JP2009135478A - 基板上に高アスペクト比の特徴部を形成する方法 - Google Patents
基板上に高アスペクト比の特徴部を形成する方法 Download PDFInfo
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- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 36
- 239000011737 fluorine Substances 0.000 claims abstract description 36
- 239000000203 mixture Substances 0.000 claims abstract description 34
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000010410 layer Substances 0.000 claims description 83
- 239000007789 gas Substances 0.000 claims description 77
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 34
- 229910052710 silicon Inorganic materials 0.000 claims description 29
- 239000010703 silicon Substances 0.000 claims description 29
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 25
- 229910003481 amorphous carbon Inorganic materials 0.000 claims description 12
- 238000012545 processing Methods 0.000 claims description 10
- 229920001940 conductive polymer Polymers 0.000 claims description 9
- 239000005368 silicate glass Substances 0.000 claims description 9
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- 239000011261 inert gas Substances 0.000 claims description 5
- 150000002500 ions Chemical class 0.000 claims description 5
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052734 helium Inorganic materials 0.000 claims description 4
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- 229910003902 SiCl 4 Inorganic materials 0.000 claims description 2
- AYHOQSGNVUZKJA-UHFFFAOYSA-N [B+3].[B+3].[B+3].[B+3].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] Chemical compound [B+3].[B+3].[B+3].[B+3].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] AYHOQSGNVUZKJA-UHFFFAOYSA-N 0.000 claims description 2
- VRZFDJOWKAFVOO-UHFFFAOYSA-N [O-][Si]([O-])([O-])O.[B+3].P Chemical compound [O-][Si]([O-])([O-])O.[B+3].P VRZFDJOWKAFVOO-UHFFFAOYSA-N 0.000 claims description 2
- OYLRFHLPEAGKJU-UHFFFAOYSA-N phosphane silicic acid Chemical compound P.[Si](O)(O)(O)O OYLRFHLPEAGKJU-UHFFFAOYSA-N 0.000 claims description 2
- 239000011241 protective layer Substances 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- GDFCWFBWQUEQIJ-UHFFFAOYSA-N [B].[P] Chemical compound [B].[P] GDFCWFBWQUEQIJ-UHFFFAOYSA-N 0.000 claims 1
- PRPAGESBURMWTI-UHFFFAOYSA-N [C].[F] Chemical compound [C].[F] PRPAGESBURMWTI-UHFFFAOYSA-N 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- VDRSDNINOSAWIV-UHFFFAOYSA-N [F].[Si] Chemical compound [F].[Si] VDRSDNINOSAWIV-UHFFFAOYSA-N 0.000 abstract description 6
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 8
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- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
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- 239000007769 metal material Substances 0.000 description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- IVHJCRXBQPGLOV-UHFFFAOYSA-N azanylidynetungsten Chemical compound [W]#N IVHJCRXBQPGLOV-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
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- 239000008246 gaseous mixture Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
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Abstract
【解決手段】一実施形態において、基板上で誘電体層を異方性エッチングする方法は、誘電体層上にパターンマスク層が配置された基板をエッチチャンバ内に配置し、少なくともフッ素・炭素含有ガスとケイ素・フッ素ガスを含むガス混合物をエッチチャンバに供給し、ガス混合物から形成したプラズマの存在下で誘電体層に特徴部をエッチングすることを含む。
【選択図】図3
Description
本発明は、概して、高アスペクト比の特徴部を基板上に形成する方法に関する。より具体的には、本発明は、概して、半導体の製造において異方性エッチ処理により高アスペクト比の特徴部を形成する方法に関する。
(関連技術の説明)
Claims (15)
- 基板上で誘電体層を高アスペクト比で異方性エッチングする方法であり、
誘電体層上にパターンマスク層が配置された基板をエッチチャンバ内に配置し、
少なくともフッ素・炭素含有ガスとケイ素・フッ素ガスを含むガス混合物をエッチチャンバに供給し、
ガス混合物から形成したプラズマの存在下で誘電体層に特徴部をエッチングすることを含む方法。 - 誘電体層が、非ドープ・ケイ素ガラス(USG)、ホウ素・ケイ酸塩ガラス(BSG)、燐・ケイ酸塩ガラス(PSG)、ホウ素・燐・ケイ酸塩ガラス(BPSG)及びこれらの組み合わせから成る群から選択される請求項1記載の方法。
- パターンマスク層が、ケイ素、酸化ケイ素、窒化ケイ素、酸窒化ケイ素、炭化ケイ素、非晶質炭素及びこれらの組み合わせから成る群から選択される請求項1記載の方法。
- ガス混合物を供給することが、誘電体層のエッチングされた表面上に伝導性高分子層を形成することを更に含む請求項1記載の方法。
- 伝導性高分子層がケイ素含有高分子である請求項4記載の方法。
- 伝導性高分子層が、誘電体層を異方性エッチングするためのプラズマから発生したイオンを誘電体層の底部に向かって伝導することを補佐する請求項4記載の方法。
- フッ素・炭素含有ガスと、ケイ素・フッ素ガスが、SiF4とSiCl4である請求項1記載の方法。
- フッ素・炭素含有ガスが、CF4、CHF3、C4F8、C2F6、C4F6、C5F8及びCH2F2から成る群から選択される請求項1記載の方法。
- ガス混合物を供給することが、
フッ素・炭素含有ガスを流量約20sccm〜約100sccmで供給し、
ケイ素・フッ素ガスを流量約10sccm〜約50sccmで供給し、
処理圧力を約10mTorr〜約60mTorrに維持し、
基板温度を約20℃〜約80℃に制御し、
約200ワット〜約1000ワットのプラズマ電力を印加することを更に含む請求項1記載の方法。 - 基板上で誘電体層を高アスペクト比で異方性エッチングする方法であり、
誘電体層上にパターン形成された非晶質炭素層が配置された基板をエッチチャンバ内に配置し、
少なくともフッ素・炭素含有ガスとケイ素・フッ素ガスを含むガス混合物をエッチチャンバ内に供給し、
非晶質炭素層の開口部を通して、ガス混合物から形成したプラズマの存在下において、約20:1を越えるアスペクト比に特徴部をエッチングすることを含む方法。 - ガス混合物を供給することが、誘電体層のエッチングされた表面上に伝導性高分子層を形成することを更に含む請求項10記載の方法。
- ケイ素・フッ素ガスから得られるケイ素元素を非晶質炭素層と反応させて保護層を形成することを更に含む請求項11記載の方法。
- ガス混合物を供給することが、ガス混合物と共に不活性ガスをエッチチャンバに供給することを更に含み、
不活性ガスがN2、Ar、He、及びKrから成る群から選択される請求項11記載の方法。 - 基板上で誘電体層を高アスペクト比で異方性エッチングする方法であり、
誘電体層上にパターン形成された非晶質炭素層が配置された基板をエッチチャンバ内に配置し、
少なくともフッ素・炭素含有ガスとケイ素・フッ素ガスを含むガス混合物をエッチチャンバ内に供給し、
ガス混合物から形成したプラズマにより、誘電体層に約20:1を越えるアスペクト比に特徴部をエッチングし、
エッチング中に特徴部の表面上に伝導性高分子層を形成し、
特徴部を電界効果トランジスタ用のコンタクト構造として構成することを含む方法。 - 誘電体層が、酸化ケイ素、ホウ素・ケイ酸塩ガラス(BSG)、燐・ケイ酸塩ガラス(PSG)、ホウ素・燐・ケイ酸塩ガラス(BPSG)及びこれらの組み合わせから成る群から選択される請求項14記載の方法。
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US11/934,589 US20100330805A1 (en) | 2007-11-02 | 2007-11-02 | Methods for forming high aspect ratio features on a substrate |
US11/934,589 | 2007-11-02 |
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US (1) | US20100330805A1 (ja) |
EP (1) | EP2056341A3 (ja) |
JP (1) | JP5553501B2 (ja) |
KR (1) | KR101103214B1 (ja) |
CN (1) | CN101431023B (ja) |
SG (1) | SG152207A1 (ja) |
TW (1) | TW200935519A (ja) |
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JP2012015343A (ja) * | 2010-07-01 | 2012-01-19 | Hitachi High-Technologies Corp | プラズマエッチング方法 |
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Also Published As
Publication number | Publication date |
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TW200935519A (en) | 2009-08-16 |
EP2056341A2 (en) | 2009-05-06 |
EP2056341A3 (en) | 2010-03-03 |
CN101431023B (zh) | 2011-04-13 |
SG152207A1 (en) | 2009-05-29 |
KR20090045868A (ko) | 2009-05-08 |
KR101103214B1 (ko) | 2012-01-05 |
CN101431023A (zh) | 2009-05-13 |
US20100330805A1 (en) | 2010-12-30 |
JP5553501B2 (ja) | 2014-07-16 |
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