27 株式会社キーエンス レーザ加工装置及びレーザ発振器
JP2019104046A (ja) * 2017-12-14 2019-06-27 株式会社キーエンス レーザ加工装置及びレーザ加工方法
JP2019106513A (ja) * 2017-12-14 2019-06-27 株式会社キーエンス レーザ加工装置
CN109967884A (zh) * 2017-12-14 2019-07-05 株式会社基恩士 激光加工装置和激光加工方法
CN109967884B (zh) * 2017-12-14 2022-06-14 株式会社基恩士 激光加工装置和激光加工方法
JP7169063B2 (ja) 2017-12-14 2022-11-10 株式会社キーエンス レーザ加工装置及びレーザ発振器
JP2019106511A (ja) * 2017-12-14 2019-06-27 株式会社キーエンス レーザ加工装置及びレーザ発振器
JP6912025B1 (ja) * 2020-08-26 2021-07-28 三菱電機株式会社 波長変換装置、レーザ発振器及びレーザ加工装置
WO2022044144A1 (ja) * 2020-08-26 2022-03-03 三菱電機株式会社 波長変換装置、レーザ発振器及びレーザ加工装置
WO2023105722A1 (ja) * 2021-12-09 2023-06-15 日本電信電話株式会社 波長変換装置
JPWO2023105722A1 (https=) * 2021-12-09 2023-06-15
JP7758968B2 (ja) 2021-12-09 2025-10-23 Ｎｔｔ株式会社 波長変換装置

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