JP2009124124A5 - - Google Patents

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Publication number
JP2009124124A5
JP2009124124A5 JP2008270668A JP2008270668A JP2009124124A5 JP 2009124124 A5 JP2009124124 A5 JP 2009124124A5 JP 2008270668 A JP2008270668 A JP 2008270668A JP 2008270668 A JP2008270668 A JP 2008270668A JP 2009124124 A5 JP2009124124 A5 JP 2009124124A5
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JP
Japan
Prior art keywords
layer
forming
mask
semiconductor
film
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JP2008270668A
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English (en)
Japanese (ja)
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JP2009124124A (ja
JP5367338B2 (ja
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Priority to JP2008270668A priority Critical patent/JP5367338B2/ja
Priority claimed from JP2008270668A external-priority patent/JP5367338B2/ja
Publication of JP2009124124A publication Critical patent/JP2009124124A/ja
Publication of JP2009124124A5 publication Critical patent/JP2009124124A5/ja
Application granted granted Critical
Publication of JP5367338B2 publication Critical patent/JP5367338B2/ja
Expired - Fee Related legal-status Critical Current
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JP2008270668A 2007-10-23 2008-10-21 表示装置の作製方法 Expired - Fee Related JP5367338B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008270668A JP5367338B2 (ja) 2007-10-23 2008-10-21 表示装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007275786 2007-10-23
JP2007275786 2007-10-23
JP2008270668A JP5367338B2 (ja) 2007-10-23 2008-10-21 表示装置の作製方法

Publications (3)

Publication Number Publication Date
JP2009124124A JP2009124124A (ja) 2009-06-04
JP2009124124A5 true JP2009124124A5 (enExample) 2011-12-01
JP5367338B2 JP5367338B2 (ja) 2013-12-11

Family

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Family Applications (1)

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JP2008270668A Expired - Fee Related JP5367338B2 (ja) 2007-10-23 2008-10-21 表示装置の作製方法

Country Status (4)

Country Link
US (1) US7824939B2 (enExample)
JP (1) JP5367338B2 (enExample)
CN (1) CN101419946B (enExample)
TW (1) TWI442481B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5357493B2 (ja) * 2007-10-23 2013-12-04 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR101448903B1 (ko) * 2007-10-23 2014-10-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 및 그의 제작방법
JP5380037B2 (ja) 2007-10-23 2014-01-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR101446249B1 (ko) 2007-12-03 2014-10-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 제조방법
WO2009072451A1 (en) * 2007-12-03 2009-06-11 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of thin film transistor and manufacturing method of display device
US8101442B2 (en) * 2008-03-05 2012-01-24 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing EL display device
TW202025500A (zh) 2008-11-07 2020-07-01 日商半導體能源研究所股份有限公司 半導體裝置和其製造方法
JP5503995B2 (ja) * 2009-02-13 2014-05-28 株式会社半導体エネルギー研究所 半導体装置の作製方法
WO2011010546A1 (en) * 2009-07-24 2011-01-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI746064B (zh) * 2009-08-07 2021-11-11 日商半導體能源研究所股份有限公司 半導體裝置和其製造方法
JP5642447B2 (ja) 2009-08-07 2014-12-17 株式会社半導体エネルギー研究所 半導体装置
KR102317763B1 (ko) 2009-11-06 2021-10-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
KR102008769B1 (ko) * 2009-11-27 2019-08-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작방법
WO2011077946A1 (en) 2009-12-25 2011-06-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6122275B2 (ja) * 2011-11-11 2017-04-26 株式会社半導体エネルギー研究所 表示装置
CN102707575B (zh) * 2012-05-18 2015-02-25 北京京东方光电科技有限公司 掩模板及制造阵列基板的方法
JP6300589B2 (ja) 2013-04-04 2018-03-28 株式会社半導体エネルギー研究所 半導体装置の作製方法
CN106298523B (zh) * 2015-05-22 2019-12-17 鸿富锦精密工业（深圳）有限公司 薄膜晶体管、薄膜晶体管的制造方法及阵列基板的制造方法
CN111007686A (zh) * 2019-11-14 2020-04-14 Tcl华星光电技术有限公司 阵列基板、显示面板及制备方法
CN114284141B (zh) * 2020-09-27 2025-08-15 中芯国际集成电路制造(上海)有限公司 半导体结构的形成方法

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JPS56122123A (en) * 1980-03-03 1981-09-25 Shunpei Yamazaki Semiamorphous semiconductor
US7023021B2 (en) * 2000-02-22 2006-04-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
US7223643B2 (en) * 2000-08-11 2007-05-29 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
JP4876341B2 (ja) * 2001-07-13 2012-02-15 日本電気株式会社 アクティブマトリクス基板及びその製造方法
KR101107682B1 (ko) * 2004-12-31 2012-01-25 엘지디스플레이 주식회사 표시 소자용 박막 트랜지스터 기판 및 그 제조 방법
JP2006302679A (ja) * 2005-04-21 2006-11-02 Seiko Epson Corp 導電膜の形成方法、及び電子機器の製造方法
JP4200983B2 (ja) * 2005-05-24 2008-12-24 セイコーエプソン株式会社 膜パターンの形成方法、アクティブマトリクス基板、電気光学装置、及び電子機器
US7608490B2 (en) * 2005-06-02 2009-10-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7588970B2 (en) * 2005-06-10 2009-09-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR101201017B1 (ko) * 2005-06-27 2012-11-13 엘지디스플레이 주식회사 액정 표시 장치 및 그 제조 방법
US7807516B2 (en) * 2005-06-30 2010-10-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of the same
US7867791B2 (en) * 2005-07-29 2011-01-11 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device using multiple mask layers formed through use of an exposure mask that transmits light at a plurality of intensities
US7914971B2 (en) * 2005-08-12 2011-03-29 Semiconductor Energy Laboratory Co., Ltd. Light exposure mask and method for manufacturing semiconductor device using the same
JP5105811B2 (ja) 2005-10-14 2012-12-26 株式会社半導体エネルギー研究所 表示装置
US8149346B2 (en) * 2005-10-14 2012-04-03 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
TWI460851B (zh) * 2005-10-17 2014-11-11 Semiconductor Energy Lab 半導體裝置及其製造方法
KR101219046B1 (ko) * 2005-11-17 2013-01-08 삼성디스플레이 주식회사 표시장치와 이의 제조방법
TWI400758B (zh) * 2005-12-28 2013-07-01 半導體能源研究所股份有限公司 半導體裝置的製造方法
US7821613B2 (en) * 2005-12-28 2010-10-26 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
KR20070070718A (ko) * 2005-12-29 2007-07-04 엘지.필립스 엘시디 주식회사 박막 트랜지스터 기판의 제조방법
TWI322288B (en) * 2006-03-07 2010-03-21 Au Optronics Corp Manufacture method of pixel array substrate

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