JP2009081406A5 - - Google Patents

Download PDF

Info

Publication number
JP2009081406A5
JP2009081406A5 JP2007251478A JP2007251478A JP2009081406A5 JP 2009081406 A5 JP2009081406 A5 JP 2009081406A5 JP 2007251478 A JP2007251478 A JP 2007251478A JP 2007251478 A JP2007251478 A JP 2007251478A JP 2009081406 A5 JP2009081406 A5 JP 2009081406A5
Authority
JP
Japan
Prior art keywords
buffer layer
group iii
iii nitride
nitride semiconductor
semiconductor light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007251478A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009081406A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007251478A priority Critical patent/JP2009081406A/ja
Priority claimed from JP2007251478A external-priority patent/JP2009081406A/ja
Priority to CN200880117594A priority patent/CN101874306A/zh
Priority to EP08833533.6A priority patent/EP2200099A4/en
Priority to US12/680,445 priority patent/US20100219445A1/en
Priority to KR1020107006929A priority patent/KR20100049123A/ko
Priority to PCT/JP2008/066261 priority patent/WO2009041256A1/ja
Priority to TW097136316A priority patent/TW200933933A/zh
Publication of JP2009081406A publication Critical patent/JP2009081406A/ja
Publication of JP2009081406A5 publication Critical patent/JP2009081406A5/ja
Pending legal-status Critical Current

Links

JP2007251478A 2007-09-27 2007-09-27 Iii族窒化物半導体発光素子及びその製造方法、並びにランプ Pending JP2009081406A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2007251478A JP2009081406A (ja) 2007-09-27 2007-09-27 Iii族窒化物半導体発光素子及びその製造方法、並びにランプ
CN200880117594A CN101874306A (zh) 2007-09-27 2008-09-09 Ⅲ族氮化物半导体发光元件及其制造方法以及灯
EP08833533.6A EP2200099A4 (en) 2007-09-27 2008-09-09 GROUP III NITRID SEMICONDUCTOR LIGHTING ELEMENT, METHOD OF MANUFACTURING THEREOF AND LAMP
US12/680,445 US20100219445A1 (en) 2007-09-27 2008-09-09 Group iii nitride semiconductor light-emitting device, method for manufacturing the same, and lamp
KR1020107006929A KR20100049123A (ko) 2007-09-27 2008-09-09 Ⅲ족 질화물 반도체 발광 소자 및 그 제조 방법, 및 램프
PCT/JP2008/066261 WO2009041256A1 (ja) 2007-09-27 2008-09-09 Iii族窒化物半導体発光素子及びその製造方法、並びにランプ
TW097136316A TW200933933A (en) 2007-09-27 2008-09-22 Group III nitride semiconductor light emitting device, method of manufacturing thereof, and lamps using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007251478A JP2009081406A (ja) 2007-09-27 2007-09-27 Iii族窒化物半導体発光素子及びその製造方法、並びにランプ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011002985A Division JP2011082570A (ja) 2011-01-11 2011-01-11 Iii族窒化物半導体発光素子の製造方法

Publications (2)

Publication Number Publication Date
JP2009081406A JP2009081406A (ja) 2009-04-16
JP2009081406A5 true JP2009081406A5 (OSRAM) 2010-05-20

Family

ID=40511145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007251478A Pending JP2009081406A (ja) 2007-09-27 2007-09-27 Iii族窒化物半導体発光素子及びその製造方法、並びにランプ

Country Status (7)

Country Link
US (1) US20100219445A1 (OSRAM)
EP (1) EP2200099A4 (OSRAM)
JP (1) JP2009081406A (OSRAM)
KR (1) KR20100049123A (OSRAM)
CN (1) CN101874306A (OSRAM)
TW (1) TW200933933A (OSRAM)
WO (1) WO2009041256A1 (OSRAM)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5272390B2 (ja) * 2007-11-29 2013-08-28 豊田合成株式会社 Iii族窒化物半導体の製造方法、iii族窒化物半導体発光素子の製造方法、及びiii族窒化物半導体発光素子、並びにランプ
US8742459B2 (en) 2009-05-14 2014-06-03 Transphorm Inc. High voltage III-nitride semiconductor devices
CN102549203B (zh) * 2009-09-28 2014-09-03 株式会社德山 叠层体的制造方法
KR101178505B1 (ko) * 2009-11-03 2012-09-07 주식회사루미지엔테크 반도체 기판과 이의 제조 방법
EP2500451B1 (en) * 2009-11-10 2019-01-30 Stanley Electric Co., Ltd. Method for producing laminate
EP2544250B1 (en) * 2010-03-01 2020-01-08 Sharp Kabushiki Kaisha Process for production of nitride semiconductor element, nitride semiconductor light-emitting element, and light-emitting device
DE102010035489A1 (de) * 2010-08-26 2012-03-01 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelement
KR20120032329A (ko) 2010-09-28 2012-04-05 삼성전자주식회사 반도체 소자
US8742460B2 (en) 2010-12-15 2014-06-03 Transphorm Inc. Transistors with isolation regions
US8409895B2 (en) * 2010-12-16 2013-04-02 Applied Materials, Inc. Gallium nitride-based LED fabrication with PVD-formed aluminum nitride buffer layer
US8643062B2 (en) 2011-02-02 2014-02-04 Transphorm Inc. III-N device structures and methods
US8772842B2 (en) 2011-03-04 2014-07-08 Transphorm, Inc. Semiconductor diodes with low reverse bias currents
JP5879225B2 (ja) * 2011-08-22 2016-03-08 住友化学株式会社 窒化物半導体テンプレート及び発光ダイオード
US8901604B2 (en) 2011-09-06 2014-12-02 Transphorm Inc. Semiconductor devices with guard rings
US9257547B2 (en) 2011-09-13 2016-02-09 Transphorm Inc. III-N device structures having a non-insulating substrate
US8598937B2 (en) 2011-10-07 2013-12-03 Transphorm Inc. High power semiconductor electronic components with increased reliability
KR20130067610A (ko) * 2011-12-14 2013-06-25 한국전자통신연구원 도파로형 광 혼합기
JP2013145867A (ja) * 2011-12-15 2013-07-25 Hitachi Cable Ltd 窒化物半導体テンプレート及び発光ダイオード
US9165766B2 (en) 2012-02-03 2015-10-20 Transphorm Inc. Buffer layer structures suited for III-nitride devices with foreign substrates
US9093366B2 (en) 2012-04-09 2015-07-28 Transphorm Inc. N-polar III-nitride transistors
DE102012103686B4 (de) * 2012-04-26 2021-07-08 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Epitaxiesubstrat, Verfahren zur Herstellung eines Epitaxiesubstrats und optoelektronischer Halbleiterchip mit einem Epitaxiesubstrat
KR20130128931A (ko) * 2012-05-18 2013-11-27 삼성전자주식회사 N형 알루미늄 갈륨 나이트라이드 박막 및 자외선 발광소자
US9184275B2 (en) 2012-06-27 2015-11-10 Transphorm Inc. Semiconductor devices with integrated hole collectors
TWI524551B (zh) 2012-11-19 2016-03-01 新世紀光電股份有限公司 氮化物半導體結構及半導體發光元件
TWI535055B (zh) 2012-11-19 2016-05-21 新世紀光電股份有限公司 氮化物半導體結構及半導體發光元件
TWI499080B (zh) 2012-11-19 2015-09-01 Genesis Photonics Inc 氮化物半導體結構及半導體發光元件
CN105164811B (zh) 2013-02-15 2018-08-31 创世舫电子有限公司 半导体器件的电极及其形成方法
US9087718B2 (en) 2013-03-13 2015-07-21 Transphorm Inc. Enhancement-mode III-nitride devices
DE112014001272B4 (de) * 2013-03-14 2023-03-30 Canon Anelva Corporation Schichtbildungsverfahren, Verfahren zum Herstellen einer lichtemittierenden Halbleitereinrichtung,lichtemittierende Halbleitereinrichtung und Beleuchtungseinrichtung
US9929310B2 (en) * 2013-03-14 2018-03-27 Applied Materials, Inc. Oxygen controlled PVD aluminum nitride buffer for gallium nitride-based optoelectronic and electronic devices
US9245993B2 (en) 2013-03-15 2016-01-26 Transphorm Inc. Carbon doping semiconductor devices
KR102075543B1 (ko) * 2013-05-06 2020-02-11 엘지이노텍 주식회사 반도체 기판, 발광 소자 및 전자 소자
WO2015009514A1 (en) 2013-07-19 2015-01-22 Transphorm Inc. Iii-nitride transistor including a p-type depleting layer
TWI536606B (zh) * 2013-12-25 2016-06-01 新世紀光電股份有限公司 發光二極體結構
DE102014101966A1 (de) 2014-02-17 2015-08-20 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines elektronischen Halbleiterchips und elektronischer Halbleiterchip
JP6176141B2 (ja) * 2014-02-19 2017-08-09 豊田合成株式会社 Iii 族窒化物半導体発光素子の製造方法
JP2015176936A (ja) * 2014-03-13 2015-10-05 株式会社東芝 半導体装置
US9318593B2 (en) 2014-07-21 2016-04-19 Transphorm Inc. Forming enhancement mode III-nitride devices
US9608103B2 (en) 2014-10-02 2017-03-28 Toshiba Corporation High electron mobility transistor with periodically carbon doped gallium nitride
JP6375890B2 (ja) 2014-11-18 2018-08-22 日亜化学工業株式会社 窒化物半導体素子及びその製造方法
US9536966B2 (en) 2014-12-16 2017-01-03 Transphorm Inc. Gate structures for III-N devices
US9536967B2 (en) 2014-12-16 2017-01-03 Transphorm Inc. Recessed ohmic contacts in a III-N device
TWI568016B (zh) * 2014-12-23 2017-01-21 錼創科技股份有限公司 半導體發光元件
CN104701432A (zh) * 2015-03-20 2015-06-10 映瑞光电科技(上海)有限公司 GaN 基LED 外延结构及其制备方法
KR102010401B1 (ko) * 2015-10-27 2019-08-14 주식회사 엘지화학 유기발광소자
CN105633223B (zh) * 2015-12-31 2018-10-09 华灿光电(苏州)有限公司 AlGaN模板、AlGaN模板的制备方法及AlGaN模板上的半导体器件
CN105633233B (zh) * 2015-12-31 2018-01-12 华灿光电(苏州)有限公司 AlN模板、AlN模板的制备方法及AlN模板上的半导体器件
CN108604597B (zh) 2016-01-15 2021-09-17 创世舫电子有限公司 具有al(1-x)sixo栅极绝缘体的增强模式iii-氮化物器件
CN105755536B (zh) * 2016-02-06 2019-04-26 上海新傲科技股份有限公司 一种采用AlON缓冲层的氮化物的外延生长技术
CN105590839B (zh) * 2016-03-22 2018-09-14 安徽三安光电有限公司 氮化物底层、发光二极管及底层制备方法
TWI762486B (zh) 2016-05-31 2022-05-01 美商創世舫科技有限公司 包含漸變空乏層的三族氮化物裝置
TWI703726B (zh) * 2016-09-19 2020-09-01 新世紀光電股份有限公司 含氮半導體元件
CN109841708B (zh) * 2017-11-28 2022-05-31 中国科学院半导体研究所 半导体器件及其制备方法
JP7555470B1 (ja) 2023-12-07 2024-09-24 日機装株式会社 窒化物半導体発光素子
CN118472152B (zh) * 2024-07-12 2024-09-17 诺视科技(浙江)有限公司 集成反射穹顶的微显示器件及其制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6039819A (ja) * 1983-08-12 1985-03-01 Nippon Telegr & Teleph Corp <Ntt> 化合物半導体薄膜の作製方法
JPS60173829A (ja) * 1984-02-14 1985-09-07 Nippon Telegr & Teleph Corp <Ntt> 化合物半導体薄膜の成長方法
JPS6365917A (ja) 1986-09-06 1988-03-24 Kurita Mach Mfg Co Ltd 濾過ユニット
JPH088217B2 (ja) 1991-01-31 1996-01-29 日亜化学工業株式会社 窒化ガリウム系化合物半導体の結晶成長方法
JP3456404B2 (ja) * 1997-10-10 2003-10-14 豊田合成株式会社 半導体素子
JPH11200031A (ja) * 1997-12-25 1999-07-27 Applied Materials Inc スパッタリング装置及びその高速真空排気方法
JP3700492B2 (ja) * 1999-09-21 2005-09-28 豊田合成株式会社 Iii族窒化物系化合物半導体素子
JP3440873B2 (ja) 1999-03-31 2003-08-25 豊田合成株式会社 Iii族窒化物系化合物半導体素子の製造方法
US6713789B1 (en) * 1999-03-31 2004-03-30 Toyoda Gosei Co., Ltd. Group III nitride compound semiconductor device and method of producing the same
JP4613373B2 (ja) * 1999-07-19 2011-01-19 ソニー株式会社 Iii族ナイトライド化合物半導体薄膜の形成方法および半導体素子の製造方法
JP3994623B2 (ja) * 2000-04-21 2007-10-24 豊田合成株式会社 Iii族窒化物系化合物半導体素子の製造方法
US6787814B2 (en) * 2000-06-22 2004-09-07 Showa Denko Kabushiki Kaisha Group-III nitride semiconductor light-emitting device and production method thereof
EP1346085B1 (en) * 2000-11-30 2011-10-12 North Carolina State University Method for producing group iii metal nitride based materials
JP2004179457A (ja) * 2002-11-28 2004-06-24 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体素子の製造方法
JP4468744B2 (ja) 2004-06-15 2010-05-26 日本電信電話株式会社 窒化物半導体薄膜の作製方法
JP2007251478A (ja) 2006-03-15 2007-09-27 Matsushita Electric Ind Co Ltd 確率的演算素子及びこれを用いた確率的演算装置

Similar Documents

Publication Publication Date Title
JP2009081406A5 (OSRAM)
JP6082032B2 (ja) 封止膜を堆積するための方法
WO2010129183A3 (en) Mocvd single chamber split process for led manufacturing
CN108899403B (zh) 基于ScAlN/AlGaN超晶格p型层的高效发光二极管及制备方法
Yong-Qiang et al. High barrier properties of transparent thin-film encapsulations for top emission organic light-emitting diodes
CN104103720A (zh) 一种氮化物半导体的制备方法
WO2010071364A3 (ko) 금속 박막 또는 금속 산화물 박막 증착용 유기금속 전구체 화합물 및 이를 이용한 박막 증착 방법
JP2009016531A5 (OSRAM)
CN104393128A (zh) 一种使用SiC衬底的氮化物LED外延结构及其制备方法
TW201130155A (en) Thin film and method of forming the same, and semiconductor light emitting device having the thin film
CN108878606A (zh) 基于超晶格结构和δ掺杂的高效发光二极管及制备方法
CN115064620B (zh) 阶梯组分YAlN/AlGaN超晶格p型层的高效深紫外发光二极管及制备方法
CN103904177A (zh) 发光二极管外延片及其制造方法
CN109638126A (zh) 一种氮化铝模板、深紫外发光二极管外延片及其制备方法
EP2360297A3 (en) Vapor deposition system, method of manufacturing light emitting device and light emitting device
TW200833886A (en) Method for manufacture of III-V family chemical compound semiconductor
CN110518099A (zh) 一种高效发光二极管及制作方法
CN204167345U (zh) 一种使用 SiC 衬底的氮化物 LED 外延结构
RU2011145603A (ru) Способ изготовления матрицы многоострийного автоэмиссионного катода на монокристаллическом кремнии
EP2448016A3 (en) Method of manufacturing semiconductor light emitting device
JP2004277882A5 (ja) 半導体装置の作製方法
CN112201733A (zh) 基于自组装亚微米ITO/Sc/ITO电流扩展层的GaN基发光二极管及制备方法
JP2006100474A5 (OSRAM)
KR101942749B1 (ko) 다층무기봉지박막 및 이의 제조방법
CN113629175A (zh) 具有复合缓冲层的led外延结构及其制备方法