JP2009059883A - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP2009059883A
JP2009059883A JP2007225694A JP2007225694A JP2009059883A JP 2009059883 A JP2009059883 A JP 2009059883A JP 2007225694 A JP2007225694 A JP 2007225694A JP 2007225694 A JP2007225694 A JP 2007225694A JP 2009059883 A JP2009059883 A JP 2009059883A
Authority
JP
Japan
Prior art keywords
electrode
pattern
glass
light emitting
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007225694A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009059883A5 (enExample
Inventor
Yoshinobu Suehiro
好伸 末広
Koji Takaku
浩二 田角
Katsunori Arakane
克学 荒金
Seiji Yamaguchi
誠治 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2007225694A priority Critical patent/JP2009059883A/ja
Publication of JP2009059883A publication Critical patent/JP2009059883A/ja
Publication of JP2009059883A5 publication Critical patent/JP2009059883A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
JP2007225694A 2007-08-31 2007-08-31 発光装置 Pending JP2009059883A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007225694A JP2009059883A (ja) 2007-08-31 2007-08-31 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007225694A JP2009059883A (ja) 2007-08-31 2007-08-31 発光装置

Publications (2)

Publication Number Publication Date
JP2009059883A true JP2009059883A (ja) 2009-03-19
JP2009059883A5 JP2009059883A5 (enExample) 2009-12-10

Family

ID=40555363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007225694A Pending JP2009059883A (ja) 2007-08-31 2007-08-31 発光装置

Country Status (1)

Country Link
JP (1) JP2009059883A (enExample)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009104558A1 (ja) 2008-02-19 2009-08-27 日本電気株式会社 光インターコネクション装置
JP2010010682A (ja) * 2008-06-24 2010-01-14 Samsung Electronics Co Ltd サブマウント、サブマウントを含む発光装置、サブマウントの製造方法
JP2011030463A (ja) * 2009-07-30 2011-02-17 Toyoda Gosei Co Ltd 水中用照明とこれを用いた養殖装置
JP2011101054A (ja) * 2009-07-03 2011-05-19 Sharp Corp 半導体発光素子搭載用基板、バックライトシャーシ、表示装置、及び、テレビ受信装置
JP2011129862A (ja) * 2009-11-19 2011-06-30 Toyoda Gosei Co Ltd 発光装置、発光装置の製造方法、発光装置の実装方法及び光源装置
JP2012124248A (ja) * 2010-12-07 2012-06-28 Toppan Printing Co Ltd Ｌｅｄチップ搭載用リードフレーム基板及びその製造方法並びにｌｅｄパッケージ
JPWO2010119580A1 (ja) * 2009-04-16 2012-10-22 株式会社光波 光源モジュール
US8426884B2 (en) 2010-09-01 2013-04-23 Hitachi Cable, Ltd. Light emitting diode with supporting substrate side electrodes and wiring structures
JP2013096020A (ja) * 2011-10-28 2013-05-20 Sumita Optical Glass Inc ヘルメット
CN103427010A (zh) * 2012-05-14 2013-12-04 欧姆龙株式会社 紫外线照射装置及紫外线照射头
US8669568B2 (en) 2010-10-13 2014-03-11 Interlight Optotech Corporation Light emitting device usable for variable driving voltages
JP2014216493A (ja) * 2013-04-25 2014-11-17 スタンレー電気株式会社 半導体発光素子及び半導体発光装置
JP2014229626A (ja) * 2013-05-17 2014-12-08 スタンレー電気株式会社 半導体発光素子アレイ
JP2015019090A (ja) * 2014-08-22 2015-01-29 シャープ株式会社 発光装置
US9093357B2 (en) 2010-01-22 2015-07-28 Sharp Kabushiki Kaisha Light emitting device
US9231023B2 (en) 2009-11-13 2016-01-05 Sharp Kabushiki Kaisha Light-emitting device having a plurality of concentric light transmitting areas
JP2016072269A (ja) * 2014-09-26 2016-05-09 日亜化学工業株式会社 発光装置及び発光装置用基板
WO2017159129A1 (ja) * 2016-03-15 2017-09-21 ソニー株式会社 ガラス配線基板及びその製造方法、部品実装ガラス配線基板及びその製造方法、並びに、表示装置用基板
JP2017168620A (ja) * 2016-03-16 2017-09-21 豊田合成株式会社 発光装置およびその製造方法
JP2018152586A (ja) * 2012-11-12 2018-09-27 晶元光電股▲ふん▼有限公司Ｅｐｉｓｔａｒ Ｃｏｒｐｏｒａｔｉｏｎ 半導体発光素子の製造方法
JP2019083246A (ja) * 2017-10-30 2019-05-30 三菱電機株式会社 光源モジュールおよび照明器具

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004082036A1 (ja) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. 固体素子デバイスおよびその製造方法
JP2006303396A (ja) * 2005-04-25 2006-11-02 Matsushita Electric Works Ltd 表面実装型発光装置
JP2007103917A (ja) * 2005-09-07 2007-04-19 Toyoda Gosei Co Ltd 固体素子デバイス

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004082036A1 (ja) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. 固体素子デバイスおよびその製造方法
JP2006303396A (ja) * 2005-04-25 2006-11-02 Matsushita Electric Works Ltd 表面実装型発光装置
JP2007103917A (ja) * 2005-09-07 2007-04-19 Toyoda Gosei Co Ltd 固体素子デバイス

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009104558A1 (ja) 2008-02-19 2009-08-27 日本電気株式会社 光インターコネクション装置
JP2010010682A (ja) * 2008-06-24 2010-01-14 Samsung Electronics Co Ltd サブマウント、サブマウントを含む発光装置、サブマウントの製造方法
JPWO2010119580A1 (ja) * 2009-04-16 2012-10-22 株式会社光波 光源モジュール
JP2011101054A (ja) * 2009-07-03 2011-05-19 Sharp Corp 半導体発光素子搭載用基板、バックライトシャーシ、表示装置、及び、テレビ受信装置
JP2011030463A (ja) * 2009-07-30 2011-02-17 Toyoda Gosei Co Ltd 水中用照明とこれを用いた養殖装置
US9607970B2 (en) 2009-11-13 2017-03-28 Sharp Kabushiki Kaisha Light-emitting device having a plurality of concentric light transmitting areas
US9231023B2 (en) 2009-11-13 2016-01-05 Sharp Kabushiki Kaisha Light-emitting device having a plurality of concentric light transmitting areas
JP2011129862A (ja) * 2009-11-19 2011-06-30 Toyoda Gosei Co Ltd 発光装置、発光装置の製造方法、発光装置の実装方法及び光源装置
US9653661B2 (en) 2009-11-19 2017-05-16 Toyoda Gosei Co., Ltd. Light-emitting device, method of manufacturing the same, method of mounting the same and lighting device
US9093357B2 (en) 2010-01-22 2015-07-28 Sharp Kabushiki Kaisha Light emitting device
US9312304B2 (en) 2010-01-22 2016-04-12 Sharp Kabushiki Kaisha LED illuminating device comprising light emitting device including LED chips on single substrate
US9966367B2 (en) 2010-01-22 2018-05-08 Sharp Kabushiki Kaisha Light emitting device
US9679942B2 (en) 2010-01-22 2017-06-13 Sharp Kabushiki Kaisha Light emitting device
US9425236B2 (en) 2010-01-22 2016-08-23 Sharp Kabushiki Kaisha Light emitting device
US8426884B2 (en) 2010-09-01 2013-04-23 Hitachi Cable, Ltd. Light emitting diode with supporting substrate side electrodes and wiring structures
US8669568B2 (en) 2010-10-13 2014-03-11 Interlight Optotech Corporation Light emitting device usable for variable driving voltages
JP2012124248A (ja) * 2010-12-07 2012-06-28 Toppan Printing Co Ltd Ｌｅｄチップ搭載用リードフレーム基板及びその製造方法並びにｌｅｄパッケージ
JP2013096020A (ja) * 2011-10-28 2013-05-20 Sumita Optical Glass Inc ヘルメット
CN103427010A (zh) * 2012-05-14 2013-12-04 欧姆龙株式会社 紫外线照射装置及紫外线照射头
JP2018152586A (ja) * 2012-11-12 2018-09-27 晶元光電股▲ふん▼有限公司Ｅｐｉｓｔａｒ Ｃｏｒｐｏｒａｔｉｏｎ 半導体発光素子の製造方法
JP2014216493A (ja) * 2013-04-25 2014-11-17 スタンレー電気株式会社 半導体発光素子及び半導体発光装置
JP2014229626A (ja) * 2013-05-17 2014-12-08 スタンレー電気株式会社 半導体発光素子アレイ
JP2015019090A (ja) * 2014-08-22 2015-01-29 シャープ株式会社 発光装置
JP2016072269A (ja) * 2014-09-26 2016-05-09 日亜化学工業株式会社 発光装置及び発光装置用基板
US9484512B2 (en) 2014-09-26 2016-11-01 Nichia Corporation Light emitting device, and substrate for light emitting device
WO2017159129A1 (ja) * 2016-03-15 2017-09-21 ソニー株式会社 ガラス配線基板及びその製造方法、部品実装ガラス配線基板及びその製造方法、並びに、表示装置用基板
US10784403B2 (en) 2016-03-15 2020-09-22 Sony Corporation Glass wiring substrate, method of producing the same, part-mounted glass wiring substrate, method of producing the same, and display apparatus substrate
US11195971B2 (en) 2016-03-15 2021-12-07 Sony Corporation Glass wiring substrate, method of producing the same, part-mounted glass wiring substrate, method of producing the same, and display apparatus substrate
JP2017168620A (ja) * 2016-03-16 2017-09-21 豊田合成株式会社 発光装置およびその製造方法
JP2019083246A (ja) * 2017-10-30 2019-05-30 三菱電機株式会社 光源モジュールおよび照明器具
JP7225529B2 (ja) 2017-10-30 2023-02-21 三菱電機株式会社 光源モジュールおよび照明器具

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