JP2009099626A5 - - Google Patents

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Publication number
JP2009099626A5
JP2009099626A5 JP2007267227A JP2007267227A JP2009099626A5 JP 2009099626 A5 JP2009099626 A5 JP 2009099626A5 JP 2007267227 A JP2007267227 A JP 2007267227A JP 2007267227 A JP2007267227 A JP 2007267227A JP 2009099626 A5 JP2009099626 A5 JP 2009099626A5
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JP
Japan
Prior art keywords
light shielding
imaging
region
insulating film
semiconductor substrate
Prior art date
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Granted
Application number
JP2007267227A
Other languages
English (en)
Japanese (ja)
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JP4799522B2 (ja
JP2009099626A (ja
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Publication date
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Priority to JP2007267227A priority Critical patent/JP4799522B2/ja
Priority claimed from JP2007267227A external-priority patent/JP4799522B2/ja
Priority to US12/248,427 priority patent/US7851879B2/en
Publication of JP2009099626A publication Critical patent/JP2009099626A/ja
Publication of JP2009099626A5 publication Critical patent/JP2009099626A5/ja
Application granted granted Critical
Publication of JP4799522B2 publication Critical patent/JP4799522B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007267227A 2007-10-12 2007-10-12 撮像装置 Expired - Fee Related JP4799522B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007267227A JP4799522B2 (ja) 2007-10-12 2007-10-12 撮像装置
US12/248,427 US7851879B2 (en) 2007-10-12 2008-10-09 Imaging device comprising shielding unit which shields light incident from imaging area to optical black area and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007267227A JP4799522B2 (ja) 2007-10-12 2007-10-12 撮像装置

Publications (3)

Publication Number Publication Date
JP2009099626A JP2009099626A (ja) 2009-05-07
JP2009099626A5 true JP2009099626A5 (enExample) 2011-03-03
JP4799522B2 JP4799522B2 (ja) 2011-10-26

Family

ID=40581759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007267227A Expired - Fee Related JP4799522B2 (ja) 2007-10-12 2007-10-12 撮像装置

Country Status (2)

Country Link
US (1) US7851879B2 (enExample)
JP (1) JP4799522B2 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008053286A (ja) * 2006-08-22 2008-03-06 Matsushita Electric Ind Co Ltd 撮像装置チップセット及び画像ピックアップシステム
JP5302644B2 (ja) * 2008-12-03 2013-10-02 キヤノン株式会社 撮像装置、及び撮像システム
JP5493461B2 (ja) * 2009-05-12 2014-05-14 ソニー株式会社 固体撮像装置、電子機器及び固体撮像装置の製造方法
JP5367459B2 (ja) 2009-05-28 2013-12-11 株式会社東芝 半導体撮像装置
JP5513872B2 (ja) * 2009-12-18 2014-06-04 株式会社東芝 固体撮像装置
JP5489705B2 (ja) * 2009-12-26 2014-05-14 キヤノン株式会社 固体撮像装置および撮像システム
TW201129087A (en) * 2010-02-09 2011-08-16 Novatek Microelectronics Corp Image sensor
JP2011216865A (ja) * 2010-03-17 2011-10-27 Canon Inc 固体撮像装置
JP5700945B2 (ja) * 2010-03-25 2015-04-15 キヤノン株式会社 光電変換装置及びその製造方法
KR101769969B1 (ko) 2010-06-14 2017-08-21 삼성전자주식회사 광 블랙 영역 및 활성 화소 영역 사이의 차광 패턴을 갖는 이미지 센서
JP2012049431A (ja) * 2010-08-30 2012-03-08 Sony Corp 固体撮像装置および電子機器
JP5693924B2 (ja) * 2010-11-10 2015-04-01 株式会社東芝 半導体撮像装置
JP2012164768A (ja) * 2011-02-04 2012-08-30 Toshiba Corp 固体撮像装置
US8610229B2 (en) * 2011-04-14 2013-12-17 Taiwan Semiconductor Manufacturing Company, Ltd. Sidewall for backside illuminated image sensor metal grid and method of manufacturing same
WO2012144196A1 (ja) * 2011-04-22 2012-10-26 パナソニック株式会社 固体撮像装置
KR101382422B1 (ko) * 2012-11-05 2014-04-08 주식회사 동부하이텍 이미지 센서 및 그 제조 방법
JP6271841B2 (ja) 2013-02-13 2018-01-31 ラピスセミコンダクタ株式会社 半導体装置、半導体装置の製造方法および半導体装置を搭載したシステム
JP2016146376A (ja) 2015-02-06 2016-08-12 ルネサスエレクトロニクス株式会社 撮像装置およびその製造方法
WO2017043330A1 (ja) * 2015-09-09 2017-03-16 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置および電子機器
GB2529567B (en) * 2015-09-22 2016-11-23 X-Fab Semiconductor Foundries Ag Light shield for light sensitive elements
WO2017169231A1 (ja) * 2016-03-31 2017-10-05 ソニー株式会社 撮像素子および電子機器
CN110767667B (zh) * 2019-11-26 2022-07-08 上海微阱电子科技有限公司 一种图像传感器结构和形成方法
CN111129049B (zh) * 2019-11-29 2023-06-02 上海集成电路研发中心有限公司 一种图像传感器结构和形成方法
WO2021192600A1 (ja) * 2020-03-24 2021-09-30 パナソニックＩｐマネジメント株式会社 固体撮像素子

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150846A (ja) * 1998-11-12 2000-05-30 Olympus Optical Co Ltd 固体撮像装置及びその製造方法
JP2001298175A (ja) * 2000-04-12 2001-10-26 Toshiba Corp 撮像システム
KR100614793B1 (ko) * 2004-09-23 2006-08-22 삼성전자주식회사 이미지 센서 및 이의 제조 방법.
JP4944399B2 (ja) * 2005-07-04 2012-05-30 キヤノン株式会社 固体撮像装置
KR100784387B1 (ko) * 2006-11-06 2007-12-11 삼성전자주식회사 이미지 센서 및 그 형성방법
JP2008218755A (ja) * 2007-03-05 2008-09-18 Canon Inc 光電変換装置及び撮像システム

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