JP2009127981A - クリーンルーム、成膜方法、および半導体装置の作製方法 - Google Patents

クリーンルーム、成膜方法、および半導体装置の作製方法 Download PDF

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Publication number
JP2009127981A
JP2009127981A JP2007305964A JP2007305964A JP2009127981A JP 2009127981 A JP2009127981 A JP 2009127981A JP 2007305964 A JP2007305964 A JP 2007305964A JP 2007305964 A JP2007305964 A JP 2007305964A JP 2009127981 A JP2009127981 A JP 2009127981A
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film
area
substrate
semiconductor film
gas
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JP2009127981A5 (enrdf_load_stackoverflow
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Shunpei Yamazaki
舜平 山崎
Yasuyuki Arai
康行 荒井
Makoto Furuno
誠 古野
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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JP2007305964A 2007-11-27 2007-11-27 クリーンルーム、成膜方法、および半導体装置の作製方法 Withdrawn JP2009127981A (ja)

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JP2009127981A5 JP2009127981A5 (enrdf_load_stackoverflow) 2010-11-18

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012117972A1 (ja) * 2011-03-03 2012-09-07 シャープ株式会社 薄膜トランジスタおよびその製造方法、並びに表示装置
JP2014060411A (ja) * 2009-07-03 2014-04-03 Semiconductor Energy Lab Co Ltd 半導体装置
WO2015045582A1 (ja) * 2013-09-26 2015-04-02 村田機械株式会社 パージ装置及びパージ方法
WO2016013440A1 (ja) * 2014-07-24 2016-01-28 東京エレクトロン株式会社 基板処理システムおよび基板処理装置
CN106548964A (zh) * 2016-12-07 2017-03-29 广东申菱环境系统股份有限公司 一种半导体蚀刻间污染物处理系统
WO2018003330A1 (ja) * 2016-06-30 2018-01-04 東京エレクトロン株式会社 真空処理装置、真空処理方法及び記憶媒体
CN111477657A (zh) * 2014-10-28 2020-07-31 株式会社半导体能源研究所 功能面板、功能面板的制造方法、模块、数据处理装置
CN112639195A (zh) * 2018-09-04 2021-04-09 Surfx技术有限责任公司 用于对电子材料进行等离子体处理的装置和方法
KR102374734B1 (ko) * 2021-09-01 2022-03-14 임성연 버섯 재배를 위한 무균실 시공 방법 및 이에 의한 무균 시스템
CN115584475A (zh) * 2022-10-28 2023-01-10 富联科技(兰考)有限公司 镀膜设备的清洁方法与镀膜设备

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JPH0173923U (enrdf_load_stackoverflow) * 1987-11-04 1989-05-18
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JPH05299314A (ja) * 1992-04-24 1993-11-12 Hitachi Ltd 半導体装置の製造方法及びその装置
JPH08261535A (ja) * 1995-03-23 1996-10-11 Sony Corp 排塵装置、半導体処理装置及び蒸着装置
JPH10238833A (ja) * 1997-02-25 1998-09-08 Mitsubishi Electric Corp クリーンルーム
JPH1163604A (ja) * 1997-08-12 1999-03-05 Tokyo Electron Ltd 処理装置及び処理装置内の気体の制御方法
JP2000257909A (ja) * 1999-03-09 2000-09-22 Daikin Plant Kk 空調設備
JP2002367896A (ja) * 2001-06-11 2002-12-20 Ebara Corp 環境チャンバ及び基板処理装置並びに基板処理方法
JP2007088432A (ja) * 2005-08-23 2007-04-05 Semiconductor Energy Lab Co Ltd トランジスタ、並びにそれを用いた表示装置、電子機器、及び半導体装置
JP2007150086A (ja) * 2005-11-29 2007-06-14 Fujitsu Ltd 半導体装置の製造方法
JP2007187668A (ja) * 2007-01-15 2007-07-26 Shimadzu Corp 放射線アレイセンサーの製造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0173923U (enrdf_load_stackoverflow) * 1987-11-04 1989-05-18
JPH04359731A (ja) * 1991-06-07 1992-12-14 Mitsubishi Electric Corp 雰囲気作成装置
JPH05299314A (ja) * 1992-04-24 1993-11-12 Hitachi Ltd 半導体装置の製造方法及びその装置
JPH08261535A (ja) * 1995-03-23 1996-10-11 Sony Corp 排塵装置、半導体処理装置及び蒸着装置
JPH10238833A (ja) * 1997-02-25 1998-09-08 Mitsubishi Electric Corp クリーンルーム
JPH1163604A (ja) * 1997-08-12 1999-03-05 Tokyo Electron Ltd 処理装置及び処理装置内の気体の制御方法
JP2000257909A (ja) * 1999-03-09 2000-09-22 Daikin Plant Kk 空調設備
JP2002367896A (ja) * 2001-06-11 2002-12-20 Ebara Corp 環境チャンバ及び基板処理装置並びに基板処理方法
JP2007088432A (ja) * 2005-08-23 2007-04-05 Semiconductor Energy Lab Co Ltd トランジスタ、並びにそれを用いた表示装置、電子機器、及び半導体装置
JP2007150086A (ja) * 2005-11-29 2007-06-14 Fujitsu Ltd 半導体装置の製造方法
JP2007187668A (ja) * 2007-01-15 2007-07-26 Shimadzu Corp 放射線アレイセンサーの製造方法

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10211231B2 (en) 2009-07-03 2019-02-19 Semiconductor Energy Laboratory Co., Ltd. Display device including transistor and manufacturing method thereof
JP2014060411A (ja) * 2009-07-03 2014-04-03 Semiconductor Energy Lab Co Ltd 半導体装置
US11978741B2 (en) 2009-07-03 2024-05-07 Semiconductor Energy Laboratory Co., Ltd. Display device including transistor and manufacturing method thereof
US9130046B2 (en) 2009-07-03 2015-09-08 Semiconductor Energy Laboratory Co., Ltd. Display device including transistor and manufacturing method thereof
US11257847B2 (en) 2009-07-03 2022-02-22 Semiconductor Energy Laboratory Co., Ltd. Display device including transistor and manufacturing method thereof
US12272698B2 (en) 2009-07-03 2025-04-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising driver circuit
US10714503B2 (en) 2009-07-03 2020-07-14 Semiconductor Energy Laboratory Co., Ltd. Display device including transistor and manufacturing method thereof
US9812465B2 (en) 2009-07-03 2017-11-07 Semiconductor Energy Laboratory Co., Ltd. Display device including transistor and manufacturing method thereof
US9837441B2 (en) 2009-07-03 2017-12-05 Semiconductor Energy Laboratory Co., Ltd. Display device including transistor and manufacturing method thereof
US11637130B2 (en) 2009-07-03 2023-04-25 Semiconductor Energy Laboratory Co., Ltd. Display device including transistor and manufacturing method thereof
WO2012117972A1 (ja) * 2011-03-03 2012-09-07 シャープ株式会社 薄膜トランジスタおよびその製造方法、並びに表示装置
KR101807822B1 (ko) 2013-09-26 2017-12-11 무라다기카이가부시끼가이샤 퍼지 장치 및 퍼지 방법
TWI619192B (zh) * 2013-09-26 2018-03-21 Murata Machinery Ltd 吹掃裝置及吹掃方法
WO2015045582A1 (ja) * 2013-09-26 2015-04-02 村田機械株式会社 パージ装置及びパージ方法
KR101906077B1 (ko) * 2014-07-24 2018-11-30 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 기판 처리 장치
KR20170024008A (ko) * 2014-07-24 2017-03-06 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 기판 처리 장치
JP2016025335A (ja) * 2014-07-24 2016-02-08 東京エレクトロン株式会社 基板処理システムおよび基板処理装置
WO2016013440A1 (ja) * 2014-07-24 2016-01-28 東京エレクトロン株式会社 基板処理システムおよび基板処理装置
CN111477657A (zh) * 2014-10-28 2020-07-31 株式会社半导体能源研究所 功能面板、功能面板的制造方法、模块、数据处理装置
CN111477657B (zh) * 2014-10-28 2024-03-05 株式会社半导体能源研究所 功能面板、功能面板的制造方法、模块、数据处理装置
US11818856B2 (en) 2014-10-28 2023-11-14 Semiconductor Energy Laboratory Co., Ltd. Functional panel, method for manufacturing the same, module, data processing device
WO2018003330A1 (ja) * 2016-06-30 2018-01-04 東京エレクトロン株式会社 真空処理装置、真空処理方法及び記憶媒体
CN106548964A (zh) * 2016-12-07 2017-03-29 广东申菱环境系统股份有限公司 一种半导体蚀刻间污染物处理系统
CN106548964B (zh) * 2016-12-07 2023-08-22 广东申菱环境系统股份有限公司 一种半导体蚀刻间污染物处理系统
EP3847301A4 (en) * 2018-09-04 2022-05-04 Surfx Technologies LLC DEVICE AND METHOD FOR PLASMA TREATMENT OF ELECTRONIC MATERIALS
CN112639195A (zh) * 2018-09-04 2021-04-09 Surfx技术有限责任公司 用于对电子材料进行等离子体处理的装置和方法
KR102374734B1 (ko) * 2021-09-01 2022-03-14 임성연 버섯 재배를 위한 무균실 시공 방법 및 이에 의한 무균 시스템
CN115584475A (zh) * 2022-10-28 2023-01-10 富联科技(兰考)有限公司 镀膜设备的清洁方法与镀膜设备
CN115584475B (zh) * 2022-10-28 2024-06-07 富联科技(兰考)有限公司 镀膜设备的清洁方法与镀膜设备

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