JP2009051654A - Substrate carrying device and substrate inspection device - Google Patents

Substrate carrying device and substrate inspection device Download PDF

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JP2009051654A
JP2009051654A JP2007222302A JP2007222302A JP2009051654A JP 2009051654 A JP2009051654 A JP 2009051654A JP 2007222302 A JP2007222302 A JP 2007222302A JP 2007222302 A JP2007222302 A JP 2007222302A JP 2009051654 A JP2009051654 A JP 2009051654A
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substrate
holding mechanism
air
floating
transport
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JP5092627B2 (en
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Ryosuke Kobayashi
亮介 小林
Masaki Kono
正樹 河野
Yasuo Toda
保男 戸田
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Toppan Inc
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Toppan Printing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To inspect a substrate while carrying, without falling wide of the depth of field, by easily, inexpensively and stably carrying the substrate without vertical vibration, without constructing complicated mechanism and system, in an inspection using an ultra-high resolution camera of the narrow depth of field. <P>SOLUTION: This substrate inspection device has a substrate floating mechanism 3 for maintaining the substrate 2 in the constant height while floating the substrate 2 by blowout and suction of air, a substrate holding mechanism 4 for spatially holding the substrate 2 in the constant height by blowout and suction of air similarly to the substrate floating mechanism 3, a substrate gripping mechanism for fixing one end part of the substrate 2 protruded from one side surface of the substrate floating mechanism 3, a floating control part arranged adjacent to the one side surface of the substrate floating mechanism 3, supplying the air to the substrate floating mechanism 3 and the substrate holding mechanism 4 and sucking the air from the substrate floating mechanism 3 and the substrate holding mechanism 4, and an inspection part B for inspecting a surface of the substrate 2. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、例えば液晶ディスプレイパネルやプラズマディスプレイパネルなどのフラットパネルディスプレイ用の基板の欠陥検査を行う基板検査装置に関するものであり、特に大型基板を振動などによる上下変動無く安定して搬送するための装置に関するものである。   The present invention relates to a substrate inspection apparatus for inspecting defects of a substrate for a flat panel display such as a liquid crystal display panel or a plasma display panel, and in particular for stably transporting a large substrate without vertical fluctuation due to vibration or the like. It relates to the device.

基板を搬送する方法としては、従来はローラを用いたコンベアによる方法が主に用いられてきた。しかし、基板が大型化したことで、従来の方法にて搬送すると、例えば、搬送中の基板の重さのよる撓みや、搬送時の上下振動などにより、基板がローラに衝突してしまうことが原因として発生する搬送中の傷など、様々な問題が発生した。   As a method for transporting a substrate, conventionally, a method using a conveyor using rollers has been mainly used. However, due to the increase in size of the substrate, the substrate may collide with the rollers due to, for example, bending due to the weight of the substrate being transferred, vertical vibration during transfer, etc. Various problems occurred, such as scratches during transportation that occurred as a cause.

よって重さによる撓みや搬送中の上下振動が大きい大型基板に関しては、ローラを用いたコンベア搬送に替わり、全面をエアによって浮上させて搬送させる非接触による搬送技術が用いられてきている。   Therefore, for a large-sized substrate having large deflection due to weight and large vertical vibration during conveyance, a non-contact conveyance technique in which the entire surface is conveyed by air is used instead of conveyor conveyance using rollers.

また、フラットパネルディスプレイでは、例えばカラーフィルタなどでは、製造工程において欠陥などの検査が行われているが、近年画面の高精細化が進み、それに伴って検査機自体も高性能なものが求められている。具体的には5μm以下の欠陥を検査するような、分解能が3μm以下の超高分解能カメラと用いた検査機が品質保証の点から必須となってきている。   In flat panel displays, for example, color filters are inspected for defects in the manufacturing process. However, in recent years, screens have become higher in definition, and accordingly, inspection machines themselves are required to have high performance. ing. Specifically, an inspection machine using an ultra-high resolution camera with a resolution of 3 μm or less that inspects defects of 5 μm or less has become essential from the viewpoint of quality assurance.

基板のエア浮上による搬送により基板検査する技術は、国際公開番号WO2003/086917や特開2004−279335、特開2006−258632にすでに記載されている。   Techniques for inspecting a substrate by conveying the substrate by air levitation have already been described in International Publication Nos. WO2003 / 086917, JP-A-2004-279335, and JP-A-2006-258632.

国際公開番号W2003/086917号International Publication Number W2003 / 086917 特開2004−279335号JP 2004-279335 A 特開2006−258632号JP 2006-258632 A 特開2000−266691号JP 2000-266991 A

しかしながら、分解能が5μm以下の検査機用カメラは焦点深度が浅くまた、被写界深度も狭く、検査として撮像するためには、その被写界深度から外れないように安定した基板搬送が求められる。   However, an inspection machine camera with a resolution of 5 μm or less has a shallow depth of focus and a narrow depth of field, and in order to capture an image for inspection, stable substrate transport is required so as not to deviate from the depth of field. .

ローラによる基板搬送では接触搬送によりローラ自体の凹凸や設置状況などで、基板の搬送中の上下方向の変動が激しく、高分解能の検査用のカメラの被写界深度からはずれてしまう問題がある。また、上下変動による振動で、基板とローラとが衝突してしまい、基板に傷をつけてしまう可能性がある。   In the substrate conveyance by the roller, there is a problem that the vertical fluctuation during the conveyance of the substrate is severe due to the unevenness of the roller itself and the installation condition due to the contact conveyance, and it is deviated from the depth of field of the high resolution inspection camera. In addition, the substrate and the roller may collide with each other due to vibration caused by vertical fluctuation, and the substrate may be damaged.

そこで、搬送面とは接触しない、エア浮上に搬送が行われるようになった。当初の非接触にエア搬送技術は基板をエアの吹き出しにより基板を浮かせるだけであったので、基板の浮上精度むらが大きく、搬送中の浮上むらから発生する上下変動が起きてしまい、それによる搬送部との接触などの傷の問題や、振動による上下変動により検査面が検査用カメラの被写界深度からはずれてしまう問題があった。そこで、基板の浮上に関して、エアの吹き出しと同時に吸い込みも行うことで、浮上の上下変動をエアの吸い込み力によって抑える技術が開発された。この技術により高精度浮上のものに関しては、搬送時の浮上むらが、10μm以下まで抑えられるようになり、安定した基板搬送が出来るようになった。これにより検査面の被写界深度内から外れずに搬送することも可能となり、また搬送面との衝突も解消された。   Therefore, the conveyance is performed in the air levitation that does not contact the conveyance surface. In the first non-contact air transfer technology, the substrate was only floated by blowing air, so the floating accuracy of the substrate was large, and the vertical fluctuation caused by the floating unevenness during transfer occurred, and the transfer by that There is a problem of scratches such as contact with the part, and a problem that the inspection surface deviates from the depth of field of the inspection camera due to vertical fluctuation due to vibration. Therefore, a technology has been developed to suppress the vertical fluctuation of the flying height by the air sucking force by performing air sucking and sucking in relation to the substrate floating. With this technology, the non-uniformity of the floating during transportation can be suppressed to 10 μm or less with respect to the highly precise floating, and stable substrate transportation can be performed. As a result, the inspection surface can be transported without departing from the depth of field, and the collision with the transport surface is eliminated.

上記の技術にて、エア搬送による浮上ムラは解消され、安定した浮上精度にて基板を搬送できるようになったが、さらに分解能が3μm以下の超高分解能な検査を行う際の検査用カメラを用いる場合は、ガラスの厚みむら自体が超高分解能の検査用カメラの被写界深度以上にある場合には、基板を上下変動無く安定して搬送できたとしても、基板の厚みむら自体がすでに高分解能の検査用のカメラの被写界深度からはずれてしまうので、うまく撮像できない問題がある。そのような場合の解決技術としては、例えば特開2000−266691号広報に記載されている。   With the above technology, floating unevenness due to air conveyance has been eliminated, and the substrate can be conveyed with stable floating accuracy. However, an inspection camera for performing ultra-high resolution inspection with a resolution of 3 μm or less has been developed. When used, if the glass thickness variation itself is greater than the depth of field of the ultra-high resolution inspection camera, the substrate thickness variation itself is already present even if the substrate can be transported stably without vertical fluctuations. Since the depth of field of the high-resolution inspection camera is deviated, there is a problem that imaging cannot be performed well. As a solution technique in such a case, it is described in, for example, Japanese Patent Application Laid-Open No. 2000-266691.

上記特許文献では、高さ検出器を備えた焦点深度の深い撮像光学系の後に、焦点深度の浅い撮像系を設置し、前記焦点深度の深い撮像光学系に備えら高さ検出器にて検出された被検体の高さ変位情報に基づいて、前記焦点深度の浅い撮像光学系と被検体とを焦点方向に相対的に移動させて焦点合わせを行うことを特徴としている。   In the above-mentioned patent document, an imaging system with a shallow focal depth is installed after an imaging optical system with a deep focal depth provided with a height detector, and the height detector provided for the imaging optical system with a deep focal depth is used. Based on the height displacement information of the subject, focusing is performed by relatively moving the imaging optical system having a shallow depth of focus and the subject in the focus direction.

しかしながら、高さ検査を行う検査機と、その情報を基に移動する検査部の撮像光学系の動作制御機構や、その動作制御など、全体のシステムとして複雑かつ高価なものになってしまう。また、高さ測定場所と検査部とが、少なからずとも距離が離れているので、必ずしも高さ測定を行った場所のデータが検査部での高さデータに一致するとはいえない。特に超高分解能検査機用のカメラになると、数μmのズレにより焦点深度から外れてしまう可能性がある。   However, the overall system becomes complicated and expensive, such as an inspection machine that performs height inspection, an operation control mechanism of the imaging optical system of the inspection unit that moves based on the information, and operation control thereof. In addition, since the distance between the height measurement place and the inspection unit is at least a distance, it cannot be said that the data of the place where the height measurement has been performed necessarily coincides with the height data at the inspection unit. In particular, when a camera for an ultra-high resolution inspection machine is used, there is a possibility that it is out of the depth of focus due to a deviation of several μm.

そこで本発明は、基板を振動などの上下変動が少なく、また特開2000−266691号広報に記載されているような複雑なシステムを構築無く、容易に安価で安定した基板搬送することが可能な基板搬送装置を提供することを目的とする。   Therefore, the present invention is capable of easily and inexpensively and stably transporting a substrate without constructing a complicated system as described in Japanese Patent Laid-Open No. 2000-266691, with less vertical fluctuation such as vibration. An object is to provide a substrate transfer device.

請求項1によれば、基板搬送部に設置された基板を浮上させる基板浮上機構と、前記基板浮上機構上の対向する位置の少なくとも一部に、基板をはさむように設置された基板を非接触に空間保持させる基板保持機構と、前記基板の少なくとも片端部を保持して、一方向に前記基板を搬送する搬送機構を備えたことを特徴とする基板搬送装置である。   According to claim 1, the substrate floating mechanism for levitating the substrate installed in the substrate transport unit, and the substrate installed so as to sandwich the substrate between at least a part of the opposing positions on the substrate floating mechanism are contactless A substrate transport apparatus comprising: a substrate holding mechanism that holds the substrate in space; and a transport mechanism that transports the substrate in one direction while holding at least one end of the substrate.

請求項2によれば、前記基板保持機構は、複数の穴で構成された空気吹き出し部と、複数の穴で構成された空気吸い込み部を有することを特徴とする請求項1記載の基板搬送装置である。   According to a second aspect of the present invention, the substrate holding mechanism includes an air blowing portion constituted by a plurality of holes and an air suction portion constituted by a plurality of holes. It is.

請求項3によれば、前記浮上機構は、前記基板保持機構と対向する領域にあって複数の穴で構成された空気噴出し部を有する処理領域と、複数の穴で構成された空気噴出し部及び複数の穴で構成された空気吸い込み部を有する搬送領域とを有することを特徴とする請求項1又は2に記載の基板搬送装置である。   According to a third aspect of the present invention, the levitation mechanism includes a processing region having an air ejection portion configured by a plurality of holes in a region facing the substrate holding mechanism, and an air ejection configured by a plurality of holes. 3. The substrate transfer apparatus according to claim 1, further comprising: a transfer area having an air suction part configured by a plurality of holes and a plurality of holes.

請求項4によれば、前記基板浮上機構は、搬送する基板全面を浮上させるように配置され、前記基板保持機構は、搬送する基板の幅方向は全面、搬送方向は一部を保持するように配置されることを特徴とする請求項1から3のいずれかに記載の基板搬送装置である。   According to a fourth aspect of the present invention, the substrate floating mechanism is arranged so as to float the entire surface of the substrate to be transferred, and the substrate holding mechanism holds the entire surface in the width direction of the substrate to be transferred and a part in the transfer direction. 4. The substrate transfer device according to claim 1, wherein the substrate transfer device is arranged.

請求項5によれば、前記搬送機構は、前記基板面と垂直な方向に自由度を有する基板把持機構を備えることを特徴とする請求項1から4のいずれかに記載の基板搬送装置である。   According to claim 5, the substrate transport apparatus according to any one of claims 1 to 4, wherein the transport mechanism includes a substrate gripping mechanism having a degree of freedom in a direction perpendicular to the substrate surface. .

請求項6によれば、前記基板保持機構の搬送方向最上流側の空気吹き出し部の搬送方向側の端部が、テーパーカットされた形状になっていることを特徴とする請求項1から5のいずれかに記載の基板搬送装置である。   According to a sixth aspect of the present invention, the end portion on the transport direction side of the air blowing portion on the most upstream side in the transport direction of the substrate holding mechanism has a tapered shape. A substrate transfer apparatus according to any one of the above.

請求項7によれば、前記基板保持機構の一部にスリットである処理部が形成されていることを特徴とする請求項1または6のいずれかに記載の基板搬送装置である。   According to a seventh aspect of the present invention, in the substrate transfer apparatus according to any one of the first or sixth aspect, a processing unit that is a slit is formed in a part of the substrate holding mechanism.

請求項8によれば、請求項7に記載の基板搬送装置の処理部あるいは処理部の近傍に、撮像素子を配置した検査装置である。   According to an eighth aspect of the present invention, there is provided an inspection apparatus in which an image sensor is disposed in the processing section of the substrate transfer apparatus according to the seventh aspect or in the vicinity of the processing section.

請求項9によれば、基板保持機構の搬送方向断面は、基板側のスリット幅が、反対側のスリット幅よりも小さい逆テーパー形状となっていることを特徴とする請求項8に記載の検査装置である。   According to the ninth aspect of the present invention, the cross section in the transport direction of the substrate holding mechanism has a reverse taper shape in which the slit width on the substrate side is smaller than the slit width on the opposite side. Device.

請求項1に係わる発明によれば、基板浮上機構と基板保持機構とを基板製品面を挟むように上下に設置することで、上下変動が少なく安定して搬送が可能である。また全面浮上させるので基板の撓みによる影響も無く、製品に傷などをつける心配もない。   According to the first aspect of the present invention, the substrate floating mechanism and the substrate holding mechanism are installed vertically so as to sandwich the substrate product surface, so that the substrate can be stably conveyed with little vertical fluctuation. In addition, since the entire surface is floated, there is no influence of the bending of the substrate, and there is no worry of scratching the product.

請求項2に係わる発明によれば、空気噴出し部及び空気吸い込み部を有することで、基板を吸い込みの力にて引きつけて基板をある一定の高さに保持することが可能となる。このため、基板上面を一定の高さに安定させることができる。   According to the second aspect of the present invention, since the air blowing portion and the air suction portion are provided, the substrate can be attracted by the suction force and held at a certain height. For this reason, the upper surface of the substrate can be stabilized at a certain height.

請求項3に係わる発明によれば、エアの吹き出しにのみにより基板を浮上させるだけでは、エアの吹き出し量が搬送面全面で均一ではないので、浮上状態が安定しない。そこで吹き出しと同時に空気の吸い込みを行うことで、基板を吸い込みの力にて引きつけて基板をある一定の高さに浮上させることが実現できる。基板が前記基板浮上機構とそれに対向するように設置された前記基板保持機構の隙間を搬送する場合には、基板浮上機構は基板の重さを支えるようにエアを吹きだすようにする。一方基板保持機構は、基板が基板浮上機構により持ち上げられているので、基板自体の重さによる撓みを考慮しなくても、エアの吹き出しと吸い込みのバランスにより、基板保持機構の表面と基板との隙間をある一定のクリアランスになるように保つことが出来る。   According to the third aspect of the present invention, if the substrate is lifted only by air blowing, the air blowing amount is not uniform over the entire conveyance surface, so that the floating state is not stable. Therefore, by sucking air at the same time as blowing, it is possible to realize that the substrate is lifted to a certain height by attracting the substrate by the suction force. When the substrate is transported through the gap between the substrate floating mechanism and the substrate holding mechanism installed so as to face the substrate floating mechanism, the substrate floating mechanism blows air so as to support the weight of the substrate. On the other hand, in the substrate holding mechanism, since the substrate is lifted by the substrate floating mechanism, the balance between the surface of the substrate holding mechanism and the substrate can be obtained by the balance between the blowing of air and the suction without considering the deflection due to the weight of the substrate itself. The gap can be kept at a certain clearance.

請求項4に係わる発明によれば、基板は製品面が搬送方向上側になるようにして搬送されるので、基板保持機構が搬送路全面に対向するようには位置をしてしまうと、搬送途中に何らかの影響で基板の浮上状態が変化した場合に、製品面を傷つけてしまう恐れがあるが、必要な部分のみ基板保持機構を配置することで、基板上に基材保持機構がある面積が減るので、製品面に傷がつく可能性を減らすことができる。   According to the invention of claim 4, since the substrate is conveyed with the product surface on the upper side in the conveyance direction, if the substrate holding mechanism is positioned so as to face the entire conveyance path, If the floating state of the substrate changes for some reason, the product surface may be damaged. However, by placing the substrate holding mechanism only in the necessary part, the area where the base material holding mechanism is located on the substrate is reduced. Therefore, the possibility of scratching the product surface can be reduced.

請求項5に係わる発明によれば、基板を搬送するための基板狭持機構の搬送が、基板搬送面に対して垂直方向に上下変動しても、基板挟持機構が基板搬送面に対して垂直方向に自由自在に移動可能な機構となっているので、搬送機構における基板搬送面に対して垂直方向に変動が起きてしまっても、基板挟持機構がその変動分を吸収してしまうので、結果として基板の浮上量には影響を与ることがない。   According to the invention relating to claim 5, even if the transport of the substrate holding mechanism for transporting the substrate fluctuates vertically in the direction perpendicular to the substrate transport surface, the substrate holding mechanism is perpendicular to the substrate transport surface. Since the mechanism can move freely in any direction, even if a change occurs in the direction perpendicular to the substrate transfer surface in the transfer mechanism, the substrate clamping mechanism will absorb the change, resulting in a result. As a result, the flying height of the substrate is not affected.

請求項6に係わる発明によれば、基板が前記基板浮上機構と前記基板保持機構との隙間に入る際に、例えば基板浮上機構の基板の浮上ムラなどにより、基板の浮上量が大きくなってしまい、基板と基板保持機構とが衝突するような場合でも、基板保持機構の最上流側の空気吹き出し部の端部が斜めにテーパーカットされた形状になっているので、浮上量変化した状態で基板浮上機構と基板保持機構の隙間に基板が搬送されてきても、テーパーカットされた面が、誘い込みのガイドとなり、基板保持機構には接触しないで基板と基板浮上機構と基板保持機構との隙間に搬送することが可能となる。   According to the invention related to claim 6, when the substrate enters the gap between the substrate floating mechanism and the substrate holding mechanism, the floating amount of the substrate increases due to, for example, uneven floating of the substrate of the substrate floating mechanism. Even when the substrate and the substrate holding mechanism collide, the end of the air blowing portion on the uppermost stream side of the substrate holding mechanism has an obliquely tapered shape, so that the substrate can be moved in a state where the flying height has changed. Even if the substrate is transported to the gap between the levitation mechanism and the substrate holding mechanism, the taper-cut surface serves as a guiding guide, and the gap between the substrate, the substrate levitation mechanism, and the substrate holding mechanism does not contact the substrate holding mechanism. It can be transported.

請求項7に係わる発明によれば、搬送方向と直行する方向に、搬送する基板分のスリットが開いているので、例えば検査用カメラや検査用光源などを設置して、そのスリット分の隙間より透過検査などを行うことが可能となる。スリットの幅は、基板と基板保持機構とのクリアランスと保つために、出来る限り狭いほうがよい。   According to the invention according to claim 7, since the slit for the substrate to be transported is open in the direction perpendicular to the transport direction, for example, an inspection camera or an inspection light source is installed, and the gap for the slit is provided. It becomes possible to perform a transmission inspection and the like. The width of the slit should be as narrow as possible in order to maintain the clearance between the substrate and the substrate holding mechanism.

請求項8に係わる発明によれば、本発明の搬送装置を検査装置に用いることにより、搬送面上面と基板保持機構面とが一定のクリアランスで平行に保たれるために、ガラスの厚みむらは、検査面とは逆側の搬送面下面に表れるので、搬送上面からの検査に関しては、ガラスの厚みむらの影響がなくなる。よってカメラに対する検査面位置が常に一定となるために、超高分解能検査用のカメラの被写界深度からはずれることなく、安定して撮像が可能となる。   According to the invention according to claim 8, by using the transfer device of the present invention for the inspection device, the upper surface of the transfer surface and the substrate holding mechanism surface are kept parallel with a certain clearance. Since it appears on the lower surface of the conveyance surface opposite to the inspection surface, the influence of the glass thickness unevenness is eliminated with respect to the inspection from the upper surface of the conveyance. Accordingly, since the inspection surface position with respect to the camera is always constant, stable imaging can be performed without deviating from the depth of field of the ultra high resolution inspection camera.

請求項9に係わる発明によれば、基板保持機構のスリットの搬送方向側に幅が、空気噴出し部側から遠ざかるにしたがって広くなるようになっているので、例えば検査用のカメラおよび光源を基板搬送面の上側に設置するような正反射による撮像系にて検査を行った場合に、光を基板搬送面の垂直方向から斜めに傾けた位置に光源を設置しても、光源の光路を十分に確保することが出来るので、被検査基板の検査効率を向上することができる。   According to the ninth aspect of the present invention, since the width of the substrate holding mechanism on the side of the slit in the conveyance direction becomes wider as the distance from the air ejection portion increases, for example, an inspection camera and a light source are mounted on the substrate. When inspection is performed with an imaging system using specular reflection that is installed on the upper side of the transfer surface, the light path of the light source is sufficient even if the light source is installed at a position inclined obliquely from the vertical direction of the substrate transfer surface. Therefore, the inspection efficiency of the substrate to be inspected can be improved.

本発明装置は、基板搬送部に設置された基板を浮上させる基板浮上機構と、前記基板浮上機構上の対向する位置の少なくとも一部に、基板をはさむように設置された基板を非接触に空間保持させる基板保持機構とを備えている。このような構成とすることにより、次のような効果がある。
第一に、基板浮上機構及びこれを対向する基板保持機構によって、基板を両面から保持することとなり、上下変動の少ない安定した搬送が可能となる。
第二に、基板の上面から基板を保持するので、基板上面の位置が一定に保たれる。
The apparatus of the present invention includes a substrate levitation mechanism for levitating a substrate installed in the substrate transport unit, and a non-contact space between the substrate installed so as to sandwich the substrate at at least a part of the opposing position on the substrate levitation mechanism. And a substrate holding mechanism for holding the substrate. By adopting such a configuration, the following effects are obtained.
First, the substrate is held from both sides by the substrate floating mechanism and the substrate holding mechanism opposed to the substrate floating mechanism, and stable conveyance with little vertical fluctuation is possible.
Second, since the substrate is held from the upper surface of the substrate, the position of the upper surface of the substrate is kept constant.

上記本発明の搬送装置の基板保持機構の一部に、開口部つまりスリット状の処理部を設け、この処理部あるいは処理部の近傍位置に検査装置、塗布装置等の処理装置を配置することにより、それぞれの装置性能を向上させることができる。つまり、基板の上面位置が搬送時においても一定に安定しているために、カメラを用いた検査装置であれば焦点位置がずれない、ダイコータ、スリットコータ等を用いた塗布装置であれば、塗布ムラを抑制し、均一な塗工が可能となる等の効果を生じる。後述する実施例においては、本発明装置を表面検査装置に適用した具体例を示した。   By providing an opening, that is, a slit-shaped processing unit in a part of the substrate holding mechanism of the transfer device of the present invention, and arranging a processing device such as an inspection device or a coating device at a position near the processing unit or the processing unit. , The performance of each device can be improved. In other words, since the upper surface position of the substrate is constantly stable during transportation, the focus position does not shift if it is an inspection device using a camera, and if it is a coating device using a die coater, a slit coater, etc. The effect of suppressing unevenness and enabling uniform coating is produced. In the examples to be described later, specific examples in which the apparatus of the present invention is applied to a surface inspection apparatus are shown.

本発明装置について図1を用いて説明する。なお図1は理解を容易とするため、基板2の厚さおよび基板浮上機構3、基板保持機構4とのギャップを誇張している。   The apparatus of the present invention will be described with reference to FIG. 1 exaggerates the thickness of the substrate 2 and the gap between the substrate floating mechanism 3 and the substrate holding mechanism 4 for easy understanding.

まず図1(a)に示すように、基板浮上機構3の領域3−1上を基板2が浮上搬送されてくる。図1では、領域3−2〜3−4に、浮上機構と対向するように基板保持機構が部分的に設けられている。ここで浮上機構の最上流側の少なくとも空気吹き出し部の端部が斜めにテーパーカットされた形状であれば、テーパーカットされた面が、誘い込みのガイドとなり、基板保持機構には接触しないで基板と基板浮上機構と基板保持機構との隙間に搬送することが可能となる。浮上機構及び基板保持機構の具体例については実施例において詳細に説明するが、図に示されるように複数の空気噴き出し穴と、空気吸い込み穴を有する部材、及びこれらの動力源となるポンプによって実現することができる。なお、図1では基盤搬送機構は図示していないが、リニアガイド、リニアモータ等を用いて、少なくとも基板の片端部を保持して搬送するものなど公知の搬送機構を用いることができる。   First, as shown in FIG. 1A, the substrate 2 is levitated and conveyed on the area 3-1 of the substrate levitating mechanism 3. In FIG. 1, a substrate holding mechanism is partially provided in regions 3-2 to 3-4 so as to face the floating mechanism. Here, if at least the end of the air blowing part on the uppermost stream side of the levitation mechanism is taper-cut obliquely, the taper-cut surface serves as a guide for guiding and does not contact the substrate holding mechanism. It becomes possible to convey the gap between the substrate floating mechanism and the substrate holding mechanism. Specific examples of the levitation mechanism and the substrate holding mechanism will be described in detail in the embodiments. As shown in the figure, the levitation mechanism and the substrate holding mechanism are realized by a plurality of air ejection holes, members having air suction holes, and pumps serving as power sources thereof. can do. In addition, although the board | substrate conveyance mechanism is not illustrated in FIG. 1, well-known conveyance mechanisms, such as what hold | maintains and conveys at least one edge part of a board | substrate using a linear guide, a linear motor, etc., can be used.

次に図1(b)に示すように、基板浮上機構3の領域3−2に達した基板2の先端部は、基板保持機構4による吸着効果により基板浮上機構側に引き寄せられる。また、基板浮上機構が、基板浮上機構と対向する領域(処理領域)である領域3−2及び3−4において空気噴出しのみを有することにより、空気の吹き上げと浮上量が大きくなり、より基板保持の効果が大きくなる。このとき図1(c)に描かれている様に、実際には基板2の先端部が上方に極わずかに撓んだ状態となる。   Next, as shown in FIG. 1B, the tip of the substrate 2 that has reached the region 3-2 of the substrate floating mechanism 3 is attracted to the substrate floating mechanism side by the adsorption effect of the substrate holding mechanism 4. Further, since the substrate levitation mechanism has only air ejection in the regions 3-2 and 3-4, which are regions (processing regions) facing the substrate levitation mechanism, the air blow-up and the amount of levitation increase, and the substrate is further increased. The holding effect is increased. At this time, as shown in FIG. 1C, the tip of the substrate 2 is actually slightly bent upward.

更に図1(c)に示すように、基板2の先端部が基板浮上機構3および基板保持機構4の分断された空間の領域3−3まで達すると、基板保持機構4の吸着保持効果により、基板2の先端からある範囲までの領域は、基板保持機構4の表面に沿った状態となる。この領域では、基板浮上機構3からの空気の吹き出しにより基板2の自重がキャンセルされた状態となっており、かつ基板保持機構4からの空気の吹き出しと吸引とのバランスにより基板保持機構4の表面と基板2の上面は高精度に間隔が保たれている。つまり、処理部であるスリット部分では、例えば基板の先頭部分と、中央部分あるいは末尾部分とで基板の厚さが異なる場合であっても、基板保持機構と基板上面の間隔が一定に保たれるために、安定した検査測定等の処理を行うことが可能となる。なお、基板浮上機構は、処理部に該当する位置において、構成する処理装置に応じて図1に示されているように分割されていてもよい。   Further, as shown in FIG. 1C, when the tip of the substrate 2 reaches the region 3-3 of the divided space of the substrate floating mechanism 3 and the substrate holding mechanism 4, due to the suction holding effect of the substrate holding mechanism 4, A region from the tip of the substrate 2 to a certain range is in a state along the surface of the substrate holding mechanism 4. In this region, the weight of the substrate 2 is canceled by the air blowing from the substrate floating mechanism 3, and the surface of the substrate holding mechanism 4 is balanced by the balance between the air blowing from the substrate holding mechanism 4 and the suction. And the upper surface of the substrate 2 are maintained with high accuracy. That is, in the slit portion that is the processing unit, for example, even when the thickness of the substrate is different between the head portion and the center portion or the tail portion of the substrate, the distance between the substrate holding mechanism and the upper surface of the substrate is kept constant. Therefore, it is possible to perform processing such as stable inspection measurement. The substrate floating mechanism may be divided as shown in FIG. 1 at a position corresponding to the processing unit according to the processing apparatus to be configured.

続いて図1(d)に示すように、基板浮上機構3の領域3−5まで達した基板先端部は、基板保持機構4による基板の吸着効果がなくなるために、前記領域3−1の状態と同様に基板浮上機構3に沿って位置決め搬送される。以上のような各領域での基板2の状態が連続的に続くことによって、領域3−3における基板2の上面の高精度位置決め搬送が可能となり、高分解能の基板検査等の処理が実現できる。   Subsequently, as shown in FIG. 1D, the substrate tip that reaches the region 3-5 of the substrate floating mechanism 3 loses the effect of adsorbing the substrate by the substrate holding mechanism 4, so that the state of the region 3-1 is reached. In the same manner as described above, the substrate is positioned and conveyed along the substrate floating mechanism 3. By continuously maintaining the state of the substrate 2 in each region as described above, high-precision positioning and conveyance of the upper surface of the substrate 2 in the region 3-3 can be performed, and processing such as high-resolution substrate inspection can be realized.

以下、具体的な実施例を挙げて本発明に係る実施の形態の基板搬送装置について図面に基づいて説明する。   Hereinafter, a substrate transfer apparatus according to an embodiment of the present invention will be described with reference to the drawings with specific examples.

図2は基板の検査装置に適用した基板搬送装置の構成図である。   FIG. 2 is a configuration diagram of a substrate transfer apparatus applied to the substrate inspection apparatus.

本発明に係る基板搬送装置1は、空気の吹き出しおよび吸引によって基板2を浮上させながら一定の高さに維持する基板浮上機構3と、前記基板浮上機構3と同様に空気の吹き出しおよび吸引によって基板2を一定の高さで空間保持する基板保持機構4と、前記基板浮上機構3の一側面からはみ出した前記基板2の片端部を固定する基板把持機構5と、前記基板浮上機構3の一側面と隣接して設けられ、前記基固定機構5を介して前記基板2を搬送方向Xに沿った方向に搬送する基板搬送機構6と、前記基板浮上機構3および前記基板保持機構4への空気の供給および前記基板浮上機構3および前記基板保持機構4からの空気の吸引を行う浮上制御部Aと、前記基板2の表面検査を行う検査部Bを備える。   The substrate transfer apparatus 1 according to the present invention includes a substrate floating mechanism 3 that keeps the substrate 2 floating while air is blown and sucked, and a substrate that is blown and sucked by air as with the substrate floating mechanism 3. A substrate holding mechanism 4 that holds the space 2 at a constant height, a substrate gripping mechanism 5 that fixes one end portion of the substrate 2 that protrudes from one side surface of the substrate floating mechanism 3, and one side surface of the substrate floating mechanism 3 And a substrate transport mechanism 6 that transports the substrate 2 in the direction along the transport direction X via the base fixing mechanism 5, and the air to the substrate floating mechanism 3 and the substrate holding mechanism 4. A levitation control unit A that performs supply and suction of air from the substrate levitation mechanism 3 and the substrate holding mechanism 4 and an inspection unit B that performs surface inspection of the substrate 2 are provided.

次に前記基板浮上機構3および前記基板保持機構4の構造について図3を使用して説明する。なお、図3は前記基板浮上機構3および前記基板保持機構4の断面模式図であり、理解を容易にするために基板2の厚みおよび浮上量を誇張している。   Next, the structure of the substrate floating mechanism 3 and the substrate holding mechanism 4 will be described with reference to FIG. FIG. 3 is a schematic cross-sectional view of the substrate floating mechanism 3 and the substrate holding mechanism 4. In order to facilitate understanding, the thickness and the floating amount of the substrate 2 are exaggerated.

本発明の基板搬送装置1における前記基板浮上機構3は、矩形状の中空構造体であり、基板2と対向する表面3aおよび3bは無数の微細な孔の空いた板状の物質(例えば、多孔質カーボンや金属焼結体など)で形成されている。この表面3aおよび3bは内部の中空空間10および12と隣接されており、この中空空間10および12に接続されている配管10p、12pを通じて前記浮上制御部Aから圧力を与えることによって、表面3aおよび3bの全域に均一な上向きの空気流13および14を形成する事ができる。この上向きの空気流によって基板2をわずかに浮上させる事が可能となる。   The substrate levitation mechanism 3 in the substrate transfer apparatus 1 of the present invention is a rectangular hollow structure, and the surfaces 3a and 3b facing the substrate 2 are plate-like substances having numerous fine holes (for example, porous materials). Carbon or sintered metal). The surfaces 3a and 3b are adjacent to the internal hollow spaces 10 and 12, and by applying pressure from the levitation controller A through the pipes 10p and 12p connected to the hollow spaces 10 and 12, the surfaces 3a and 3b Uniform upward air flows 13 and 14 can be formed over the entire area 3b. This upward air flow makes it possible to slightly lift the substrate 2.

また前記基板浮上機構3において、前記基板保持機構4と対向する領域以外の表面3aには、10〜50mm程度の範囲で等間隔もしくは不規則な間隔で直径0.5〜2mm程度の吸引穴8が全域に設けられている。この吸引穴8は基板浮上機構3の内部に設けられた前記中空空間10とは導通しておらず、別に設けられた中空空間11と接続されており、前記浮上制御部Aによって配管11vを通じて中空空間11の内圧を下げることにより、前記吸引穴8から空気を吸い込む事ができる。   In the substrate floating mechanism 3, suction holes 8 having a diameter of about 0.5 to 2 mm are formed on the surface 3 a other than the region facing the substrate holding mechanism 4 at an equal interval or an irregular interval in the range of about 10 to 50 mm. Are provided throughout. The suction hole 8 is not electrically connected to the hollow space 10 provided in the substrate floating mechanism 3 and is connected to the hollow space 11 provided separately. The suction hole 8 is hollowed by the floating control unit A through the pipe 11v. By reducing the internal pressure of the space 11, air can be sucked from the suction hole 8.

そして前記表面3a全域から空気を吹き出すと同時に、前記吸引穴8からも空気の吸い込みを行うことにより、前記基板2の浮上量を高い精度で維持する事が可能となる。   By blowing air from the entire surface 3a and simultaneously sucking air from the suction hole 8, the flying height of the substrate 2 can be maintained with high accuracy.

本発明の基板搬送装置1における前記基板保持機構4は、前記基板浮上機構3と基本構造は等しく矩形状の中空構造体であり、該構造体下方の基板2と対向する表面4aは無数の微細な孔の空いた板状の物質(例えば、多孔質カーボンや金属焼結体など)で形成されている。この表面4aは内部の中空空間15隣接されており、この中空空間15に接続されている配管15pを通じて前記浮上制御部Aから圧力を与えることによって、表面4aの全域に均一な下向きの空気流17を形成する事ができる。   The substrate holding mechanism 4 in the substrate transfer apparatus 1 of the present invention is a hollow structure having the same basic structure as that of the substrate floating mechanism 3 and a rectangular hollow structure, and the surface 4a facing the substrate 2 below the structure is infinitely fine. It is formed of a plate-like substance having a perforated hole (for example, porous carbon or sintered metal). The surface 4a is adjacent to the internal hollow space 15, and by applying pressure from the levitation control unit A through a pipe 15p connected to the hollow space 15, a uniform downward air flow 17 over the entire surface 4a. Can be formed.

また前記基板保持機構4の表面4aには、数ミリ〜50mm程度の範囲で等間隔もしくは不規則な間隔で直径0.5〜2mm程度の吸引穴9が全域に設けられている。この吸引穴9は基板保持機構4の内部に設けられた前記中空空間15とは導通しておらず、別に設けられた中空空間16と接続されており、前記浮上制御部Aによって配管16vを通じて中空空間16の内圧を下げることにより、前記吸引穴9から空気を吸い込む事ができる。   The surface 4a of the substrate holding mechanism 4 is provided with suction holes 9 having a diameter of about 0.5 to 2 mm at equal intervals or irregular intervals in the range of several millimeters to 50 mm. The suction hole 9 is not electrically connected to the hollow space 15 provided in the substrate holding mechanism 4 and is connected to a hollow space 16 provided separately, and is hollowed by the levitation control unit A through the pipe 16v. By reducing the internal pressure of the space 16, air can be sucked from the suction hole 9.

そして前記吸引穴9から比較的大量の空気を吸い込むと同時に、前記表面4a全域からわずかに空気を吹き出すことにより、前記基板2を表面4aに近接した位置に高い精度で非接触に空間保持する事が可能となる。   A relatively large amount of air is sucked from the suction hole 9 and at the same time, a slight amount of air is blown out from the entire surface 4a to hold the substrate 2 in a non-contact space at a position close to the surface 4a with high accuracy. Is possible.

本発明の基板搬送装置1における前記基板把持機構5は、図2に示すように、少なくとも2つのブロック状の部材をエアーアクチュエーター等により基板2に垂直な方向に稼動させて基板2の端部を挟み込んで固定する挟持部、またはブロック状の部材に埋め込まれた吸着パッドによって基板2を吸着し、吸着パッドが収縮することで前記ブロック状部材に基板を当てて位置決めを行うことが可能な吸着部を2つ以上備えている。更に前記挟持部または前記吸着部は全体が基板2に垂直な方向に移動自在なフローティング構造を介して前記基板搬送機構6の稼動部分であるベースプレート7に固定されている。これにより搬送中の基板2の垂直方向位置と前記基板搬送機構6の垂直方向位置とのずれを吸収することが可能となり、基板2のより高精度な搬送が実現できる。   As shown in FIG. 2, the substrate gripping mechanism 5 in the substrate transport apparatus 1 of the present invention moves at least two block-shaped members in a direction perpendicular to the substrate 2 by an air actuator or the like to move the end of the substrate 2. A holding part that can be sandwiched and fixed, or an adsorbing part that can adsorb the substrate 2 by an adsorbing pad embedded in a block-like member and place the substrate on the block-like member when the adsorbing pad contracts to perform positioning 2 or more. Further, the holding part or the suction part is fixed to a base plate 7 which is an operating part of the substrate transport mechanism 6 through a floating structure which is movable in the direction perpendicular to the substrate 2 as a whole. As a result, it is possible to absorb the deviation between the vertical position of the substrate 2 being transferred and the vertical position of the substrate transfer mechanism 6, and more accurate transfer of the substrate 2 can be realized.

本発明の基板搬送装置1における基板搬送機構6は、図2に示すように、基板浮上機構3の一側面と隣接して設けられ、基板搬送方向Xに沿って基板2をムラ無く一定速度で搬送する一軸の搬送機構である。例えば、サーボモーターとボールネジの組み合わせに比べ速度変動の小さなリニアモータとリニアガイドの組み合わせが適している。しかしながら今後検査の要求精度が上がり超高分解能の検査機等に本搬送装置を適用させる場合などは、コアレスタイプのリニアモータにエア浮上ガイド等を組み合わせることも考えられる。   As shown in FIG. 2, the substrate transport mechanism 6 in the substrate transport apparatus 1 of the present invention is provided adjacent to one side surface of the substrate floating mechanism 3, and moves the substrate 2 along the substrate transport direction X at a constant speed without unevenness. It is a uniaxial transport mechanism for transporting. For example, a combination of a linear motor and a linear guide whose speed fluctuation is smaller than a combination of a servo motor and a ball screw is suitable. However, in the future, when the required accuracy of inspection will increase and this transfer device will be applied to an ultra-high resolution inspection machine, it may be possible to combine an air levitation guide with a coreless type linear motor.

本発明の基板搬送装置1における前記浮上制御部Aは、図2に示すように、基板浮上機構3の中へ圧縮空気を供給する圧空経路25と、基板浮上機構3から空気を吸引排気する排気経路26と、基板保持機構4の中へ圧縮空気を供給する圧空経路32と、基板保持機構4から空気を吸引排気する排気経路33を備える。なお、図2において前記浮上制御部Aは説明のために基板搬送装置1の機側空間に配置されているが、実際には基板搬送装置1の下、もしくは別体の筐体に収まる。   As shown in FIG. 2, the levitation control unit A in the substrate transfer apparatus 1 of the present invention has a compressed air path 25 that supplies compressed air into the substrate levitation mechanism 3 and an exhaust that sucks and exhausts air from the substrate levitation mechanism 3. A path 26, a compressed air path 32 for supplying compressed air into the substrate holding mechanism 4, and an exhaust path 33 for sucking and exhausting air from the substrate holding mechanism 4 are provided. In FIG. 2, the levitation control unit A is disposed in the machine-side space of the substrate transfer apparatus 1 for the sake of explanation, but actually, it is housed under the substrate transfer apparatus 1 or in a separate housing.

前記圧空経路25の上流側には供給圧力を調整する圧力調整弁23と、配管を分岐して基板浮上機構3に圧空を分配供給するマニホールド24を備える。また前記排気経路26の上流側には空気吸引の動力源となるブロアーポンプ21と、吸い込み流量および圧力を調整するボールバルブ22が具備されている。供給圧力および吸い込み流量を調整することにより、前記基板浮上機構3上の基板の浮上精度を高める事が可能となる。   On the upstream side of the compressed air path 25, there are provided a pressure adjusting valve 23 for adjusting the supply pressure, and a manifold 24 for branching the piping to distribute and supply the compressed air to the substrate floating mechanism 3. A blower pump 21 serving as a power source for air suction and a ball valve 22 for adjusting the suction flow rate and pressure are provided upstream of the exhaust passage 26. By adjusting the supply pressure and the suction flow rate, the floating accuracy of the substrate on the substrate floating mechanism 3 can be increased.

前記圧空経路32の上流側には供給圧力を調整する圧力調整弁30と、配管を分岐して基板保持機構4に圧空を分配供給するマニホールド31を備える。また前記排気経路33の上流側には空気吸引の動力源となるブロアーポンプ27と、吸い込み流量および圧力を調整するボールバルブ28が具備されている。供給圧力および吸い込み流量を調整することにより、前記基板保持機構4下の基板2の空中保持精度を高める事が可能となる。また前記排気経路33の途中にある容積を持ったチャンバー29を設けることにより前記基板保持機構内の圧力変動を小さくして、更に高精度に基板2の空中保持搬送が可能となる。   A pressure adjusting valve 30 that adjusts the supply pressure and a manifold 31 that branches the piping and distributes and supplies the compressed air to the substrate holding mechanism 4 are provided on the upstream side of the compressed air path 32. Further, on the upstream side of the exhaust path 33, a blower pump 27 serving as a power source for air suction and a ball valve 28 for adjusting the suction flow rate and pressure are provided. By adjusting the supply pressure and the suction flow rate, the air holding accuracy of the substrate 2 under the substrate holding mechanism 4 can be increased. Further, by providing the chamber 29 having a volume in the middle of the exhaust path 33, the pressure fluctuation in the substrate holding mechanism can be reduced, and the substrate 2 can be held and transported in the air with higher accuracy.

本発明の基板搬送装置1における前記検査部Bは、図2に示すように、基板搬送機構6、基板浮上機構3および基板保持機構4を搬送方向Xに垂直な幅方向に跨ぐように設置された梁状部材40によって基板浮上機構3の上面より所定の高さ位置に設けられ、基板2の上面を撮像するカメラ装置41と、図示しない取り付け部材によって基板浮上機構3の上面よりも下方に設けられ、前記カメラ装置7の導光方向に光を照射する光源42を備える。また、カメラ装置42は搬送面に垂直な方向の位置調整および搬送方向xと平行な回転軸周りの角度調整自在なアライメントステージ43を介して梁状部材40に固定されている。   As shown in FIG. 2, the inspection section B in the substrate transport apparatus 1 of the present invention is installed so as to straddle the substrate transport mechanism 6, the substrate floating mechanism 3, and the substrate holding mechanism 4 in the width direction perpendicular to the transport direction X. The beam-like member 40 is provided at a predetermined height position from the upper surface of the substrate floating mechanism 3, and is provided below the upper surface of the substrate floating mechanism 3 by a camera device 41 that images the upper surface of the substrate 2 and an attachment member (not shown). And a light source 42 for irradiating light in the light guide direction of the camera device 7. The camera device 42 is fixed to the beam-like member 40 via an alignment stage 43 that can adjust the position in the direction perpendicular to the transport surface and adjust the angle around the rotation axis parallel to the transport direction x.

次に前記基板浮上機構3と前記基板保持機構4の形状および配置について、図3および図4を用いて詳細に説明する。   Next, the shape and arrangement of the substrate floating mechanism 3 and the substrate holding mechanism 4 will be described in detail with reference to FIGS.

前記基板浮上機構3は、図3に示すように、搬送路上の全域もしくは高精度の搬送が必要なプロセスを行う領域に、空気吹き出しおよび吸い込み孔のある表面3a、3bを上向きにして水平に配置される(図3では一部分のみ抽出して記載)。なお本発明の基板搬送装置1を基板の検査装置に適用した場合、基板浮上機構3は前記検査部Bの光源42の取り付けスペース37を確保するため、搬送方向上流側と下流側に分断された状態で配置される。   As shown in FIG. 3, the substrate levitation mechanism 3 is horizontally arranged with the surfaces 3a and 3b having air blowing and suction holes facing upward in the entire area on the conveyance path or in an area where a process requiring high precision is required. (In FIG. 3, only a part is extracted and described). In addition, when the board | substrate conveyance apparatus 1 of this invention is applied to the board | substrate inspection apparatus, in order to ensure the attachment space 37 of the light source 42 of the said test | inspection part B, the board | substrate floating mechanism 3 was divided | segmented into the conveyance direction upstream and downstream Arranged in a state.

前記基保持機構4は、図3に示すように、基板浮上機構3の上方に一定の距離36を離して、空気吹き出しおよび吸い込み孔のある表面4aを下向きにした状態で基板浮上機構に平行に配置される。なお本発明の基板搬送装置1を基板の検査装置に適用した場合、基板保持機構4は前記検査部Bのカメラ装置41の取り付けスペース38を確保するため、搬送方向上流側と下流側に分断された状態で配置される。   As shown in FIG. 3, the base holding mechanism 4 is separated from the substrate floating mechanism 3 by a predetermined distance 36 and parallel to the substrate floating mechanism with the surface 4a having air blowing and suction holes facing downward. Be placed. When the substrate transport apparatus 1 of the present invention is applied to a substrate inspection apparatus, the substrate holding mechanism 4 is divided into an upstream side and a downstream side in the transport direction in order to secure a mounting space 38 for the camera device 41 of the inspection unit B. It is arranged in the state.

また、上流側と下流側に分断された基板保持機構4のスペース38に接する側面39は、撮像用のカメラ装置(撮像素子)41の光路確保のため、カメラ装置41に近づくにつれて開く形で傾斜した状態となっている。なお搬送精度を保つため、分断された基板保持機構4の間隔はできるだけ小さい事が理想であるが、最低でもカメラ装置41の撮像視野幅以上は必要となる。   Further, the side surface 39 that contacts the space 38 of the substrate holding mechanism 4 divided into the upstream side and the downstream side is inclined so as to open as it approaches the camera device 41 in order to secure the optical path of the camera device (imaging device) 41 for imaging. It has become a state. In order to maintain the conveyance accuracy, it is ideal that the distance between the divided substrate holding mechanisms 4 is as small as possible, but at least the imaging field width of the camera device 41 is required.

更に基板保持機構4の空気吹き出しおよび吸い込み孔のある表面4aにおいて、2つに分断された各々の領域で前記スペース38と逆側の端部にテーパーが設けられているため、万が一基板2の浮上量が規定よりも大きくなってしまった場合でも、前記テーパーに沿って誘い込まれるため、基板2が基板保持機構4に衝突する事が無くなる。   Further, on the surface 4a having the air blowing and suction holes of the substrate holding mechanism 4, a taper is provided at the end opposite to the space 38 in each of the two divided regions. Even when the amount is larger than the specified value, the substrate 2 is not drawn into the substrate holding mechanism 4 because it is drawn along the taper.

本発明の基板搬送装置1において前記基板浮上機構3と前記基板保持機構4との間隔は非常に重要であり、図4に示すように、基板2が基板浮上機構3と基板保持機構との間を通過するためには、それらの間隔36は少なくとも基板2の厚さ36aと基板2の浮上量36bの合計よりも大きくなければならない。ただし本発明の基板搬送装置1においては基板浮上機構3上を基板2が通過する際は基板2の下面位置基準で搬送され、基板保持機構4の設置範囲を通過する際は基板上面位置基準で搬送されることを目標にしているため、願わくは前記間隔36は基板2の厚さ36aと基板2の浮上量36bと基板2の基板保持機構4による空間保持間隔36cの合計よりも数μm程度大きい値が望ましい。   In the substrate transfer apparatus 1 of the present invention, the distance between the substrate floating mechanism 3 and the substrate holding mechanism 4 is very important. As shown in FIG. 4, the substrate 2 is located between the substrate floating mechanism 3 and the substrate holding mechanism. In order to pass through, the distance 36 must be at least larger than the sum of the thickness 36a of the substrate 2 and the flying height 36b of the substrate 2. However, in the substrate transfer apparatus 1 of the present invention, when the substrate 2 passes over the substrate floating mechanism 3, the substrate 2 is transferred based on the lower surface position of the substrate 2, and when passing through the installation range of the substrate holding mechanism 4, the substrate upper surface position is determined. The distance 36 is preferably several micrometers larger than the sum of the thickness 36 a of the substrate 2, the flying height 36 b of the substrate 2, and the space holding distance 36 c of the substrate 2 by the substrate holding mechanism 4. A value is desirable.

次に図5を用いて、本発明の基板搬送装置1を基板の検査装置に適用した場合の検査部Bの構成(カメラ装置、光源の配置)について説明する。図5aは基板2の上面を透過光で高精度に検査するための構成であり、カメラ装置41が基板保持機構4の上方に垂直下向きに設置され、光源42が基板浮上機構3の分断されたスペース37の位置にカメラ装置41の方向へ光を照射できるように設置される。また図5bは基板2の上面を正反射光で高精度に検査するための構成であり、カメラ装置41および光源42が基板保持機構4の上方に、基板搬送面に垂直でかつスペース38の中央を通る面に対して対称となるように一定の角度をつけた状態で設置される。また図5cは基板2の上面を透過光で高精度に検査するための構成であり、同軸落照射用プリズムを内蔵したカメラ装置41が基板保持機構4の上方に垂直下向きに設置され、光源42は光ファイバー等を介して前記カメラ装置41に接続されている。いずれの構成の場合も、検査部Bにおいて基板2の上面を基板保持機構4の表面4aに高精度に間隔を保ちながら沿わせて搬送させることにより、カメラ装置41の焦点位置において基板2の上面位置変動を限りなく小さくする事で、カメラ装置42の焦点位置追従機構なしに、固定のままで超高分解能の検査が実現できる。   Next, the configuration of the inspection unit B (arrangement of camera device and light source) when the substrate transport apparatus 1 of the present invention is applied to a substrate inspection apparatus will be described with reference to FIG. FIG. 5 a shows a configuration for inspecting the upper surface of the substrate 2 with transmitted light with high accuracy. The camera device 41 is installed vertically above the substrate holding mechanism 4, and the light source 42 is divided by the substrate floating mechanism 3. It is installed at the position of the space 37 so that light can be irradiated in the direction of the camera device 41. FIG. 5b shows a configuration for inspecting the upper surface of the substrate 2 with specular reflection light with high accuracy. The camera device 41 and the light source 42 are located above the substrate holding mechanism 4 and perpendicular to the substrate transport surface and in the center of the space 38. It is installed at a certain angle so as to be symmetric with respect to the plane passing through. FIG. 5c shows a configuration for inspecting the upper surface of the substrate 2 with transmitted light with high accuracy. A camera device 41 having a coaxial falling illumination prism is installed vertically above the substrate holding mechanism 4 and a light source 42. Is connected to the camera device 41 via an optical fiber or the like. In any configuration, the upper surface of the substrate 2 is transported along the surface 4a of the substrate holding mechanism 4 while keeping a high accuracy in the inspection unit B, so that the upper surface of the substrate 2 is located at the focal position of the camera device 41. By making the position fluctuation as small as possible, it is possible to realize an ultra-high resolution inspection without changing the focal position tracking mechanism of the camera device 42.

また、基板保持機構の搬送方向断面は、基板側の開口幅が、反対側の開口幅よりも小さい逆テーパー形状となっていることが好ましい。これは、基板保持する面をできるだけ大きく取ることにより、処理部での上面位置の安定性を向上し、なおかつ逆テーパー形状であれば、検出光の光路の障害とならないという効果があるためである。特に、図5の(b)のように斜め入射の装置構成によって検査する場合に効果的である。   The cross section in the transport direction of the substrate holding mechanism preferably has a reverse tapered shape in which the opening width on the substrate side is smaller than the opening width on the opposite side. This is because the surface holding position of the substrate is made as large as possible to improve the stability of the upper surface position in the processing section, and if it has an inversely tapered shape, there is an effect that it does not hinder the optical path of the detection light. . In particular, this is effective when inspecting with an obliquely incident apparatus configuration as shown in FIG.

同上基板搬送装置において基板の浮上位置決め状態を順に示した断面模式図。The cross-sectional schematic diagram which showed the floating positioning state of the board | substrate in order in the board | substrate conveyance apparatus same as the above. 本発明による基板搬送装置の実施例を示す概略斜視図。The schematic perspective view which shows the Example of the board | substrate conveyance apparatus by this invention. 同上基板搬送装置の基板浮上機構および基板保持機構の断面模式図。The cross-sectional schematic diagram of the board | substrate floating mechanism and board | substrate holding | maintenance mechanism of a board | substrate conveyance apparatus same as the above. 同上基板搬送装置の基板浮上機構、基板保持機構、基板との間隔を示す断面模式図。The cross-sectional schematic diagram which shows the space | interval with the board | substrate floating mechanism, board | substrate holding mechanism, and board | substrate of a board | substrate conveyance apparatus same as the above. 同上基板搬送装置におけるカメラおよび光源の配置例を示した断面模式図Cross-sectional schematic diagram showing an example of the arrangement of cameras and light sources in the same substrate transport apparatus

符号の説明Explanation of symbols

1… 基板搬送装置
2… 基板
3… 基板浮上機構
3a… 表面(基板浮上機構)
3b… 表面(基板浮上機構)
4… 基板保持機構
4a… 表面(基板保持機構)
5… 基板把持機構
6… 基板搬送機構
7… ベースプレート
8… 吸引穴(基板浮上機構)
9… 吸引穴(基板保持機構)
10… 中空空間(基板浮上機構:吹き上げ)
10p… 配管(基板浮上機構:吹き上げ)
11… 中空空間(基板浮上機構:吸引)
11v… 配管(基板浮上機構:吸引)
12… 中空空間(基材浮上機構:吹き上げ)
12p… 配管(基材浮上機構:吹き上げ)
13… 空気流(基板浮上機構:吹き上げ)
14… 空気流(基板浮上機構:吹き上げ)
15… 中空空間(基板保持機構:吹き上げ)
15p… 配管(基材保持機構:吹き上げ)
16… 中空空間(基板保持機構:吸引)
16v… 配管(基板保持機構:吸引)
17… 空気流(基板保持機構:吹き上げ)
21… ブロアーポンプ
22… ボールバルブ
23… 圧力調整弁
24… マニホールド
25… 圧空経路
26… 排気経路
27… ブロアーポンプ
28… ボールバルブ
29… チャンバー
30… 圧力調整弁
31… マニホールド
32… 圧空経路
33… 排気経路
37… スペース
38… スペース
39… 側面
41… カメラ装置(撮像素子)
42… 光源
43… アライメントステージ
DESCRIPTION OF SYMBOLS 1 ... Substrate conveyance apparatus 2 ... Substrate 3 ... Substrate floating mechanism 3a ... Surface (substrate floating mechanism)
3b ... Surface (substrate floating mechanism)
4 ... Substrate holding mechanism 4a ... Surface (substrate holding mechanism)
5 ... Substrate gripping mechanism 6 ... Substrate transport mechanism 7 ... Base plate 8 ... Suction hole (Substrate floating mechanism)
9 ... Suction hole (substrate holding mechanism)
10 ... Hollow space (substrate floating mechanism: blowing up)
10p ... Piping (substrate floating mechanism: blowing up)
11 ... Hollow space (substrate floating mechanism: suction)
11v ... Piping (substrate floating mechanism: suction)
12 ... Hollow space (base floating mechanism: blowing up)
12p ... Piping (base levitation mechanism: blowing up)
13 ... Air flow (substrate floating mechanism: blowing up)
14 ... Air flow (substrate floating mechanism: blowing up)
15 ... Hollow space (substrate holding mechanism: blowing up)
15p ... Piping (base material holding mechanism: blowing up)
16 ... Hollow space (substrate holding mechanism: suction)
16v ... Piping (substrate holding mechanism: suction)
17 ... Air flow (substrate holding mechanism: blowing up)
21 ... Blower pump 22 ... Ball valve 23 ... Pressure adjustment valve 24 ... Manifold 25 ... Pressure air passage 26 ... Exhaust passage 27 ... Blower pump 28 ... Ball valve 29 ... Chamber 30 ... Pressure adjustment valve 31 ... Manifold 32 ... Pressure air passage 33 ... Exhaust Path 37 ... Space 38 ... Space 39 ... Side 41 ... Camera device (imaging device)
42 ... Light source 43 ... Alignment stage

Claims (9)

基板搬送部に設置された基板を浮上させる基板浮上機構と、前記基板浮上機構上の対向する位置の少なくとも一部に、基板をはさむように設置された基板を非接触に空間保持させる基板保持機構と、前記基板の少なくとも片端部を保持して、一方向に前記基板を搬送する搬送機構を備えたことを特徴とする基板搬送装置。   A substrate levitating mechanism for levitating a substrate installed in the substrate transport unit, and a substrate holding mechanism for holding the substrate installed so as to sandwich the substrate in a non-contact space at least at a part of the opposing position on the substrate levitating mechanism And a transport mechanism that transports the substrate in one direction while holding at least one end of the substrate. 前記基板保持機構は、複数の穴で構成された空気吹き出し部と、複数の穴で構成された空気吸い込み部とを有することを特徴とする請求項1記載の基板搬送装置。   The substrate transfer apparatus according to claim 1, wherein the substrate holding mechanism includes an air blowing portion constituted by a plurality of holes and an air suction portion constituted by a plurality of holes. 前記浮上機構は、前記基板保持機構と対向する領域にあって複数の穴で構成された空気噴出し部を有する処理領域と、複数の穴で構成された空気噴出し部及び複数の穴で構成された空気吸い込み部を有する搬送領域とを有することを特徴とする請求項1又は2に記載の基板搬送装置。   The levitation mechanism includes a processing region having an air ejection portion configured by a plurality of holes in a region facing the substrate holding mechanism, an air ejection portion configured by a plurality of holes, and a plurality of holes. The substrate transfer apparatus according to claim 1, further comprising a transfer region having an air suction portion. 前記基板浮上機構は、搬送する基板全面を浮上させるように配置され、前記基板保持機構は、搬送する基板の幅方向は全面、搬送方向は一部を保持するように配置されることを特徴とする請求項1から3のいずれかに記載の基板搬送装置。   The substrate floating mechanism is arranged so as to float the entire surface of the substrate to be transported, and the substrate holding mechanism is disposed so as to hold the entire surface in the width direction of the substrate to be transported and a part in the transport direction. The substrate transfer apparatus according to claim 1. 前記搬送機構は、前記基板面と垂直な方向に自由度を有する基板把持機構を備えることを特徴とする請求項1から4のいずれかに記載の基板搬送装置。   The substrate transport apparatus according to claim 1, wherein the transport mechanism includes a substrate gripping mechanism having a degree of freedom in a direction perpendicular to the substrate surface. 前記基板保持機構の搬送方向最上流側の空気吹き出し部の搬送方向側の端部が、テーパーカットされた形状になっていることを特徴とする請求項1から5のいずれかに記載の基板搬送装置。   6. The substrate transport according to claim 1, wherein an end of the air blowing portion on the most upstream side in the transport direction of the substrate holding mechanism has a tapered shape. apparatus. 前記基板保持機構の一部にスリットである処理部が形成されていることを特徴とする請求項1または6のいずれかに記載の基板搬送装置。   The substrate transfer apparatus according to claim 1, wherein a processing unit that is a slit is formed in a part of the substrate holding mechanism. 請求項7に記載の基板搬送装置の処理部あるいは処理部の近傍に、撮像素子を配置した検査装置。   The inspection apparatus which has arrange | positioned the image pick-up element in the processing part of the board | substrate conveyance apparatus of Claim 7, or the vicinity of a processing part. 基板保持機構の搬送方向断面は、基板側のスリット幅が、反対側のスリット幅よりも小さい逆テーパー形状となっていることを特徴とする請求項8に記載の検査装置。

9. The inspection apparatus according to claim 8, wherein a cross section in the transport direction of the substrate holding mechanism has a reverse taper shape in which the slit width on the substrate side is smaller than the slit width on the opposite side.

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