JP2009137740A - 天井バッファとその移設方法 - Google Patents
天井バッファとその移設方法 Download PDFInfo
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- JP2009137740A JP2009137740A JP2007318332A JP2007318332A JP2009137740A JP 2009137740 A JP2009137740 A JP 2009137740A JP 2007318332 A JP2007318332 A JP 2007318332A JP 2007318332 A JP2007318332 A JP 2007318332A JP 2009137740 A JP2009137740 A JP 2009137740A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- Condensed Matter Physics & Semiconductors (AREA)
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- Warehouses Or Storage Devices (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Carriers, Traveling Bodies, And Overhead Traveling Cranes (AREA)
Abstract
【解決手段】天井バッファを、鉛直方向に延びる支持部材により、天井走行車との間で物品を受け渡し自在な棚を支持する。前記支持部材は、天井に取り付けられかつ下部に水平方向に沿った開口を有する第1のレースウェイを支持する第1の支持部材と、該レースウェイに水平方向にスライド自在に取り付けられ、かつ前記棚を支持する第2の支持部材、とからなる。第1の支持部材を天井に固定し、該第1の支持部材に、下部に水平方向に沿った開口を有する第1のレースウェイを取り付け、該レースウェイに第2の支持部材を取り付け、該第2の支持部材に棚を取り付けることにより、天井バッファを設置し、かつ、前記第2の支持部材を前記レースウェイに沿って水平方向にスライドさせることにより、天井バッファを移設する。
【選択図】図1
Description
前記支持部材は、天井に取り付けられかつ下部に水平方向に沿った開口を有する第1のレースウェイを支持する第1の支持部材と、該レースウェイに水平方向にスライド自在に取り付けられ、かつ前記棚を支持する第2の支持部材、とからなることを特徴とする。
第1の支持部材を天井に固定し、
該第1の支持部材に、下部に水平方向に沿った開口を有する第1のレースウェイを取り付け、
該レースウェイに第2の支持部材を取り付け、
該第2の支持部材に棚を取り付けることにより、天井バッファを設置し、かつ
前記第2の支持部材を前記レースウェイに沿って水平方向にスライドさせることにより、天井バッファを移設する。
より好ましくは、前記第2の支持部材は、棚の両端の支持部材と棚の中央部の支持部材とからなり、
棚の中央部の支持部材は、前記第1のレースウェイ及び第2のレースウェイに沿って水平方向にスライド自在で、
L字状をなす2片と、該2片を連結する連結部とを備えた取付部材を、前記第1のレースウェイの開口に沿って第2の支持部材の前後双方に配置し、前記L字状の2片の1片をレースウェイに、他片を第2の支持部材に取り付ける。
さらにL字状の取付部材の1片を第2の支持部材に、他片を第1のレースウェイに取り付け、L字の2片の連結すると、第1のレースウェイに第2の支持部材を強固に取り付けることができる。このため第2の支持部材を互いに結合するビームが不要になる。そして棚の中央部を支持する第2の支持部材を、第1及び第2のレースウェイに沿ってスライドさせると、棚上での載置部材の配置を容易に変えることができる。
(1) 天井4への吊りボルト6の取付ピッチにより、バッファユニット10の設置位置や長さなどが制限されない。
(2) バッファユニット10を上部レースウェイ8に沿ってスライドさせることにより、簡単に移動させることができる。
(3) 中央の下部支持部材12bを移動させることにより、シート18a〜18dの配置を変えることができる。
(4) 下部支持部材12は取付部材14により互いに連結され、かつ強固に上部レースウェイ8に取り付けられる。
4 天井
6 吊りボルト
8 上部レースウェイ
10 バッファユニット
12 下部支持部材
14 取付部材
15 補強板
16 下部レースウェイ
18 シート
20 レール
22 吊りボルト
24 天井走行車
26 FOUP
27 θドライブ
28 ホイスト
29 チャック
30 ラテラルドライブ
31 落下防止カバー
32 開口
34 ナット
36,37 プレート
38,39 開口
40,41 ボルト
42 ナットプレート
45 ブレス
50 ボルト
g1,g2 ギャップ
Claims (4)
- 鉛直方向に延びる支持部材により、天井走行車との間で物品を受け渡し自在な棚を支持する天井バッファであって、
前記支持部材は、天井に取り付けられかつ下部に水平方向に沿った開口を有する第1のレースウェイを支持する第1の支持部材と、該レースウェイに水平方向にスライド自在に取り付けられ、かつ前記棚を支持する第2の支持部材、とからなることを特徴とする、天井バッファ。 - 前記棚は、第2の支持部材に取り付けられ、かつ水平方向に沿った開口を有する第2のレースウェイと、該第2のレースウェイにより水平方向にスライド自在に支持された物品の載置部材とからなることを特徴とする、請求項1の天井バッファ。
- 前記第2の支持部材は、棚の両端の支持部材と棚の中央部の支持部材とからなり、
棚の中央部の支持部材は、前記第1のレースウェイ及び第2のレースウェイに沿って水平方向にスライド自在で、
L字状をなす2片と、該2片を連結する連結部とを備えた取付部材を、前記第1のレースウェイの開口に沿って第2の支持部材の前後双方に配置し、前記L字状の2片の1片をレースウェイに、他片を第2の支持部材に取り付けたことを特徴とする、請求項2の天井バッファ。 - 鉛直方向に延びる支持部材により、天井走行車との間で物品を受け渡し自在な棚を支持した、天井バッファを移設する方法であって、
第1の支持部材を天井に固定し、
該第1の支持部材に、下部に水平方向に沿った開口を有する第1のレースウェイを取り付け、
該レースウェイに第2の支持部材を取り付け、
該第2の支持部材に棚を取り付けることにより、天井バッファを設置し、かつ
前記第2の支持部材を前記レースウェイに沿って水平方向にスライドさせることにより、天井バッファを移設することを特徴とする、天井バッファの移設方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007318332A JP5163866B2 (ja) | 2007-12-10 | 2007-12-10 | 天井バッファとその移設方法 |
TW97139751A TWI414468B (zh) | 2007-12-10 | 2008-10-16 | Roof buffer and its transfer method |
EP08020463A EP2071617A3 (en) | 2007-12-10 | 2008-11-25 | Overhead buffer and transfer method of the same |
KR1020080120961A KR101236361B1 (ko) | 2007-12-10 | 2008-12-02 | 천정 버퍼 |
CN 200810185722 CN101456487B (zh) | 2007-12-10 | 2008-12-08 | 悬挂式暂存货架及其移设方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007318332A JP5163866B2 (ja) | 2007-12-10 | 2007-12-10 | 天井バッファとその移設方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009137740A true JP2009137740A (ja) | 2009-06-25 |
JP5163866B2 JP5163866B2 (ja) | 2013-03-13 |
Family
ID=40343562
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007318332A Expired - Fee Related JP5163866B2 (ja) | 2007-12-10 | 2007-12-10 | 天井バッファとその移設方法 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2071617A3 (ja) |
JP (1) | JP5163866B2 (ja) |
KR (1) | KR101236361B1 (ja) |
CN (1) | CN101456487B (ja) |
TW (1) | TWI414468B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018211898A1 (ja) * | 2017-05-19 | 2018-11-22 | 村田機械株式会社 | 保管システム |
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TWI488251B (zh) | 2012-10-19 | 2015-06-11 | Inotera Memories Inc | 軌道緩衝裝置及晶圓傳輸系統 |
KR102490590B1 (ko) * | 2016-06-29 | 2023-01-20 | 세메스 주식회사 | 캐리어 이송 장치 |
KR102512046B1 (ko) * | 2016-06-29 | 2023-03-20 | 세메스 주식회사 | 캐리어 이송 장치 |
CN105931448B (zh) * | 2016-07-06 | 2019-07-12 | 北京爱德王智能科技有限公司 | 一种单通道多向传送系统 |
KR102020234B1 (ko) * | 2017-09-08 | 2019-09-11 | 세메스 주식회사 | 레이스웨이 유닛 및 이를 갖는 oht |
KR102080877B1 (ko) * | 2018-05-28 | 2020-02-24 | 세메스 주식회사 | 레이스웨이 유닛 및 이를 갖는 oht |
KR102114413B1 (ko) * | 2018-07-25 | 2020-05-22 | 세메스 주식회사 | 천장 주행 시스템 |
EP3915901A4 (en) * | 2019-01-25 | 2022-09-28 | Murata Machinery, Ltd. | STORAGE SYSTEM |
CN109720765A (zh) * | 2019-01-26 | 2019-05-07 | 西安威仁自动化科技有限公司 | 一种自动存取物料装置 |
KR102541299B1 (ko) * | 2020-09-23 | 2023-06-12 | 세메스 주식회사 | 물품 반송 시스템 |
KR102361173B1 (ko) | 2021-01-22 | 2022-02-14 | 주식회사 에이치씨씨 | 반도체 제조에 사용되는 풉 저장장치 |
KR102360920B1 (ko) | 2021-02-22 | 2022-02-14 | 주식회사 에이치씨씨 | 반도체 생산라인에서 사용되는 풉 저장 장치 |
CN114582772B (zh) * | 2022-04-28 | 2022-08-02 | 长鑫存储技术有限公司 | 悬吊式暂存装置、水平调节系统、水平调节方法 |
Citations (6)
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JPH04367621A (ja) * | 1991-06-15 | 1992-12-18 | Matsushita Electric Works Ltd | 台所のハンギング装置 |
JPH08288355A (ja) * | 1995-04-12 | 1996-11-01 | Nikon Corp | 基板搬送装置 |
JP3067682B2 (ja) * | 1997-03-13 | 2000-07-17 | 村田機械株式会社 | 天井走行車システム |
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TW200732234A (en) * | 2005-11-04 | 2007-09-01 | Daifuku Kk | Conversion equipment |
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KR100400788B1 (ko) * | 1995-08-22 | 2004-04-14 | 가부시키가이샤 다이후쿠 | 이동선반설비 |
JP2001031368A (ja) * | 1999-07-22 | 2001-02-06 | Murata Mach Ltd | 搬送車システム |
JP2001284433A (ja) * | 2000-01-28 | 2001-10-12 | Sony Corp | 基板移載装置及び基板移載方法 |
TWI246501B (en) * | 2003-02-03 | 2006-01-01 | Murata Machinery Ltd | Overhead traveling carriage system |
US7168553B2 (en) * | 2003-11-13 | 2007-01-30 | Applied Materials, Inc. | Dynamically balanced substrate carrier handler |
-
2007
- 2007-12-10 JP JP2007318332A patent/JP5163866B2/ja not_active Expired - Fee Related
-
2008
- 2008-10-16 TW TW97139751A patent/TWI414468B/zh not_active IP Right Cessation
- 2008-11-25 EP EP08020463A patent/EP2071617A3/en not_active Withdrawn
- 2008-12-02 KR KR1020080120961A patent/KR101236361B1/ko active IP Right Grant
- 2008-12-08 CN CN 200810185722 patent/CN101456487B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04367621A (ja) * | 1991-06-15 | 1992-12-18 | Matsushita Electric Works Ltd | 台所のハンギング装置 |
JPH08288355A (ja) * | 1995-04-12 | 1996-11-01 | Nikon Corp | 基板搬送装置 |
JP3067682B2 (ja) * | 1997-03-13 | 2000-07-17 | 村田機械株式会社 | 天井走行車システム |
US20040109746A1 (en) * | 2002-12-09 | 2004-06-10 | Murata Kikai Kabushiki Kaisha | Overhead travelling carriage system |
JP2005206371A (ja) * | 2003-12-26 | 2005-08-04 | Murata Mach Ltd | 天井走行車システム |
TW200732234A (en) * | 2005-11-04 | 2007-09-01 | Daifuku Kk | Conversion equipment |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018211898A1 (ja) * | 2017-05-19 | 2018-11-22 | 村田機械株式会社 | 保管システム |
CN110603632A (zh) * | 2017-05-19 | 2019-12-20 | 村田机械株式会社 | 保管系统 |
JPWO2018211898A1 (ja) * | 2017-05-19 | 2020-01-16 | 村田機械株式会社 | 保管システム |
TWI734915B (zh) * | 2017-05-19 | 2021-08-01 | 日商村田機械股份有限公司 | 保管系統 |
US11171027B2 (en) | 2017-05-19 | 2021-11-09 | Murata Machinery, Ltd. | Storing system |
CN110603632B (zh) * | 2017-05-19 | 2023-03-14 | 村田机械株式会社 | 保管系统 |
Also Published As
Publication number | Publication date |
---|---|
EP2071617A2 (en) | 2009-06-17 |
CN101456487B (zh) | 2012-12-26 |
KR20090060940A (ko) | 2009-06-15 |
TWI414468B (zh) | 2013-11-11 |
EP2071617A3 (en) | 2011-11-02 |
JP5163866B2 (ja) | 2013-03-13 |
TW200927620A (en) | 2009-07-01 |
KR101236361B1 (ko) | 2013-02-22 |
CN101456487A (zh) | 2009-06-17 |
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