JP2012127761A - Substrate inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve inspection accuracy by stably floating a substrate with air jet when the substrate is conveyed.SOLUTION: In a substrate inspection device, air jet shift plate means having a plurality of openings that allow inspection light to pass therethrough is disposed in an inspection area located halfway through air floating stage means in such a manner that the air jet shift plate means can be shifted in the direction perpendicular to that in which a substrate is conveyed. A defect in a predetermined area of the substrate can be inspected by shifting the air jet shift plate means and moving optical means in association with the plurality of openings. The air floating stage means is composed of a plurality of divided rectangular air jet plates and the air jetted out from an air jet hole is effectively discharged through between the air jet plates. The number of the openings is decided so that one shift of the air jet shift plate means can cover a whole scanning area of the substrate to be inspected. The air floating stage means conveys the substrate with one or both sides of the substrate supported.

Description

  The present invention relates to a substrate inspection apparatus for inspecting defects on a production line such as a glass substrate and a plastic substrate used for manufacturing a display panel or the like.

  Manufacture of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electro Luminescence) display panel substrates, etc. for liquid crystal display devices used as display panels is a glass substrate by photolithography technology. Or by forming a pattern on a plastic substrate or the like. At that time, if a defect such as a scratch or a foreign substance exists on the substrate, the pattern is not formed well, which causes a defect. For this reason, a substrate inspection apparatus is used to inspect defects such as scratches and foreign matter on the substrate.

  The substrate inspection apparatus irradiates a substrate with inspection light such as laser light and receives reflected light or scattered light from the substrate to detect defects such as scratches or foreign matter on the substrate. Since the substrate is scanned with the inspection light, it takes time to inspect the entire substrate. Therefore, conventionally, it has been difficult to inspect for defects in a substrate in real time on a production line for a glass substrate, a plastic substrate or the like, or on a production line for a display panel substrate using these substrates. Therefore, as described in Patent Document 1, information on particles for some unit regions scanned by a camera for each glass substrate in-line is converted into data, and information on particles for all regions of the glass substrate is converted into data. A method has been proposed in which particle information of the entire glass substrate is measured by displaying as a statistical numerical value.

JP 2005-164558 A JP 2010-06660023 A

  Many conventional conventional foreign matter inspection devices have been operated in a separate and independent form from the production line, and when performing inspection and measurement, the glass substrate is extracted from the production line and the inspection device is used using a transfer device or the like. It was necessary to put it in and inspect it. It is common to inspect the entire surface of a glass substrate, which requires a lot of time for operations such as transport / inspection operations and inspection processing, and the glass substrate must be extracted from the production line once. In terms of operation management, it was inefficient. Further, when measuring a local position in the glass substrate, the conventional inspection apparatus has to bother to perform a full inspection, and this also results in wasted time.

  Accordingly, the applicant of the present application has applied for the invention described in Patent Document 2 for the purpose of promptly inspecting defects in the substrate within the line. The invention described in Patent Document 2 stores the detected defect data of the substrate in the scanning region for each scanning region, and stores the same data stored for each substrate by the newly detected substrate defect data in the scanning region. By updating the defect data of the substrate in the scanning region and generating defect data for one substrate from the defect data of the substrate in a plurality of scanning regions, the defect data for one substrate is generated for each substrate. Therefore, the inspection of the defect of the substrate in the line can be performed more quickly. The substrate inspection apparatus described in Patent Document 2 includes two series of optical systems, a plurality of openings for each optical system, and the arrangement of the two series of openings is staggered. By doing so, a quick inspection is performed. However, since a plurality of air outlets are provided on the upper surface of the stage that moves the glass substrate in the movement direction (X direction), it is necessary to provide openings in each of the two systems of optical systems in the inspection area. The number of air outlets will be reduced, the deflection of the glass substrate due to its own weight will increase, the surface accuracy will become rough, and this may hinder high-precision inspection. Further, the substrate inspection apparatus described in Patent Document 2 needs to provide two expensive optical systems.

  An object of this invention is to provide the board | substrate inspection apparatus which can improve a test | inspection precision by stabilizing the air floating at the time of board | substrate conveyance.

A first feature of the substrate inspection apparatus according to the present invention is that air floating stage means for moving the substrate from the upstream line to the downstream line while blowing the air jet from the air blowing port to the lower surface of the substrate and projecting light is provided. An optical system means comprising a system and a light receiving system is moved to irradiate a predetermined portion of the substrate with inspection light, receive reflected light or scattered light from the substrate, and receive the reflected light or scattered light from the substrate A substrate inspection apparatus comprising: a substrate inspection device for inspecting a defect of the substrate based on the plurality of openings for passing the inspection light applied to the substrate from the optical system means; Air jet shift plate means provided with the air outlet at a location, wherein the air jet shift is configured to be shiftable in a direction perpendicular to the moving direction of the substrate Means is provided in an inspection area by the optical system means in the middle of the air levitation stage means, the air ejection shift plate means is shifted and the optical system means is moved in association with the opening. In other words, a defect in a predetermined area is inspected.
The substrate inspection apparatus according to the present invention performs measurement for a predetermined scanning region on each glass substrate in an inspection area on a fluid production line in which the substrate is sequentially levitated and moved from the upstream line to the downstream line. Do. When a gap serving as an opening for allowing inspection light to pass therethrough is provided in the middle of the air levitation stage means, there is no air outlet at the position where the gap is provided, and when the air levitation substrate passes therethrough As a result, the tip of the substrate gets caught in the gap, and there is a risk that stable air levitation transfer cannot be performed. Therefore, in the present invention, an air ejection shift plate means having a plurality of openings through which inspection light passes is provided in the inspection area in the middle of the air levitation stage means so as to be shiftable in a direction perpendicular to the moving direction of the substrate. Then, the air ejection shift plate means is shifted and the optical system means is moved in correspondence with the opening, thereby inspecting a defect in a predetermined region of the substrate. As a result, the substrate being transported stably floats on the air, and the inspection accuracy can be improved.

  A second feature of the substrate inspection apparatus according to the present invention is the substrate inspection device according to the first feature, wherein the air levitation stage is divided in a direction perpendicular to the moving direction of the substrate. A plurality of air ejection plate means. This is because the air ejected from the air ejection plates is efficiently discharged from the air ejection plates by configuring the air levitation stage with a plurality of divided air ejection plates. The air ejection plate may be provided with air ejection holes made up of a large number of pores in a zigzag pattern, and the air adsorption holes for adsorbing the ejection air may be arranged in a zigzag pattern so as to alternate with the ejection holes.

  A third feature of the substrate inspection apparatus according to the present invention is the substrate inspection device according to the first or second feature, wherein the air ejection shift plate means shifts once to perform full scanning of the substrate. The number of the openings that can correspond to the inspection of the area is provided. This prescribes the number of numerical apertures provided in the air ejection shift plate means so that the entire scanning region of the substrate can be covered by one shift movement.

  According to a fourth feature of the substrate inspection apparatus of the present invention, in the substrate inspection apparatus according to the first, second or third feature, the air levitation stage means holds one side or both sides of the substrate. The substrate is moved in a state. This clarifies that one side or both sides of the substrate are held (clamped) when the air levitation stage means is transported. As a holding method, a contact holding method using a ball bearing that restricts the movement in a direction perpendicular to the substrate surface, a non-contact holding method using an air jet, or the like may be used.

  According to a fifth aspect of the substrate inspection apparatus of the present invention, there is provided an air levitation stage means for moving the substrate from an upstream line to a downstream line while blowing the air jet from an air outlet to the lower surface of the substrate, and projecting light. An optical system means comprising a system and a light receiving system is moved to irradiate a predetermined portion of the substrate with inspection light, receive reflected light or scattered light from the substrate, and receive the reflected light or scattered light from the substrate And a substrate inspection apparatus for inspecting a defect of the substrate based on the optical system means, the optical system means being moved at a predetermined inclination angle with respect to the movement direction of the substrate. And the air levitation stage is divided in a direction perpendicular to the moving direction of the substrate, and the substrate is irradiated from the optical system means. Is that constituted by elongated plurality of air ejection plate means having a gap for passing the inspection light. This is because when a plurality of air ejection plate means constituting the air levitation stage means are provided with a gap for allowing the inspection light irradiated from the optical system means to the substrate to pass therethrough, the substrate being conveyed in the vicinity of the gap. As a result, the floating air cannot be blown, and the substrate may get caught in the gap and be damaged, so the gaps provided in the plurality of air ejection plate means have a predetermined inclination angle with respect to the traveling direction of the substrate. did. The moving direction of the optical system means is also moved along with the inclined gap. As a result, the front end of the substrate in the transport direction is not caught in the gap, and the substrate can be transported smoothly.

  A sixth feature of the substrate inspection apparatus according to the present invention is the substrate inspection device according to the fifth feature, wherein the air levitation stage means moves the substrate while holding one or both sides of the substrate. There is to make it. This clarifies that one side or both sides of the substrate are held (clamped) when the air levitation stage means is transported. As a holding method, a contact holding method using a ball bearing that restricts the movement in a direction perpendicular to the substrate surface, a non-contact holding method using an air jet, or the like may be used.

  According to the present invention, there is an effect that the inspection accuracy can be improved by stabilizing the air levitation during the conveyance of the substrate.

It is the top view which looked at the board | substrate inspection apparatus by one embodiment of this invention from the top. It is the figure which looked at the board | substrate inspection apparatus by one embodiment of this invention from the side. It is the 1st top view which looked at the air levitation stage of Drawing 1 and Drawing 2 from the upper part. FIG. 3 is a second top view of the air levitation stage of FIGS. 1 and 2 as viewed from above. It is a partial cross section side view which shows schematic structure of the optical system moving mechanism which moves two optical systems to a Y direction. It is a perspective view which shows schematic structure of the light projection system and light reception system of the optical system of FIG. It is a figure which shows schematic structure of the optical system and control part of FIG. It is a figure which shows an example of the scanning area | region of a board | substrate. It is a flowchart which shows operation | movement of the board | substrate inspection apparatus by one embodiment of this invention. It is a figure which shows another embodiment of the board | substrate inspection apparatus by one embodiment of this invention.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a top view of a substrate inspection apparatus according to an embodiment of the present invention as viewed from above, and FIG. 2 is a view of the substrate inspection apparatus according to an embodiment of the present invention as viewed from the side. The substrate inspection apparatus includes an air levitation stage 10, one-side chucks 11 and 12, a chuck support drive unit 13, frames 14 a and 14 b, an optical system unit 20, a focus adjustment mechanism 41, a sensor 51, and a control unit (in FIGS. 1 and 2). (Not shown). Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  1 and 2, a plurality of substrates 1a and 1b to be inspected are placed on the air floating stage 10 of the substrate inspection apparatus by a carry-in conveyor (not shown) located on the right side of FIGS. 1 and 2 in the line. It is carried in order, moved with the one side of each of the substrates 1a and 1b held by the one-side chucks 11 and 12, and inspected by passing through the inspection area. After the inspection, the substrates are sequentially unloaded from the substrate inspection apparatus by an unillustrated unloading conveyor located on the left side of FIGS.

  The air levitation stage 10 is a long divided type stage composed of a plurality of first to fifth air ejection plates 101 to 105 and a plurality of sixth to tenth air ejection plates 106 to 110. Composed. On the surfaces of these long air ejection plates 101 to 110, air ejection holes composed of a large number of pores are provided over the entire surface. The first to fifth air ejection plates 101 to 105 are located on the right side of the inspection area, the sixth to tenth air ejection plates 106 to 110 are located on the left side of the inspection area, and the width dimension of the inspection area in the Y direction. Are arranged at positions spaced apart from each other by a predetermined distance in the Y direction. The air levitation stage 10 is divided into a plurality of air ejection plates 101 to 110 so that the air ejected from the air ejection holes can be efficiently discharged from between the air ejection plates 101 to 110. It is.

  In FIG. 1, one-side chucks 11 and 12 are provided on the side surfaces of the air levitation stage 10 adjacent to the lower side of the fifth air ejection plate 105 and the tenth air ejection plate 110 so as to be movable in the X direction. A chuck support drive unit 13 is provided. The air levitation stage 10 sequentially receives the substrates 1a and 1b from a carry-in conveyor (not shown), and conveys in the X direction so that the one side chucks 11 and 12 hold one side of the substrates 1a and 1b and pass through the inspection area. Moving. The one-side chucks 11 and 12 sandwich one side of the side along the transport direction of the substrates 1a and 1b (the lower side of the substrates 1a and 1b in FIG. 1). The chuck support drive unit 13 moves the substrates 1a and 1b sandwiched between the one-side chucks 11 and 12 through the inspection area. In synchronization with this movement, in the inspection area, the optical system unit 20 irradiates inspection light onto the substrates 1a and 1b held by the one-side chucks 11 and 12 and carried by air levitation to perform a predetermined inspection process.

  As shown in FIGS. 1 and 2, above the substrates 1a and 1b moved in the X direction by the one-side chucks 11 and 12 of the air levitation stage 10 (on the near side in the depth direction of FIG. 1, the upper side of FIG. 2). Are provided with frames 14a and 14b extending over a width in a direction (Y direction) substantially orthogonal to the substrate moving direction (X direction) of the substrates 1a and 1b. An optical system moving mechanism that moves the optical system unit 20 in the Y direction is mounted on the frames 14a and 14b.

  3 and 4 are top views of the air levitation stage of FIGS. 1 and 2 as viewed from above. 3 shows only the configuration of the air levitation stage 10 excluding the frames 14a and 14b, the optical system unit 20, the focus adjustment mechanism 41, and the sensor 51 from FIG. The air levitation stage 10 must be provided with a plurality of openings in a region where the inspection light from the light projecting system of the optical system unit 20 is irradiated. In this embodiment, as shown in FIG. 3, between the 1st-5th air ejection plates 101-105 which comprise the air levitation stage 10, and the 6th-10th air ejection plates 106-110. An air ejection shift plate 111 having a plurality of openings for allowing the detection light and the received light of the optical system unit 20 to pass therethrough is provided.

  The air ejection shift plate 111 is configured to be shiftable in the vertical direction (Y direction) in the figure. FIG. 3 shows a state in which the air ejection shift plate 111 is shifted so as to be positioned at the lower end portions of the fifth air ejection plate 105 and the 10th air ejection plate 110, and FIG. The state which shifted so that the board 111 may be located in the upper side edge part of the 1st air ejection board 101 and the 6th air ejection board 106 is shown. The air ejection shift plate 111 is shifted in the Y direction so that the opening of the air ejection shift plate 111 of FIG. 4 is positioned between the openings of the air ejection shift plate 111 of FIG. This is so that the optical system unit 20 can irradiate the entire surface of the substrates 1a and 1b through these openings before and after the shift and receive the reflected light. In addition to the opening on the upper surface of the air ejection shift plate 111, a plurality of air outlets (not shown) are provided. The plurality of air outlets blow air to the back surfaces of the substrates 1a and 1b to be moved. By the action of the air blown to each of the substrates 1a and 1b, the substrates 1a and 1b are levitated without being bent even when passing through the air ejection shift plate 111, and sequentially move in the X direction.

  FIG. 5 is a partial cross-sectional side view showing a schematic configuration of an optical system moving mechanism that moves two optical systems in the Y direction. The optical system moving mechanism includes guides 15 and 17, a moving table 16, and a linear motor including a magnet plate 18 and a coil 19. In the substantially L-shaped frames 14 a and 14 b, a guide 15 extending in the depth direction (Y direction) in FIG. 5 is provided so as to sandwich the optical system unit 20. On the upper side of each guide 15, a storage portion 16c of the movable table 16 is mounted.

  The movable table 16 includes a concave storage portion 16c that stores the optical system unit 20, and an arm portion 16d that extends in the horizontal direction from the upper end portion of the storage portion 16c. The optical system unit 20 is housed and mounted in the housing portion 16c via a focus adjustment mechanism 41 described later. Guides 17 extending in the depth direction (Y direction) in FIG. 5 are provided on both sides of the upper surface of the frame 14a. On the upper side of each guide 17, an arm portion 16 d of the movable table 16 is mounted.

  A magnet plate 18 that is a stator of the linear motor is attached to the center of the upper surface of the frame 14a. A coil 19 which is a mover of the linear motor is attached to the lower side of the arm portion 16d of the moving table 16. When an electric current is passed from the optical system movement control circuit 60 to be described later to the coil 19, a thrust (Lorentz force) acts on the coil 19 from the current of the coil 19 and the magnetic field of the magnet plate 18 according to Fleming's left-hand rule. The optical system unit 20 is controlled to move in the drawing depth direction (Y direction) orthogonal to the substrate movement direction (X direction).

  FIG. 6 is a perspective view showing a schematic configuration of a light projecting system and a light receiving system of the optical system. FIG. 7 is a diagram illustrating a schematic configuration of the optical system and the control unit. The optical system unit 20 includes a light projecting system that irradiates the substrate 1a with inspection light, a reflected light detection system that detects reflected light from the substrate 1a, and a light receiving system that receives scattered light from the substrate 1a. . The control system includes a focus adjustment control circuit 40, a signal processing circuit 50, an optical system movement control circuit 60, a memory 70, a notification device 80, an input / output device 90, and a CPU 100.

  As shown in the figure, the light projecting system includes a laser light source 21, a lens group 22, and a mirror 23. The laser light source 21 generates laser light serving as inspection light. The lens group 22 condenses the inspection light generated from the laser light source 21, spreads the collected inspection light in a direction (Y direction) orthogonal to the substrate movement direction (X direction), and moves the spread inspection light to the substrate. Focus in the direction (X direction). The mirror 23 obliquely irradiates the surface of the substrate 1 with the inspection light collected by the lens group 22. The inspection light applied to the surface of the substrate 1 is focused on the surface of the substrate 1 in the substrate movement direction (X direction) and has a predetermined width in a direction (Y direction) orthogonal to the substrate movement direction (X direction). It becomes a long inspection light. When the substrate 1 moves in the substrate movement direction (X direction), the inspection light with a predetermined width irradiated from the light projecting system scans the substrate 1, and inspection of defects in the scanning region is performed.

  When there are no defects such as scratches or foreign matter on the surface of the substrate 1, part of the inspection light irradiated obliquely onto the surface of the substrate 1 is reflected by the surface of the substrate 1, and the remaining inspection light is inside the substrate 1. And is emitted from the back surface of the substrate 1. If the surface of the substrate 1 has defects such as scratches or foreign matter, the light irradiated to the defects such as scratches or foreign matter on the surface of the substrate 1 is scattered and scattered in the inspection light irradiated to the surface of the substrate 1. As in the case described above, a part of the light irradiated on the other portions is reflected on the surface, and the rest is transmitted.

  In FIG. 7, the reflected light detection system includes a mirror 25, a lens 26, and a CCD line sensor 27. Reflected light from the surface of the substrate 1 enters the lens 26 through the mirror 25. The lens 26 focuses the reflected light from the substrate 1 and forms an image on the light receiving surface of the CCD line sensor 27.

  At this time, the light receiving position of the reflected light on the light receiving surface of the CCD line sensor 27 varies depending on the height of the surface of the substrate 1. When the height of the surface of the substrate 1 shown in FIG. 7 is used as a reference and the height of the surface of the substrate 1 is lower than the reference, the position where the inspection light is irradiated and reflected on the surface of the substrate 1 moves to the left side of the drawing. Then, the light receiving position of the reflected light on the light receiving surface of the CCD line sensor 27 moves to the right side of the drawing. On the contrary, when the height of the surface of the substrate 1 is higher than the reference, the position where the inspection light is irradiated and reflected on the surface of the substrate 1 moves to the right side of the drawing, and the light receiving surface of the CCD line sensor 27 receives the reflected light. The position moves to the left side of the drawing.

  The CCD line sensor 27 outputs a detection signal corresponding to the intensity of the reflected light received by the light receiving surface to the focus adjustment control circuit 40. In accordance with a command from the CPU 100, the focus adjustment control circuit 40 focuses so that the reflected light from the surface of the substrate 1 is received at the center position of the light receiving surface of the CCD line sensor 27 based on the detection signal of the CCD line sensor 27. The adjustment mechanism 41 is driven to move the optical system unit 20. The focus adjustment mechanism 41 includes a pulse motor 42, a cam 43, and a cam follower 44. An eccentric cam 43 is attached to the rotation shaft of the pulse motor 42, and a cam follower 44 is attached to the optical system unit 20. By supplying a drive pulse from the focus adjustment control circuit 40 to the pulse motor 42, the pulse motor 42 is driven to rotate the cam 43, the optical system unit 20 is moved up and down, and the focal position of the optical system unit 20 is adjusted. Be controlled.

  In FIG. 6, the inspection light emitted from the light projecting system of the optical system unit 20, transmitted to the inside of the substrate 1 and emitted from the back surface of the substrate 1 passes through the opening of the air ejection shift plate 111 and passes through the opening of the stage 10. The light travels downward and is not received by the reflected light detection system and the light receiving system of the optical system unit 20. The inspection light emitted from the light projecting system of the optical system unit 20, transmitted to the inside of the substrate 1, and emitted from the back surface of the substrate 1 similarly proceeds through the opening to the lower side of the stage 10, and the optical system unit 20. Are not received by the reflected light detection system and the light receiving system.

  6 and 7, the light receiving system includes a condenser lens 28, an imaging lens 29, and a CCD line sensor 2A. The condensing lens 28 condenses the scattered light from the substrate 1, and the imaging lens 29 forms an image of the scattered light collected by the condensing lens 28 on the light receiving surface of the CCD line sensor 2A. In FIG. 6, the CCD line sensor 2 </ b> A converts a detection signal corresponding to the intensity of scattered light received by the light receiving surface into a digital signal and outputs it to the signal processing circuit 50.

  In FIG. 7, the optical system movement control circuit 60 supplies current to the coil 19 in accordance with a command from the CPU 100, and moves the optical system unit 20 in a direction (Y direction) orthogonal to the substrate movement direction (X direction). Then, the scanning area of the substrate 1 scanned by the inspection light of a predetermined width from the light projecting system of the optical system unit 20, that is, the opening of the air ejection shift plate 111 is changed for each substrate.

  FIG. 8 is a diagram illustrating an example of the scanning region of the substrate. This embodiment shows an example in which the inspection area of the substrate 1a is divided into 24 scanning areas, and scanning is performed 22 times each using two optical system units 20. Note that the number of scanning regions and the number of scans are not limited to this, and are appropriately determined according to the size of the substrate and the number of optical systems.

  In FIG. 7, scanning areas SA1 to SA12 and SB1 to SB12 are scanning areas of the optical system unit 20. In the present embodiment, first, the air ejection shift plate 111 is positioned as shown in FIG. 3, and the position where the scanning area SA1 passes through the optical system unit 20 before the first substrate 1a reaches below the sensor 51. It moves to the sky (the lowermost opening of the air ejection shift plate 111). Then, the scanning area SA1 is scanned with the inspection light from the light projecting system of the optical system unit 20 for the first substrate 1a. After the scanning of the scanning area SA1 with respect to the first substrate is completed, the scanning area SA2 passes through the optical system unit 20 before the second substrate 1b reaches below the sensor 51 (described later) ( The air jet shift plate 111 moves from the bottom to the sky above the second stage opening. Then, the second substrate 1b is scanned in the scanning area SA2 by the inspection light from the light projecting system of the optical system unit 20, and thereafter, these operations are repeated, and the optical system unit for the twelfth substrate is repeated. Scanning up to the scanning region SA12 is performed by the inspection light from the 20 light projecting systems so as to correspond to the respective openings of the air ejection shift plate 111. After the scanning of the twelfth substrate is completed, the air ejection shift plate 111 is positioned as shown in FIG. 4, and the scanning of the thirteenth to twenty-fourth substrates is similarly performed. The above-described scanning order is an example, and the air ejection shift plates 111 are alternately positioned at the positions shown in FIGS. 3 and 4 so that the scanning areas SA1, SB1, SA2, SB2,. You may scan in order. Further, after the scanning of the scanning areas SA1 to SA12, the optical system unit 20 may be moved in the reverse direction to scan from the scanning area SB12 toward the scanning area SB1.

  1 and 2, the sensor 51 detects the edge of the substrate 1 a that is air levitating and moving on the substrate moving direction side, and outputs a detection signal to the signal processing circuit 50 of FIG. 7. In FIG. 7, the signal processing circuit 50 processes the digital signal from the CCD line sensor 2A to detect the defect of the substrate 1 in the scanning region for each rank of a predetermined size, and within the scanning region of the detected defect. The position in the direction (Y direction) orthogonal to the substrate movement direction (X direction) is detected. The signal processing circuit 50 also detects the position of the detected defect in the substrate movement direction (X direction) based on the elapsed time since the detection signal was input from the sensor 51. The signal processing circuit 50 outputs the detected defect data to the CPU 100.

  In FIG. 7, the memory 70 stores, for each scanning region, defect data of the substrate 1 in the scanning region detected by the signal processing circuit 50 under the control of the CPU 100. The reporting device 80 performs reporting under the control of the CPU 100. The input / output device 90 inputs a line stop command or the like, and outputs defect data and a determination result described later under the control of the CPU 100.

  FIG. 9 is a flowchart showing the operation of the substrate inspection apparatus according to the embodiment of the present invention. First, the CPU 100 instructs the optical system movement control circuit 60 to move the optical system unit 20. The optical system movement control circuit 60 supplies a current to the coil 19 in accordance with a command from the CPU 100, moves the optical system unit 20 to a position where each scanning region passes, and air jet shift plate as shown in FIG. 111 is positioned as shown in FIG. 3 or 4 (step 101). Along with the movement of the substrate 1 and the shift of the air ejection shift plate 111, the signal processing circuit 50 processes the digital signal from the CCD line sensor 2A and detects a defect of the substrate 1 in each scanning region (step 102).

  Next, the CPU 100 controls the memory 70 to store the detected defect data of the substrate in each scanning region for each scanning region, and for each substrate, the substrate 1 in the scanning region newly detected by the signal processing circuit 50. The defect data of the substrate 1 in the same scanning area stored in the memory 70 is updated with the defect data (step 103). Then, the CPU 100 creates defect data for one substrate from the defect data of the substrate 1 in a plurality of scanning regions stored in the memory 70 for each substrate (step 104).

  Next, the CPU 100 determines, for each substrate, whether or not the number of defects for one substrate is within an allowable value based on the created defect data for one substrate (step 105). This determination may be performed for each rank of defect size, or may be performed for all defects for one substrate regardless of the rank of defect size. If the number of defects for one substrate is within the allowable value, the process proceeds to step 109. When the number of defects for one substrate exceeds the allowable value, the CPU 100 controls the reporting device 80 to notify the line manager or line control facility that the number of defects for one substrate exceeds the allowable value. A notification to the effect is made (step 106). Subsequently, the CPU 100 determines whether or not a line stop command is input from the line manager or the line control facility to the input / output device 90 (step 107). If no line stop command is input, the process proceeds to step 109. When the line stop command is input, the CPU 100 controls the input / output device 90 to output the defect data and the determination result (step 108), and stops the processing.

  Next, the CPU 100 controls the input / output device 90 to output defect data and determination results for each substrate. (Step 109). The output of the defect data is, for example, a map showing the size and position of the defect is displayed on a monitor display and printed by a printer, or the number of defects in each scanning area and the rank of defect size and The number of defects for one substrate is displayed on a monitor display and printed by a printer. Subsequently, the CPU 100 determines whether or not the inspection of all the substrates has been completed (step 110). If not completed, the process returns to step 101, and if completed, the process is stopped.

  According to the embodiment described above, the detected defect data of the substrate in the scanning region is stored for each scanning region, and stored for each substrate by the newly detected defect data of the substrate in the scanning region. By updating the defect data of the substrate in the same scanning region (step 103) and generating defect data for one substrate from the defect data of the substrate in the plurality of scanning regions (step 104), the substrate 1 Since the defect data for the number of sheets can be obtained for each substrate, the defect inspection of the substrate in the line can be performed more quickly. Furthermore, according to the embodiment described above, it is determined for each substrate whether or not the number of defects for one substrate is within an allowable value based on the created defect data for one substrate (step 105). Thus, when a defect occurs in which the number of defects for one substrate exceeds an allowable value, the defect can be detected early for each substrate. In the above-described embodiment, the case where twelve openings are provided has been described, but this is an example, and there may be more or less than this.

  FIG. 10 is a diagram showing another embodiment of the substrate inspection apparatus according to one embodiment of the present invention. In FIG. 10, the same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted. 10 differs from that of FIG. 1 in that the frames 14a and 14b on which the optical system unit 20 and the like are mounted are placed in the Y direction (perpendicular to the conveyance direction (X direction) of the substrates 1a and 1b). Between the plurality of air ejection plates 301 to 310 constituting the air levitation stage 30 along the longitudinal direction of the frames 14a and 14b (moving direction of the optical system unit 20). Thus, a gap is formed in the region irradiated with the inspection light from the light projecting system of the optical system unit 20. That is, the substrate inspection apparatus of FIG. 10 inclines the moving direction of the optical system unit 20 by a predetermined angle with respect to the transport direction of the substrates 1a and 1b, and divides the air floating stage 30 along the moving direction of the optical system unit 20. A gap is provided. This is because, when a plurality of air ejection plates 301 to 310 constituting the air levitation stage 30 are divided along the Y direction, the levitation air is blown to the substrates 1a and 1b being conveyed at the division position (gap). This is because the substrates 1a and 1b are bent because they are not formed, and the leading ends of the substrates 1a and 1b in the transport direction may get caught in the gap and may be damaged. In this way, by tilting the dividing position (gap) of the air levitation stage 30 with respect to the traveling direction of the substrates 1a and 1b, the front end portions in the transport direction of the substrates 1a and 1b do not get caught in the gap, and the substrate 1a. , 1b can be transported smoothly. An air ejection plate that can be shifted along the same inclination as in FIG. 1 may be provided in this gap. In the above-described embodiment, the case where the air levitation stage 30 moves the substrate while holding one side of the substrate has been described, but the air levitation stage 30 may be moved while holding both sides of the substrate. In the above-described embodiment, the case where the air ejection holes including a large number of pores are provided over the entire surface of the air ejection plate has been described. However, the air ejection holes are provided in a zigzag shape to adsorb the ejection air. The air suction holes may be arranged in a staggered manner so as to alternate with the ejection holes.

10 ... Air levitation stage,
100 ... CPU,
101-110 ... Air ejection plate,
11, 12 ... One side chuck,
111 ... Air jet shift plate,
13 ... Chuck support drive unit,
14a, 14b ... frame,
15 ... Guide,
16 ... Moving table,
16c ... storage part,
16d ... arm part,
17 ... Guide,
18 ... magnet plate,
19 ... coil,
1a, 1b ... substrate,
20: Optical system unit,
21 ... Laser light source,
22 ... Lens group,
23, 25 ... mirror,
26 ... Lens,
27 ... CCD line sensor,
28 ... Condensing lens,
29 ... imaging lens,
2A ... CCD line sensor,
30 ... Air levitation stage,
301 ... Air ejection plate,
40. Focus adjustment control circuit,
41. Focus adjustment mechanism,
42 ... pulse motor,
43 ... cam,
44 ... Cam follower,
50. Signal processing circuit,
51 ... Sensor,
60: Optical system movement control circuit,
70 ... Memory,
80 ... Reporting device,
90 ... I / O device

Claims (6)

An air levitation stage means for moving the substrate from the upstream line to the downstream line while air levitation by blowing an air jet from an air outlet to the lower surface of the substrate;
Optical system means comprising a light projecting system and a light receiving system is moved to irradiate inspection light onto a predetermined portion of the substrate, receive reflected light or scattered light from the substrate, and receive reflected light from the substrate or In a substrate inspection apparatus comprising substrate inspection means for inspecting the substrate for defects based on scattered light,
A plurality of openings for passing the inspection light applied to the substrate from the optical system means, and an air ejection shift plate means provided with the air outlets at locations other than the openings, and the movement of the substrate An air ejection shift plate means configured to be shiftable in a direction perpendicular to the direction is provided in an inspection area by the optical system means in the middle of the air levitation stage means, and the air ejection shift plate means is shifted and moved. A substrate inspection apparatus for inspecting a defect in a predetermined region of the substrate by moving the optical system means in association with the opening. The board inspection apparatus according to claim 1,
2. The substrate inspection apparatus according to claim 1, wherein the air levitation stage comprises a plurality of long air ejection plate means divided in a direction perpendicular to the moving direction of the substrate. In the board | substrate inspection apparatus of Claim 1 or 2,
2. The substrate inspection apparatus according to claim 1, wherein the air ejection shift plate means includes a number of the openings that can correspond to the inspection of the entire scanning region of the substrate by shifting once. In the board | substrate inspection apparatus of Claim 1, 2, or 3,
The substrate inspection apparatus, wherein the air levitation stage means moves the substrate while holding one or both sides of the substrate. An air levitation stage means for moving the substrate from the upstream line to the downstream line while air levitation by blowing an air jet from an air outlet to the lower surface of the substrate;
Optical system means comprising a light projecting system and a light receiving system is moved to irradiate inspection light onto a predetermined portion of the substrate, receive reflected light or scattered light from the substrate, and receive reflected light from the substrate or In a substrate inspection apparatus comprising substrate inspection means for inspecting the substrate for defects based on scattered light,
The optical system means irradiates a predetermined portion of the substrate with inspection light by being moved with a predetermined inclination angle with respect to the moving direction of the substrate,
The air levitation stage is divided in a direction perpendicular to the moving direction of the substrate, and has a plurality of long airs having gaps for allowing inspection light irradiated from the optical system means to the substrate to pass therethrough. A substrate inspection apparatus comprising an ejection plate means. The board inspection apparatus according to claim 5,
The substrate inspection apparatus, wherein the air levitation stage means moves the substrate while holding one or both sides of the substrate.

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