CN102666323A - Substrate processing apparatus and method for manufacturing display element - Google Patents
Substrate processing apparatus and method for manufacturing display element Download PDFInfo
- Publication number
- CN102666323A CN102666323A CN2010800488000A CN201080048800A CN102666323A CN 102666323 A CN102666323 A CN 102666323A CN 2010800488000 A CN2010800488000 A CN 2010800488000A CN 201080048800 A CN201080048800 A CN 201080048800A CN 102666323 A CN102666323 A CN 102666323A
- Authority
- CN
- China
- Prior art keywords
- substrate
- maintaining part
- sheet material
- board treatment
- material substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Disclosed is a substrate processing apparatus which is provided with: a processing section, which performs predetermined processing with respect to a substrate; and a substrate holding section, which moves with respect to the processing section, and which holds the substrate, while having the processed surface of the substrate being formed.
Description
Technical field
The present invention relates to the manufacturing approach of substrate board treatment and display element.
The application is willing to advocate preceence 2009-268789 number based on the spy who proposed to Japan on November 26th, 2009, and its content is quoted so far.
Background technology
As the display element that constitutes read out instrument such as display equipment, known have for example organic electroluminescent (organic EL) element.Organic EL becomes and on substrate, has anode and negative electrode, and has the formation that is clipped in the organic luminous layer between these anodes and the negative electrode.Organic EL forms from anode to the organic luminous layer injected hole, in organic luminous layer, makes hole and electron recombination, through the luminous display light that obtains of this compound tense.Organic EL for example is formed with on substrate and anode and negative electrode bonded assembly circuit etc.
As one of method of making organic EL, the known method (for example with reference to patent documentation 1) that volume to volume (the roll to roll) mode that for example is known as (following brief note is " volume mode ") arranged.The volume mode is that the roller of emitting the substrate of 1 sheet on the roller that twists in the substrate supply side on one side and utilizing substrate to reclaim side batches the substrate of being emitted; Transmit substrate on one side; From substrate be released to batched during, in processing equipment, on substrate, form to constitute the method for the luminescent layer, anode, negative electrode, circuit etc. of organic EL successively.
Patent documentation 1: No. 2006/100868 booklet of International Publication
But, in such volume mode, for example when using the little substrate of thickness of slab, have this problem of flatness that is difficult to guarantee substrate.Therefore, hindered the raising of processing accuracy of the formation processing, registration process etc. of luminescent layer, electrode etc.
Summary of the invention
The purpose of mode involved in the present invention is, the manufacturing approach of good substrate board treatment of a kind of processing accuracy and display element is provided.
Substrate board treatment in the mode involved in the present invention possesses: handling part, and its relative substrate carries out predetermined process; And the substrate maintaining part, it moves relative to this handling part, and in the face that is processed that forms substrate, substrate is kept.
The manufacturing approach of the display element in the mode involved in the present invention has: treatment process, the face that is processed of substrate is carried out predetermined process; Substrate keeps operation, while the face that is processed that utilizes the substrate maintaining part to form substrate keeps substrate; And mobile process, the substrate maintaining part of the support unit that is disposed at ring-type is moved to the direction of transfer of substrate.
According to mode of the present invention, the manufacturing approach of good substrate board treatment of processing accuracy and display element can be provided.
Description of drawings
Figure 1A is the pie graph of organic EL.
Figure 1B is the b-b cutaway view of the organic EL among Figure 1A.
Fig. 1 C is the c-c cutaway view of the organic EL among Figure 1A.
Fig. 2 is the figure of the formation of expression substrate board treatment.
Fig. 3 is the figure of the formation of expression processing substrate portion.
Fig. 4 is the figure of the formation of expression droplet applying apparatus.
Fig. 5 is the figure of the formation of expression connecting gear.
Fig. 6 is the figure of the formation of expression connecting gear.
Fig. 7 is the figure of the formation of expression connecting gear.
Fig. 8 is the figure of the formation of expression connecting gear.
Fig. 9 is the figure of the formation of expression connecting gear.
Figure 10 is the figure that the next door of expression processing substrate portion forms operation.
Figure 11 is the shape in the next door that forms on the expression sheet material substrate and the figure of configuration.
Figure 12 is the cutaway view in the next door that forms on the sheet material substrate.
Figure 13 A is the figure of the coating action of expression drop.
Figure 13 B is the cutaway view that is coated in the drop between the next door.
Figure 14 A is formed in the cutaway view of the film between the next door.
Figure 14 B is the figure that expression is formed on the formation of the film between the next door.
Figure 15 is illustrated in the figure that forms the operation of gate insulator on the sheet material substrate.
Figure 16 is the figure of expression with the operation of the wiring cut-off of sheet material substrate.
Figure 17 is illustrated in the figure that source drain forms regional film forming operation.
Figure 18 is the figure that expression forms the operation of organic semiconductor layer.
Figure 19 is the figure of an example of expression aligning.
Figure 20 is the figure of the action of expression connecting gear.
Figure 21 is the figure of the variation of expression connecting gear.
The specific embodiment
[the 1st embodiment]
Below, the 1st embodiment that the present invention relates to reference to accompanying drawing explanation.
(organic EL)
Figure 1A is the birds-eye view of the formation of expression organic EL.Figure 1B is the b-b cutaway view among Figure 1A.Fig. 1 C is the c-c cutaway view among Figure 1A.
Shown in Figure 1A～Fig. 1 C, organic EL 50 is on sheet material substrate FB, to have formed gate electrode G and gate insulator I, and then forms after source electrode S, drain electrode D and the pixel electrode P, forms the bottom contact-type of organic semiconductor layer OS.
Shown in Figure 1B, on gate electrode G, be formed with gate insulator I.On gate insulator I, be formed with the source electrode S of source bus line SBL, and be formed with and pixel electrode P bonded assembly drain electrode D.Between source electrode S and drain electrode D, be formed with organic semiconductor layer OS.So far, accomplished FET.In addition, shown in Figure 1B and Fig. 1 C, on pixel electrode P, form luminescent layer IR, on this luminescent layer IR, form transparency electrode ITO.
Shown in Figure 1B and Fig. 1 C, for example on sheet material substrate FB, be formed with next door BA (cofferdam layer).And shown in Fig. 1 C, source bus line SBL is formed between the BA of next door.Like this,, make source bus line SBL high precision form through there being next door BA, and pixel electrode P and also formation exactly of luminescent layer IR.In addition, though not shown in Figure 1B and Fig. 1 C, grid bus GBL also and source bus line SBL likewise be formed between the BA of next door.
This organic EL 50 for example is applicable to read out instruments such as display equipments to be the display part etc. of the electronic machine of representative.Under this situation, use the parts that for example organic EL 50 formed panel-like.In the manufacturing of such organic EL 50, need process the substrate that has formed thin film transistor (TFT), pixel electrode.In order to form the organic compound layer more than 1 layer (light emitting element layer) that comprises luminescent layer well in precision on the pixel electrode on this substrate, hope the borderline region of pixel electrode easily and precision form next door BA (cofferdam layer) well.
(substrate board treatment)
Fig. 2 is the skeleton diagram that the formation with substrate board treatment 100 that flexual sheet material substrate FB handles is used in expression.
In following explanation, set the XYZ orthogonal coordinate system, with reference to this XYZ orthogonal coordinate system each position component relation is described.The direction of transfer of sheet material substrate FB in the horizontal surface is made as X-direction, will be in horizontal surface be made as Y direction, with being made as Z-direction with the direction (being vertical) of X-direction and Y direction quadrature respectively with the direction of X-direction quadrature.In addition, will be made as θ X, θ Y and θ Z direction respectively around rotation (inclination) direction of X axle, Y axle and Z axle.
As sheet material substrate FB, for example can use stable on heating resin film, corrosion-resistant steel etc.For example, resin film can use materials such as poly-vinyl resin, acrylic resin, alkide resin, ethylene-vinyl alcohol copolymer resin, Vinyl chloride resin, celluosic resin, amilan, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin.The size of the Y direction of sheet material substrate FB for example is formed about 1m～2m, and the size of directions X for example is formed more than the 10m.Certainly, this size is an example only, is not limited thereto.For example, the size of the Y direction of sheet material substrate FB also can be below the 50cm, also can be more than the 2m.In addition, the size of the directions X of sheet material substrate FB also can be below the 10m.Wherein, even the pliability in this embodiment for example is meant that the specified force that applies the degree of conducting oneself with dignity at least to substrate can not break yet, breakage, can make the character of this curved substrate.In addition, above-mentioned pliability changes according to environment such as material, size, thickness or temperature of this substrate etc.
The thermal expansion coefficient of preferred sheet material substrate FB is little, even so that the hot size that for example receives about 200 ℃ does not change yet.For example can inorganic filler be mixed in resin film and reduce thermal expansion coefficient.As the example of inorganic filler, can enumerate titanium oxide, zinc oxide, aluminium oxide, monox etc.
Fig. 3 is the figure of the formation of expression processing substrate portion 102.
As shown in Figure 3, processing substrate portion 102 has transmission portion 105, element formation portion 106, aligned portions 107 and substrate cut-out portion 108.Processing substrate portion 102 transmits the sheet material substrate FB that is supplied with by substrate supply unit 101 on one side; On this sheet material substrate FB, form each inscape of above-mentioned organic EL 50 on one side, and see the part of the sheet material substrate FB after having formed organic EL 50 off to substrate recoverer 103.
Next door formation portion 91 has roller platen 110 and hot transfer roll 115.91 couples of sheet material substrate FB that seen off by substrate supply unit 101 of next door formation portion form next door BA.In the next door formation portion 91, utilize roller platen 110 to push sheet material substrate FB, and, utilize hot transfer roll 115 that sheet material substrate FB is heated to more than the glass transition temperature in order to make the next door BA that is pressed into keep shape.Therefore, the lip-deep mould shape of roller that is formed on roller platen 110 can be transferred on the sheet material substrate FB.Sheet material substrate FB for example is heated to about 200 ℃ through hot transfer roll 115.
The roller surface of roller platen 110 has been installed the fine imprint mold 111 that is made up of materials such as SiC, Ta by mirror-like finish on its roller surface.Fine imprint mold 111 has formed pressing mold (stamper) and the pressing mold that colored filter is used of the wiring usefulness of thin film transistor.
As thin film transistor (TFT), can be the thin film transistor of inorganic semiconductor system, also can be to use the organic semi-conductor thin film transistor.As the thin film transistor of inorganic semiconductor, the known thin film transistor that amorphous layer is arranged, but also can be to use the organic semi-conductor thin film transistor.If use this organic semiconductor to constitute thin film transistor, then can apply flexibly printing technology, the droplet applying law technology forms thin film transistor.In addition, such FET (FET) shown in preferred especially Figure 1A～Fig. 1 C in having used the organic semi-conductor thin film transistor.
In this embodiment; As droplet applying apparatus 120, can use the droplet applying apparatus 120G that for example when forming gate electrode G, uses, the droplet applying apparatus 120I that when forming gate insulator I, uses, the droplet applying apparatus 120SD that when formation source electrode S, drain electrode D and pixel electrode P, uses, the droplet applying apparatus 120OS that when forming organic semiconductor OS, uses etc.
Fig. 4 is the birds-eye view of the formation of expression droplet applying apparatus 120.Represented the formation when+Z side is observed droplet applying apparatus 120 among Fig. 4.Droplet applying apparatus 120 forms along Y direction more longways.Be provided with not shown actuating device in the droplet applying apparatus 120.Droplet applying apparatus 120 for example can move along directions X, Y direction and θ Z direction through this actuating device.
In droplet applying apparatus 120, be formed with a plurality of nozzles 122.Nozzle 122 is set in the droplet applying apparatus 120 and opposed faces sheet material substrate FB.Nozzle 122 is for example arranged along Y direction, and the row of this nozzle 122 (nozzle rows) for example are formed with 2 row.Control part 104 can make all nozzles 122 apply drop in the lump, also can adjust the opportunity that applies drop respectively to each nozzle 122.
As droplet applying apparatus 120, for example can adopt ink-jetting style, separatory mode etc.As ink-jetting style, can enumerate charged mode, pressurization and vibration mode, dynamo-electric change type, thermoelectric conversion regime, electrostatic adherence mode etc.The droplet applying method is less wastage in the use of material, and can on the position of hope, dispose the material of desirable amount exactly.One amount of the metallic ink that wherein, applies through the droplet applying method for example is 1～300 nanogram.
Turn back to Fig. 3, droplet applying apparatus 120G is the plating ink in the BA of the next door of grid bus GBL.Droplet applying apparatus 120I is that resin or urethanes are the electrical insulating property ink of resin to switch (switching) portion coating polyimide.Droplet applying apparatus 120SD is the plating ink in the BA of the next door of source bus line SBL and in the next door BA of pixel electrode P.The switch portion of droplet applying apparatus 120OS between source electrode S and drain electrode D applies organic ink ductor.
Metallic ink is the liquid of the electric conductor stable dispersion in the solvent of room temperature about the about 5nm of particle diameter, can use carbon, silver (Ag) or gold (Au) etc. as electric conductor.The cmpd that forms organic ink ductor can be a monocrystalline material section, also can be amorphous materials, can be low molecule, also can be Polymer.As preferred especially cmpd in the cmpd that forms organic ink ductor, can enumerate with pentacene, benzo [9,10] phenanthrene, anthracene etc. is Polymer etc. for the single crystals of the ring system aromatic hydrocarbon compound that contracts of representative is perhaps pi-conjugated.
Annealing device BK is configured in each droplet applying apparatus 120+X side (substrate direction of transfer downstream) respectively.Annealing device BK can radiate for example hot blast, far-infrared rays etc. to sheet material substrate FB.These radiation heat of annealing device BK use are come dry perhaps sintering (roasted) the sheet material coated drop of substrate FB and are made its curing.
As the kind of laser, preferably for the metallic membrane that will cut off be can absorbed wavelength laser, in wavelength conversion laser, 2,3,4 times of high order harmonics of YAG etc. are better.In addition, thermal diffusion can be prevented, the damage beyond the cut-out portion can be reduced through using the pulse mode laser.When material is aluminium, preferably adopt the femto-second laser of 760nm wavelength.
In this embodiment, adopted and for example used the femtosecond laser irradiating part of titanium sapphire laser device as light source.This femtosecond laser irradiating part is for example with the pulse irradiation laser LL of 10KHz～40KHz.
Owing to use femto-second laser in this embodiment,, can cut off the source electrode S of the performance that determines FET and the interval of drain electrode D exactly so can carry out the processing of submicron order.The interval of source electrode S and drain electrode D for example is about 3 μ m～30 μ m about.
Except above-mentioned femto-second laser, also can use for example carbon dioxide laser or green (light) laser etc.In addition, except laser, also can adopt the formation of mechanically cutting off through cast-cutting saw etc.
Through using above-mentioned next door formation portion 91 and 92 both sides of electrode formation portion, even do not use so-called photo-mask process, also can apply flexibly printing technology, the droplet applying law technology forms thin film transistor etc.For example when only having used the electrode formation portion 92 that adopts printing technology, droplet applying law technology etc., exist because the infiltration of ink, expansion and can not precision form the situation of thin film transistor etc. well.
Relative therewith, because through using next door formation portion 91 to form next door BA, so can prevent infiltration, the expansion of ink.In addition, the source electrode S of the performance of decision thin film transistor and the interval of drain electrode D form through laser beam machining or machine up.
Luminescent layer formation portion 93 is configured in electrode formation portion 92+X side.Luminescent layer formation portion 93 is forming on the sheet material substrate FB of electrode the luminescent layer IR that for example forms as the inscape of organic El device, pixel electrode ITO etc.Luminescent layer formation portion 93 has droplet applying apparatus 140 and annealing device BK.
Form the luminescent layer IR that portion 93 forms by luminescent layer and contain host compound and phosphorescent compounds (being also referred to as the phosphorescence luminance compound).Host compound is the cmpd that contains in the luminescent layer.Phosphorescent compounds is the luminous cmpd that observation comes self-stimulated triplet, and it is luminous at room temperature to produce phosphorescence.
In this embodiment; As droplet applying apparatus 140, used the droplet applying apparatus 140IT of droplet applying apparatus 140Re, the droplet applying apparatus 140Gr that forms green light emitting layer that for example forms red light emitting layer, the droplet applying apparatus 140Bl that forms blue light-emitting layer, the droplet applying apparatus 140I that forms insulating barrier and formation pixel electrode ITO etc.
As droplet applying apparatus 140, same with above-mentioned droplet applying apparatus 120, can adopt ink-jetting style or separatory mode.For example be provided with under the situation as the inscape of organic EL 50 such as hole transmission layer and electron transfer layer, the device that forms these layers (for example droplet applying apparatus etc.) is being set in addition.
Droplet applying apparatus 140Re applies R solution on pixel electrode P.The spray volume of droplet applying apparatus 140Re adjustment R solution is so that dried thickness is 100nm.As R solution, for example the polyvinylcarbazole of material of main part (PVK) can use the red-doped agent material is dissolved in 1, the solution in the 2-dichlorethane.
Droplet applying apparatus 140Gr applies G solution on pixel electrode P.As G solution, for example material of main part PVK can use the green dopant material dissolves in 1, the solution in the 2-dichlorethane.
Droplet applying apparatus 140Bl applies B solution on pixel electrode P.As B solution, for example material of main part PVK can use the blue dopant material dissolves in 1, the solution in the 2-dichlorethane.
Droplet applying apparatus 120I applies the electrical insulating property ink to the part of grid bus GBL or source bus line SBL.As the electrical insulating property ink, for example can use polyimide is that resin or urethanes are the ink of resin.
Droplet applying apparatus 120IT applies ITO (Indium Tin Oxide: ink indium tin oxide) on redness, green and blue light-emitting layer.As the ITO ink, can use at indium oxide (In
2O
3) in added several percentage points oxide of tin (SnO
2) cmpd etc.In addition, also can use can enough IDIXO (In
2O
3-ZnO) wait noncrystalline to make the material of nesa coating.The transmitance of preferably clear conducting film is more than 90%.
Annealing device BK is configured in each droplet applying apparatus 140+X side (substrate direction of transfer downstream) respectively.The annealing device BK that uses in annealing device BK and the electrode formation portion 92 is same, can radiate for example hot blast, far-infrared rays etc. to sheet material substrate FB.Annealing device BK uses these radiation heated dryings or the coated drop of sintering (roasted) sheet material substrate FB to make its curing.
Aligned portions 107 has a plurality of alignment cameras CA of being provided with along directions X (CA1～CA8).Alignment cameras CA can utilize CCD or CMOS shooting under visible illumination, and handles the position that this photographed images detects alignment mark AM, also can be to alignment mark AM irradiating laser, and receive the position that its scattering light detects alignment mark AM.
Alignment cameras CA1 is configured in hot transfer roll 115+X side.Alignment cameras CA1 detects the position of the alignment mark AM that on sheet material substrate FB, is formed by hot transfer roll 115.Alignment cameras CA2～CA8 is configured in annealing device BK's respectively+the X side.The position of the alignment mark AM of the sheet material substrate FB behind the annealing device BK has been passed through in alignment cameras CA2～CA8 detection.
Because through overheated transfer roll 115 and annealing device BK, so sheet material substrate FB is flexible to X-direction and Y direction sometimes.Like this, through the hot transfer roll 115 of heat-treating+X side, annealing device BK+X side configuration alignment cameras CA, can detect the position deviation of the sheet material substrate FB that causes because of thermal deformation etc.
The testing result of alignment cameras CA1～CA8 is sent out to control part 104.Control part 104 based on the testing result of alignment cameras CA1～CA8 carry out coating position and the adjustment on opportunity of the ink of droplet applying apparatus 120, droplet applying apparatus 140 for example, supply with from substrate supply unit 101 sheet material substrate FB speed or roller RR transfer rate adjustment, through the adjustment of roller RR to the off-position of the adjustment of moving of Y direction, shutoff device 130 and opportunity etc.
(connecting gear)
Then, the formation to the connecting gear TR that is located at aforesaid substrate handling part 102 describes.Fig. 5 is the figure of the formation of expression connecting gear TR.The a plurality of connecting gear TR that represent among above-mentioned Fig. 3 become identical formation respectively.Therefore, in Fig. 5, be that example describes with the connecting gear TR among these a plurality of connecting gear TR with droplet applying apparatus 120 corresponding configurations.
As shown in Figure 5, connecting gear TR has: conveyer mechanism 10, belt drive mechanisms 20 and air cushion mechanism 40.Conveyer mechanism 10 and belt drive mechanisms 20 relative sheet material substrate FB are configured in-the Z side.In addition, air cushion mechanism 40 relative sheet material substrate FB are configured in+the Z side.
Fig. 6 is the figure when+Z side is observed connecting gear TR.As shown in Figure 6, it is outstanding to the Y direction that absorption holding plate 12 forms relative sheet material substrate FB.And like Fig. 5 and shown in Figure 6, connecting gear TR keeps sheet material substrate FB at directions X through 4 the absorption holding plates 12 (S) that are positioned at central authorities.
Fig. 7 and Fig. 8 are the figure of the formation of 1 absorption of expression holding plate 12.Fig. 7 is the figure when+Z side is observed absorption holding plate 12, and Fig. 8 is the figure of the formation of the A-A ' section in the presentation graphs 7.
Like Fig. 7 and shown in Figure 8, absorption holding plate 12 becomes holding member 15 and suction tray 16 is configured in the formation on the back plate 17 respectively.Holding member 15 is configured in the substantial middle of the Y direction of back plate 17, forms with the size that is processed part FBA that covers sheet material substrate FB shown in Figure 7 in the Y direction.Therefore, the part FBA that is processed at least among the sheet material substrate FB is kept by holding member 15.
Holding member 15 among Fig. 7 and Fig. 8+face of Z side becomes the maintenance face 15a that sheet material substrate FB is kept.It is smooth that holding member 15 forms this maintenance face 15a.Therefore, be held sheet material substrate FB that face 15a keeps be processed part FBA through maintenance face 15a by maintenance flatly.
This adsorption plane 16a form and the maintenance face 15a of holding member 15 between become the coplane state.Therefore, the absorption of absorption holding plate 12 keeps face 12a to be formed by maintenance face 15a that forms the coplane state each other and adsorption plane 16a.Sheet material substrate FB becomes on the adsorption plane 16a at the two ends that are located at the Y direction in absorption maintenance face 12a and is adsorbed, the formation that on the maintenance face 15a of the central authorities of Y direction, is not adsorbed.
According to this formation; For example be assumed to be the state that on 2 suction trays 16, has adsorbed sheet material substrate FB; Through make+suction tray 16 of Y side moves to+Y direction; Make-suction tray 16 of Y side moves to-Y direction, and the hold mode that can maintain on the maintenance face 15a comes sheet material substrate FB is applied tension force to the Y direction.
Fig. 9 is the cutaway view of the formation of expression and suction tray 16 bonded assembly pump machanisms 18.
As shown in Figure 9, pump machanism 18 has stationary cylinder axle 30, rotating cylinder (cylinder) 31 and suction pump 32.
Attract supply port 30b be inside at stationary cylinder axle 30 along the peristome that the Y direction forms, be connected with suction pump 32.Attract supply port 30b be provided with along among the figure+branching portion 30d that the Z direction forms.This branching portion 30d forms and is connected between 2 above-mentioned protuberance 30a.Therefore, the sucking action of suction pump 32 reaches between 2 protuberance 30a via attracting supply port 30b, branching portion 30d.Atmosphere liberation port 30c spreads all between the both ends of Y direction of stationary cylinder axle 30 and forms, and is connected with atmosphere at these both ends.Atmosphere liberation port 30c has branching portion 30e.Branching portion 30e is connected away from the position between above-mentioned 2 protuberance 30a.
Rotating cylinder 31 is configured to surround stationary cylinder axle 30.Rotating cylinder 31 for example both ends through being arranged on the Y direction etc. spacer 33 and and separate the certain clearance configuration between the stationary cylinder axle 30.The inside face of rotating cylinder 31 seamlessly contacts with 2 protuberance 30a of stationary cylinder axle 30 via spacer 33.Therefore, the space between the inside face of the outside face of stationary cylinder axle 30 and rotating cylinder 31 becomes the state that is divided into space S 1 and space S 2 by 2 protuberance 30a.Wherein, space S 1 is in the state that is attracted by above-mentioned suction pump 32, and space S 2 is in the state that atmosphere discharges usually.
Rotating cylinder 31 is provided with a plurality of peristome 31a along θ Y direction.Each peristome 31a is connected with above-mentioned pipe arrangement 16c respectively.Among a plurality of peristome 31a and inside part space S 1 bonded assembly peristome 31a are attracted by above-mentioned suction pump 32.In addition, rotating cylinder 31 is through the rotative speed corresponding rotation of not shown rotating mechanism and conveyer mechanism 10, and the peristome 31a that is attracted is along with rotation is switched.In this embodiment, sucking action acts on 4 rotating parts, the 11 bonded assembly peristome 31a with supporting sheet substrate FB.
In addition; For the receipts of carrying out sheet material substrate FB are smoothly awarded; The absorption holding plate 12 that preferred this pump machanism 18 forms leaning on most in 4 absorption holding plates 12-θ Y side begins to attract before arriving the position that sheet material substrate FB is kept; When lean on most+the absorption holding plate 12 of Y side from the position that keeps sheet material substrate FB away from the time, remove (atmosphere releases) attraction simultaneously.
Turn back to Fig. 5, belt drive mechanisms 20 has base portion 21, belt conveyor press section 22 and belt conveyor by hydraulic actuator 23.Other parts of base portion 21 relative processing substrate portions 102 (for example bottom surface sections, chassis portion etc.) are fixed, and invariant position is moving.Belt conveyor press section 22 be configured to relative base portion 21 dispose along θ Y direction a plurality of, to the outside of rotate path (periphery of the conveyer mechanism 10 of the for example rotate path of rotating part 11, rotation etc.) push with conveyer mechanism 10 respectively adsorb holding plate 12 cooresponding rotating parts 11.Conveyer mechanism 10 is by these a plurality of belt conveyor press section 22 supportings.The front end of belt conveyor press section 22 is via can be along the roller and conveyer mechanism 10 butts of θ Y direction rotation.
Belt conveyor press section 22 is provided with a plurality of along the hand of rotation of conveyer mechanism 10.A plurality of belt conveyor press section 22 is according to the spacing configuration of absorption holding plate 12.As an example, belt conveyor press section 22 base portion 21+the Z side disposes 4, so that 4 absorption holding plates 12 that keep sheet material substrate FB are pushed one by one.And, belt conveyor press section 22 base portion 21+the X side and-the X side respectively disposes 4, so that conveyer mechanism 10 not deflections.In a plurality of belt conveyor press section 22 for example be configured in base portion 21+4 belt conveyor press sections 22 of Z side are connected by hydraulic actuator 23 with belt conveyor respectively.These belt conveyor press sections 22 are configured to and can move along Z direction among the figure by the driving of hydraulic actuator 23 through belt conveyor.Therefore, be configured in base portion 21+4 of Z side absorption holding plates 12 are pushed to+Z side.In addition, these 4 absorption holding plates 12 be configured in the position of handling by droplet applying apparatus 120 with and near.Therefore, at least in the processing position of droplet applying apparatus 120, absorption holding plate 12 is transmitted band press section 22 and pushes.In addition, be configured in base portion 21+the X side and-the respectively relative base portions in 8 belt conveyor press sections of X side 22 21 are fixing.Wherein, as an example, belt conveyor press section 22 can also can be made up of the such elastomeric element of spring the component set-up with higher rigidity.
Air cushion mechanism 40 (gas blanket formation portion) has disk component 41, air-flow adjusting mechanism 42 and pipe arrangement 43.Disk component 41 for example respectively is provided with 1 in upstream side (+X side) and downstream (the X side) of droplet applying apparatus 120.Each disk component 41 is respectively arranged with a plurality of gas vent 41a to-Z side ejection gas (for example non-active gas such as air, nitrogen etc.) and attracts a mouthful 41b with the gas that attracts gas.Gas vent 41a and gas attract a mouthful 41b to be connected with air-flow adjusting mechanism 42 respectively via pipe arrangement 43.The traffic attraction that the spray volume of air-flow adjusting mechanism 42 adjustment gas vent 41a and gas attract mouthful 41b.Through utilizing air-flow adjusting mechanism 42 this spray volume of adjustment and traffic attractions, disk component 41-the Z side forms the layer (gas blanket or bear portion) of gas with certain bed thickness along the Z direction.
In addition; As shown in Figure 3; In luminescent layer formation portion 93, connecting gear TR is configured to cross over droplet applying apparatus 140R, 140G and 140B, but is not limited to this formation; For example connecting gear TR also can become the formation that relative each droplet applying apparatus 140R, 140G and 140B are provided with independently, can also become the formation of crossing over 2 configurations in 3 droplet applying apparatus 140.
In addition; In the electrode formation portion 92 of Fig. 3; The relative droplet applying apparatus 120G of connecting gear TR, 120I and 120SD are provided with independently; But be not limited to this formation, for example connecting gear TR also can become the formation that these droplet applying apparatus of leap 120G, 120I and 120SD are configured, and can also become the formation of crossing over 2 configurations in 3 droplet applying apparatus 120.
(action of substrate board treatment)
The action of the substrate board treatment 100 that as above-mentioned, constitutes then, is described.
As shown in Figure 2, substrate board treatment 100 is supplied with sheet material substrate FB from substrate supply unit 101 to processing substrate portion 102, and in processing substrate portion 102, on this sheet material substrate FB, constantly forms element.As shown in Figure 3, in processing substrate portion 102, transmit sheet material substrate FB through roller RR and connecting gear TR.
The sheet material substrate FB that offers processing substrate portion 102 by substrate supply unit 101 at first is sent to the next door and forms portion 91.In the next door formation portion 91, sheet material substrate FB is pushed by roller platen 110 and hot transfer roll 115 clampings, on the sheet material substrate, forms next door BA and alignment mark AM through hot transfer printing.
Figure 10 is illustrated in the figure that has formed the state of next door BA and alignment mark AM on the sheet material substrate FB.Figure 11 is the figure that the part of Figure 10 is amplified expression.Figure 12 is the figure of the formation of the D-D ' section of expression in Figure 11.Figure 10 and Figure 11 have represented the appearance when+Z side is observed sheet material substrate FB.
Shown in figure 10, next door BA is formed at the element-forming region 60 of the Y direction central portion of sheet material substrate FB.Shown in figure 11; Through forming next door BA, zone (grid forms zone 52) that forms grid bus GBL and gate electrode G and the zone (source drain forms zone 53) that forms source bus line SBL, source electrode S, drain electrode D and anode P in element-forming region 60, have been divided.Shown in figure 12, grid forms zone 52 and forms trapezoidal shape under analysing and observe.Though omitted diagram, source drain forms zone 53 and also becomes same shape.Width W (μ m) in the BA of next door becomes the live width of grid bus GBL.Preferably with respect to the bubble diameter d (μ m) that is applied by droplet applying apparatus 120G, this width W is the width about 2 times～4 times.
In addition, form zone 52 and source drain forms zone 53 section shape, preferably analyse and observe down to be V-shape or U word shape, so that after fine imprint mold 111 had been pushed sheet material substrate FB, sheet material substrate FB was easy to peel off for grid.As other shape, for example also can be to analyse and observe to be rectangular shape down.
On the other hand, shown in figure 10, alignment mark AM forms a pair of in the fringe region 61 at the Y direction both ends of sheet material substrate FB.Next door BA and alignment mark AM are because the mutual alignment relation is more important, so formed simultaneously.Shown in figure 11, stipulated that in Y direction alignment mark AM and grid form the predetermined distance PY between the zone 52, stipulated that in X-direction alignment mark AM and source drain form the predetermined distance PX between the zone 53.Therefore, can detect the skew of the X-direction of sheet material substrate FB, the skew and the θ rotation of Y direction based on the position of a pair of alignment mark AM.
In Figure 10 and Figure 11, alignment mark AM is provided with a pair of by the multirow next door BA of X-direction, but is not limited thereto, and for example also can alignment mark AM be set by per 1 row next door BA.In addition, if having living space on the sheet material substrate FB, then except the fringe region 61 of sheet material substrate FB, also alignment mark AM can be set in element-forming region 60.In addition, in Figure 10 and Figure 11, alignment mark AM has represented cross shape, but also can be circular mark, other mark shape such as bevelled linear mark.
Next, sheet material substrate FB is sent to electrode formation portion 92 through transfer roller RR.In electrode formation portion 92, carry out coating based on the drop of each droplet applying apparatus 120, on sheet material substrate FB, form electrode.
When sheet material substrate FB was sent to connecting gear TR under this state, sheet material substrate FB was attracted on the adsorption plane 16a through suction tray 16, and was maintained on the maintenance face 15a of holding member 15.Therefore, sheet material substrate FB is adsorbed maintenance face 12a maintenance.Control part 104 moves to the Y direction through making dish support unit 17b as required, comes sheet material substrate FB is applied tension force and improves the flatness of sheet material substrate FB.
Like this, under the state of the flatness of the face that the is processed FBc that has kept sheet material substrate FB, the action of control part 104 beginning droplet applying apparatus 120.For example, at first on sheet material substrate FB, utilize droplet applying apparatus 120G to form grid bus GBL and gate electrode G.Figure 13 A and Figure 13 B are the sheet material substrate FB of droplet applying is carried out in expression by droplet applying apparatus 120G the figure of appearance.
Shown in Figure 13 A, droplet applying apparatus 120G forms zone 52 for example with 1～9 order plating ink to the grid of the sheet material substrate FB that has formed next door BA.This order for example is the order that is coated in linearity with metallic ink tension force each other.Figure 13 B is the figure that has represented for example to apply the state behind 1 metallic ink.Shown in Figure 13 B owing to be provided with next door BA, so be coated on grid form zone 52 the metallic ink indiffusion be held.Like this, droplet applying apparatus 120G forms the whole plating ink in zone 52 to grid.
After forming zone 52 to grid and having applied metallic ink, according to the part that has applied this metallic ink be positioned at annealing device BK-mode of Z side transmits sheet material substrate FB.Annealing device BK heat-treats the metallic ink that is coated on the sheet material substrate FB, makes this metallic ink dry.Figure 14 A is that expression makes the dried grid of metallic ink form the figure of the state in zone 52.Shown in Figure 14 A, dry through making metallic ink, the conductor layer that comprises in the metallic ink builds up film like.The electric conductor of such film like is formed at the integral body that grid forms zone 52, shown in Figure 14 B, on sheet material substrate FB, forms grid bus GBL and gate electrode G.
Then, sheet material substrate FB be sent to droplet applying apparatus 120I-the Z side.In droplet applying apparatus 120I, apply the electrical insulating property ink to sheet material substrate FB.In droplet applying apparatus 120I, for example shown in figure 15, the grid bus GBL that forms zone 53 through source drain goes up and the last coated electrical insulating property ink of gate electrode G.
After coated electrical insulating property ink, sheet material substrate FB be sent to annealing device BK-the Z side, by annealing device BK this electrical insulating property ink is implemented heat treatment.The electrical insulating property ink passes through this heat treatment and drying, forms gate insulator I.Represented among Figure 15 that gate insulator I forms round-shaped state according to the mode on the BA of next door, do not formed but do not need necessarily to cross over next door BA.
After having formed gate insulator I, sheet material substrate FB be sent to droplet applying apparatus 120SD-the Z side.In droplet applying apparatus 120SD, form regional 53 plating inks to the source drain of sheet material substrate FB.Source drain is formed the part that stride across gate insulator I of zone in 53, for example with shown in Figure 16 1～9 order ejection metallic ink.
After being ejected metallic ink, sheet material substrate FB be sent to annealing device BK-the Z side, carry out the dried of metallic ink.After this dried, the contained electric conductor tegillum of metallic ink builds up film like, forms source bus line SBL, source electrode S, drain electrode D and anode P.But in this stage, be in the bonded assembly state between source electrode S and the drain electrode D.
Then, sheet material substrate FB is sent to shutoff device 130-Z side.In shutoff device 130, be cut off between the source electrode S of sheet material substrate FB and the drain electrode D.Figure 17 is the figure of the state after expression utilizes shutoff device 130 with the interval cut-out of source electrode S and drain electrode D.In shutoff device 130, Yi Bian use galvanometer mirror 131 to adjust the irradiation position of laser LL to sheet material substrate FB, Yi Bian cut off.
After being cut off between source electrode S and the drain electrode D, sheet material substrate FB be sent to droplet applying apparatus OS-the Z side.In droplet applying apparatus OS, on sheet material substrate FB, form organic semiconductor layer OS.According to the mode that strides across source electrode S and drain electrode D on sheet material substrate FB with gate electrode G overlapping areas ejection organic semiconductor ink.
After being ejected the organic semiconductor ink, sheet material substrate FB be sent to annealing device BK-the Z side, carry out the dried of organic semiconductor ink.After this dried, semiconductor layer contained in the organic semiconductor ink builds up film like, and is shown in figure 18, forms organic semiconductor OS.Through above operation, on sheet material substrate FB, form FET and connecting wiring.
Next, sheet material substrate FB is transmitted roller RR and is sent to luminescent layer formation portion 93 (with reference to Fig. 3).In luminescent layer formation portion 93, utilize droplet applying apparatus 140Re, droplet applying apparatus 140Gr, droplet applying apparatus 140Bl and annealing device BK to form the luminescent layer IR of redness, green, blueness respectively.Owing on sheet material substrate FB, be formed with next door BA; Even so under the situation that continues to apply not utilizing annealing device BK that red, green and blue luminescent layer IR are heat-treated, solution yet can not overflow and colour mixture takes place to the pixel adjacent zone.
After having formed luminescent layer IR, sheet material substrate FB forms insulating barrier I through droplet applying apparatus 140I and annealing device BK, forms transparency electrode IT through droplet applying apparatus 140IT and annealing device BK.Operation through such forms the organic EL 50 shown in Figure 1A～Fig. 1 C on sheet material substrate FB.
Form in the action at element, while, prevent that sheet material substrate FB to directions X, Y direction and the skew of θ Z direction, having carried out alignment actions in order as above-mentioned, to transmit sheet material substrate FB, to form in the process of organic EL 50.Below, with reference to Figure 19 alignment actions is described.
In alignment actions, (CA1～CA8) detects and suitably is formed on the alignment mark AM on the sheet material substrate FB, and sends testing results to control part 104 to be located at a plurality of alignment cameras CA of each one.Control part 104 carries out alignment actions based on the testing result of sending.
For example, (CA1～CA8) shooting of detected alignment mark AM waits the transfer rate that detects sheet material substrate FB to control part 104 at interval, judges whether roller RR for example rotates with specified speed based on alignment cameras CA.When being judged as roller RR when not rotating with specified speed, the adjustment that control part 104 sends the rotative speed of roller RR is instructed and is applied feedback.
In addition, for example whether control part 104 detects the position of the Y direction of alignment mark AM and squints based on the image pickup result of alignment mark AM, and detects the offset whether sheet material substrate FB exists Y direction.When detecting offset, control part 104 detects in state upper/lower positions skew that sheet material substrate FB is transmitted and how to have continued the time of degree.
If the time of offset is the short time, then deal with through the nozzle 122 of the coating drop in a plurality of nozzles 122 that switch droplet applying apparatus 120.If the skew of the Y direction of sheet material substrate FB has continued the long period, then carry out the position correction of the Y direction of sheet material substrate FB through moving of roller RR.
In addition, for example whether control part 104 detects sheet material substrate FB and squints to θ Z direction based on the X axle of the detected alignment mark AM of alignment cameras CA and the position of Y direction.When detecting offset, control part 104 is same during with the offset that detects Y direction, detects in the state upper/lower positions skew that transmits sheet material substrate FB how to have continued the time of degree.
If the time of offset is the short time, then deal with through the nozzle 122 of the coating drop in a plurality of nozzles 122 that switch droplet applying apparatus 120.If skew has continued the long period, then make to clip 2 roller RR that are provided with on the position that detects this out-of-position alignment cameras CA and move to directions X or Y direction, carry out the position correction of the θ Z direction of sheet material substrate FB.
In addition; In this embodiment; When control part 104 control air cushion mechanisms 40; Preference is as being controlled to gas blanket AR on the layer of uniform thickness, and forms the processing of the processing substrate portion 102 in the above-mentioned embodiments such as cut-out action that action, luminescent layer form action, sheet material substrate FB according to alignment actions, electrode, controls the formation scope of bed thickness, gas blanket AR, by the feed speed of disk component 41 gas supplied or delivery volume etc.
In sum, the substrate board treatment 100 in this embodiment possesses: droplet applying apparatus 120 and 140, and it carries out predetermined process to sheet material substrate FB; And absorption holding plate 12, it moves relative to this droplet applying apparatus 120 and 140, Yi Bian and form the face that the is processed FBc of sheet material substrate FB, Yi Bian keep this sheet material substrate FB.In addition, according to the substrate board treatment 100 of this embodiment, on one side can guarantee the flatness of the face that the is processed FBc of sheet material substrate FB, Yi Bian sheet material substrate FB is handled.Thus, can provide and to form the substrate board treatment 100 of pattern with high precision having flexual substrate.
Technical scope of the present invention is not limited to above-mentioned embodiment, can in the scope that does not break away from purport of the present invention, impose suitable change.
For example; In the above-described embodiment, constitute the bottom surface sections with respect to substrate board treatment 100, making connecting gear TR is long side direction with direction of transfer (directions X); Vertical direction (Z direction) with direction of transfer is a short side direction; But be not limited thereto, also can be shown in figure 21, constituting with the Z direction is long side direction.Under this situation, sheet material substrate FB transmits along the Z direction, is carrying out on the directions X or on the Y direction to the processing of this sheet material substrate FB.
In addition; In the above-described embodiment; Adopted the base portion 21 that only uses among the connecting gear TR+the absorption holding plate 12 of Z side transmits and is processed the formation of the formation of face FBc; But be not limited thereto, also can be shown in figure 21, be to use base portion 21-the absorption holding plate 12 of Z side transmits and is processed the formation of the formation of face FBc.Under this situation; For example the droplet applying apparatus 120 of electrode formation portion 92 uses 12 pairs of sheet material substrates of absorption holding plate FB of base portions 21+Z side to carry out above-mentioned processing, the droplet applying apparatus 140 of luminescent layer formation portion 93 use base portions 21-12 pairs of sheet material substrates of absorption holding plate FB of Z side carries out above-mentioned processing.Thus, the size of the device of substrate board treatment 100 self diminishes, and the space of placement substrate processing equipment 100 is by save spaceization.
In addition, in the above-described embodiment, connecting gear TR only is arranged on and droplet applying apparatus 120,140 cooresponding positions, but connecting gear TR also can be configured in other position.
Description of reference numerals: FB... sheet material substrate; TR... connecting gear; FBA... be processed part; S1... space; S2... space; 10... conveyer mechanism; 12... absorption holding plate; 12a... absorption maintenance face; 13... support unit; 14... spindle unit; 15... holding member; 16... suction tray; 16a... adsorption plane; 17... back plate; 17a...Y direction is used actuator; 18... pump machanism; 20... belt drive mechanisms; 22... belt conveyor press section; 23... belt conveyor is pressed hydraulic actuator; 30... stationary cylinder axle; 31... rotating cylinder; 40... air cushion mechanism; 41... disk component; 43... pipe arrangement; 100... substrate board treatment; 104... control part; 105... transmission portion.
Claims (24)
1. substrate board treatment is characterized in that possessing:
Handling part, it carries out predetermined process to substrate; With
The substrate maintaining part, it moves relative to said handling part, Yi Bian and form the face that is processed of said substrate, Yi Bian keep said substrate.
2. substrate board treatment according to claim 1 is characterized in that,
Said substrate maintaining part is provided with a plurality of.
3. substrate board treatment according to claim 1 and 2 is characterized in that,
Said substrate maintaining part has the said smooth maintenance face of face that is processed that makes.
4. according to any described substrate board treatment in the claim 1～3, it is characterized in that,
Said substrate maintaining part is configured in the support unit of closed form.
5. according to any described substrate board treatment in the claim 1～4, it is characterized in that,
Said substrate maintaining part keeps said substrate in the position that said handling part is handled.
6. according to any described substrate board treatment in the claim 1～5, it is characterized in that,
Also possesses the pressing mechanism that said substrate maintaining part is pushed to said handling part side.
7. substrate board treatment according to claim 6 is characterized in that,
Also possesses the portion of bearing of bearing the said substrate maintaining part of being pushed by said pressing mechanism.
8. substrate board treatment according to claim 7 is characterized in that,
Also possess and said substrate maintaining part between form the gas blanket formation portion of gas blanket,
Said gas blanket is used as the said portion of bearing.
9. according to claim 7 or 8 described substrate board treatments, it is characterized in that,
Use said substrate maintaining part and the said portion of bearing to form the reference plane that is processed the benchmark of face as said.
10. substrate board treatment according to claim 9 is characterized in that,
The moving direction that said gas blanket formation portion is provided in said substrate maintaining part clips said handling part.
11. according to any described substrate board treatment in the claim 1～10, it is characterized in that,
Also possesses the drive division that drives said substrate maintaining part.
12. substrate board treatment according to claim 11 is characterized in that,
Also possess the substrate transmission portion that transmits said substrate,
Said drive division drives said substrate maintaining part according to the transfer rate of said substrate.
13. according to any described substrate board treatment in the claim 1～12, it is characterized in that,
Said substrate maintaining part has the adsorption section of the said substrate of absorption.
14. substrate board treatment according to claim 13 is characterized in that,
Said adsorption section has the switching mechanism of the adsorbed state that switches said substrate.
15. substrate board treatment according to claim 14 is characterized in that,
Said switching mechanism switches said adsorbed state according to the position of said substrate maintaining part.
16. according to any described substrate board treatment in the claim 13～15, it is characterized in that,
The corresponding configuration of edge part of said adsorption section and said substrate.
17. according to any described substrate board treatment in the claim 13～16, it is characterized in that,
Said substrate maintaining part has the travel mechanism that moves said adsorption section.
18. the manufacturing approach of a display element is characterized in that, has:
Treatment process is carried out predetermined process to the face that is processed of substrate;
Substrate keeps operation, forms the face that is processed of said substrate through the substrate maintaining part, and keeps said substrate; With
Mobile process makes the said substrate maintaining part of the support unit that is disposed at ring-type move to the direction of transfer of said substrate.
19. the manufacturing approach of display element according to claim 18 is characterized in that,
Has on said substrate the formation operation that forms as the reference plane of the said benchmark that is processed face.
20. the manufacturing approach of display element according to claim 19 is characterized in that,
Said formation operation comprises to said substrate supply gas, on said substrate, forms the processing of gas blanket.
21. the manufacturing approach of display element according to claim 20 is characterized in that,
Said formation operation comprises the processing of controlling said gas blanket according to said predetermined process.
22. the manufacturing approach according to any described display element in the claim 18～21 is characterized in that,
Have said substrate maintaining part is pushed operation to what said substrate-side was pushed.
23. the manufacturing approach according to any described display element in the claim 18～22 is characterized in that,
Said substrate maintenance operation comprises makes said substrate maintaining part adsorb said substrate, switches the processing of the adsorbed state of said substrate according to the position of said substrate maintaining part.
24. the manufacturing approach according to any described display element in the claim 18～23 is characterized in that,
Have to said direction of transfer transmission and have the transmission operation of flexual said substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-268789 | 2009-11-26 | ||
| JP2009268789 | 2009-11-26 | ||
| PCT/JP2010/071124 WO2011065478A1 (en) | 2009-11-26 | 2010-11-26 | Substrate processing apparatus and method for manufacturing display element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102666323A true CN102666323A (en) | 2012-09-12 |
| CN102666323B CN102666323B (en) | 2015-06-03 |
Family
ID=44066582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080048800.0A Active CN102666323B (en) | 2009-11-26 | 2010-11-26 | Substrate processing apparatus and method for manufacturing display element |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5887935B2 (en) |
| KR (3) | KR101906129B1 (en) |
| CN (1) | CN102666323B (en) |
| HK (1) | HK1174316A1 (en) |
| WO (1) | WO2011065478A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5951044B2 (en) * | 2012-01-17 | 2016-07-13 | エーエスエムエル ネザーランズ ビー．ブイ． | Method for carrying in flexible substrate, device manufacturing method, apparatus for carrying in flexible substrate, and lithographic apparatus |
| KR20210003358A (en) | 2019-07-01 | 2021-01-12 | 삼성디스플레이 주식회사 | Apparatus and method for manufacturing a display device |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0558515A (en) * | 1991-08-30 | 1993-03-09 | Toppan Printing Co Ltd | Positioning device for board |
| JPH09306974A (en) * | 1996-05-14 | 1997-11-28 | Toshiba Corp | Work holder |
| JPH11293459A (en) * | 1998-04-07 | 1999-10-26 | Murata Mfg Co Ltd | Multilayer film forming device |
| JP2003174074A (en) * | 2001-12-06 | 2003-06-20 | Seiko Epson Corp | Substrate suction pad, substrate carrier, substrate processing system and substrate carrying method |
| JP2006116435A (en) * | 2004-10-21 | 2006-05-11 | Seiko Epson Corp | Liquid droplet discharge device, work adapted thereto, manufacturing method of electrooptical device, electrooptical device and electronic device |
| WO2006100842A1 (en) * | 2005-03-03 | 2006-09-28 | Fujifilm Corporation | Sheet body holding mechanism and lithography apparatus using same |
| JP2007048929A (en) * | 2005-08-10 | 2007-02-22 | Tokyo Electron Ltd | Coating apparatus and method therefor |
| JP2007283634A (en) * | 2006-04-17 | 2007-11-01 | Fuji Xerox Co Ltd | Liquid droplet ejection apparatus |
| CN100352000C (en) * | 2004-11-15 | 2007-11-28 | 大日本网目版制造株式会社 | Base-board treating device |
| JP2008063020A (en) * | 2006-09-04 | 2008-03-21 | Olympus Corp | Substrate carrying device, and substrate inspection system using it |
| CN101295661A (en) * | 2007-04-24 | 2008-10-29 | 东京毅力科创株式会社 | Substrate attracting device and substrate transfer apparatus |
| CN101323396A (en) * | 2007-06-11 | 2008-12-17 | 奥林巴斯株式会社 | Substrate absorbing apparatus, substrate conveying apparatus and exterior inspection apparatus |
| JP2009051654A (en) * | 2007-08-29 | 2009-03-12 | Toppan Printing Co Ltd | Substrate carrying device and substrate inspection device |
| JP2009218505A (en) * | 2008-03-12 | 2009-09-24 | Sumitomo Heavy Ind Ltd | Unload chamber, and method for operating the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2439001B (en) | 2005-03-18 | 2011-03-09 | Konica Minolta Holdings Inc | Method of forming organic compound layer, method of manufacturing organic el element and organic el element |
-
2010
- 2010-11-26 KR KR1020187019872A patent/KR101906129B1/en active IP Right Grant
- 2010-11-26 KR KR1020127009105A patent/KR101843545B1/en active IP Right Grant
- 2010-11-26 KR KR1020187007930A patent/KR101880017B1/en active IP Right Grant
- 2010-11-26 WO PCT/JP2010/071124 patent/WO2011065478A1/en active Application Filing
- 2010-11-26 JP JP2011543319A patent/JP5887935B2/en active Active
- 2010-11-26 CN CN201080048800.0A patent/CN102666323B/en active Active
-
2013
- 2013-02-06 HK HK13101660.2A patent/HK1174316A1/en not_active IP Right Cessation
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0558515A (en) * | 1991-08-30 | 1993-03-09 | Toppan Printing Co Ltd | Positioning device for board |
| JPH09306974A (en) * | 1996-05-14 | 1997-11-28 | Toshiba Corp | Work holder |
| JPH11293459A (en) * | 1998-04-07 | 1999-10-26 | Murata Mfg Co Ltd | Multilayer film forming device |
| JP2003174074A (en) * | 2001-12-06 | 2003-06-20 | Seiko Epson Corp | Substrate suction pad, substrate carrier, substrate processing system and substrate carrying method |
| JP2006116435A (en) * | 2004-10-21 | 2006-05-11 | Seiko Epson Corp | Liquid droplet discharge device, work adapted thereto, manufacturing method of electrooptical device, electrooptical device and electronic device |
| CN100352000C (en) * | 2004-11-15 | 2007-11-28 | 大日本网目版制造株式会社 | Base-board treating device |
| WO2006100842A1 (en) * | 2005-03-03 | 2006-09-28 | Fujifilm Corporation | Sheet body holding mechanism and lithography apparatus using same |
| JP2007048929A (en) * | 2005-08-10 | 2007-02-22 | Tokyo Electron Ltd | Coating apparatus and method therefor |
| JP2007283634A (en) * | 2006-04-17 | 2007-11-01 | Fuji Xerox Co Ltd | Liquid droplet ejection apparatus |
| JP2008063020A (en) * | 2006-09-04 | 2008-03-21 | Olympus Corp | Substrate carrying device, and substrate inspection system using it |
| CN101295661A (en) * | 2007-04-24 | 2008-10-29 | 东京毅力科创株式会社 | Substrate attracting device and substrate transfer apparatus |
| CN101323396A (en) * | 2007-06-11 | 2008-12-17 | 奥林巴斯株式会社 | Substrate absorbing apparatus, substrate conveying apparatus and exterior inspection apparatus |
| JP2009051654A (en) * | 2007-08-29 | 2009-03-12 | Toppan Printing Co Ltd | Substrate carrying device and substrate inspection device |
| JP2009218505A (en) * | 2008-03-12 | 2009-09-24 | Sumitomo Heavy Ind Ltd | Unload chamber, and method for operating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180084144A (en) | 2018-07-24 |
| CN102666323B (en) | 2015-06-03 |
| KR20120113699A (en) | 2012-10-15 |
| KR20180033596A (en) | 2018-04-03 |
| JPWO2011065478A1 (en) | 2013-04-18 |
| KR101843545B1 (en) | 2018-03-30 |
| KR101906129B1 (en) | 2018-10-08 |
| WO2011065478A1 (en) | 2011-06-03 |
| JP5887935B2 (en) | 2016-03-16 |
| KR101880017B1 (en) | 2018-07-18 |
| HK1174316A1 (en) | 2013-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101796561B (en) | The manufacture method of display element, the manufacturing installation of display element and display device | |
| JP5676175B2 (en) | Thin film deposition apparatus and organic light emitting display device manufacturing method using the same | |
| KR101254335B1 (en) | In-line equipment using metal-plate belt source for OLED manufacturing | |
| TWI463528B (en) | A manufacturing method of a display element, a manufacturing apparatus for a display element, and a display element | |
| CN103189542B (en) | Vapor deposition method, vapor deposition apparatus, and organic el display device | |
| KR101174883B1 (en) | Apparatus for thin layer deposition and method for manufacturing of organic light emitting display apparatus using the same | |
| CN107409455B (en) | The manufacturing method of thin-film component device and its used light irradiation device | |
| TW201248954A (en) | Mother substrate structure of light emitting devices and light emitting device and method of fabricating the same | |
| TWI691111B (en) | Substrate stretching unit, film forming device, and method for manufacturing film and organic electronic device | |
| US11335892B2 (en) | Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same | |
| JP2008108482A (en) | Organic el display device | |
| KR20150089174A (en) | Stretching apparatus for substrate | |
| CN102666323A (en) | Substrate processing apparatus and method for manufacturing display element | |
| CN111873648B (en) | Inkjet printing vacuum drying device and inkjet printing method | |
| KR102505832B1 (en) | Adsorption apparatus, position adjusting method, and method for forming film | |
| US20190352113A1 (en) | Transport device | |
| KR20030013721A (en) | Mask holding apparatus in the process of the O-EL display and method thereof | |
| KR20130063146A (en) | Printer | |
| KR101489055B1 (en) | Pattern forming apparatus | |
| JP5977044B2 (en) | Printing apparatus and printing method | |
| KR20210053761A (en) | Apparatus for forming film, and method for forming film | |
| KR101652674B1 (en) | Device for transporting sheet substrate, and processing device | |
| JP2004337729A (en) | Feed method for main scanning and feed device for main scanning, liquid drop delivery device, method for manufacturing electro-optical device, electro-optical device and electronic instrument | |
| JP5773940B2 (en) | Pattern forming apparatus and pattern forming method | |
| KR101001941B1 (en) | A Device for Protecting Damage to Substrate and A Method of Protecting Damage to Substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1174316 Country of ref document: HK |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: GR Ref document number: 1174316 Country of ref document: HK |